Last month, a confidential presentation in China gave AMD's laptop partners their first glimpse of what's coming next. The slides hinted at modest clock-speed improvements and the addition of more entry-level models, all under the codename "Gorgon Point." Not long after, NBD's shipping manifests today show a series of new FP8, FP10, and FP12 product codes. These identifiers don't match any existing "Strix Point" or "Kracken Point" chips, so it's clear AMD is gearing up for a Ryzen AI 400-series refresh set to roll out around mid-2026. Despite the new name, Gorgon Point sticks with the same winning formula. It still uses Zen 5 and Zen 5c CPU cores alongside RDNA 3.5 graphics and XDNA 2 neural accelerators. Core counts haven't changed, so you'll see configurations ranging from 4 to 12 cores just like before, with up to 4x Zen 5 and 8x Zen 5c cores.

What's different, according to the leaked partner slides, is a slight bump in boost clocks. The top-end Ryzen AI 9 HX 475 and 470 chips are now rated for up to 5.2 GHz, a slight but welcome increase from the previous 5.1 GHz, while maintaining a 28 W default TDP. AMD is also broadening its reach into budget laptops. In addition to the Ryzen 9 HX upgrades, the company will introduce new Ryzen 5 and Ryzen 3 models. Early leaks mention parts numbered 440 and 430, as well as a mystery Ryzen 3 SKU. These entry-level chips will use the same Gorgon Point silicon but will be tuned for cost-sensitive devices. Branding will likely follow AMD's recent pattern. Given how AMD has renumbered previous families, slotting Gorgon Point into familiar retail channels should be straightforward. Until AMD makes an official announcement, these shipping manifests and partner leaks are the best clues we have about the performance and efficiency gains in the next wave of AI-accelerated laptops.

The first model update for XMG's ultrabooks, originally introduced last year, is now underway. Leading the way is the XMG EVO 14, which will be available with three different AMD Ryzen AI processors, including the Ryzen AI 9 HX 370. The 1.45 kg laptop features a brighter 1800p display, now offering 500 nits compared to the previous 400 nits. Other highlights include an 80 Wh battery, a dual-fan cooling system and a wide range of external connectivity options. Like its predecessor, the EVO 14 continues to rely on upgradeable, plugged-in SSDs and DDR5 RAM modules - now configurable with up to 128 GB of memory.

Launched in 2024, the EVO series marked XMG's first ultrabooks to forgo a dedicated graphics unit in favour of an efficient integrated graphics solution. The 14-inch model is the first to receive an update: the XMG EVO 14 (E25) is now available with a choice of three AMD processors. Alongside AMD's Ryzen AI 9 HX 370 (12 cores, 24 threads), XMG is offering the compact 311 x 220 x 17 mm, 1.45 kg ultrabook with either the Ryzen AI 9 365 (10 cores, 20 threads) or Ryzen AI 7 350 (8 cores, 16 threads). These options also differ in their integrated graphics: with 16 compute units, the iGPU in the HX 370 delivers the highest 3D performance for accelerating content creation applications or enabling entry-level gaming.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, proudly introduces the SMART 900 AI Mini PC - a powerful, compact system designed to accelerate AI-driven content creation. Engineered for students and professionals, the SMART 900 combines cutting-edge performance with a sleek industrial design, pushing the boundaries of what a mini-PC can deliver.

At its core is the new Ryzen AI Max+ 395 processor, built on the advanced Zen 5 architecture. With 16 cores and 32 threads, a turbo frequency of up to 5.1 GHz, and 80 MB of cache, it delivers desktop-class performance in a 4-liter form factor. The integrated Radeon 8060S graphics, based on the RDNA 3.5 architecture with 40 compute units, offer GPU performance rivaling discrete mobile GPUs. For AI tasks, a dedicated 50 TOPS NPU provides outstanding acceleration for machine learning and generative workloads. The SMART 900 is built for creators on the move. It features a rich set of connectivity options including 3x USB 3.2 Gen 2, 2x USB 4.0, 2x USB 2.0, and a high-speed SD 4.0 card slot - making high-resolution image and video transfer seamless and efficient.

