Hewlett Packard Enterprise today announced expansions of its HPE Aruba Networking wired and wireless portfolio, along with new HPE Aruba Networking CX 10K distributed services switches, which feature built-in programmable data processing units (DPU) from AMD Pensando to offload security and network services to free up resources for complex AI workload processing.

The new expansions from HPE Aruba Networking include:

• The HPE Aruba Networking CX 10040 is HPE's latest distributed services switch -- also known as a "smart switch" -- that doubles the scale and performance of the previous networking and security solution.
• Four new HPE Aruba Networking CX 6300M campus networking switches, which provide faster data speeds for enterprise IoT, AI, or high-performance computing with a more compact footprint.
• New Wi-Fi 7 access points (APs) and capabilities for AI-driven indoor and outdoor connectivity that deliver the highest quality of service for data, voice, and video communications.

As COMPUTEX 2025, one of the most anticipated global tech events, prepares to open its doors in Taipei, AI applications are set to reach new heights. GIGAIPC, the industrial computing and edge AI subsidiary of GIGABYTE Technology, will unveil three innovative AI edge computing solutions at COMPUTEX 2025, showcasing its expertise in industrial-grade system design. Powered by NVIDIA Jetson Orin modules, the flagship QN-ORAX32-A1, QN-ORNX16GH-A1, and QN-ORNX16 deliver exceptional AI performance for smart manufacturing, intelligent surveillance, smart healthcare, smart retail, and AIoT applications, setting new benchmarks for edge computing.

The QN-ORAX32-A1, built on the NVIDIA Jetson AGX Orin 32 GB module, features an 8-core Arm v8.2 64-bit CPU and an NVIDIA Ampere GPU with 1792 CUDA cores and 56 Tensor cores, delivering up to 200 TOPS of AI performance—six times faster than its predecessor. This enhanced computing power makes it well-suited for high-load data processing and complex AI models. Beyond its computing performance, the QN-ORAX32-A1 is also built for real-world deployment. To ensure long-term durability in harsh industrial environments, the system incorporates a fanless thermal design and wide-range DC power input.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and storage devices, is excited to introduce the EdgeComp MS-J6412 industrial PC, a powerful new addition to its EdgeComp series built specifically for industrial automation and edge computing applications.

Designed to excel in demanding industrial settings, EdgeComp MS-J6412 combines powerful performance, energy efficiency, and versatile connectivity in a compact, fanless design. Powered by the Intel Elkhart Lake J6412 SoC, a quad-core processor with speeds up to 2.6 GHz and an ultra-low 10 W TDP, the system ensures stable, round-the-clock operation with minimal heat generation and silent performance. Its embedded architecture makes it ideally suited for space-limited and noise-sensitive environments where reliability is paramount.

MSI, a global leader in industrial computing solutions, proudly announces the release of the MS-C927, a highly compact and fanless embedded Box PC designed to meet the growing demand for power-efficient edge computing in harsh and space-constrained environments. Powered by Intel 's Meteor Lake-U and Arrow Lake-U series Core Ultra processors, the MS-C927 delivers high performance, reliable connectivity, AI acceleration, and rich I/O in an ultra-compact form factor.

Feature-Rich, Future-Ready
With a footprint of only 130 x 155 x 40 mm, the MS-C927 fits seamlessly into tight enclosures while offering exceptional processing power and industrial-grade durability. It features DDR5 memory up to 96 GB, dual 4K DisplayPort outputs, dual LAN including 2.5GbE, and multiple M.2 slots for NVMe storage, wireless connectivity, and cellular communication.

MediaTek CEO Dr. Rick Tsai will deliver a keynote speech at COMPUTEX 2025. The presentation will highlight MediaTek's AI vision—from edge to cloud—and how the company is driving AI innovation. It will also explore the evolution of next-generation connectivity and reveal how cutting-edge, power-efficient, high-performance chips are shaping the future. The keynote will take place on opening day, May 20 at 11:00 AM (UTC+8), at the Taipei Nangang Exhibition Center, Hall 2, 7F. As a global leader in semiconductor technology and AI computing, MediaTek continues to drive innovation across devices, smart homes, automotive electronics, IoT, and data center technologies. At COMPUTEX 2025, MediaTek CEO Dr. Rick Tsai will outline MediaTek's vision for AI computing from edge to cloud, explore the evolution of next-generation connectivity, and discuss how high-performance, power-efficient chipsets are shaping our future.

