TEAMGROUP, the world's leading memory brand, today joins forces with motherboard leader ASRock and release the cobranded Phantom Gaming RGB solid state drive and RGB memory. Both of them are certified and strictly tested by ASRock Phantom Gaming and their lighting effects can be both synchronized with motherboard and officially presented in CES 2019.

The read/write speed performance of T-FORCE DELTA Phantom Gaming RGB SSD(5V) is fully evolved, you can upgrade your computer easily; T-FORCE XCALIBUR Phantom Gaming RGB luminous memory uses high quality OEM IC chips, and also has an eye-catching 120° wide angle RGB lighting range. The easy overclocking feature also receives top recommendations from gamers.

Capellix is an innovation new RGB LED design by Corsair, which has significantly reduced size, power-draw, while offering increased brightness and durability, compared to conventional SMD LEDs. You can read all about these in our older article. The first product to implement Capellix is Corsair's upcoming flagship memory series, the 2019 Dominator Platinum RGB. These modules each feature 12 individually addressable Capellix aRGB LEDs, which take up significantly lower PCB real-estate than SMD LEDs on older generations of Corsair memory modules.

A silicone diffuser puts out light from these diodes through slits along the sides and top of the modules. The LEDs are fully compatible with Corsair iCUE software, in addition to pretty much any addressable-RGB software. The modules themselves feature hand-binned DRAM chips, cooled by die-cast, micro-arc oxidized anodized aluminium heatspreaders. The first of these could be out in February 2019.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that it will be in Las Vegas during this year's CES to showcase its exciting new products for gamers, overclockers, PC enthusiasts, and general users. Under the theme of "Innovating the Future," ADATA will be presenting its latest hardware including solid-state drives (SSD), memory modules, and gaming accessories. ADATA will be showcasing its products from January 9-12, 2019.

RAIDMAX launched the MX-902F, a set of two heatspreaders for full-length DDR4 thru DDR2 memory modules, which add RGB multi-color LED bling. The heatspreaders are made of an aluminium alloy, with silicone diffusers for five addressable RGB LEDs that can put out 16.7 million colors. Each of the two heatspreaders take in standardized 3-pin addressable-RGB input, and daisy-chain a single aRGB source between the two heatspreaders. The heatspreaders are 51 mm tall (factor in some additional height when installed with a module), 8 mm-thick, and 127 mm long. The company didn't reveal pricing.

TEAMGROUP is proudly announcing the T-FORCE has done to the apex again, work with world's Korean renown overcloker, SAFEDISK, by using the T-FORCE XTREEM DDR4 4500 MHz modules all the way grabbed the world record of SUPER PI 32m calculation, successfully beat all the powerful professional overclockers from HWBOT and all over the world. This excellent performance of T-FORCE XTREEM made the possibility of completion on SUPER PI 32m calculation within 4 minutes and 5 seconds which is unbelievably amazing!

SUPER PI is a significant DRAM module overclocking benching application, also a way to check the overall module specification stability. This time T-FORCE understands need to show the high performance and stability in front of all the users. Thus works with SAFEDISKset up the test environment including T-FORCE XTREEM DDR4 4500 MHz module, Intel Core i9 9900K "Coffee Lake Refresh" CPU and ASUS ROG Maximus IX Apex motherboard. Without a doubt, the world record has been posted at HWBOT and all over the public platform in front of everyone to be the witness of all this awesome performance record from T-FORCE module.

When GIGABYTE originally launched the Aorus RGB Memory DDR4-3200 16GB dual-channel memory kit, it included a pair of dummy modules that resemble the real thing, and let you fill up the blank memory slots of your motherboard. Dummy modules add to the cost, and some users simply don't prefer them, and so the company introduced a new kit bearing the SKU "GP-AR32C16S8K2HU416R," which lacks these dummies.

