News Posts matching "Kaby Lake"

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ASRock Updates Beebox-S Mini-PCs with Core "Kaby Lake" Processors

ASRock updated its Beebox-S line of mini-PC desktops with 7th generation Core "Kaby Lake" processors. These 110 mm x 46 mm x 118.5 mm (WxHxL) desktops come with two new processor options, Core i5-7200U, and Core i3-7100U. Both are dual-core chips, with the i5-7200U offering 2.50-3.10 GHz clock speeds (core/Turbo Boost), 3 MB L3 cache, and Intel HD 620 graphics; while the i3-7100U offers 2.40 GHz clocks (no Turbo Boost), 3 MB L3 cache, and HD 620 graphics.

Other internal features of the Beebox-S include two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2133 memory; one 32 Gb/s M.2-2280 slot with NVMe boot support, and one 9 mm-thick 2.5-inch drive bay with SATA 6 Gb/s interface. Network connectivity includes 802.11ac WLAN, Bluetooth 4.0, Infrared, and gigabit Ethernet. Display outputs include one each of HDMI 2.0 (supports 4K @ 60 Hz), HDMI 1.4, and DisplayPort 1.2a. Other features include two USB 3.0 ports, two USB 3.1 ports (of which one is type-C), and an infrared media remote. ASRock didn't reveal pricing.

Intel "Coffee Lake" Company's First 6-core Mainstream SKU

Intel's upcoming "Coffee Lake" micro-architecture, or the 9th generation Core processor family by Intel, is scheduled for launch in the second half of 2018. It succeeds the 8th generation "Cannon Lake" family of notebook processors (which likely doesn't see a desktop launch), and the 7th Gen Core "Kaby Lake" socket LGA1151 processors slated for January 2017. While it's not known if mainstream desktop "Coffee Lake" chips will continue to be based on the LGA1151 socket, the possibility is diminishing, looking at a platform layout diagram leaked to the web by Benchlife.info, supported by new connectivity interfaces coming out of the CPU package. The biggest selling-point of "Coffee Lake," is its core-count.

The 9th generation Core "Coffee Lake" family could introduce Intel's first 6-core processor to the mainstream desktop platform. The company's first 6-core client part was launched in its LGA1366 HEDT (high-end desktop) platform with the Core i7 "Gulftown" processor, way back in 2010. An increase in core-count from 4 has eluded the mainstream-desktop lineup. The 6-core "Coffee Lake" silicon will be built on a highly-refined 14 nm node by Intel, with a die-size of 149 mm². Quad-core parts won't be carved out of this silicon by disabling two cores, but rather be built on a smaller 126 mm² die. For reference, the quad-core "Kaby Lake" die is expected to be 123 mm², and the current quad-core "Skylake-D" die measures 122.6 mm².

AMD's Zen Rumored for January 17th Launch; 8 Cores With 16 Threads for $300

As we inch ever closer to AMD's Zen launch, more and more information seems to be slipping through the cracks. This time, MAXSUN, an AMD China partner (poised to provide customers with AM4 platform motherboards) is the source of the proverbial leak, with information that, if true, is sure to stir the pot of bubbling Zen excitement even more.

According to MAXSUN, Zen's initial release date is pegged for January 17th, which, if true, would probably mean a product announcement around CES 2017 (scheduled from the 5th of January through the 8th) - at the same time as Intel is expected to fully unveil their Kaby Lake parts. The company also reports a second release window at March 2017, which lends further credence to AMD's expected staggered launch of Zen-based processors, first for the High-Performance-Desktop (HEDT) market, and trickling down from there. MAXSUN also confirms the pricing scheme we reported yesterday, with regards to the companies' SR7 processors (the top-of-the-line parts in the Zen line-up, and whose naming scheme I think isn't the final one) - the company states these are expected to be priced at around 1500-2000 Yuan SKU ($250-$300).

