Montage Technology today announced the sampling of its Gen 6 DDR5 Registering Clock Driver chip (RCD06) with key customers. Designed for next-generation DDR5 Registered Dual In-line Memory Modules (RDIMMs), the chip is set to accelerate performance and reliability for upcoming server platforms.

The RCD06 supports data transfer rates of up to 9200 MT/s, a 15% increase over the previous generation, addressing the stringent high-bandwidth demands of next-generation server platforms. The chip features a dual-channel independent architecture in which both sub-channels share clock logic while operating independently, enabling separate parity checking without cross-channel interference. The device also integrates Continuous Time Linear Equalization (CTLE) and a low-jitter Phase-Locked Loop (PLL), improving signal integrity while ensuring precise and stable clock distribution.

Following a record-setting year for the semiconductor industry, the start of the new year has continued the momentum, as semiconductor revenue grew 27% in 1Q26 from 4Q25 to reach $319bn, according to new research form Omdia. Memory revenue drove the increase, rising over 80% sequentially in 1Q26 from 4Q25.

Since Omdia began tracking the semiconductor market at a quarterly level in1Q02, this 27% quarter-over-quarter (QoQ) growth is the highest observed. The market has now experienced three consecutive quarters of double-digit revenue growth, with 2Q26 expected to continue this pattern. This puts semiconductor revenue on track to surpass $700bn in 1H26. AI-related demand remains strong, while memory supply/demand imbalances continue to be among the leading trends in the semiconductor market.

TwinMOS brought a couple of their high-end memory and storage products targeting gamers and enthusiasts. The TwinMOS Volt X RGB is the company's enthusiast PC DDR5 memory kit that features ARGB LED lighting that can be controlled with popular RGB platforms such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, and ASRock Polychrome Sync. It comes in conventional densities of 32 GB per module, sold in single-module packs; and offers speeds of DDR5-6000 with CL36.

Next up, is the TwinMOS Core X Pro, the company's flagship M.2 NVMe Gen 5 SSD that comes in 1 TB, 2 TB, and 4 TB capacities, and uses a controller with DRAM cache. It uses 3D TLC NAND flash, and offers sequential read speeds of up to 14 GB/s. The drive lacks any cooling solution of its own, you're expected to use the M.2 SSD heatsink of your motherboard.

XPower, the brand of Silicon Power targeting gamers and PC enthusiasts, showcased their latest high-end DDR5 memory kits, and SSDs. The star attraction in their booth was the XPower Cyclone ASUS ROG Certified DDR5 memory. This memory comes with ARGB LED diffusers that support ASUS Aura Sync RGB, and which you can control from the Armoury Crate application. These modules feature DDR5-6000 with AMD EXPO-ULL (ultra-low latency) profiles. The wider XPower Cyclone series comes in 64 GB (2× 32 GB), 48 GB (2× 24 GB), 32 GB (2× 16 GB), and 16 GB kits, with speeds of DDR5-6000, DDR5-7200, and DDR5-8000, with CAS latencies ranging from CL28 to CL40; and module voltages between 1.35 V and 1.45 V.

Next up, is the new Silicon Power XPower XS90, an enthusiast-segment M.2 NVMe Gen 5 SSD that comes in capacities of 1 TB, 2 TB, and 4 TB. The read speeds on all three variants is up to 14.3 GB/s. While the 2 TB and 4 TB variants write at up to 13.4 GB/s, the 1 TB variant writes at up to 10.5 GB/s. The company didn't specify controller, but mentioned that it has DRAM cache.

ADATA brought its two key brands to Computex 2026, XPG targeting gamers and PC enthusiasts; and TRUSTA, targeting enterprise storage. The XPG Novakey RGB DDR5 memory is a high-end DDR5 memory module with an infinity-reflection element framing its ARGB LED lighting setup. The module comes in speeds of up to DDR5-8000. The company is working on high-end memory products based on new standards, such as DDR5 CUDIMMs with speeds in excess of 10000 MT/s; and new AMD EXPO-ULL kits with tight latencies. The company also showcased its Premier series 4R CUDIMM (quad-rank). The module offers 128 GB of density with speeds of DDR5-7200 with CL58 and 1.1 V module voltage.