Dr. Tsai brings extensive leadership experience in the semiconductor and technology industries. Under his leadership, MediaTek has further strengthened its position as a leading innovator of advanced chip solutions, maintaining a leading position in the global mobile chipset market and driving progress in the entire portfolio of technology platforms. Demonstrate how MediaTek's vision to empower a connected, intelligent world for everyone.

Synaptics Incorporated announced it has extended its Veros wireless portfolio with its first family of Wi-Fi 7 systems-on-chips (SoCs) tailored for the Internet of Things (IoT). Comprising the SYN4390 and SYN4384, the scalable offering supports bandwidths up to 320 MHz to deliver 5.8 Gbps peak speed and low latency. The triple-combo SoCs integrate Wi-Fi 7 with Bluetooth 6.0 and Zigbee/Thread, support Matter, and are designed to minimize system cost and power consumption. They target IoT applications requiring reliable performance-over-range for enhanced user experiences across use cases that include 8K video streaming, interactive gaming, security monitoring, immersive AR/VR, and home and automotive entertainment.

Wi-Fi 7's multi-link operation (MLO) allows the devices to send and receive a data stream using multiple frequency bands (2.4 GHz, 5 GHz, 6 GHz) simultaneously in support of low latency, reliable connections, and high throughput for real-time applications like video calls and gaming. Synaptics' architecture provides a power-efficient, cost-effective way to deliver the benefits of MLO.

TSMC today unveiled its next cutting-edge logic process technology, A14, at the Company's North America Technology Symposium. Representing a significant advancement from TSMC's industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company's experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.

ADLINK Technology Inc., a global leader in edge computing, proudly announces that its newly released EMP-520 Series industrial compact box PC has been recognized for its excellence, securing the Best-in-Show award in the Computer Boards, Systems, Components & Peripherals category at embedded world 2025. It was selected for its innovative design, user-centric features, and exceptional performance in industrial environments.

Smart, Reliable, and Efficient Industrial Computing Solution
Designed to meet the needs of modern industrial applications, the EMP-520 Series delivers high computing performance with minimal maintenance, helping businesses maximize productivity and reduce downtime. Powered by Intel 14th Gen Core processors, it ensures energy-efficient operation, making it ideal for high-demand environments that require continuous, reliable computing. Supporting four simultaneous 4K video outputs and EDID emulation, users can achieve seamless visual performance. The compact design enables easy integration into space-constrained environments while ensuring reliable operation in mission-critical applications.

Compulab has updated its "ruggedised" Airtop3 compact form factor PC line with a new configuration that includes a pre-installed "Ada Lovelace" GeForce RTX 4060 8 GB discrete graphics card. Back in 2018, TechPowerUp's news section covered the Israeli firm's initiation of a crowdfunding campaign for their fanless Airtop2 Inferno Mini-PC. This second generation design launched with a desktop GeForce GTX 1080 "Pascal" card onboard. Compulab's current-gen SFF fanless IoT Edge server model was first revealed in 2019; debuting with passively cooled Intel Core i9-9900K (Coffee Lake Refresh) processors and Team Green's Quadro RTX 4000 (Turing) graphics cards. Going further back—to February 2018—the brand introduced its vanilla Airtop2 design.

The latest Airtop3 revision still utilizes an old LGA1151 socket platform; compatible with a small selection of Team Blue "Coffee Lake"—original and refreshed—CPUs. The best configuration can be equipped with a workstation grade Xeon E-2278GE processor. The cheapest option is outfitted with an entry level Celeron G4900T unit. As noted by VideoCardz, Compulab's starting price for an Airtop3 + GeForce RTX 4060 dGPU is $2780. A GPU-less setup costs $1790. Customers can pick between the GeForce RTX 4060 or an older "Ampere" RTX A2000 6 GB card. No matter the specification, CPU/APU and GPU aspects are passively cooled via sizeable copper plates.