ASRock Z270 Fatal1ty Motherboard Teased

Here are some of the first pictures of a production version of an ASRock Z270 Fatal1ty-branded motherboard. While there's no picture of the board in full, Expreview scored pictures of its key sections, including its CPU VRM area, showing us prominent "Z270" badging on a VRM heatsink, a Fatal1ty logo on the PCH heatsink and its print on the PCB; and an Intel Gigabit Ethernet on the rear I/O hood, and Creative Sound Blaster Cinema 3 logo on the audio area hood; all pointing to this being a production version.

The rear I/O picture reveals two gigabit Ethernet interfaces, provision for a WLAN card, four USB 3.1 ports (of which one is type-C), two USB 3.0 ports, 8-channel HD audio with a TOSLINK connector; and display outputs including DVI, D-Sub, and HDMI. Storage appears to include eight SATA 6 Gb/s ports, and at least one M.2 slot (with Intel Optane support out of the box). Not much else is revealed by these pictures. Intel 200-series chipset motherboards are expected to launch alongside 7th generation Core "Kaby Lake" processors, in January 2017.

Intel Readies Overclockable Core i3 "Kaby Lake" Processor

With early tests showing minimal CPU core performance gains (IPC) over the current-gen Core "Skylake" processors, Intel is taking a different approach to selling its 7th generation Core "Kaby Lake" processors to DIY PC enthusiasts. The lineup will have a third overclockable "K" processor SKU, besides the top-dog Core i7-7700K and the performance-segment Core i5-7600K. Intel is planning to spice things up for the sub-$200 market with an overclockable dual-core part, the Core i3-7350K.

The Core i3-7350K will be the company's first overclockable Core i3 part. The company had celebrated the 20th anniversary of the Pentium brand with an overclockable Pentium dual-core G3258 processor. The i3-7350K will feature an unlocked base-clock multiplier, letting you easily overclock it. The dual-core chip will feature HyperThreading, enabling 4 logical CPUs for the OS to address. Out of the box, it will come with clocks of 4.00 GHz, and 4.20 GHz Turbo Boost. It will also feature 4 MB of L3 cache. Interestingly, its TDP will be rated at 91W, the same as overclockable quad-core parts. The chip could likely come in a special PIB package that lacks a stock cooling solution. The chip is rumored to be priced at US $177.

Intel Readies Skylake-X As its Next High-end Desktop Platform

Intel's next high-end desktop (HEDT) platform to succeed the current "Broadwell-E" LGA2011v3 will be the X-series "Basin Falls" platform. This consists of the "Skylake-X" and "Kaby Lake-X" processors, and a chipset derived from Intel's upcoming 200-series. Just as Intel changed sockets for its previous three HEDT platforms (LGA1366 for "Nehalem" and "Westmere/Gulftown," LGA2011 for "Sandy Bridge-E" and "Ivy Bridge-E," and LGA2011v3 for "Haswell-E" and "Broadwell-E,") the company will launch a new socket, the LGA2066.

As with its HEDT predecessors, "Skylake-X" and "Kaby Lake-X" will be multi-core processors devoid of integrated graphics, with double the memory bus width and up to triple the PCIe lane budgets as the desktop ("Skylake-D," eg: Core i7-6700) processors. In an interesting move, Intel will launch both "Skylake-X" and "Kaby Lake-X" in quick succession, with a catch - "Skylake-X" will come in 6-core, 8-core, and 10-core variants; while the "Kaby Lake-X" will initially only be offered in quad-core. The "Kaby Lake-X" chip will further only feature a dual-channel memory bus, and the LGA2066 motherboard will have half its DDR4 DIMM slots disabled, besides a few PCIe lanes.

Future Intel Chipset to Feature WLAN Controllers and USB 3.1

The 7th generation Core "Kaby Lake" processor, and its companion 200-series chipset are almost upon us, with the company planning to launch them this 2017 International CES (early January). It looks like the 200-series chipset is turning out to be what the 9-series chipset was to the 8-series; with a handful new features, but nothing extraordinary. Current 100-series chipset motherboards are already receiving BIOS updates from manufacturers to make them support the new processors. It looks like the succeeding 300-series chipset, which Intel plans towards the end of 2017, could stand out.