Switching gears to storage products, and we are greeted by the company's first SD 7.1 microSDXC card with a whopping 1 TB capacity, and sequential speeds of up to 800 MB/s reads, with up to 700 MB/s writes. The ADATA Urban Pocket Elite is a surprisingly compact portable SSD with a 40 Gbps USB4 interface, offering speeds of 4 GB/s sequential reads, with 3.6 GB/s sequential writes. The drive looks very similar to the SE920 from 2024, but lacks the fan, relying instead on passive cooling. The ADATA Urban Tapsafe, a portable SSD that comes in 1 TB and 2 TB capacities, with a 20 Gbps USB 3.2 Gen 2x2 interface, with transfer speeds of up to 1.9 GB/s, and a unique NFC-based data security mechanism that binds it to your smartphone.

If you think about it, an M.2 NVMe SSD isn't conceptually different from an NES cartridge, so you shouldn't need a USB/Thunderbolt enclosure to treat your M.2 SSD like a portable storage device, or so argues Lexar. The company innovated a concept for Mini-PCs and desktops that calls for a robust M.2 slot that can take many insertions, and for an M.2 SSD to be encased in a metal jacket (not an enclosure, just a jacket). The SSD is then inserted into a 25 mm-wide slot on the front-panel of a mini PC, directly into the M.2 slot that's wired to the processor or chipset, thereby eliminating all other overheads.

The Mini-PC you see is a prototype by ASUS. There is of course the problem that neither PCIe isn't practically a hot-pluggable standard, which is why Thunderbolt and USB 3 came to existence in the first place as hot-pluggable link layers on top of a serial physical layer. The company also showcased the AI-Grade Gen 5 x4 NVMe SSD. This M.2 NVMe drive that's probably based on a DRAMless controller. Driving Lexar's effort is the ability to treat the SSD like memory, so the LLM can load larger models, using a 3-tiered memory hierarchy. The GPU's video memory is at L1 due to its highest bandwidth and least latency to the GPU. Then comes the system memory, larger but relatively slower; and finally, NVMe SSDs. Lexar claims that this approach has found to relieve memory footprint by at least 40%.

Golden Emperor Industries (GeIL) brought its latest high-end PC and workstation memory to the 2026 Computex. We begin our tour with the company's latest CAMM2 and LPCAMM2 modules. The CAMM2 module comes in speeds of up to DDR5-8000, and helps you save on Z-Height around the CPU socket area. For ultraportable notebooks and mini PCs, the company released its LPCAMM2 modules, which bring full bus-width LPDDR5X memory in a replaceable form-factor.

4R DDR5 (quad-rank) is the flavor of the season, and GeIL showed us their latest products targeting workstations and AI inferencing machines. The first one is a 256 GB (128 GB ×2) DDR5 CQDIMM kit. Next up, is a quad-rank DDR5 RDIMM that comes in DDR5-6400 speeds, and per-module capacities of 256 GB, 128 GB, 96 GB, 64 GB, and 32 GB. There is, curiously, also a DDR4 RDIMM, which packs up to 128 GB per module, and runs at DDR4-3200.

Team Group brought a large selection of new products to Computex 2026 across its main brand, the T-Force brand targeting PC enthusiasts, and the T-Create brand targeting creative professionals and AI developers. We begin our tour with the new Team Group T-Force Vulcan DDR5 CAMM2 module. Intended to be installed along the plane of the motherboard, CAMM2 modules conserve Z-Height around the CPU socket, and are dual-channel memory modules. The T-Force Vulcan CAMM2 somes with a thick heat spreader with a carbon fiber decal on top. Next up, is the T-Force Delta CAMM2, which is among the first CAMM2 modules we've seen with an ARGB LED lighting setup. Both these CAMM2 modules offer speeds of DDR5-8000. The T-Force DARK Low-Profile RGB are a line of DDR5 UDIMMs with reduced Z-Height, yet featuring ARGB LEDs. These come in mid-range speeds of DDR5-6400.

Next up, is the T-Create Expert AI 4R CUDIMM, a quad-rank memory module with CKD. A single module offers 128 GB of density across four ranks, along with speeds of DDR5-8000 and timings of 64-64-64-128, at 1.1 V. Team Group demoed this module on an MSI MEG Z890 Unify-X motherboard that has a 1 DIMM per channel topology. The new T-Create Master AI DDR5 RDIMM series is targeted at HEDTs and workstations that support ECC RDIMMs. The module shown offers 64 GB of density (per module), with DDR5-7600 speed at CL38. Winding things up on the memory front is the T-Create Expert AI LPCAMM2 for notebooks and mini-PCs that support LPDDR5X.More pictures follow.

Apacer at the 2026 Computex showed off its latest PC memory and storage products under its own brand, and under its ZADAK brand targeting PC enthusiasts and gamers. We begin our tour with its enthusiast-segment PC memory. The company showcased the NOX series of DDR5 memory kits under its main marquee. The new Apacer NOX CUDIMM comes in out-of-the-box frequencies ranging between DDR5-8400 and DDR5-9200, with capacities of 16 GB, 24 GB, and 32 GB per module. The modules are crowned by silicone ARGB diffusers.

