Samsung has reported a record quarterly profit for Q1 2026, with chip division operating income jumping to 53.7 trillion won ($36.15 billion), a 49% increase from the 1.1 trillion won ($745 million) posted in the same quarter last year. That figure accounted for 94% of the company's total operating profit of 57.2 trillion won ($38.7 billion), which itself was up from 6.69 trillion won a year prior. Overall revenue rose 69% year over year to 133.9 trillion won ($90.6 billion). Its record profit came mostly from the AI data center sector that pushed demand for advanced memory well beyond what Samsung and its peers can supply. The company has signed multi-year binding supply contracts with customers looking to lock in capacity, though it hasn't disclosed names or terms. Samsung's memory chief Kim Jaejune told analysts that supply is already falling well short of demand, and that based on orders already received, the gap in 2027 is expected to be even wider than in 2026.

On HBM specifically, Samsung said it began mass-production sales of HBM4 for NVIDIA's Vera Rubin platform in February and is on track to more than triple HBM revenue this year versus last. However, rising memory prices are affecting the profit of other Samsung businesses. Mobile and network division profit fell 35% to 2.8 trillion won, due to higher component costs, and the display division saw operating profit drop 20% to 400 billion won ($270 million). Reuters also reports the risk of a strike, with unions representing a large portion of Samsung's South Korean chip workforce considering work stoppages over pay disputes. For the rest of 2026, Samsung expects that increasing demand will keep pushing memory, foundry, and display businesses.

AMD has officially launched its Extended Profiles for Overclocking (EXPO) version 1.2, which expands support for more memory profiles, CUDIMM, and additional features. With this release, AMD aims to introduce more advanced memory tuning profiles to the "Zen 5" platform and its DDR5 memory types, while full support for EXPO 1.2 features is anticipated with the "Zen 6" processor generation. This means that full CUDIMM support for "Zen 5" tuning is still limited, and only "Zen 6" will offer complete CUDIMM support. EXPO 1.2 works with AMD's AGESA, but since AGESA 1.3.0.1 lacks full CUDIMM DDR5 support, this feature is postponed until the next-generation "Zen 6." Current-generation "Zen 5" CPUs on the AM5 socket may be able to use EXPO 1.2, but they won't fully support the new DDR5 memory with an onboard clock driver, instead relying on traditional memory to perform the task. Notably, popular AMD developer 1usmus mentioned that AMD EXPO 1.2 brings the following changes.

• Support for module geometry.
• Added support for MRDIMM (CUDIMM and CSODIMM are already supported). AGESA 1.3.0.1 still lacks full CUDIMM support; AMD is preparing this for Zen 6.
• New! tREFI, tRRDS, tWR, ULL Enable—Unified Latency Lock and VDDP(V).

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced successful proof-of-concept (POC) results for its 3D X-DRAM technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems.

The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Acer, and former Board Director of TSMC for over 20 years. As a globally respected technology pioneer and entrepreneur, Mr. Shih's participation reflects strong confidence in NEO's technology and vision, and will support the company's next phase of development.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today previewed a set of new features planned for incorporation into the next version of its JESD209-6 LPDDR6 standard. Building on the foundational JESD209-6 published in July 2025, JEDEC's JC-42.6 Subcommittee has been working to enhance the next version of the standard to extend LPDDR6 beyond mobile platforms to support selected data center and accelerated computing workloads seeking a power-efficient, high-capacity memory platform.

Planned features for the upcoming LPDDR6 update include:

• Narrower per-die interface (x6) enables higher capacities: With the move to a non-binary interface width - from x16 to x24, the inclusion of x12 and an additional x6 sub-channel mode, allows more die per package and higher memory capacities per component and per channel, a critical enabler for AI-scale memory footprints.
• Flexible metadata carve-out intended to minimize impact to peak data throughput, giving data center customers the option to balance user capacity and metadata needs according to their specific reliability requirements.
• 512 GB density on the horizon: LPDDR6 is expected to unlock densities beyond the current LPDDR5/5X maximum, a capability designed to address the ever-growing memory capacity requirements of AI training and inference workloads.
• LPDDR6 SOCAMM2 module standard in development: JEDEC is actively working on an LPDDR6-based SOCAMM2 module standard, which is being designed to carry the compact, serviceable module form factor forward and offer a clear upgrade path from today's LPDDR5X SOCAMM2 modules.

