Advantech (TWSE: 2395), a global leader in Edge Computing and IoT automation solutions, today announced the launch of the EKI-6333BE-4GD, its first industrial-grade Wi-Fi 7 Access Point designed to deliver deterministic wireless connectivity for next-generation smart factories, autonomous logistics, and AI-driven industrial environments.

As mobile automation, robotics, and Edge AI applications rapidly expand across industrial environments, reliable wireless infrastructure has become critical for ensuring uninterrupted operations. The EKI-6333BE-4GD addresses these challenges with high-throughput Wi-Fi 7 connectivity, industrial-grade resilience, and advanced network management, enabling enterprises to build secure and scalable wireless infrastructure for mission-critical industrial systems.

Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of a new intelligent CPE reference design based on the MediaTek T930 platform, integrating 5G-Advanced and Wi-Fi 8 technologies.

The solution combines the high-performance 5G-A connectivity, intelligent reliability and advanced capabilities of the MediaTek T930 platform with Quectel's deep expertise in the global Fixed Wireless Access (FWA) market. Moving beyond a simple focus on high speed, it delivers a fully integrated, all-in-one solution featuring exceptional performance, ultra-high stability, and intelligent network management.

ASRock listed one of the first branded mobile-on-desktop platforms based on the latest Intel Core Ultra Series 3 "Panther Lake" processors, barely two months into the launch of the new processor generation. The new NUC Box-358H, NUCS BOX-358H, NUCS BOX-325, and NUC BOX-325 are powered by "Panther Lake-H" (mainstream laptop) variants of the chip, and are marketed by the Industrial sub-brand of ASRock that deals with IPCs and IIoT products. All four models are TAA-compliant. The NUC Box-358H and NUCS BOX-325 come with a thicker chassis measuring 117.5 mm x 110 mm x 49 mm (WxDxH), while the NUCS BOX-358H and NUC BOX-325 come in a slimmer chassis measuring 117.5 x 110 mm x 38 mm. All four feature active fan-based cooling for the SoC, and are barebones that exclude memory and storage.

For memory, all four models offer two DDR5 SO-DIMM slots, and support the latest CSODIMMs besides regular SO-DIMMs. For storage, all four offer two M.2-2280 slots, one of which is Gen 5. Intel BE200 Wi-Fi 7 WLAN adapters are standard. The thicker models come with two Intel 2.5 GbE wired Ethernet interfaces, while the thinner ones come with just the one. All four offer quad display outputs, including two HDMI 2.1, one DisplayPort 2.1 passed through a 40 Gbps USB4/Thunderbolt 4 port, and a second DisplayPort 1.4a passed through a USB 3.2 Gen 2x2 type-C port (alternate mode). All four come with 19 V, 120 W power bricks.

Arm Flexible Access is evolving, unlocking broader startup eligibility, expanded edge AI capabilities, and a more flexible way to design, test, and bring silicon to market. Innovation in silicon design thrives on iteration. For startups and established design teams alike, the ability to explore, test, and refine without financial friction is essential. That's why Arm Flexible Access is evolving to make that journey even easier.

Arm Flexible Access already offers up-front, low-cost or no-cost access to a wide portfolio of Arm technology, tools, and training. This "try before you buy" model allows teams to build and test designs freely, only paying licensing fees for the technologies used in production silicon. It's helped launch over 400 chips across more than 100 companies.

As industries accelerate toward digital and connected operations, cybersecurity has become critical to maintaining trust and reliability at the edge. ASRock Industrial, the trusted pioneer in Secure Edge AI Platforms, today announced the launch of AiSafeguard, an intelligent device isolation solution designed to strengthen endpoint protection and ensure continuous, secure operations in industrial and enterprise environments. Built on ASRock Industrial's security vision of Secure Device, Secure Deployment, and Secure Operation, AiSafeguard leverages Honeypot Sandbox technology and a zero-trust architecture to seamlessly integrate with ASRock Industrial Robust Edge AIoT Platforms.

The solution automatically detects, classifies, and isolates external devices in real time, allowing trusted peripherals to access host resources securely while containing untrusted devices for behavioral analysis. With adaptive isolation, trusted access control, and centralized management, AiSafeguard establishes a robust, self-defending cybersecurity framework at the edge.