You get two 8 GB memory modules making up the 16 GB dual-channel kit, each with a chunky 2 mm-thick aluminium heatspreader capped by an acrylic diffuser that puts out light from five addressable RGB LEDs. These modules pack an XMP 2.0 profile that runs them at DDR4-3200 with 16-18-18-38 timings, at 1.35 V. Although the company doesn't specify which brand of DRAM chips it's using, it mentions support for both Intel and AMD platforms.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235B is available for download from the JEDEC website.

JEDEC standard JESD235B for HBM leverages Wide I/O and TSV technologies to support densities up to 24 GB per device at speeds up to 307 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard can support 2-high, 4-high, 8-high, and 12-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB - 24 GB per stack.

Earlier today we brought you the story of the Corsair Vengeance Pro RGB Lighting Enhancement kit, a $40 pair of dummy modules that fill up your vacant DIMM slots, a solution that polarized our readers to call it both genius and dumb. Thermaltake has a saner solution to fix your memory lighting woes - the Pacific R1 Plus Memory Lighting kit. This accessory latches on to your DIMM 4-slot cluster much like memory air coolers, but instead provides four LED diffusers that gives the appearance of four RGB LED illuminated modules. The best part is you can have any type of standard-height memory underneath, DDR2-thru-DDR4.

The top with four diffusers plugs into a single addressable RGB header. Each diffuser has 9 LEDs underneath, totaling 36. If you don't have an aRGB-capable motherboard, Thermaltake is also including an RGB controller module that lets you plug the kit into a USB 2.0 header and control via the company's own TT RGB Plus app. Measuring 156 mm x 51.1 mm x 43 mm (WxHxD), it weighs about 168 g. The company didn't reveal pricing.

INNO3D, a leading manufacturer of pioneering high-end multimedia components and various innovations including the recent addition high performance gaming iCHILL Memory. Its introduction to the market has been very well received due to the various capacities that the iCHILL memory series offers including 4GB to 16GB at speeds of 2400MHz to 4000MHz and with ultra-low latencies up to 15CL.

INNO3D has done wonders with the iCHILL series over the last decade in the graphics department so wanted to apply the same principles, intricacies and devotion to creating a series of performance gaming memory with the ice cool touch. The iCHILL memory modules are equipped with a unique heat spreader design that optimizes system performance for smoother gaming experience with that extra kick to your PC.

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, has announced the release of their fastest kit ever of DDR4 memory today, VIPER STEEL SERIES DDR4 16GB (2x 8 GB) 4400 MHz. Built for the latest Intel and AMD platforms, the VIPER STEEL SERIES provides extreme performance and stability for the most demanding computer environments. The VIPER STEEL SERIES DDR4 memory kit brings Intel XMP 2.0 performance to new heights and is able to achieve up to 4400 MHz with a simple setting on supporting Intel's latest processors and motherboards.

The VIPER STEEL SERIES utilizes a custom designed high-performance aluminum heatshield for providing optimal heat dissipation when overclocking and foregoing high-performance tasks. These hand-tested memory modules feature the highest quality memory chips and are running performance timings of CL19-19-19-39 at 1.45 V. VIPER STEEL SERIES DDR4 4400 MHz is optimized for PC enthusiasts, overclockers, or those who want to push their system's performance to the limit through the use of extremely fast components.

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers today announced the new additions to their SUPER LUCE RGB SYNC Series DDR4 memory. The new modules are available in three capacities and speeds: 4133 MHz 16 GB (8 GB x2) CL19-19-19-39 1.40 V, 3600 MHz 16GB (8 GB x2) CL16-18-18-36 1.35 V, and 3200 MHz 16 GB (8 GB x2) CL14-14-14-34 1.35V