Natalie Vock, a well-known Valve contractor and Linux graphics driver developer, recently debuted a new patch that enabled better VRAM management on Linux for GPUs with low VRAM. When we originally covered the set of kernel patches, we noted that it could cut VRAM usage in half in some applications, potentially making certain aging graphics hardware viable for gaming where it may not have been before the patches. Aside from some early tests by Vock herself, not much other data was available at the time to draw any conclusions about the potential performance improvements. Now, thanks to NJ Tech on YouTube, we have some idea of how the patch could improve performance on a GPU like the AMD Radeon RX 6500 XT, which has a mere 4 GB of VRAM. The YouTuber tested the GPU across nine games, including some heavy hitters, like Crimson Desert, Hogwarts Legacy, and Cyberpunk 2077 in CachyOS, which was the first Linux distribution to package and release Vock's kernel patches in what it calls GPU Booster. In the current GPU market, it would be nice to have a silver bullet to make low VRAM GPUs viable, but the results are far more varied than that, with some games seeing no improvement and others seeing up to 100% increases in FPS.

In Alan Wake II, VRAM use is actually increased, but there's a more than 2× increase in FPS, going from 14 FPS to a very playable 42 FPS average. In Resident Evil: Requiem, VRAM use is identical, but there's a 16% FPS increase, and in Silent Hill f, the story is similar, with identical VRAM utilization but marginal performance increases. Crimson Desert saw a decrease in VRAM usage, but there was no measurable performance increase as a result, as was the case with Hogwarts Legacy and Cyberpunk 2077, both of which saw reduced VRAM usage but an increase of 1 FPS average in the former and identical performance in the latter. The Last of Us Part 2 actually saw a 1 FPS drop in both average and 1% low FPS, but it seems as though there was just too much graphics memory pressure for Vock's VRAM patches to mitigate the issue. Death Stranding 2 and Marvel's Spider-Man 2 also saw little to no improvement despite reduced VRAM utilization in the former. The full video by NJ Tech follows.

Intel has officially unveiled its "Wildcat Lake" Core 300 series of processors for the entry-level PC segment. These CPUs are designed for value-oriented buyers looking for good CPU performance and basic GPU output in small form-factor commercial and edge AI PCs. Officially rated at 40 TOPS, these processors are capable of Copilot+ AI PC certification, meaning Intel has managed to provide basic local AI processing functionality to entry-level buyers. As part of the Core 300 series non-Ultra family, Intel's main selling point is all-day battery life in laptops with local AI processing. There are three segments, each featuring a hybrid core configuration, pairing two "Cougar Cove" P-cores with four LPE "Darkmont" cores.

The actual SoC package integrates two dies. The first and most important one, built on the 18A internal Intel node, features a 6-core CPU configuration, NPU 5 with 40 TOPS of INT8 data, Xe display and media engine, and a GPU that includes up to two Xe3 cores. This die also contains the memory controller and cache pool, supporting LPDDR5X memory running at 7,467 MT/s or up to 6,400 MT/s for DDR5. The memory-side cache includes 4 MB to help tasks "buffer" into this cache before and after accessing memory. Intel dedicates the second die to I/O handling, as the platform supports 6 PCIe Gen 4 lanes, two Thunderbolt 4 connections, two USB 3.2 connectors, and up to eight USB 2.0 connectors. For Wi-Fi, there is the Wi-Fi 7 standard, and Intel also includes Bluetooth 6.0.

YMTC (Yangtze Memory Technologies Corp) is planning to significantly expand its manufacturing capacity, with Reuters reporting the Chinese NAND flash maker intends to build two additional factories on top of one already nearing completion. When all three are running at full capacity, YMTC's total output would more than double from its current 200,000 wafers per month to 400,000 wafers per month (each new plant is designed for 100,000 wafers monthly). The third fab, located in Wuhan alongside the existing two plants, has already been built and is currently being equipped. The fab is expected to start operations later this year and reach 50,000 wafers per month by 2027. Notably, over half of the equipment has been sourced domestically, including tooling for vertical layer stacking, a sign of how much YMTC has leaned into local suppliers since the US added it to the Entity List in December 2022. However, recently, the U.S. Government's Bureau of Industry and Security reportedly removed YMTC from the list of restricted Chinese companies.