Intel is reportedly equipping the 300-series chipset with wireless networking becoming part of the feature-set. This means at least some variants of the chipset could feature native WLAN controllers (likely with external PHY for signal clarity). The company is also planning to implement native 10 Gb/s USB 3.1 (gen 2.0) controllers into the chipset. This decision could impact third-party WLAN and USB 3.1 controller manufacturers, observes DigiTimes.

GIGABYTE to Sell AORUS Branded Motherboards and Graphics Cards from 2017

GIGABYTE is planning to expand its subsidiary AORUS into motherboards and graphics cards. The company currently sells gaming notebooks and gaming peripherals, including keyboards and mice, under the AORUS brand. This could be GIGABYTE's third attempt at establishing a premium motherboard/VGA brand that rivals ASUS Republic of Gamers and MSI Gaming Series; besides its G1.Gaming and Xtreme Gaming extensions under its main brand. AORUS is a brand unto itself, with products lacking any prominent GIGABYTE markings.

The first AORUS branded motherboards will be socket LGA1151, based on Intel's upcoming 200-series chipset, with out of the box support for 7th generation Core "Kaby Lake" processors. The motherboards will hit the shelves in January 2017. The first AORUS-branded graphics cards will launch when AMD and NVIDIA launch their next high-end GPUs (think NVIDIA GeForce GTX 1080 Ti and AMD "Vega"). Last we heard, the GTX 1080 Ti is headed for a January 2017 launch.

Intel Core i5-7600K Tested, Negligible IPC Gains

Ahead of its launch, a Core i5-7600K processor (not ES) made its way to Chinese tech publication PCOnline, who wasted no time in putting it through their test-bench, taking advantage of the next-gen CPU support BIOS updates put out by several socket LGA1151 motherboard manufacturers. Based on the 14 nm "Kaby Lake" silicon, the i5-7600K succeeds the current i5-6600K, and could be positioned around the $250 price-point in Intel's product-stack. The quad-core chip features clock speeds of 3.80 GHz, with 4.20 GHz max Turbo Boost frequency, and 6 MB of L3 cache. Like all its predecessors, it lacks HyperThreading.

In its review of the Core i5-7600K, PCOnline found that the chip is about 9-10% faster than the i5-6600K, but that's mostly only due to its higher clock speeds out of the box (3.80/4.20 GHz vs. 3.50/3.90 GHz of the i5-6600K). Clock-for-clock, the i5-7600K is just about 1% faster, indicating that the "Kaby Lake" architecture offers only negligible IPC (instructions per clock) performance gains over the "Skylake" architecture. The power-draw of the CPU appears to be about the same as the i5-6600K, so there appear to be certain fab process-level improvements, given the higher clock speeds the chip is having to sustain, without a proportionate increase in power-draw. Most of the innovation appears to be centered on the integrated graphics, which is slightly faster, and has certain new features. Find more performance figures in the review link to PCOnline below.

Intel Kaby Lake Desktop Processors Specifications Detailed In Official Documents

News and specifications about Intel's upcoming Kaby Lake-based desktop CPUs are thin, but a recent leak has made it possible to discern at least some details, due to an Intel product change notification (PCN) document.

A PCN is a document issued by a manufacturer to inform customers about a change to a mass-produced product or its manufacturing process. In this PCN, Intel details a new factory in Vietnam which will work in order to "ensure a continuous supply of the Select Intel Xeon Processor E3-1205, Intel Core i5-7400 Processor, Intel Core i5-7400T Processor, Intel Core i5-7500 Processor, Intel Core i5-7500T Processor, Intel Core i5-7600 Processor, Intel Core i5-7600K Processor, Intel Core i5-7600T Processor, Intel Core i7-7700 Processor, Intel Core i7-7700T Processor and Intel Core i7-7700K Processor products".
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