The 4133 MHz 16 GB (8 GB x2) CL19-19-19-39 1.40 V DDR4 kits can be the overclocker's new favorite with support for most ASUS, GIGABYTE, MSI and ASROCK Z390 and Z370 motherboards as well as giving enthusiasts the room to push their systems to the limit without exception. The 3600 MHz 16GB (8 GB x2) CL16-18-18-36 1.35 V DDR4 kits meets the memory needs for any gaming system using the latest Intel platforms and is an excellent solution for first time overclockers. The 3200 MHz 16 GB (8GBx2) CL14-14-14-34 1.35 V DDR4 kits are compatible with both Intel and AMD AM4 platforms and feature a low latency design to enhance performance and offer the most affordable upgrade option for users.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is launching Trident Z Royal series DDR4 RGB memory kits, featuring a patent-pending full-length crystalline light bar upon a polished heatspreader in gold or silver with stunning 8-zone RGB lighting. The patent of the crystalline design on PC components has been applied for across major countries. Available in high-speed specifications, the Trident Z Royal is first available from DDR4-3000MHz to DDR4-4600MHz at launch. With the perfect marriage of RGB lighting and speed, the Trident Z Royal is the ideal memory kit for any high-class system build.

Trident Z Royal is the latest addition to the Trident Z flagship family, featuring a crown jewel design. Meticulously crafted to display just the right amount of light refraction, the crystalline light bar scatters the RGB colors in a magnificent display of LED lighting. Complementing the patented high-class light bar design, polished aluminum heatspreaders of gold or silver colors cools the memory modules in the award-winning classic Trident Z tri-fin design. And to help maintain the pristine shine of the heatspreaders, each Trident Z Royal memory kit comes with a piece of microfiber cloth to let you wipe away fingerprints and dust.

Micron Technology, Inc., today announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology. GDDR6 is optimized for a variety of demanding applications, including machine learning, that require multi-terabit memory bandwidth and will enable Achronix to offer FPGAs at less than half the cost of FPGAs with comparable memory solutions.

Achronix's high-performance FPGAs, combined with GDDR6 memory, are the industry's highest-bandwidth memory solution for accelerating machine learning workloads in data center and automotive applications.

This new joint solution addresses many of the inherent challenges in deep neural networks, including storing large data sets, weight parameters and activations in memory. The underlying hardware needs to store, process and rapidly move data between the processor and memory. In addition, it needs to be programmable to allow more efficient implementations for constantly changing machine learning algorithms. Achronix's next-generation FPGAs have been optimized to process machine learning workloads and currently are the only FPGAs that offer support for GDDR6 memory.

Micron Technology, Inc., today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications. This latest generation of Micron's LPDDR4 memory brings key improvements in power consumption while maintaining the industry's fastest LPDDR4 clock speeds, thereby delivering advanced performance for next-generation mobile handsets and tablets. In addition, Micron's 12Gb LPDDR4x doubles memory capacity to offer the industry's highest-capacity monolithic LPDDR4 without increasing the footprint compared to the previous generation product.

The exponential increase in usage of compute and data-intensive mobile applications such as artificial intelligence (AI), augmented reality (AR) and 4K video has been accompanied with demands by mobile users to maximize battery life and performance and increase capacity. Next-generation mobile devices that integrate multiple high-resolution cameras and increasingly use AI for image optimization also require higher DRAM capacities to support these features.

As the industry transitions towards deployment of 5G mobile technology, the memory subsystem in mobile handsets will have to support these dramatically higher data rates and the associated processing of data in real-time. New applications built upon 5G technology will also be able to leverage the increased capabilities of the memory subsystem to enable new and immersive user experiences.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced several groundbreaking additions to its comprehensive semiconductor ecosystem that encompass next-generation technologies in foundry as well as NAND flash, SSD (solid state drive) and DRAM. Together, these developments mark a giant step forward for Samsung's semiconductor business.

"Samsung's technology leadership and product breadth are unparalleled," said JS Choi, President, Samsung Semiconductor, Inc. "Bringing 7 nm EUV into production is an incredible achievement. Also, the announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries. Together, these additions to Samsung's comprehensive technology ecosystem will power the next generation of datacenters, high-performance computing (HPC), enterprise, artificial intelligence (AI) and emerging applications."