Qualcomm today announced the acquisition of MovianAI Artificial Intelligence (AI) Application and Research JSC (MovianAI), the former generative AI division of VinAI Application and Research JSC (VinAI) and a part of the Vingroup ecosystem. As a leading AI research company, VinAI is renowned for its expertise in generative AI, machine learning, computer vision, and natural language processing. Combining VinAI's advanced generative AI research and development (R&D) capabilities with Qualcomm's decades of extensive R&D will expand its ability to drive extraordinary inventions.

For more than 20 years, Qualcomm has been working closely with the Vietnamese technology ecosystem to create and deliver innovative solutions. Qualcomm's innovations in the areas of 5G, AI, IoT and automotive have helped to fuel the extraordinary growth and success of Vietnam's information and communication technology (ICT) industry and assisted the entry of Vietnamese companies into the global marketplace.

AAEON's UP brand, has released the UP 710S Edge, the company's smallest Intel Processor N-powered Mini PC with Wi-Fi support, measuring just 92 mm x 77 mm x 38 mm.

Positioned as a compact platform for companies to upgrade industrial automation setups, the UP 710S Edge is available in models featuring the full Intel Processor N series family (formerly Alder Lake-N), as well as offering an 8-bit GPIO with optional SPI, I2C, and PWM, a first for the product line.

In industrial environments, equipment runs 24/7, handling frequent and intensive write operations. To support these demanding workloads, storage solutions must offer high endurance to extend lifespan, minimize downtime, and lower Total Cost of Ownership (TCO). Designed to meet these demands, the Cervoz T455 Series, M.2 2280 NVMe SSD delivers 35% greater endurance through a refined firmware architecture and proven storage technologies. Ideal for industrial automation, edge computing, and high-performance computing (HPC), it ensures reliable performance under heavy workloads.

Enhanced Endurance for Demanding Industrial Applications—Over-Provisioning Technology: Endurance SSD Performance and Longevity
Cervoz's Over-Provisioning technology optimizes SSD performance by reserving extra storage space, boosting efficiency, and extending lifespan. How SSD Over-Provisioning Delivers Benefits:

• Extended Lifespan: Efficiently reserves additional storage space, enhancing NAND durability at least 35%.
• Consistent Performance: Maintains steady performance levels even under high-intensity workloads.
• Optimized Resource Management: Reserved space allocation for optimal write efficiency.

ASRock Industrial introduces the iEP(F)-9040 Series, a next-generation Robust Edge AIoT Platform designed to deliver high-performance edge AI computing, real-time industrial automation, and scalable expansion for smart manufacturing, intelligent vision systems, autonomous robotics, and edge AI applications. Powered by Intel Core 200S Processors (Bartlett Lake-S), the iEP(F)-9040 Series enables seamless AI inferencing, high-speed data processing, and intelligent edge computing for industrial IoT and AIoT applications. With support for up to 24 cores and 32 threads with enhanced longevity, DDR5 5600 MHz memory up to 96 GB, PCIe Gen 5 expansion, the Series is built to handle complex AI workloads. Designed to thrive in extreme industrial conditions, the series supports up to -40°C~75°C wide operating temperature range and 9 V-36 V DC power input with ignition control, ensuring reliable operation in mission-critical environments. The iEP(F)-9040 Series features rich industrial I/O, supports real-time TSN/TCC, and connectivity options like 5G/4G LTE, Wi-Fi 6E and BT 5.4 for high-speed, low-latency communication. The Series is ideal for various industrial applications such as smart factory, AI-based Inspection, robotics, surveillance, smart transportation, and more, providing a future-ready AIoT solution for next generation edge and industrial intelligence.

