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AMD X570 Unofficial Platform Diagram Revealed, Chipset Puts out PCIe Gen 4

AMD X570 is the company's first in-house design socket AM4 motherboard chipset, with the X370 and X470 chipsets being originally designed by ASMedia. With the X570, AMD hopes to leverage new PCI-Express gen 4.0 connectivity of its Ryzen 3000 Zen2 "Matisse" processors. The desktop platform that combines a Ryzen 3000 series processor with X570 chipset is codenamed "Valhalla." A rough platform diagram like what you'd find in motherboard manuals surfaced on ChipHell, confirming several features. To maintain pin-compatibility with older generations of Ryzen processors, Ryzen 3000 has the same exact connectivity from the SoC except two key differences.

On the AM4 "Valhalla" platform, the SoC puts out a total of 28 PCI-Express gen 4.0 lanes. 16 of these are allocated to PEG (PCI-Express graphics), configurable through external switches and redrivers either as single x16, or two x8 slots. Besides 16 PEG lanes, 4 lanes are allocated to one M.2 NVMe slot. The remaining 4 lanes serve as the chipset bus. With X570 being rumored to support gen 4.0 at least upstream, the chipset bus bandwidth is expected to double to 64 Gbps. Since it's an SoC, the socket is also wired to LPCIO (SuperIO controller). The processor's integrated southbridge puts out two SATA 6 Gbps ports, one of which is switchable to the first M.2 slot; and four 5 Gbps USB 3.x ports. It also has an "Azalia" HD audio bus, so the motherboard's audio solution is directly wired to the SoC. Things get very interesting with the connectivity put out by the X570 chipset.
Update May 21st: There is also information on the X570 chipset's TDP.
Update May 23rd: HKEPC posted what looks like an official AMD slide with a nicer-looking platform map. It confirms that AMD is going full-tilt with PCIe gen 4, both as chipset bus, and as downstream PCIe connectivity.

ZADAK Announces the SPARK RGB DDR4 Memory

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

MSI X570 MPG Motherboards Leaked: Gaming Pro Carbon, Gaming Plus

The folks over at Videocardz have treated us to a leak on MSI's upcoming X570 motherboards. The company's mid-tier MPG motherboards usually include the likes of the Gaming Carbon and Gaming Plus motherboards, and this round of motherboard development is no different. Both motherboards join leaked designs from other brands that showed active cooling being mounted on top of the chipset, a throwback to another era.

The leaked Gaming Plus is the lower-tier of the two leaked solutions of today, cutting on reinforcements on some expansion ports (such as the PCIe 16x slot). The Gaming Pro Carbon features a fancier design (with RGB lighting); the chipset hroud also serves as cooling for M.2 slots you can populate underneath (or so it seems). The Gaming Pro Carbon has more attention to detail on the placement of connectors such as SATA, and seems to have a slight advantage on the overall motherboard power delivery circuits, but these are just being eyeballed. One thing we can see is that while the Gaming Pro Carbon features MSI's Audio Boost feature, the Gaming Plus doesn't. Expect more details to be available closer to launch.

AMD Confirms Launch of Next-gen Ryzen, EPYC and Navi for Q3

During AMD's annual shareholder meeting today, AMD president and CEO Dr. Lisa Su confirmed the launch of next-generation AMD Ryzen, EPYC CPUs and Navi GPUs for the third quarter of this year. The expected products are going to be manufactured on TSMC's 7 nm process and will be using new and improved architectures.

Ryzen 3000 series CPUs are rumored to have up to as much as 16 cores in Ryzen 9 SKUs, 12 cores in Ryzen 7 SKUs and 8 cores in Ryzen 5 SKUs. EPYC server CPUs will be available in models up to 64 cores. All of the new CPUs will be using AMD "Zen 2" architecture that will offer better IPC performance and, as rumors suggest for consumer models, are OC beasts. Navi GPUs are the new 7 nm GPUs that are expected to be very competitive both price and performance wise to NVIDIA's Turing series, hopefully integrating new technologies such as dedicated Ray Tracing cores for higher frame rates in Ray Tracing enabled games. No next generation ThreadRipper launch date was mentioned, so we don't yet know when and if that will that land.