The two planned factories don't yet have confirmed locations or target dates, but all three new plants will reportedly allocate some capacity to DRAM production alongside NAND. YMTC has already sent LPDDR samples to clients and expects feedback by year-end, which will shape how aggressively it pursues DRAM going forward. On the NAND side, YMTC already holds 11.8% of the global market, on par with Sandisk and not far behind SK Hynix (16%), Kioxia (15.9%), and Micron (13.3%), while Samsung leads at 30.4%. UBS expects the YMTC shares to pass 14% by early 2027. The company is pushing its Xtacking 4.0 architecture, which is considered competitive with what the industry leaders are shipping.

Valve's Linux developer, Natalie Vock, has introduced a new method for handling memory management on GPUs with 8 GB or less VRAM. Since a large part of the gaming community uses systems with limited resources, improving performance and VRAM allocation is an excellent way to maximize frames per second. According to Vock's solution, GPUs with 8 GB of VRAM or less on Linux will now benefit from better background VRAM management, allowing more free space for games. Several Linux kernel patches have been submitted to guide how Linux manages resources when a game is loaded. Previously, when a game used too much VRAM on a low-VRAM GPU, the Linux Graphics Translation Table (GTT) would move data to system RAM to prevent the game from crashing. Since Linux doesn't prioritize programs, it could sometimes move the actual game from VRAM to system RAM to make space for something like a browser or another third-party app.

In Vock's testing before these new patches, running Cyberpunk 2077 resulted in the system using only 6 GB of the 8 GB of available GPU VRAM, with about 1.37 GB spilling over to GTT and being allocated in system RAM. This could lead to game stuttering and frame-pacing issues. Now, Vock has developed a real-time dmemcg-booster, which stands for Device Memory Control Groups, to inform Linux when a program running on the GPU VRAM needs to stay there without being moved to GTT and then to system RAM. With the new patch, running Cyberpunk 2077 now uses almost the entire available system VRAM, reaching 7.4 GB, while GTT allocation has been reduced to 650 MB, cutting usage by more than half. In the picture below, you can check the "GameThread" behavior before and after the patch is applied.

According to the latest research from Omdia, total shipments of desktops, notebooks, and workstations in 1Q26 increased by 3.2% year-over-year to 64.8 million units. Notebooks (including mobile workstations) saw a modest year-over-year increase of 2.6% in Q1 to 50.8 million units. Meanwhile, desktops (including desktop workstations) performed slightly better, up 5.4% to 14.0 million units. Growth was supported by vendors and channel partners pulling orders forward ahead of a widely anticipated increase in component costs, the continuation of the Windows 10 replacement cycle that is still driving commercial refresh budgets, and by a heavier than usual slate of spring product launches across both Windows OEMs and Apple.

"With supply-chain pressures still building, Q1's modest growth is likely to mark the high point for the year," said Ben Yeh, Principal Analyst at Omdia. "Memory and storage costs are expected to rise further and more steeply than previously assumed from Q2, squeezing PC vendor gross margins and forcing them to pass costs through to channel partners and end-customers. AI data center build-outs are crowding consumer categories out of memory and storage supply, which have already seen roughly five-fold and three-fold cost increases respectively since Q1 2025. CPU prices are a smaller but compounding pressure, with Intel and AMD projecting increases of 10-25% into Q2."

Late last week, we reported on a new series of rowhammer bit-flip attacks targeting GDDR6-based NVIDIA GPUs. Most of these attacks can be mitigated by enabling IOMMU through the BIOS, which restricts the memory regions the GPU can access on the host system, thereby closing the primary attack path. However, researchers from the University of Toronto have introduced "GPUBreach," which can bypass IOMMU and enable CPU-side privilege escalation, unlike the previous "GDDRHammer" and "GeForge" attacks. In most typical server, workstation, and even PC configurations, IOMMU restricts the GPU's access to the CPU's physical addresses, preventing direct memory access. These are the typical DMA-based attacks that the Input-Output Memory Management Unit protects users from. However, the new "GPUBreach" operates differently.