SolidRun has announced the first industrial PC based on the AMD Ryzen AI 9 HX 370 with support for the latest AMD ROCm 7 stack. The combination of high-performance Zen 5 cores, Radeon iGPU, XDNA NPU and high memory capacity in a compact and ruggedized x86 device provides secure and robust edge AI processing capabilities.

AMD Ryzen AI 9 HX 370 processor contains a 12C/24T Zen 5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU. Up to 128 GB of DDR5 capacity allows for the local execution of large AI models.

Following the unveiling of the new Intel Core Ultra Series 3 processors (formerly Panther Lake) at CES, AAEON's UP brand (stock code: 6579) has announced its development timeline for the UP Xtreme PTL Edge, an AI Mini PC leveraging the platform.

Expected to enter mass production during the latter part of Q1, the UP Xtreme PTL Edge will be available with either the Intel Core Ultra X7 358H or Intel Core Ultra 5 Processor 338H from the new series, featuring an integrated Intel Arc GPU with up to 12 Xe3 Cores and Intel NPU 5.0 for up to 180 TOPs of AI performance in total.

India has achieved a significant milestone in its semiconductor journey with the launch of DHRUV64. It is a fully indigenous microprocessor developed by the Centre for Development of Advanced Computing (C-DAC) under the Microprocessor Development Program (MDP). DHRUV64 provides the nation a reliable, homegrown processor technology. It is capable of supporting strategic and commercial applications. It marks a major advancement in India's pursuit of self-reliance in advanced chip design.

DHRUV64 is built with modern architectural features. It delivers higher efficiency, enhanced multitasking capability and improved reliability. Its advanced design enables seamless integration with a wide range of external hardware systems. The processor's modern fabrication leverages technologies used for high-performance chips. This makes DHRUV64 suitable for sectors such as 5G infrastructure, automotive systems, consumer electronics, industrial automation and the Internet of Things (IoT).

Since their debut in 2023, AI PCs have taken the market by storm. Gartner projects that 77 million AI PCs will ship in 2025, representing 31% of the worldwide PC market, and growing to a 55% market share in 2026. Meanwhile, edge AI is multiplying due to a variety of factors, including smaller and more efficient AI algorithms, more powerful AI silicon, and the proliferation of IoT devices.

As laptops, AI PCs, and the latest imaging systems demand even higher performance and lower power, SoCs are challenged to keep pace. Advanced-node SoCs at 5 nm and below must balance efficiency with ultra-low voltages and growing bandwidth needs. High-resolution cameras, faster frame rates, and AI-driven workloads all require interfaces that deliver speed with minimal EMI/RFI noise.

MSI IPC announces the launch of its latest edge AI system, the MS-C910E, a high-performance industrial computer engineered for robust AI inference, demanding I/O tasks, and real-world industrial deployments. The MS C910E is built on the LGA 1700 Intel R680E platform and supports up to Intel Core Processors (Series 2) for strong and scalable performance. It offers 2 DDR5 SO- DIMM slots for up to 96 GB memory with ECC for reliable data handling. The system supports 4 independent displays through 2 HDMI and 2 DP outputs and delivers fast networking with four 2.5 GbE LAN ports for demanding AI and industrial tasks.

The MS C910E is built for reliability with strong resistance to vibration and shock and supports wide range DC input from 12 to 48 volt. It operates in environments from -10 °C to 40 °C, making it ready for harsh industrial conditions.

Samsung Electronics today announced that TM Roh was officially named Head of Device eXperience (DX) Division and appointed as CEO, joining Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, as co-CEOs of the Company. President Roh will continue to oversee the Company's mobile business as Head of Mobile eXperience (MX) Business, while Vice Chairman Jun will remain as Head of Memory Business.

To strengthen Samsung's technology leadership, the Company named Janghyun Yoon as President, Chief Technology Officer of DX Division and Head of Samsung Research, and Hongkun Park as Head of Samsung Advanced Institute of Technology (SAIT). President Yoon was previously the CEO of Samsung Venture Investment. Prior to Samsung Venture Investment, he was responsible for software platforms as well as IoT and Tizen development at the MX Business. Park is currently the Mark Hyman Jr. Professor of Chemistry and Professor of Physics at Harvard University, and a renowned researcher in the fields of nanoscience, quantum science and engineering.

Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, today launched a compact but powerful single-board computer (SBC) which will help embedded device manufacturers to meet the mounting pressure to take sophisticated and AI-ready new products to market quickly.

The new Grinn GenioBoard is a full-featured SBC in a standard 87 mm x 56 mm form factor, providing all the communications, graphics and power interfaces needed to access the capabilities of the Grinn GenioSOM-700 or Grinn GenioSOM-510 systems-on-module (SOMs). These products are themselves the industry's smallest SOMs to be based on the MediaTek Genio family of applications processors which feature multiple Arm Cortex-A cores, a graphics processing unit, and a neural processing unit for AI applications.

ASUS IoT today unveils PE3000N, a compact edge-AI platform engineered to meet the advanced requirements of next-generation robotics and intelligent automation. Accelerated by the cutting-edge NVIDIA Jetson Thor platform, with advanced NVIDIA Blackwell GPU, a powerful 14-core Arm CPU, and an industry-leading 128 GB of LPDDR5X memory, enabling an impressive 2,070 FP4 TFLOPS of AI processing power in a highly space-efficient form factor - making it ideal for integration into robotic systems where both space and energy efficiency are critical. With its robust architecture, PE3000N powered by Jetson T5000 module enables developers and integrators to achieve new levels of autonomy, sensor fusion, and AI-driven control for industrial, commercial, and smart infrastructure deployments.

Rugged reliability for challenging environments
Engineered for durability, PE3000N incorporates MIL-STD-810H industrial-grade connectors and a low-profile chassis to withstand demanding operating conditions. With support for up to four optional 25GbE links and 16 GMSL cameras, it enables high-bandwidth sensor fusion and advanced machine vision, even in the most challenging environments. The wide 12-60 V DC input and ignition support provide stable, battery-friendly operation across diverse settings - from factory floors and autonomous vehicles to smart-city infrastructure. With an operating temperature range from -20°C up to 60°C, PE3000N ensures resilient performance and secure data handling, making it a trusted solution for mission-critical robotics, automation, and edge AI deployments.

Synaptics Incorporated (Nasdaq: SYNA), announces the new Astra SL2600 Series of multimodal Edge AI processors designed to deliver exceptional power and performance. The Astra SL2600 series enables a new generation of cost-effective intelligent devices that make the cognitive Internet of Things (IoT) possible.

The SL2600 Series will launch with the SL2610 product line, featuring five processor families tailored for diverse Edge AI applications. These processors are purpose-built for the next wave of smart appliances, home and factory automation equipment, charging infrastructure, healthcare devices, retail point of sale terminals and scanners, autonomous robotic systems, UAVs, casual gaming devices, and more.

Broadcom Inc. today announced the industry's first Wi-Fi 8 silicon solutions for the broadband wireless edge ecosystem including residential gateways, enterprise access points, and smart mobile clients. Broadcom's Wi-Fi 8 solutions are purpose-built to address the stringent performance, reliability, intelligence, and efficiency demands of AI-era edge networks. Recognizing the need for rapid industry-wide deployment of AI-first wireless connectivity for the edge, Broadcom further announced the availability of its Wi-Fi 8 IP for license for Internet of Things (IoT), automotive, and mobile devices as a complement to the access ecosystem.

The new family of Wi-Fi 8 solutions include:

• BCM6718 designed for residential and operator access applications
• BCM43840 and BCM43820 are tailored for enterprise access applications
• BCM43109 for edge wireless clients such as smartphones, laptops, tablets and automotive

Qualcomm Technologies, Inc. today announced its agreement to acquire Arduino, a premier open-source hardware and software company. The transaction accelerates Qualcomm Technologies' strategy to empower developers by facilitating access to its unmatched portfolio of edge technologies and products. This acquisition builds on the Company's recent integrations of Edge Impulse and Foundries.io, reinforcing its commitment to delivering a full-stack edge platform that spans hardware, software, and cloud services. The closing of this transaction is subject to regulatory approval and other customary closing conditions.