BIOSTAR Releases 3rd Gen Ryzen Support BIOS Updates for AM4 Motherboards

BIOSTAR,a leading manufacturer of motherboards, graphics cards, and storage devices offers piece of mind for its customers, announcing the BIOSTAR AMD AM4 300-series and 400-series motherboardswill be compatible with upcoming 3rd Gen AMD RYZEN CPUs. BIOSTAR's engineering team have been working relentlessly prior to the availability of the upcoming CPUs to ensure BIOSTAR products keep their promise of ensuring customers get the best value without worrying about future upgrades.

Among the motherboard models eligible for BIOS update are: B350ET2, B350GT3, B350GT5, B350GTN, B450GT3, X370GT3, X370GT5, X370GT7, X370GTN, X470GT8, X470GTN, A320MD PRO, A320MH PRO, TA320-BTC, TB350-BTC, A320MY-Q7, A320MH, B45M2, B450MHC, B450MH, and Hi-Fi B350S1. You should be able to find the BIOS updates in the downloads section of the product pages of these motherboards on the BIOSTAR website.

Lenovo Launches New ThinkPad Laptops Based on New AMD Ryzen PRO processors

Lenovo has released a trio of new Windows 10 laptops based on new, 2nd generation AMD Ryzen PRO processors, in their famous ThinkPad form factor. There are two models that are part of the T series of ThinkPads, while one is part of X series. For reminding, the T series is the flagship line that offers the best balance between ruggedness, features, processing power, and portability in a 14 or 15-inch unit, while the X series focuses on portability.

The new ThinkPads use the second generation of AMD Ryzen PRO processors, which are 12nm improvements of the previous 14nm Ryzen Family. They carry the 3000 name branding but are similar to the 2000 series of desktop CPUs.

ASRock Releases Next-gen AMD CPU BIOS Updates for Socket AM4 Motherboards

ASRock has announced BIOS updates for AMD X470/B450/X370/B350 and A320 series motherboards to support the soon to be released new AMD Ryzen processors. The latest BIOS update will be available for download from specific product pages on ASRock website or simply update through ASRock APP Shop. The latest BIOS for each motherboard are listed as below. BIOS are expected to be released in May.

AMD's Zen 2 Threadripper Conspicuously Absent From Company's Latest Roadmaps

We've all taken a look at AMD's March 2019 product roadmap, which showed us the upcoming 2019 tech the company would be bringing to the table in its "non-stop product momentum". However, it seems that this non-stop product momentum might be coming to an unexpected twist of fate that might delay it from entering the last station - the Zen 2-based Threadripper. In the company's latest May earnings call roadmap, the company silently removed the Zen 2 Threadripper from its product roadmap - where it used to sit right after the launch of Zen 2-based Ryzen products for consumers, is now just a big crop of the space it occupied.

This might mean many things, and a mistake on someone's part while cropping the PowerPoint slide could be the only thing going on here. However, the best and most plausible speculation that can be entertained when one considers this is simple - a supply problem. With the 7 nm node being the newest, most dense fabrication process possible, and with AMD having to share TSMC's 7 nm wafer production with a number of high profile companies - such as Qualcomm, for instance - may mean that supply is simply too tight to support Zen 2-based products across so many product stacks - Ryzen and Epyc - at the same time.

Samsung Kills Production of Famed B-die DDR4 Memory in Favor or Higher Densities

As the world becomes more and more centered on data, as well as its processing and storage, increased memory density across products is becoming more of a necessity. It seems that out of this necessity and a need to streamline its memory production towards favoring denser outputs, Samsung is killing of the famous B-die chips, which were - and still are - part of a love affair with any enthusiast's Ryzen desktop.

Memory compatibility issues with the first gen Ryzen took a while to dissipate, and didn't vanish entirely; however, overclockers quickly found that the most stable and overclockable memory ICs all were of the Samsung B-die type. Now, the company has updated its product catalogue to reflect EOL (End of Life) status for B-dies, replacing it with denser M-Die and A-Die products. M-dies were supposed to bring 32 GB densities to a single rank of memory - and have apparently been siphoned off to server applications and left out in the cold for consumer purchase), while the new A dies increase memory density per IC, meaning less of these are necessary to achieve the same final memory footprint. Whether or not these will feature the same Ryzen compatibility and overclockability as their B-die predecessors is unknown at this point, but it would make a lot of enthusiasts slightly unhappy - and increase the value of B-die offerings in any sort of discerning second-hand market - if they did not.