The ZADAK PRO RGB DDR5 series of memory are conventional DDR5 DIMMs that come in speeds ranging between DDR5-6000 and DDR5-8000. The ZADAK PRO ROG Certified memory comes in DDR5-6000 with CAS latencies as low as 28. We're not sure if these feature EXPO-ULL. We've also seen the Apacer NOX RGB DDR5 series from last year, which come in DDR5-5200 to DDR5-8000 speeds. Winding things up on the memory front are the Apacer Panther RGB DDR5 series of mainstream memory kits that range between DDR5-5200 and DDR5-6800.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory, is showcasing an ultra-high speed DDR5 CU-DIMM 32 GB (2× 16 GB) memory kit operating at an impressive DDR5-9200 CL74-74-74-148 speed with only 1.1 V DRAM voltage, validated on the flagship MSI MEG Z890 GODLIKE motherboard platform.

As memory performance continues to advance, balancing high frequency and operation voltage has become increasingly important. Demonstrating the quality of G.SKILL's memory engineering and IC selection process, this DDR5-9200 32 GB (2× 16 GB) CU-DIMM kit is able to achieve an extreme memory frequency while operating at the standard JEDEC voltage level of just 1.1 V. This demonstration highlights the potential of next-generation DDR5 memory technology, where users can benefit from higher bandwidth while maintaining lower power consumption and thermal output.

Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun shipping the industry's first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market.

Following the industry's first mass production and commercial shipment of its industry-leading HBM4 earlier this year, Samsung now extends its HBM roadmap with the introduction of HBM4E samples, addressing the rapidly evolving demands of AI computing and hyperscale infrastructure.

The shift in AI development from large-scale model training toward inference-centric Agentic AI applications is driving a structural expansion in memory demand, according to TrendForce's latest findings on the memory industry. With the resulting supply deficit unlikely to be resolved in the short term, prices are set to rise further.

TrendForce has therefore significantly raised its global memory market forecasts, increasing its 2026 estimate from US$551.6 billion in the previous report to $889.3 billion. Meanwhile, the 2027 forecast has been revised upward from $842.7 billion to more than $1.28 trillion, representing annual growth of approximately 44%.

TRUSTA, the enterprise storage brand of memory leader ADATA Technology Co., today will officially launch the TRUSTA AI Scaler Extended Memory Solution. As an industry pioneer, TRUSTA introduces the AI Scaler Toolkit as the core of the solution, extending AI model deployment beyond GPU-only architectures to system memory and high-speed SSDs. This software-hardware integrated solution helps enterprises overcome GPU memory limitations and reduce AI deployment costs by more than 50% in model inference and fine-tuning scenarios.

The launch also marks ADATA's evolution from a memory and storage brand into a software-hardware integrated solution provider, reinforcing its commitment to building more efficient, scalable, and flexible on-premises AI infrastructure for global enterprises. Research firms project AI infrastructure to grow at a CAGR of approximately 26% through 2034, while more AI deployment are moving beyond cloud services and into a new phase of enterprise-built and edge deployment. As organizations build out AI infrastructure, factors such as data privacy, regulatory compliance, cost controllability, and data gravity have led TRUSTA to introduce a new concept: how to establish a more economical and scalable memory configuration across GPU, DRAM, and SSD, on-premises.

Global memory and storage technology leader Team Group Inc. is set to showcase its latest innovations at COMPUTEX 2026, taking place from June 2 to 5. Under the themes "100% Secure Your Data, Your Technology!" and "Awaken AI, Drive Evolution," Team Group will spotlight breakthrough advancements at Booth P1225 (TaiNEX 2) and Booth I0407a (TaiNEX 1) of the Taipei Nangang Exhibition Center. Global media and industry partners are warmly invited to visit and witness Team Group's long-term strategic development across the enterprise, industrial, and gaming sectors.

Team Group has remained committed to product innovation and technological advancement, continuously driving the evolution of storage solutions across the industry. Its proprietary "One-Click Data Destruction" mechanism, applied to both industrial-grade and consumer products, has successfully secured invention patents in Taiwan and the United States. Such innovation underscores the company's robust engineering expertise and technological leadership. Leveraging advanced R&D capabilities and internationally recognized certifications, Team Group empowers users worldwide with industry-leading protection for confidential data and reliable data security solutions.