Gearbox and 2K today opened Borderlands 4 pre-orders, with the rather unexpected $69.99 base game price resulting in a simultaneous sigh of relief following the gaming industry's recent move towards $80 AAA games. Following the pre-order launch, Borderlands 4's Steam page revealed the game's minimum system requirements as a bit of a mixed bag. According to the Steam page, the new looter shooter will only run on an AMD Radeon RX 5700 XT or NVIDIA GeForce RTX 2070, but this seems to largely be related to VRAM, since the minimum requirements also mentions that 8 GB is the minimum VRAM amount. An SSD and an eight-core CPU—listed as the AMD Ryzen 2700X or Intel Core i7-9700—will also be mandatory for Borderlands 4. Even the recommended specifications for Borderlands 4 are rather moderate, with the NVIDIA GeForce RTX 3080 and Radeon RX 6800 XT making the cut.

In addition to the reasonable PC specs, news also broke about an ECHO-4 Collector's Edition, a curious edition to the line-up of special edition bundles for Borderlands 4 that seems to be exclusive to GameStop for now. The Echo-4 Collector's Edition bundle is a host of physical Borderlands 4 memorabilia, including a cloth map of Kairos, an eight-inch Echo-4 figure with LED lights, a Vault symbol necklace, a card with five SHiFT codes for Borderlands 4 golden keys, and four double-sided lithography art prints—all for $149.99. The one glaring omission from the Echo-4 bundle is an actual game key for Borderlands 4. That is clearly labelled as "sold separately" on the GameStop page.

MSI listed the MPG B850I EDGE TI WIFI, a Mini-ITX form-format AMD AM5 socket motherboard built around AMD's B850 chipset with support for the latest Ryzen CPU series. The board features an 8+2+1 phase digital VRM with 90 A SPS DrMOS power stages, powered through a single 8-pin EPS connector. It uses a 10-layer PCB with 2oz copper for enhanced conductivity and thermal performance. The motherboard supports DDR5 memory up to 8200 MT/s in a dual-slot, single DIMM per channel configuration. Storage connectivity includes a front-mounted PCIe 5.0×4 M.2 slot with active cooling fan connected directly to the CPU, plus a rear PCIe 4.0×4 M.2 slot through the chipset and two SATA III ports. A single PCIe 5.0×16 slot provides GPU connectivity via CPU lanes.

Networking capabilities include 5 GbE wired connectivity through a Realtek RTK8126 controller and Wi-Fi 7 with 320 MHz channels supporting up to 5.8 Gbps, alongside Bluetooth 5.4. Audio processing uses the Realtek ALC4080 codec. The I/O configuration provides USB-C connectivity at 20 Gbps on the rear panel and 10 Gbps via internal header, multiple USB-A ports ranging from 480 Mbps to 10 Gbps speeds, HDMI 2.1 FRL video output, S/PDIF digital audio, and dual antenna connectors for wireless connectivity. The active cooling fan on the primary M.2 slot addresses thermal management for high-performance PCIe 5.0 SSDs while maintaining the compact Mini-ITX form factor.

AMD's Z2 series of processors for handheld gaming devices has been expanded with a pair of new chips, namely the Ryzen AI Z2 Extreme and the Ryzen Z2 A. From AMD's naming scheme, one would assume that the two are quite similar, but if you've kept track of AMD's Z2 product lineup, you're most likely already aware that there are some major differences between the three older SKUs and this time around, we get a further change at the low-end. The new top of the range chip, the Ryzen AI Z2 Extreme appears to be largely the same SoC as the older Ryzen Z2 Extreme, with the addition of a 50 TOPS NPU for AI tasks, which appears to be shared with many of AMD's mobile SoCs.