Possible Listings of AMD Ryzen 9 3800X, Ryzen 7 3700X, Ryzen 5 3600X Surface in Online Stores

Remember to bring your osmosis process to the table here, as a good deal of salt is detected present in this story's environment. Some online webstores from Vietnam and Turkey have started listing AMD's 3000 series CPUs based on the Zen 2 architecture. The present company stands at a Ryzen 9 3800X, Ryzen 7 3700X, and Ryzen 5 3600X, and the specs on these are... Incredible, to say the least.

The Ryzen 9 3800X is being listed with 32 threads, meaning a base 16-core processor. Clock speeds are being reported as 3.9 GHz base with up to 4.7 GHz Turbo on both a Turkish and Vietnamese etailer's webpages. The Turkish Store then stands alone in listing AMD's Ryzen 7 3700X CPU, which is reported as having 12 cores, 24 threads, and operating at an extremely impressive 4.2 GHz base and 5.0 GHz Boost clocks. Another listing by the same website, in the form of the Ryzen 5 3600X, details the processor as having 8 physical cores and running at 4.0 GHz base and 4.8 Boost clocks.

Intel, AMD, and HTC Partner to Resolve Vive Wireless Adapter Compatibility Issue with Ryzen Processors

The headline of this post makes it seem a touch more innocuous than the story may lead to, at least if you believe the rumor mills abound. There has been an ongoing issue with AMD systems using Ryzen CPUs and the HTC Vive wireless adapter (powered by Intel WiGig) to where the systems have frozen or even had a BSOD. HTC acknowledged this as early as Nov, 2018, noting that they have seen this with a subset of Ryzen-based motherboards when the PCIe wireless adapter is installed and running. It took until last week to get a solution of sorts, and unfortunately reports from users indicate this is not a true fix for everyone.

The hotfix update 1.20190410.0 was made available April 25 to attempt to combat this issue, which was garnering a lot of attention in the VR-community on whether there was more Intel could be doing to help AMD customers. This hotfix update is available automatically once an end user with the Vive wireless adapter checks for an update, and HTC acknowledge that they continue to test this, as well as partner with Intel and AMD to help resolve this once and for all. In the meantime, users report mixed success to date, including some we know personally as well, and it remains a thorn in the side of wireless VR to get to the PC successfully.

AMD Reports First Quarter 2019 Financial Results- Gross margin expands to 41%, up 5 percentage points year-over-year

AMD today announced revenue for the first quarter of 2019 of $1.27 billion, operating income of $38 million, net income of $16 million and diluted
earnings per share of $0.01. On a non-GAAP(*) basis, operating income was $84 million, net income was $62 million and diluted earnings per share was $0.06.

"We delivered solid first quarter results with significant gross margin expansion as Ryzen and EPYC processor and datacenter GPU revenue more than doubled year-over-year," said Dr. Lisa Su, AMD president and CEO. "We look forward to the upcoming launches of our next-generation 7nm PC, gaming
and datacenter products which we expect to drive further market share gains and financial growth."

AMD X570 Chipset to Feature 40 PCIe 4.0 Lanes

As we gear up for launch of AMD-s Ryzen 3000 series, details are bound to come up with increasing frequency. One of the latest, regarding AMD's in-house developed X570 chipset, which brings a renewed feature set to the AM4 platform, pertains to its PCIe lanes. AMD has included a grand total of 40 PCIe 4.0 lanes on the chipset, which will be distributed between PCIe uplink, USB 3.1 Gen2, USB 2.0 and SATA, as the spec sheet below (which may not be real) indicates. That's a whole load of bandwidth for the PC platform, not counting those PCIe lanes that are to be provided by the Ryzen CPUs.

It seems AMD will be using PCIe support level as a differentiator factor for its chipsets. The X570 is reported to be the only chipset to feature PCIe 4.0 support, while all other chipsets below it (B550 and so on) will only support PCIe 3.0. These lower-end chipsets should be manufactured by ASMedia.