By combining Qualcomm Technologies' leading-edge processing, graphics, computer vision, and AI with Arduino's simplicity, affordability, and community, the Company is poised to supercharge developer productivity across industries. Arduino will preserve its open approach and community spirit while unlocking a full-stack platform for modern development—with Arduino UNO Q as the first step.

ASUS IoT, a global leader in AIoT solutions, today introduced AISVision 365, a cloud-native AI-vision platform designed to reduce onboarding time and accelerate AI deployment for enterprises. By bringing machine-vision capabilities directly to the browser, the platform eliminates complex setup and allows companies to start building AI applications within minutes.

Accelerated development with lower entry barrier
AISVision 365 allows registered members to start AI projects immediately in a web browser. Its all-in-one workflow integrates data annotation, model training, and inference management, streamlining the process and accelerating proof-of-concept validation. The online version helps enterprises quickly test and optimize AI models, providing clear benefits for product validation and development. At the same time, the existing AISVision AI Toolkit will continue to operate, ensuring uninterrupted service for current customers.

On September 17, the LattePanda Team officially launched the new LattePanda IOTA, a palm-sized x86 single-board computer powered by the Intel N150 quad-core processor. Compared to the previous-generation, LattePanda IOTA offers up to 8x the performance, and provides 2-3x faster CPU speeds and 10-30x better GPU capabilities than the Raspberry Pi 5. It is available with either 8 GB or 16 GB of LPDDR5 memory and 64 GB or 128 GB of eMMC storage, bringing powerful computing to a palm-sized form factor.

LattePanda IOTA maintains full compatibility with the classic LattePanda V1 footprint, including dimensions, interfaces, and mounting holes, making upgrades straightforward. The board features HDMI 2.1 and eDP display output, USB 3.2 Gen 2, Gigabit Ethernet, an M.2 expansion slot, and a GPIO header supporting UART, I2C, and USB 2.0. Additionally, it includes a built-in RP2040 coprocessor, broadening its range of potential applications. With its efficient x86 architecture, extensive I/O options, and long-term supply stability, LattePanda IOTA is well suited for prototyping, edge computing, smart instrumentation, handheld devices, industrial control, and embedded systems.

Further expanding SiFive's lead in RISC-V AI IP, the company today launched its 2nd Generation Intelligence family, featuring five new RISC-V-based products designed to accelerate AI workloads across thousands of potential applications. The lineup includes two entirely new products—the X160 Gen 2 and X180 Gen 2—alongside upgraded X280 Gen 2, X390 Gen 2 and XM Gen 2. These new products all feature enhanced scalar, vector and, specifically with XM, matrix processing capabilities designed for modern AI workloads.

The X160 Gen 2 and X180 Gen 2 target far edge compute and IoT applications, achieving high efficiency in a compact footprint and delivering advanced AI functionality to the deeply embedded edge, which is heavily constrained by power and area. Target industries include automotive, autonomous robotics, industrial automation, and smart IoT.

Today Arm (NASDAQ:ARM) published a letter to its shareholders containing the company's results for its first quarter of fiscal year 2026 ended June 30, 2025. The infographic below provides the key highlights:Here are what the results mean and how they were achieved:

• Record revenues for an Arm first quarter, crossing the $1 billion quarterly revenue milestone for the second consecutive quarter and delivering the second-best revenue quarter ever.
• Royalty revenue rose 25% year-over-year to $585 million, driven by the growing adoption of the Armv9 architecture, increasing number of chips based on Arm Compute Subsystems (CSS), and use of Arm-based chips in datacenters.

The ESM-HRPL is a next-generation COM-HPC module designed for compute-intensive edge applications. Paired with the high-performance EEV-HC10 carrier board, this solution is ideal for AI inference, smart healthcare, industrial automation, and intelligent energy systems. It delivers exceptional processing power, modular scalability, and long-term product availability for critical embedded deployments.

Advanced COM-HPC Performance for Evolving Edge Architecture
The ESM-HRPL module complies with the PICMG COM-HPC Client Type specification and supports Intel 12th, 13th, and 14th Gen Core processors (LGA 1700, up to 65 W TDP), along with the Intel R680E chipset. It includes four DDR5 SO-DIMM sockets supporting up to 128 GB of memory at speeds up to 3600 MT/s and optional ECC support, depending on the selected CPU.