Silicon Power (SP) announces the launch of the ROG certified XPOWER Cyclone R DDR5 memory module, the latest addition to its performance-focused XPOWER gaming lineup. The new module will be showcased at COMPUTEX 2026, underscoring Silicon Power's continued push into high-performance gaming hardware designed for next-generation PC ecosystems.

ROG Certified for Next-Generation Gaming Systems
Developed in close collaboration with ASUS and validated through extensive testing within the ROG ecosystem as part of the brand's 20th anniversary initiatives, the XPOWER Cyclone R carries the prestigious ROG (Republic of Gamers) Certified badge, a validation reserved for components that meet ASUS's rigorous standards for compatibility, stability, and gaming performance across its premium platform ecosystem.

Corsair, a global leader in high-performance gaming peripherals and enthusiast PC components, today announced Corsair SHUGO DDR5, a limited-edition enthusiast memory series created for builders who see the machine as both a performance PC and a personal design statement. At the center of SHUGO DDR5 is a distinctive visual construction that elevates memory from a hidden component into a defining element of the build. Each module features premium aluminium heat spreaders, high-resolution UV printing, and precision pad printing to create a layered, collector-grade appearance. The launch designs, ONYX BLADE and SAKURA NOA, were developed in collaboration with community artists to bring originality, craftsmanship, and visual identity to premium DIY systems.

SHUGO DDR5 also introduces Corsair patent-pending light-emitting micro-drilling technology, which allows RGB lighting to shine through the side of the module and become part of the artwork itself. Each SHUGO design incorporates its own micro-hole pattern, creating lighting effects that emerge from the art rather than sitting apart from it. The result is a memory series designed to look intentional from every angle inside a showcase PC.

Micron Technology, Inc. (Nasdaq: MU) today is celebrating the start of 1α (1-alpha) DRAM manufacturing at its Manassas, Virginia, fab, an important step in the company's efforts to significantly expand U.S. memory manufacturing. As the only United States manufacturer of memory, Micron is uniquely positioned to strengthen America's domestic memory supply. The 1α DRAM node, the most advanced memory technology ever produced in the United States, is well suited to long-lifecycle memory for critical applications, including DDR4 and LP4 products. Micron's Virginia manufacturing expansion serves the automotive, defense and aerospace, industrial, networking and medical device sectors that depend on this kind of memory.

Senior U.S. and Virginia officials join Micron at Manassas fab to mark the milestone
Micron Chairman, President and CEO Sanjay Mehrotra and other executives will host the event, with remarks delivered by U.S. Secretary of Commerce Howard Lutnick, U.S. Trade Representative Ambassador Jamieson Greer, U.S. Sen. Mark Warner, U.S. Sen. Tim Kaine and Virginia Speaker of the House Don Scott. They will be joined by other distinguished guests from the Trump Administration, Congress, the Commonwealth of Virginia and local governments, customers, suppliers, the business community and partners from area academic institutions, nonprofits and other community groups.

TetraMem Inc., a Silicon Valley-based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22 nm multi-level RRAM-based analog IMC system-on-chip (SoC).

The achievement marks a significant step toward the commercialization of analog computing architectures based on emerging non-volatile memory technologies, addressing the growing challenges of data movement, power consumption, and thermal constraints in modern AI systems.

ASUS is entering the enthusiast PC memory market segment with its first ROG branded DDR5 memory kits. The company has launched these memory kits in China, and VideoCardz reports that BIWIN is the OEM behind the kit. The module comes with the distinct black+red ROG color scheme with gold accents commemorating 20 years of the ROG brand. ASUS recommends pairing the memory with its limited edition ROG Crosshair X870E 2006 20th Anniversary Edition motherboard.

The kit comes with a capacity of 48 GB, with two 24 GB DIMMs. These run at DDR5-6000 with tight timings of 26-36-36-76. The module includes both AMD EXPO and Intel XMP profiles for broad compatibility, but with a special "ROG Mode" profile extension that works on ASUS ROG Crosshair, ROG Maximus, and ROG Strix motherboards. The modules are crowned by an ARGB LED kit that's compatible with ASUS Aura Sync RGB controls through the company's Armoury Crate application. The special edition kit is priced at RMB ¥5,999, or USD $880. ASUS also announced the ROG-certified memory program, where popular consumer DDR5 memory vendors can offer ROG-themed (and badged) memory with ROG Mode profile extensions for special timings, and Aura Sync RGB support.

Micron Technology, Inc. (Nasdaq: MU), today announced it has sampled 256 GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company's leading-edge 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production today. Micron's module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron's 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256 GB module can reduce operating power by more than 40% versus two 128 GB modules, enabling greater efficiency for modern AI data centers.