For example, "GPUBreach" exploits memory-safe bugs in the actual GPU driver and corrupts them. When IOMMU confines the GPU's direct memory access to driver-assigned buffers, the new exploit corrupts metadata within these permitted buffers. This causes the driver, which has kernel privileges enabled on the CPU host, to perform out-of-band writes to the buffer, effectively bypassing any protection IOMMU can offer. This logic is built into the kernel by default, as the GPU driver is one of the most trusted components of the operating system. Hence, IOMMU bypass is possible when the metadata is corrupted. Since "GPUBreach" grants an attacker full root privilege escalation, the attack differs significantly from previous rowhammer attacks.

Canonical increased the recommended system memory for the upcoming Ubuntu 26.04 LTS "Resolute Raccoon" to 6 GB of RAM, a first major change since 2018. According to the release note, the 26.04 LTS now lists 6 GB of RAM as the baseline for a comfortable desktop experience, alongside a 2 GHz dual-core CPU and 25 GB of storage, unchanged from previous generations. This represents a 50% increase over Ubuntu 18.04 LTS, which in 2018 raised the bar to 4 GB, and a notable shift from earlier releases that ran on as little as 1 GB. The change is not caused by a heavier core OS. Instead, it reflects the reality of modern workloads. The GNOME desktop, now updated to newer revisions, along with current web browsers (i.e., Firefox) and everyday apps like LibreOffice, demand more memory in multitasking scenarios.

Importantly, 6 GB is not a hard requirement. Ubuntu 26.04 LTS will still install on systems with less than 6 GB of RAM. However, performance may suffer. Early testing shows that the OS remains functional even on 2 GB systems although with significant slowdowns. As before, the 25 GB storage requirement remains mandatory for the desktop edition. As Ubuntu 26.04 LTS is expected to be the next long-term support release from Canonical, the Ubuntu ecosystem provides many options for those using lower-end hardware. Lighter flavors such as the official Lubuntu or the Linux Lite distro, and manual installations with a minimal base remain available and viable options. Also, Ubuntu Server can be deployed on systems with around 1-1.5 GB of RAM, depending on the use case. Ubuntu 26.04 LTS is currently in development and scheduled to be released on April 23.

Worldwide 300 mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300 mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring. Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.

"AI is resetting the scale of semiconductor manufacturing investment," said Ajit Manocha, President and CEO of SEMI. "With global 300 mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era."

Advantech (TWSE: 2395), a global leader in IoT intelligent systems and embedded platforms, today announced the expansion of its SQRAM DDR5 7200 MT/s industrial memory module series. Designed to meet the escalating data demands of Edge AI, the new modules offer a 12.5% performance increase over previous generations and a groundbreaking 64 GB per-module capacity, setting a new benchmark for stability and scalability in outdoor deployments.

12.5% Faster, Up to 64 GB per Module
The DDR5 7200 MT/s delivers a 12.5% performance increase compared to the previous DDR5 6400 generation. In addition to higher bandwidth, each module supports up to 64 GB capacity using 32 Gb IC technology. This enables AI PCs and high-end workstations to scale system memory up to 256 GB, fully addressing the growing demands of data-intensive Edge AI and computing applications.

The rumor mill has started grinding about NVIDIA's next-generation gaming GPU, and it looks like NVIDIA does not want to allow the current market environment to get in the way of implementing its product roadmap, with a roughly 2-year GeForce generation product launch cadence. The next-generation GeForce RTX 60-series will be powered by the "Rubin" graphics architecture. "Rubin" already debuted on NVIDIA's bread-winning AI GPU series, and is making its way to GeForce, reports RedGaming Tech.

The first slice of rumors about GeForce RTX 60-series predicts that NVIDIA will stick to a more conservative approach with foundry nodes, and not go with a sub-2 nm nanosheet-based node. GeForce "Rubin" will be built on some variant of the current TSMC 3 nm FinFET node. They need not be the same N3 node that's in use by Apple, Intel, and others; and NVIDIA might collaborate with TSMC on an exclusive variant just the way it created the NVIDIA 4N node, derived from TSMC N5. Chips in the series will follow the numbering scheme "GR20x," with examples being "GR202" for the biggest part powering the flagship product. The 3 nm node will allow NVIDIA to maintain GPU clock speeds ranging between high 2 GHz and low 3 GHz, which is a minor increase over the current "Blackwell."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC website.