Silicon Power (SP) introduced the XPOWER line of gaming DDR4 memory modules today. The XPOWER AirCool and Turbine DDR4 are designed and engineered to handle complex computing tasks with ease and ensure the most realistic picture quality, higher resolutions, and smoother 3D renders and transitions for gamers and modders. With the rising popularity of role-playing, first-person shooter, and massively multiplayer online games like PUBG and StarCraft, SP aims to give its customers the best memory upgrade user experience.

The high-quality RAMs feature speeds up to 4133 MHz at a low 1.4V power consumption. Designed to support the most dedicated gamers and modders, the XPOWER AirCool and Turbine DDR4 are the premier choices for a powerful and affordable memory upgrade. Both The XPOWER AirCool and Turbine DDR4 combine performance with compatibility and are both 100% tested for stability, durability, and compatibility in a range of rigs. As an added plus to kickstart a bold new direction for the memory storage company, SP has added a cool blue heat sink to the Turbine memory module to keep gamers safe from overheating complications.

GIGABYTE expanded its teething DDR4 memory lineup with a new 16 GB (2x 8 GB) dual-channel DDR4 memory kit, called simply "GIGABYTE Memory 2666MHz." These modules lack the Aorus branding featured on the company's very first DDR4 modules. You instead get 32 mm tall, 7 mm-thick modules with a restrained design, and plain GIGABYTE branding.

One area where the company refined its design is the heatspreaders, which are thicker, and have more mass to them, even if they lack finnage. GIGABYTE's module does what it says on the tin - DDR4-2666 with 16-16-16-35 timings, at 1.2 Volts. Out of the box, it packs both JEDEC and XMP SPD profiles. Memory controllers that support DDR4-2666 (such as Intel "Coffee Lake" and later), should run it at the advertised speeds without any user intervention. For older platforms, an XMP 2.0 profile helps achieve the advertised settings. The modules are backed by lifetime warranty.

Ukrainian PC enthusiast and software developer 1usmus today released DRAM Calculator for Ryzen version 1.4.0. This utility was formerly known as "Ryzen DRAM Calculator," which has since been voluntarily renamed by the author in the interest of avoiding any future trademark conflict with AMD, or giving users the impression that the software has been made by AMD. The change in name doesn't change the fact this could be your go-to app to figure out the best memory settings for your AMD Ryzen-powered machine.

PC enthusiasts usually only remember 4 or 5 DRAM timing settings besides DRAM clock and voltage, letting the motherboard BIOS figure out the rest of the stable values, which could often be looser than needed. DRAM Calculator for Ryzen figures out nearly every under-the-hood timing, voltage, clock-speed, and other setting needed to make the most out of your memory overclock. You can also make the app work out "safe," "stable," and "extreme" variations of its own calculations. Version 1.4.0 isn't just a name-change for the application. It introduces a large number of critical updates to the app that improve accuracy and functionality.

DOWNLOAD: DRAM Calculator for Ryzen v1.4.0The change-log follows.

Smartphones or TVs may be Samsung's most popular products, but they are certainly not the most profitable for the company. The South Korea electronics giant has announced its estimates for the third quarter of the year, and that data points to the company achieving the highest operating profit in its entire history. Samsung is set to reach 17.5 trillion won ($15.8 billion), up 20% from the same period last year. Not only that: revenues will also reach a record 65 trillion won ($57.3 billion), almost 5% more than last year.

The surprise of these results lies precisely in the products that have been the main protagonists of these revenues and profits. It wasn't smartphones, and in fact in the second quarter those lost more market share than any other manufacturer with a Galaxy S9 and a Galaxy S9+ whose sales haven't been as good as expected. TVs weren't that succesful either.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is proud to announce the launch of its latest product to be part of its illustrious iGame series of high-performance parts. The new iGame DDR4 memory features speeds up to DDR4-3200 and sports the new, custom heatspreader from COLORFUL which fits in the iGame series theme. The new iGame memory features RGB lighting and supports for ASUS AURA Sync controls so you can customize the lighting to your personal style.