However, the new low-end entry, the Ryzen Z2 A appears to have more in common with the Steamdeck SoC, than any of the other Z2 chips. It sports a quad core, eight thread Zen 2 CPU, an RDNA 2 based GPU with a mere eight CUs and support for LPDDR5-6400 memory. On the plus side, it has a TDP range of 6-20 Watts, suggesting it would allow for better battery life, assuming devices based on it get a similar size battery as a handheld based on one of the higher-end Z2 SoCs. ASUS is using both of these chips in its two new ROG Ally handheld gaming devices, but Lenovo is expected to follow shortly with its own handheld devices.

ASUS Republic of Gamers (ROG) is proud to announce an all-new series of Ally handhelds built from the ground up with improved ergonomics and a seamless player-first user experience. Developed in partnership with the incredible team at Xbox, the new ROG Xbox Ally and ROG Xbox Ally X offer best-in-class ergonomics and a full-screen Xbox experience that marries the best of Xbox and PC gaming in one cohesive package.

"We wanted to take our handheld to the next level, but we could not do it alone." said Shawn Yen, Head of the Consumer product team at ASUS. "This revolutionary partnership with Microsoft allowed us to forge a brand new device with ROG muscle and the soul of Xbox." The ROG Xbox Ally sports an AMD Ryzen Z2 A Processor with incredible power efficiency, while the ROG Xbox Ally X offers the new AMD Ryzen AI Z2 Extreme Processor for next-level gaming performance. Both launch holiday 2025 in select markets, with additional markets to follow.

Early indications of AMD's next-generation Ryzen processors have surfaced as AIDA64's newest beta release adds initial support for Ryzen 10000 "Zen 6" desktop, server, and mobile chips. The update was noted by X user HXL, suggesting that AMD has quietly shared basic specifications with developers of hardware monitoring software. Looking back, AIDA64 tends to announce chip support almost a year before official launches, so these new processors may not appear until Computex 2026. Leaks from March 2025 suggest that AMD's Zen 6 desktop lineup, currently codenamed Medusa Ridge, will remain compatible with the existing AM5 socket. This news should please PC enthusiasts because it means many users will not have to replace their motherboards when upgrading. Reports indicate that Medusa Ridge CPUs may include 12-core chiplet dies, marking a step forward from previous architectures.

These chips are expected to be manufactured using TSMC's N3P process, which is designed to deliver improved power efficiency and higher frequencies. Additionally, a Zen 6-based X3D series is likely to feature a 3D V-Cache, targeting gamers. A model like the Ryzen 7 10800X3D could follow the success of the 9800X3D by offering strong performance at its price. On the mobile side, "Medusa Point" processors are rumored to incorporate up to 22 hybrid cores that combine performance and efficiency cores under the Zen 6 architecture. However, these mobile chips seem to be further off, with a launch window set for late 2026 or early 2027. Although AIDA64's beta edition now recognizes Ryzen 10000 series chips, AMD's usual schedule suggests we will not see them in shops until mid-2026 at the earliest. Still, compatibility with AM5 and a move to a more advanced process promise meaningful improvements when Zen 6 finally arrives.

It seems as though an official international launch for the elusive AMD Ryzen 9000G APUs might still be on the cards for later this year, after all. While an announcement was expected at Computex 2025, along with a full-scale retail launch later this year, AMD was suspiciously quiet about its CPUs at the electronics trade show. Now, it looks as though Gigabyte has seemingly started preparing its B650 motherboard line-up for the arrival of AMD's Ryzen 9000G APUs.

On Gigabyte's B650 Gaming motherboard memory compatibility page, the hardware maker seems to have replaced any mention of Ryzen 9000 series CPUs with "Ryzen 9000 G-series CPUs," altogether. It's unclear whether this change means the same memory compatibility table will apply for both AMD Ryzen 9000 and 9000G CPUs, but that seems to be the case. At any rate, this leak suggests that previous rumors claiming a Q4 launch may have been correct. Those same leaks suggested that the Ryzen 9000G APUs would feature AMD Zen 5 CPU cores paired with AMD RDNA 3.5 iGPUs, with the top-spec iGPU likely being capable of running at least some lighter-weight games and e-sports titles. As it stands, the iGPUs found in recent AMD Ryzen CPUs are merely there for basic video output and diagnostic purposes, while the G-series APUs are generally intended for use without a dedicated GPU. It seems reasonable to expect AMD to launch at least one variant in the AMD Ryzen 9000G APU series equipped with the Radeon 890M, which also powers some of the most popular Windows gaming handhelds on the market.