LPDDR5/5X memory devices are capable of supporting two sets of timing parameters: a full speed mode and a reduced speed mode that consumes less power. This feature allows for longer battery life for mobile devices which are a common application for LPDDR5/5X chips and modules and may also be leveraged by data centers as the use of LPDDR5/5X devices grows. The updated JESD406-5 standard documents key parameters for calculating the switching time between fast and low power modes, making the feature more efficient and allowing higher system performance.

Earlier this week we reported that the memory shortage was going to persist until late 2028, but news out of Korea now suggests it might stick around all the way until 2030. SK Group Chairman Chey Tae-won is quoted by The Korea Times saying that "The shortage stems from a lack of wafer capacity, and securing additional wafers takes at least four to five years," continuing "We expect the industry-wide supply shortfall to persist at over 20 percent through 2030."

The company is apparently looking at ways to stabilise pricing, but as to when this will happen, is anyone's guess at this point in time. In this specific case, it's down to SK hynix CEO Kwak Noh-jung to try and resolve the immediate situation. SK Group doesn't seem interested in building fabs outside of South Korea either, as Chey also told The Korea Times that "Korea already has the infrastructure in place, allowing for a much faster response. That is why we are concentrating our efforts here." There is at least some good news here, as it doesn't seem like SK hynix will put its entire focus on HBM memory, as the company is aware that might lead to further shortages of DRAM, which will affect the broader tech industry.

Samsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies. The signing ceremony was held at Samsung's most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.

"Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration," said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. "From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD's evolving AI roadmap."

Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry's only semiconductor company offering a total AI solution spanning memory, logic, foundry and advanced packaging, Samsung will exhibit its full suite of products and solutions that enable customers to design and build groundbreaking AI systems. To learn more about Samsung's AI solutions, please visit the company's GTC 2026 booth (#1207).

The centerpiece of Samsung's showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform. Samsung's HBM4 is expected to help accelerate the development of future AI applications, delivering consistent processing speeds of 11.7 gigabits-per-second (Gbps), which exceeds the industry standard of 8 Gbps, and can be enhanced to 13 Gbps.

Penguin Solutions, Inc. (Nasdaq: PENG), the AI factory platform company, today announced the industry's first production-ready KV cache server that utilizes CXL memory technology to address the critical "memory wall" challenge in AI inferencing—Penguin Solutions MemoryAI KV cache server. This innovative solution delivers up to 11 TB of CXL-based memory engineered to optimize performance of enterprise scale inference, including agentic AI. The result is lower latency, higher throughput, increased efficiency of GPU clusters, consistent achievement of stringent service-level agreements (SLAs), and faster time-to-first-token (TTFT).

While model training and tuning is primarily compute-bound and occurs episodically, the continuous memory-bound and latency-sensitive inference workloads required for inference and agentic AI are complex and fundamentally different. Inference demands are typically 30% compute driven (GPU) and 70% memory driven (RAM), elevating the need for greater memory capacity and causing performance bottlenecks and GPU idle time. Accelerating memory-dependent AI processes, Penguin's MemoryAI KV cache server increases memory capacity by integrating 3 TB of DDR5 main memory and up to eight 1 TB CXL Add-in Cards (AICs).

Micron Technology, Inc. (Nasdaq: MU) today announced it has completed the acquisition and assumed ownership of Powerchip Semiconductor Manufacturing Corporation's (PSMC) P5 site in Tongluo, Miaoli County, Taiwan, under the acquisition agreement previously announced on January 17, 2026.

The new site will complement Micron's existing operations in Taiwan as an extension of the company's vertically integrated mega campus in Taichung, located approximately 15 miles away. The site includes approximately 300,000 square feet of existing 300 mm cleanroom space and will support Micron's efforts to expand supply of leading-edge DRAM products, including HBM, to meet growing AI-driven demand.

AMD has published a guide for running OpenClaw locally on Windows through two distinct hardware paths it calls "RyzenClaw" and "RadeonClaw," both built around its own silicon and designed to keep AI agent workloads off the cloud entirely. The push is part of AMD's broader "Agent Computer" narrative, where it argues that not every AI workload belongs in a data center, people and businesses want control over their data, affordable always-on AI without usage limits, and the confidence that their models are running locally rather than on someone else's infrastructure. The setup runs through WSL2 with LM Studio handling local LLM inference via llama.cpp, and supports Memory.md through local embeddings, no cloud dependency required. AMD says the environment can be configured in under an hour, targeting early adopters and developers experimenting with personal AI agents.