Optimized AI and Compute Performance with Intel Core 200S Processors
The iEP(F)-9040 Series harness the power of Intel Core 200S Processors (Bartlett Lake-S) to deliver superior computing performance and AI acceleration with long-term support. With up to 24 (8P+16E) cores, delivering up to 32 threads, the series enables real-time AI inferencing, industrial automation, and intelligent edge computing. Compared to previous generations, Intel Core 200S Processors (Bartlett Lake-S) achieve up to 1.06x faster single-threaded and 1.08x faster multi-thread performance. Supporting dual DDR5 5600 MHz SO-DIMM memory up to 96 GB, the iEP(F)-9040 Series significantly boosts machine vision, AI model deployment, and automation. Integrated Intel UHD Graphics provides up to 4K high-resolution AI-driven imaging, with DisplayPort 1.4a, HDMI 2.0b, and VGA outputs for flexible industrial display configurations.

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries.

"As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN."

Embedded World is one of the most influential exhibitions in the global embedded technology sector, attracting numerous experts in industrial computing, automotive electronics, IoT, and AI technologies each year. Phison Electronics (8299TT), a leading innovator of NAND controller and NAND storage solutions, will participate in the Taiwan Excellence Pavilion at Embedded World 2025 in Germany from March 11 to 13.

Phison will showcase its exclusive AI solution aiDAPTIV+, the enterprise ultra-high-capacity PASCARI PCIe 5.0 122.88 TB SSD, and its latest automotive storage technology, the MPT5 Automotive PCIe Gen 4 SSD, demonstrating over 15 years of technical expertise in the embedded market.

ASUS IoT, a global leader in AIoT solutions, today unveils its latest innovations at Embedded World 2025. Showcasing a comprehensive lineup of advanced Edge AI and embedded computing technologies, ASUS IoT empowers businesses to accelerate AI adoption and enhance efficiency across industries such as manufacturing, robotics, and smart city infrastructure.

Revolutionary edge AI computing
This year, ASUS IoT is showcasing the upcoming RUC-1000G, its rugged 19-inch 2U edge AI computer - the world's first to support a 600 W GPU and PCIe 5.0. Designed for mission-critical industrial applications, it features advanced thermal management to ensure superior real-time AI inference and deep learning performance. Enhanced data security with TPM IC and IEC 62443-4-1 compliance ensures protection, while the iBMC module enables rapid system recovery.

Synaptics Incorporated has extended its award-winning Synaptics Astra AI-Native platform with the SR-Series high-performance adaptive microcontroller units (MCUs) for scalable context-aware Edge AI. The series features three tiers of operation: performance (100 GOPS), efficiency, and ultra-low-power (ULP) always-on (AON) to deliver intelligence at every power level. Based on an Arm Cortex-M55 core and the Arm Ethos-U55 neural processing unit (NPU), the SR-Series is supported by the Astra Machina Micro development kit and open-source SDK. It is optimized for multimodal consumer, enterprise, and industrial Internet of Things (IoT) workloads with accelerators and adaptive vision, audio, and voice algorithms. The small-form-factor MCUs have a rich set of peripherals—including multiple camera interfaces—to help minimize system cost, power, and footprint while enabling integration into a wide range of devices, such as battery-operated security cameras, sensors, appliances, point-of-sale, digital signage, and scanners.

Announced at EW2024 with the SL-Series MPUs, the Synaptics Astra AI-Native compute platform for the IoT combines scalable, low-power compute silicon for the device Edge with open-source, easy-to-use software and tools and Veros wireless connectivity. The platform was built upon Synaptics' foundation in neural networks, field-hardened AI hardware and compiler design expertise for the IoT, and refined, in-house support of a broad base of modalities.

Realtek Semiconductor will participate in the globally acclaimed top technology event—the Embedded World 2025 in Nuremberg, Germany, from March 11 to 13. Highlighted exhibits will include networking multimedia applications, Ethernet solutions for various transmission media, industrial Ethernet switch application solutions, as well as Bluetooth and Wi-Fi/IoT solutions. These exhibits will demonstrate Realtek's innovation in multimedia and communication networks, combined with AI-powered smart applications, providing customers with stable, reliable, and high-performance solutions.