Ecosystem partner validation
Micron is collaborating with key ecosystem enablers to validate the 256 GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale.

Origin Code, a performance-driven brand pushing the boundaries of hardware, today announces the latest expansion of its Vortex DDR5 family: a newly optimized 48 GB (24 GB × 2) kit running at 6200 MT/s CL28, in the striking Meteorite Black finish, will be launched at Computex 2026.

Complementing this launch, Origin Code also introduces a purpose-built independent watercooling block, designed to further enhance thermal efficiency and unlock sustained performance for high-end systems

Memory makers like Samsung, SK hynix, and Micron are currently striving to find the delicate balance between supplying the world with enough DRAM and expanding their production capacity by placing large new orders for the semiconductor fabs used to produce the memory. According to SK Group chairman Chey Tae-won, who also oversees SK hynix, if companies like SK hynix do not increase their memory supply, customers will find ways to use less memory by optimizing their infrastructure and software for much lower utilization. At present, hyperscalers and AI accelerator makers such as AMD, NVIDIA, and others are securing as much memory as possible. This is part of AI data center expansion, which requires more GPU and CPU DRAM to support large training runs and maintain massive model inference, now reaching tens of trillions of parameters and needing hundreds of gigabytes of system memory to host a single model for just a few users.

This demand has created a supply chain issue where memory makers are selling all of their available DRAM months in advance but are hesitant to significantly expand manufacturing capacity, despite recognizing the increase in demand years ago. Memory makers are the first to notice rising demand, and their reluctance to increase manufacturing capacity is contributing to the current memory shortage. However, they are also wary of expanding production capacity as it takes years to build new memory fabs, just as projected demand is expected to stabilize. SK hynix has ordered about 20 Low-NA EUV machines from ASML for their expansion plans, which will also support future storage production once the tools are operational. However, all of this added capacity is still years away, and we will remain in a tight situation for a little while longer.

The Chinese DRAM market has just gained another player with POWEV entering the DDR5 market. POWEV is a sub-brand of the Chinese company Jiahe Jinwei, which announced its entry into the DDR5 market almost half a decade ago but is delivering now when it is needed most. POWEV has introduced DDR5 DRAM in form factors like UDIMM, SODIMM, and RDIMM, capable of up to 64 GB capacity and available in either 4,800 MT/s or 5,600 MT/s speeds. At these speeds, modules have different latencies, so it is best to refer to the specification table below. Firstly, POWEV separates its DDR5 products into "pure domestic" memory modules and industrial memory modules. This likely refers to some modules being for PC DIY and OEM applications, while others are for servers and industrial applications.

Both categories come with non-ECC unbuffered memory modules, while RDIMMs carry registered ECC on their own DIMMs. Every module operates at a voltage of 1.2 V, with a specific pin count depending on the form factor. Interestingly, it is unclear what technology POWEV uses to manufacture these DDR5 modules and create these DIMMs, as the underlying technology is undefined. South Korean memory makers such as SK hynix and Samsung usually reveal which iteration of their 10 nm manufacturing technology is used for chip manufacturing, but that is not the case here. Jiahe Jinwei has entered mass production of DDR5 memory, but no underlying technology has been disclosed. For many, this doesn't matter as long as the performance meets JEDEC's DDR5 specifications.

Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, is proud to announce its latest breakthrough in high-performance computing at Computex 2026. Leading the charge is the industry-first DDR5 8000 MT/s JEDEC Standard memory, alongside the global debut of the AQUARIUS Diamond RGB product line.

Witness 8000 MT/s: Simply Truly Plug & Play
GeIL is redefining the boundaries of high-speed DRAM by introducing the DDR5-8000 MT/s specification that fully adheres to JEDEC standards. Unlike traditional high-frequency modules that require manual BIOS adjustments or overclocking profiles, GeIL's JEDEC 8000 MT/s modules offer a "True Plug & Play" experience.

In the fast-paced world of hardware, longevity is the ultimate benchmark of quality. As ADATA Technology celebrates its 25th anniversary, we reflect on a journey that transformed a visionary startup into a global titan. For the international tech community, our history is not just a series of dates - it is a 25-year track record of stability, innovation, and the relentless pursuit of reliability.

Innovation catches the eye, but reliability keeps the world moving. For a quarter-century, ADATA has served as the "Invisible Hero" behind the world's most ambitious digital breakthroughs. Whether powering professional workstations or safeguarding personal data, ADATA provides the stable foundation that makes inspiration possible. We believe that to truly inspire, technology must first be dependable.