Tiny PC maker Minisforum was showing off its upcoming N5 Pro NAS at Computex, and it's quite different from what most NAS makers have put out to date. For starters, it's built around AMD's Ryzen AI 9 HX Pro 370 SoC and has support for up to 96 GB of ECC DDR5 5600 MHz memory over two SO-DIMM slots. Connectivity consists of one 10 Gbps and one 5 Gbps Ethernet port, two USB4 ports—with DP Alt mode support—one HDMI 2.1 port, two USB 3.2 10 Gbps ports and one USB 2.0 port. For some reason the Oculink port, clearly visible around the back of the unit on display, isn't mentioned in the specs we were provided, but it's still mentioned on the product page, so we'll have to wait and see if that will be part of the final product or not.

On the storage side of things there's room for five 3.5-inch or 2.5-inch drives in traditional drive caddies, and drives up to 22 TB in size are supported. In addition to this, there's room for one M.2 NVMe slot which is limited to PCIe 4.0 X1, lengths of up to 110 mm are supported. There is also an extra PCB that can be slotted in that adds support for a further two NVMe drives in either the U.2 or M.2 form factor, one with a PCIe 4.0 x2 interface and one with PCIe 4.0 x1. Judging by the design of this expansion PCB, it might be a bit fiddly to install, but as the main PCB of the N5 Pro slides out for access, it could've been far worse. Internally there's also a full-length low-profile PCIe x16 slot—which was occupied by a GPU in the unit on display—although it's limited to four lanes electrically, as well as a USB 3.2 10 Gbps port. It will apparently come with MinisCloud OS, but Windows 11 is also supported, which means the N5 Pro could be used for something else than just as a NAS. No word on pricing, but the company is offering a 30 percent off discount if you sign up on their website.

Although Synology already announced its first plus series NAS in its 2025 range a month ago with the DS925+ and its accompanying expansion unit, the company had no less than six new devices on display at Computex. We also talked at length with the company and got an explanation as to why the company decided to move to supporting its own brand drives only and it turns out the situation isn't quite what Synology's press release made it seem like, but more on that after we go over the new devices.

The new range starts with the DS225+ and the DS425+, where the DS225+ is the new base model of the plus series. Both models are built around an Intel Celeron J4125—a chip that launched at the end of 2019—which is paired with 2 GB of DDR4 which can be expanded to 6 GB in total. Both models come with one 2.5 Gbps and one 1 Gbps Ethernet port, two 5 Gbps USB 3.2 Gen 1 ports and two or four drive bays. The DS425+ also gets a pair of M.2 2280 NVMe SSD slots, but unless the CPU information provided is wrong, these will only be PCIe 2.0 and will most likely not sport more than one or two lanes.

ASRock proudly announces that its WRX90 WS EVO and TRX50 WS workstation motherboards now offer full support for AMD Ryzen Threadripper Pro 9000 and Threadripper 9000 series processors, delivering outstanding computing performance for HEDT & Workstation platform. Featuring the latest Zen 5 architecture, the AMD Ryzen Threadripper Pro 9000 / Threadripper 9000 series processors boast up to 96 cores and supports more PCIe 5.0 lanes, setting a new benchmark for industry-leading performance.

ASRock WS series motherboards, including the WRX90 WS EVO and TRX50 WS, support AMD Ryzen Threadripper Pro 9000 / Threadripper 9000 series processors through a simple BIOS update, which is now available to download from ASRock official website.