The RyzenClaw path is built around a Ryzen AI Max+ system with 128 GB of unified memory, AMD specifically recommends reserving 96 GB as variable graphics memory for this use case. Running the Qwen 3.5 35B A3B model, that configuration delivers around 45 tokens per second, processes 10,000 input tokens in roughly 19.5 seconds, supports a 260K token context window, and can run up to six agents concurrently. AMD is positioning this as capable of "agent swarm" experimentation on consumer hardware. RadeonClaw takes a different approach, pairing OpenClaw with the Radeon AI PRO R9700, a workstation-class card with 32 GB of VRAM. That setup is considerably faster, around 120 tokens per second with the same model, and 10,000 input tokens processed in about 4.4 seconds. The tradeoff is a smaller 190K token context window and support for only two concurrent agents, compared to six on the Ryzen AI Max+ path.

As more gamers move toward AMD Ryzen series platforms for modern DDR5 gaming builds, v-color Technology Inc. is introducing a smarter and more flexible upgrade option with its new 1+1 DDR5 Memory and RGB Filler NON-DRAM Solution. Designed for gamers who want a more accessible way into DDR5, each kit includes one active DDR5 memory module and one matching RGB Filler module. This gives users real DDR5 performance today while keeping the clean dual DIMM RGB look that many builders want in their systems.

The concept is especially well suited for AMD Ryzen gaming systems, including the widely recognized Ryzen 7 7800X3D as well as the high-end processors such as the Ryzen 7 9850X3D. With AMD X3D architecture, single module DDR5 configurations remain a practical option for gaming focused users. This allows builders to start with one module now, lower their upfront cost, and upgrade later with a second memory module when needed.

SolidRun, a leading developer and manufacturer of high-performance system-on-module (SOM) solutions, single-board computers (SBC) and network edge solutions, announced its new P100 COM Express Type 6 module family, powered by AMD Ryzen AI Embedded P100 processors. Designed for real-world edge deployments where systems don't sit still, the P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments across industrial automation, transportation, medical systems, and robotics.

"Edge AI is moving out of controlled environments and into the real world, like mobile platforms, harsh industrial sites, and mission-critical deployments where serviceability, and longevity matter as much as raw compute," said Dr. Atai Ziv, CEO of SolidRun. "Our new P100 COM Express Type 6 modules are built to deliver powerful AI performance at the edge while improving the mechanical durability and serviceability product developers need to deploy confidently in demanding environments."

Patriot Memory, a global leader in high-performance memory and storage solutions, is pleased to announce its participation in Embedded World 2026. Under its dedicated industrial and embedded brand, ACPI, Patriot Memory will showcase a comprehensive portfolio of next-generation hardware designed for AIoT, edge computing, and 5G infrastructure. Highlighting the display are the new M2PDR-8LP PCIe Gen 5 x4 SSD, the high-capacity Enterprise NVMe SSD series, and high-speed DDR5 RDIMM modules featuring wide-temperature support.

As industrial applications transition toward data-heavy workloads involving AI training and autonomous systems, the demand for extreme bandwidth and thermal stability has reached a critical point. ACPI's latest offerings are engineered to address these challenges by combining cutting-edge interface standards with industrial-grade reliability.

Applied Materials, Inc. today announced it is working with Micron Technology to develop next-generation DRAM, high-bandwidth memory (HBM) and NAND solutions that increase the energy-efficient performance of AI systems, bringing together advanced R&D capabilities from Applied's EPIC Center in Silicon Valley and Micron's state-of-the-art innovation center in Boise, Idaho to strengthen the semiconductor innovation pipeline in the United States.

"Applied Materials and Micron have a long-standing partnership focused on driving higher performance and more energy-efficient advanced memory chips by pushing the boundaries of materials engineering and manufacturing innovation," said Gary Dickerson, President and CEO of Applied Materials. "We are excited to deepen our collaboration with Micron as a founding partner at the EPIC Center as next-generation memory technologies play an increasingly vital role in the future of AI systems."