Avalue Technology Inc., a global leader in industrial computing solutions, announces the release of its new EPS-RPR fanless rugged embedded system. As AI inference migrates from the cloud to edge devices, there is an increasing demand for fanless systems. Market research indicates that the global Edge AI Box PC market will grow from USD 1.141 billion in 2024 to USD 2.283 billion by 2033, at a compound annual growth rate (CAGR) of 6.2%. Designed in response to this trend, the EPS-RPR offers a high-performance, stable, and flexible embedded platform that is ideal for smart manufacturing, autonomous vehicles, and intelligent retail applications.

The EPS-RPR fanless industrial PC is powered by the 14th Gen Intel Core i9/i7/i5/i3 processors and supports DDR5-5600 memory, delivering robust computing power. Its fanless thermal solution and wide temperature tolerance (from -10°C to 55°C) ensure stable operation in harsh environments. In terms of I/O capabilities, the EPS-RPR model offers four 4K display outputs, dual Intel LAN ports (2.5GbE and 1GbE), six COM ports, and eight USB ports. This configuration is designed to meet the diverse needs of a wide range of industrial applications. The system also supports versatile expansion with 1× M.2 Key-B, 1× Key-E, 1× Key-M, and 1× mPCIe, enabling seamless integration with Wi-Fi, LTE/5G, and various I/O modules.

BIOSTAR, a leading manufacturer of edge computing solutions, motherboards, graphics cards, and storage devices, is excited to unveil the EdgeComp MS-1335U, a standout addition to its EdgeComp embedded edge computing system lineup. Designed to meet the evolving demands of smart cities and connected infrastructure, the MS-1335U combines powerful processing, quiet fanless operation, and flexible connectivity, making it an ideal choice for system integrators, municipal projects, digital signage networks, and next-generation kiosks where performance and efficiency are paramount.

Featuring a compact, fanless design, the EdgeComp MS-1335U is powered by Intel Raptor Lake SoC processors, delivering a powerful balance of performance and energy efficiency for demanding edge applications. With up to 10 cores and speeds reaching 4.6 GHz, it ensures responsive multitasking while operating silently, even in noise-sensitive environments. Supporting up to 96 GB of high-speed DDR5 5200 MHz memory, ultra-fast PCIe Gen 4 storage, and SATA III support for flexible storage options, the MS-1335U is perfectly suited for smart kiosks, interactive digital signage, self-service terminals, and municipal systems that require reliable, space-saving computing with seamless 4K visual output.

ASUS IoT, a leader in AIoT solutions, today introduces R680EA-IM-Z, a high-performance industrial ATX motherboard built to empower advanced industrial applications with exceptional processing power and robust reliability. Powered by 14th Gen Intel Core processors, R680EA-IM-Z delivers up to 21%-faster CPU performance, providing the optimal foundation for AI-enabled machine vision, robotics and real-time data analysis.

Optimized for data-heavy industrial workloads, R680EA-IM-Z efficiently handles high-resolution image processing and complex algorithmic tasks. Its advanced computing capability ensures seamless integration into intelligent manufacturing and automation systems - where real-time responsiveness and unwavering reliability are essential.

BIOSTAR, a leading manufacturer of edge computing solutions, motherboards, graphics cards, and storage devices, is excited to introduce the EdgeComp MS-N97, a key product in its newly launched EdgeComp industrial system lineup. Purpose-built for smart retail, EdgeComp MS-N97 delivers exceptional space efficiency, reliability, and intelligent performance—making it the perfect fit for modern retail environments where compactness and capability are paramount.

Featuring a compact, fanless design, the EdgeComp MS-N97 is powered by the Intel Alder Lake-N N97 processor, delivering an ideal balance of performance and energy efficiency. With four cores running up to 3.6 GHz and a low 12 W TDP, it supports continuous, silent operation even in tight installations, making it ideal for kiosks, vending machines, point-of-sale systems, and digital signage throughout today's fast-paced retail spaces. It also features integrated Intel UHD Graphics, delivering smooth and reliable visual output for applications such as digital signage, live menus, or interactive kiosks.