ZOTAC made a notable impression at Computex 2025 by unveiling a range of compact gaming and AI-ready machines combining high performance and tiny footprints. The highlight was the second-generation ZOTAC Zone handheld prototype, now powered by AMD's top-tier Ryzen AI 9 HX 370 APU. Equipped with Radeon 890M graphics, the Zone achieves smooth 1080p gameplay on its 7-inch AMOLED display, which offers a 120 Hz refresh rate and up to 800 nits of brightness. Despite its size, the device packs either 24 GB or 32 GB of LPDDR5X memory alongside a 1 TB PCIe Gen 4 SSD to ensure rapid load times and efficient multitasking.

For wireless connectivity, ZOTAC has included Wi-Fi 6E, Bluetooth 5.2, dual USB4 ports, and a microSD slot. A built-in kickstand adds flexibility to handheld play, and Hall-effect joysticks, precise triggers, and twin trackpads provide a control scheme designed for accuracy. A 48.5 Wh battery that should support extended gaming sessions is powering all this. ZOTAC also previewed its Manjaro Linux distribution on the Zone, featuring a dedicated handheld interface and Wine-based compatibility for Windows titles.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

ASUS presented at Computex 2025 its complete updated gaming laptops series that features NVIDIA GeForce RTX 5060/5070 graphics solutions with the latest Intel and AMD CPUs. The ROG Zephyrus G14/G16 and ROG Strix G16/18 alongside ASUS TUF A14/A16/F16 gaming laptops were showcased at ASUS's booth and are expected to hit the stores soon, giving gamers powerful up-to-date portable solutions to fuel their gaming passion. The ROG Zephyrus G14 gaming laptops are equipped with AMD Ryzen AI 9 270 processor and NVIDIA GeForce RTX 5060 GPU, 16 GB RAM and 1 TB SSD. All those are packed in a slim form with just 1.5 kg weight and 1.6 cm thin. The ROG Strix G16 & G18 gaming laptops offer Intel Core Ultra 9 275HX or AMD Ryzen 9 9955HX processors, NVIDIA GeForce RTX graphics, up to 32 GB RAM, and ROG Nebula Displays with 240 Hz refresh rates.

The TUF Gaming A18, TUF's first 18-inch laptop, comes with AMD Ryzen 7 260, RTX 5060, up to 16 GB DDR5 RAM, 1 TB storage, and a 240 Hz screen with 500 nits brightness. The TUF Gaming F16 and A16 features Intel Core Ultra 9 275HX or AMD Ryzen 9 270 processors respectively, with RTX 5060/5070 GPUs, 2.5K 165 Hz displays, and up to 32 GB DDR5 RAM. The ASUS TUF Gaming A14 is a compact 14-inch gaming laptop featuring up to AMD Ryzen AI 7 350 processor and NVIDIA GeForce RTX 5060 graphics. It sports a 2.5K (WQXGA, 2560x1600) IPS display with 165 Hz refresh rate, up to 32 GB of LPDDR5X memory, and storage up to 2 TB SSD. The laptop includes a wide range of connectivity with USB4, USB-C, USB-A, and HDMI 2.1 ports, Dolby Atmos audio and a 73Wh battery. It weighs just 1.46 kg with a slim profile under 2 cm thick, and features a white backlit keyboard with a redesigned air intake that helps the cooling.

Acer today announced new models in its Swift X laptop series, the Swift X 14 AI and Swift X 14, designed to offer professionals and content creators reliable performance and a suite of AI tools to enhance their creative endeavors. Powered by AMD Ryzen AI 300 Series processors, the Swift X 14 AI enables seamless on-device rendering, modeling, and real-time visualization. This new Copilot+ PC is equipped to handle demanding AI workloads and offers exclusive AI experiences such as Recall (preview), Click to Do (preview), and improved Windows search, Cocreator, Live Captions, Image Creator, and Windows Studio Effects. The new Swift X 14 creator laptop ensures responsive performance for demanding creative workflows and all-day battery life powered by Intel Core Ultra Processors (Series 2).