COLORFUL has designed the iGame DDR4 memory to compliment the full line of COLORFUL iGame products. Its heatspreaders feature an aggressive, gamer styling featuring the new iGame logo. Across the top is the lighting module capable of RGB lighting to give users full control of what they want their memories to look. The heatspreaders also add great cooling to the product ensuring consistent and reliable performance even in under instense gaming load.

Toshiba Memory Corporation and Western Digital Corporation today celebrated the opening of a new state-of-the-art semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan. Toshiba Memory started construction of Fab 6, a dedicated 3D flash memory fabrication facility, in February 2017. Toshiba Memory and Western Digital have installed cutting-edge manufacturing equipment for key production processes including deposition and etching. Mass production of 96-layer 3D flash memory utilizing the new fab began earlier this month.

Demand for 3D flash memory is growing for enterprise servers, data centers and smartphones, and is expected to continue to expand in the years ahead. Further investments to expand its production will be made in line with market trends. The Memory R&D Center, located adjacent to Fab 6, began operations in March of this year, and will explore and promote advances in the development of 3D flash memory. Toshiba Memory and Western Digital will continue to cultivate and extend their leadership in the memory business by actively developing initiatives aimed at strengthening competitiveness, advancing joint development of 3D flash memory, and making capital investments according to market trends.

Memory subsystems are an important part of graphics workloads, and both AMD and NVIDIA have always been looking to cross the cutting-edge of tech in both GPU production and memory fabrication technologies. AMD has been hitching itself to the HBM bandwagon with much more fervor than NVIDIA, albeit with somewhat lukewarm results - at least from a consumer, gaming GPU perspective. NVIDIA has been more cautious: lock HBM's higher costs and lower availability to higher-margin products that can leverage the additional bandwidth, and leave GDDR to muscle its way through consumer products - a strategy that has likely helped in keeping BOM costs for its graphics cards relatively low.

As it stands, Micron was the only company with both the roadmap and production volume to be NVIDIA's partner in launching the RTX 20-series, with products above (and including) the GTX 2070 all carrying the new high-performance memory subsystem. Micron has already announced GDDR6 memory as a product back in 2017, with sampling by the beginning of 2018 and mass volume production by June - just enough time to spool up a nice inventory for new, shiny graphics cards to come out in September. Of course, this ramp-up and initial Micron leadership doesn't mean they will be the only suppliers for NVIDIA - however, it's safe to say they'll be the most relevant one for at least a good while.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory is being used in NVIDIA's new Turing architecture-based Quadro RTX GPUs.

Thanks to Samsung's industry-leading 16Gb GDDR6 memory, end users can expect improved performance and energy efficiency in the widest array of graphics-intensive applications, including computer-aided design (CAD), digital content creation (DCC) and scientific visualization applications. Samsung's 16Gb GDDR6 can also be used in rapidly growing fields such as 8K Ultra HD video processing, virtual reality (VR), augmented reality (AR) and artificial intelligence (AI).

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of the XPG SPECTRIX D41 TUF Gaming Edition DDR4 RGB memory module. The special edition memory module is TUF Gaming Alliance-certified, which means it has passed rigorous testing to meet the stringent standards of the alliance. While this memory module offers the same great performance and dazzling programmable RGB lighting as the original model, it sports a more combative look via its black heat spreaders with yellow trimming.

SK Hynix Inc. today announced that the Company will construct a new semiconductor fabrication plant (or 'the FAB') at its headquarters in Icheon, Gyeonggi-do, to respond to growing demand for memory chips and to secure a future growth engine.

Construction on the 53,000 m² site in Icheon will begin late 2018 and is slated to be completed in October 2020. SK Hynix will invest 3.5 trillion won in the FAB. The production portfolio of the FAB shall be decided considering future market conditions as well as the Company's technology capability.