Networked Multimedia Application
Realtek provides end customers with a highly secure, sustainably upgradeable, open-source, and shared Linux platform. Designed to meet the needs of SoCs, it leverages an advanced 12 nm process, a high-performance CPU/GPU, and Edge AI computing with NPU to fully support 4K video decoding and all HDMI 2.1 functions. It also enables audio and video transmission via DisplayPort. Additionally, the platform features high integration with multiple interfaces, including USB, PCIe, GPIO, UART, and SDIO. For system integration, Realtek incorporates its NICs (1G/2.5G/10 Gbps) and Wi-Fi/BT chips. SoCs are able to seamlessly connect to panels of various sizes via built-in MIPI or eDP, ensuring compatibility with networked multimedia applications.

Silicon Motion Technology Corporation, a global leader in NAND flash controllers for solid-state storage devices, today announced its participation in Embedded World 2025, taking place from March 11-13, 2025, in Nuremberg, Germany.

At the event, Silicon Motion will showcase its latest storage and display interface solutions, including PCIe NVMe Gen 4/5 SSD controllers, Ferri embedded storage solutions, and advanced display interface SoCs. These cutting-edge innovations are designed to maximize performance per watt, extend device longevity and power for the next generation of AI-driven industrial, embedded, automotive, and data center applications.

Industrial digitalization is reshaping connectivity requirements across various sectors. From smart manufacturing floors to remote monitoring stations, the industrial environment demands wireless solutions that excel in extreme conditions. Temperature fluctuations ranging from -40°C to 85°C, which were once limiting factors for wireless deployments, now represent the standard operating range for mission-critical industrial systems. This shift reflects the growing importance of wireless connectivity in driving industrial automation, remote operations, and the broader Industrial Internet of Things (IIoT) ecosystem.

Wi-Fi 6: Mastering Temperature Extremes
The Cervoz new Wi-Fi module, MEC-WIFI-2042B-30 W delivers reliable wireless connectivity across the industrial temperature range of -40°C to 85°C. This temperature resilience, combined with Wi-Fi 6 (IEEE 802.11ax) technology, ensures consistent connectivity in environments where standard wireless solutions would fail. The module's 2T2R MIMO architecture delivers throughput up to 1201 Mbps on 80 MHz channels while maintaining stability across both 2.4 GHz and 5 GHz bands. Whether deployed in freezing outdoor installations or high-temperature industrial environments, this robust architecture ensures uninterrupted performance for data-intensive applications.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

Arm's new Cortex-A320 represents its first ultra-efficient CPU using the advanced Armv9 architecture dedicated to the needs of IoT and AI applications. The processor achieves over 50% higher efficiency compared to the Cortex-A520 through several microarchitecture optimizations, together with a narrow fetch and decode data path, densely banked L1 caches, and a reduced-port integer register file. It also delivers 30% improved scalar performance compared with its predecessor, the Cortex-A35, via efficient branch predictors, pre-fetchers, and memory system improvements.

The Cortex-A320 is a single-issue, in-order CPU with a 32-bit instruction fetch and 8-stage pipeline. The processor offers scalability by supporting single-core to quad-core configurations. It features DSU-120T, a streamlined DynamIQ Shared Unit (DSU) which enables Cortex-A320-only clusters. Cortex-A320 supports up to 64 KB L1 caches and up to 512 KB L2, with a 256-bit AMBA5 AXI interface to external memory. The L2 cache and the L2 TLB can be shared between the Cortex-A320 CPUs. The vector processing unit, which implements the NEON and SVE2 SIMD (Single Instruction, Multiple Data) technologies, can be either private in a single core complex or shared between cores in dual-core or quad-core implementations.

Intel today launched two new Ethernet product lines - the Intel Ethernet E830 Controllers and Network Adapters, and the Intel Ethernet E610 Controllers and Network Adapters - designed to meet the growing demands of enterprise, telecommunications, cloud, edge, high performance computing (HPC) and artificial intelligence (AI) applications. These next-generation solutions provide robust, high-performance connectivity while enhancing energy efficiency and security, and lowering total cost of ownership (TCO).

"In today's interconnected world, networking is essential to the success of business and technology transformation. With the launch of the Intel Ethernet E830 and E610 products, we are helping customers meet the growing demand for high-performance, energy-efficient solutions that optimize network infrastructures, lower operational costs and enhance TCO." -Bob Ghaffari, Intel vice president, Network and Edge Group