Both laptops are powered by NVIDIA GeForce RTX 5070 Laptop GPUs with NVIDIA Blackwell architecture and also feature Calman-verified 3K OLED touch displays that are calibrated to produce captivating and accurate colors right out of the box.

Acer today announced the expansion of its Aspire AI series laptops with six new Copilot+ PCs, showcasing intuitive AI capabilities and versatile features. Available in sleek 14- and 16-inch models, these laptops offer varied configuration options, combining powerful computing with modern designs at pocket-friendly prices. The new Aspire AI laptops cater to a diverse range of users, including students, professionals and families seeking reliable performance and multi-day battery life for their daily computing needs. As Copilot+ PCs, these laptops serve to streamline workflow with exclusive AI experiences, including Recall (preview), Click to Do (preview), and Improved Windows Search, making it easier to resume tasks and quickly find what users need. Acer's proprietary AI applications - AcerSense, Acer LiveArt 2.0, Acer PurifiedView 2.0 and Acer PurifiedVoice 2.0 - make it easy to manage settings, sift through files, produce stunning content instantly, and improve videoconferencing quality.

Featuring a durable, thin-and-light aluminium chassis, the Aspire 16 AI and Aspire 14 AI are perfect for travel, going to school and mobile work. Their versatile 180° hinge designs allow them to lay flat or be positioned in various ways, adjusting viewing angles based on the task at hand. With plenty of battery life, these devices can power through more than an entire day without needing to plug in. The Aspire range comes with 14- or 16-inch up to 120 Hz displays featuring slim bezels, and 16:10 aspect ratios for expansive viewing. Touchscreen models are available for more interactive use cases. Each device is equipped with up to 32 GB LPDDR5X memory, 1 TB PCIe Gen 4 storage, and offers ultra-fast, stable connectivity with up to Wi-Fi 7 and Bluetooth 5.4. Plus, they are equipped with a generous number of I/O ports, including a pair of USB Type-C and USB Type-A ports, HDMI 2.1, and MicroSD card slots. Each model is also EPEAT Gold registered and is encased in 100% recyclable packaging.

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, continues to redefine DIY PC building with its innovative Project STEALTH, first introduced in 2022. The Project STEALTH concept was the industry's pioneer in adopting reverse-connector motherboards for a cleaner, more streamlined assembly. Now, responding to the growing demand for all-white and cableless PC builds, GIGABYTE launches the STEALTH ICE Series, featuring the AMD X870 and B850 chipset motherboards.

Beyond aesthetics and easier assembly, GIGABYTE ensures that the Project STEALTH build is highly compatible. In addition to supporting its own chassis lineup (GIGABYTE C500P STEALTH Series), GIGABYTE has partnered with over 10 renowned case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. This makes the GIGABYTE Project STEALTH Series the most compatible, the most widely supported and flexible solution in the market for cableless PC builds.

ASUS has unwillingly revealed its upcoming ROG Ally 2 handheld through FCC filings and certification images, offering an early glimpse at two distinct models. According to Indonesian certification entries and a linked US FCC listing, the Ally 2 will launch in both black and white finishes. The black version includes a dedicated Xbox button, suggesting tighter integration with Microsoft's gaming services, while the white model adheres to the traditional ROG control scheme. This latest reveal follows ASUS's April 1st teaser of "Project Kennan," which showed an animated fusion of an ROG Ally and an Xbox controller, hinting at a formal collaboration between the two companies. Under the hood, the black edition of the Ally 2 represents ASUS's most ambitious handheld to date. It employs AMD's Ryzen Z2 Extreme processor, an eight‑core chip rated at 36 W, paired with 64 GB of LPDDR5X‑8533 memory. In contrast, the white model will feature AMD's Aeirth Plus APU with four cores operating at 20 W. These hardware choices position the black version as a high‑performance Xbox-linked system, while the white version aims to balance power efficiency and sustained battery life.

Both variants are confirmed to sport a 7‑inch display with a 120 Hz refresh rate. Notably, the screen bezels appear unchanged from the original Ally and the higher‑end Ally X. The new design instead focuses on ergonomics, with larger rear grips that resemble those of a traditional controller. The top-mounted I/O includes a pair of USB Type‑C ports, and side‑view images suggest a somewhat bulkier profile. However, the final weight and comfort will depend on ASUS's manufacturing refinements. No powered‑on images have emerged, so details about display quality or software remain unverified. We assume it could support the standard Windows 11 OS, with SteamOS being an option since we reported multiple software patches for ASUS ROG Ally on SteamOS. With multiple certifications now completed in Indonesia, the United States, and Korea, ASUS seems poised to announce the ROG Ally 2 at Computex 2025. Enthusiasts are now left to await official specifications, pricing, and availability when ASUS takes the stage next month.

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and workstation product families. As outlined and interpreted by VideoCardz, several of these next-gen branches are already somewhat "known" properties—namely AMD's allegedly Zen 5-based Ryzen Threadripper "Shimada Peak" 9000WX (workstation) processor series. Following almost two years of leaks, an official introduction is expected to happen during Computex 2025. The Ryzen 9000G "Gorgon Point" desktop (Zen 5 + RDNA 3.5) APU series has turned up again; now "fully" linked to the AM5 socket platform (not a big surprise). The two leakers have also uncovered another rumored AM5-bound product lineup—"Grado" chips could be based on existing "Granite Ridge" foundations, but elevated to commercial/enterprise levels. These speculated basic/entry-level "EPYC 4005" processors are floated as natural successors to currently available 4004 forebears (related to Ryzen 7000 "Raphael" architecture).

Olrak29 and InstLatX64 have also found multiple mysterious FP8 socket-related Ryzen AI Mobile SoCs. "Krackan2" could be a cheaper refresh of current "Krackan Point" APUs—Tom's Hardware proposes smaller designs that sport fewer cores, and not configured with NPUs. Kepler_L2 has weighed in on the matter of three listed "Gorgon Point" IPs—he reckons that the third variant ("Gorgon Point3") will be a spin-off (aka refresh) of a "Krackan2" design. As suggested by insider knowledge, Team Red's convoluted scheme points to "Gorgon Point" being the sequel to "Strix Point." An FF5-based "Soundwave" processor design has appeared alongside the aforementioned futuristic Ryzen AI Mobile chipsets—industry whispers propose that AMD will be leveraging Arm architecture within a lower product tier. InstLatX64 pulled additional compelling information from AMD's Technical Information Portal—providing further insight into Ryzen AI "Medusa Point" APUs (Zen 6 + RDNA 3.5) being dreamt up, with a matching "larger footprint" FP10 platform.

Microsoft has deployed three AI features to Copilot+ PCs through the Windows 11 April 2025 non-security preview update. Users can finally access the long-promised Recall, Click to Do, and enhanced Windows Search by enabling "Get the latest updates as soon as they're available" in Settings > Windows Update. Recall operates as a background capture system that takes periodic screenshots, encrypts them via the device's TPM chip, and stores them locally. The system creates a searchable index organized by keywords, dates, and applications. Privacy controls include Windows Hello authentication for settings changes, app-specific exclusions, customizable retention periods, and snapshot deletion options. Windows E3 enterprise deployments can implement Group Policy controls for centralized management.

Click to Do functions at the window manager level, activated by Win + Click or touchscreen right swipe. The context-aware tool provides different capabilities based on content type, offering summarization and translation for text, and background removal and editing for images. Image processing works across all Copilot+ hardware, while text functionality currently supports only Snapdragon processors, with AMD Ryzen AI 300-series and Intel Core Ultra 200V compatibility scheduled for later release. The updated Windows Search implements a compact language model running directly on the device's NPU. This enables natural-language queries throughout Windows interfaces, allowing users to find content without exact filenames. The system operates on NPUs rated at over 40 TOPS and delivers 70 percent faster retrieval than Windows 10.

AMD has released the latest version of the Ryzen Chipset Software, version 7.04.09.545, which introduces new bug fixes and adds new device IDs. The Ryzen Chipset Software drivers support AMD 300-series to 800-series desktop chipsets, as well as TRX and WRX series Ryzen Threadripper chipsets. The new version still includes several known issues that will hopefully be addressed in future updates, including the issue where after installing the AMD Chipset Installer version "7.xx.xx.xx", users cannot install older version "6.xx.xx.xx" or earlier drivers. Thankfully, there is a workaround detailed below. It also includes an issue where non-English driver names appearing in the English language selection and an issue with occasional failure to install or upgrade Ryzen PPKG.

DOWNLOAD: AMD Chipset Software 7.04.09.545

AMD today announced that it will be hosting a press conference during Computex 2025. The in-person and livestreamed press conference will take place on Wednesday, May 21, 2025, at 11 a.m. UTC+8, Taipei, at the Grand Hyatt, Taipei. The event will showcase the advancements AMD has driven with AI in gaming, PCs and professional workloads.

AMD senior vice president and general manager of the Computing and Graphics Group Jack Huynh, along with industry partners, will discuss how AMD is expanding its leadership across gaming, workstations, and AI PCs, and highlight the breadth of the company's high-performance computing and AI product portfolio. The livestream will start at 8 p.m. PT/11 p.m. ET on Tuesday, May 20 on AMD.com, with replay available after the conclusion of the livestream event.

Lenovo today unveiled a refreshed portfolio of ThinkPad devices engineered to meet the evolving needs of modern professionals—from content creators and engineers to knowledge workers and hybrid teams. The lineup includes powerful Copilot+ PCs, such as the ThinkPad P14s Gen 6 AMD and ThinkPad P16s Gen 4 AMD mobile workstations, alongside new ThinkPad L Series business laptops and expands its ThinkPad X1 Aura Editions, delivering the performance, manageability, and intelligence today's AI-powered workflows demand.

Together, these latest ThinkPad systems reflect Lenovo's commitment to delivering smarter, more adaptive solutions that support advanced workloads, sustainability goals, and flexible work models—whether users are building complex simulations or collaborating across teams.

Yesterday, AMD released Radeon Software Adrenalin Edition 25.4.1 Optional Beta drivers that add FidelityFX Super Resolution 4 to The Elder Scrolls IV: Oblivion Remastered, Assassin's Creed Shadows, Kingdom Come Deliverance 2, Dynasty Warriors Origin, Civilization 7, and Naraka Bladepoint. It also brings Amuse 3 support and AMD-optimized models to Radeon RX 9000 and RX 7000 series graphics cards alongside Ryzen AI 300 series processors. Among the many fixes you'll find corrected lighting artifacts in Topaz Photo AI's Adjust Lighting features on RX 9000 series cards, removed flicker when using AMD FreeSync, improved DirectML and GenAI performance in Amuse 3.0 on RX 7000 GPUs and Ryzen AI 300 series chips, and patched image corruption in certain diffuser models on RX 9000 hardware.

The update also smooths out stutter and performance drops in World of Warcraft's Western Plaguelands, restores integrated camera detection after factory resets on Ryzen AI Max devices, and addresses AMD Chat installation hangs. Since this is still an optional beta with some known issues, like FSR 4 not activating in Naraka Bladepoint on Windows 10, crashes in The Last of Us Part 2, memory leaks in SteamVR on RX 9000 cards, or intermittent launch and stability hiccups in games like Cyberpunk 2077, Fantasy VII Rebirth, Battlefield 1, Monster Hunter Wilds and Marvel's Spider-Man 2, AMD recommends using the suggested workarounds such as disabling motion smoothing or integrated graphics in your BIOS and holding out for your system vendor's certified driver to ensure full compatibility.

DOWNLOAD: AMD Software Adrenalin 25.4.1 Beta