AMD Ryzen 7 2700X 50th Anniversary Edition Pictured Up Close: Signed by Lisa Su

Here are two of the first high-resolution pictures of the Ryzen 7 2700X 50th Anniversary Edition commemorative processor by AMD. It turns out we were right in guessing that it has special markings on the IHS (integrated heatspreader). Turns out, you get a facsimile of AMD CEO Lisa Su's signature, in addition to the AMD-50 logo above the main Ryzen logo. The box itself sees black replace gray as the primary color, and gold replacing auburn/orange in most places except the main Ryzen logo on the front face. A Wraith Prism RGB cooling solution is included, just like normal 2700X PIB packages. Early listings of the processor pinned its price around USD $340, a premium over the $295 price the Ryzen 7 2700X is typically going for.

AMD Announces the Ryzen Embedded R1000 SoC Series

At the Taiwan Embedded Forum, AMD announced the Ryzen embedded product family is growing with the new AMD Ryzen Embedded R1000 SoC. Building upon the success of the Ryzen Embedded V1000 SoC, the AMD Ryzen Embedded R1000 SoC provides embedded customers with dual core, quad-threaded performance, as well as the ability to run fanless, low power solutions for 4K displays; while providing leading-edge security features. The AMD Ryzen Embedded R1000 is perfect for applications in digital displays, high-performance edge computing, networking, thin clients and more.

Customers like Advantech, ASRock Industrial, IBASE, Netronome, Quixant and others are already working on Ryzen Embedded R1000-based products. As well, Atari© is using the high-performance Vega 3 graphics and 'Zen' CPU architecture in the AMD Ryzen Embedded R1000 SoC to power the upcoming Atari VCS game system.

MSI Issues Clarification on Next-Gen AMD CPU Support on 300-series Motherboards

It has come to our attention that MSI Customer Support has regrettably misinformed an MSI customer with regards to potential support for next-gen AMD CPUs on the MSI X370 XPOWER GAMING TITANIUM motherboard. Through this statement we want clarify the current situation.

At this point, we are still performing extensive testing on our existing lineup of 300- and 400-series AM4 motherboards to verify potential compatibility for the next-gen AMD Ryzen CPUs. To be clear: Our intention is to offer maximum compatibility for as many MSI products as possible. Towards the launch of the next-gen AMD CPUs, we will release a compatibility list of MSI AM4 motherboards. Below is a full list of upcoming BIOS versions which include compatibility for the next-gen AMD APUs for our 300-Series and 400-Series AM4 motherboards based on the latest AMD Combo PI version 1.0.0.0. These BIOS versions are expected to be released in May this year.

AMD Readies 50th Anniversary Special Edition Ryzen 7 2700X

AMD is celebrating its 50th Anniversary with a new commemorative special edition package of the Ryzen 7 2700X eight-core desktop processor. This package carries the PIB SKU number "YD270XBGAFA50." American online retailer ShopBLT had it listed for USD $340.95 before pulling the listing down and marking it "out of stock." The listing doesn't come with any pictures or details about the SKU, except mentioning that a Wraith Prism RGB CPU cooler is included (as it normally is for the 2700X PIB package).

Given that AMD hasn't changed the model number, we expect these processors to have the same specifications as regular Ryzen 7 2700X, but with some special packaging material, and perhaps some special laser engraving on the processor's IHS. AMD has used tin boxes in the past for its first FX-series processors, so the possibility of something similar cannot be ruled out. Since pricing of this SKU isn't significantly higher, we don't expect it to be of a higher bin (better overclockers) than regular 2700X chips. Based on the 12 nm "Pinnacle Ridge" silicon, the 2700X is an 8-core/16-thread processor derived from the "Zen+" architecture, with 3.70 GHz clock-speed, 4.30 GHz maximum Precision Boost, XFR, L2 cache of 512 KB per core, and 16 MB of shared L3 cache.

AMD "Castle Peak," "Rome," and "Matisse" Referenced in Latest AIDA64 Changelog

FinalWire over the past week posted the latest public beta of AIDA64, which adds support for the three key processor product lines based on AMD's "Zen 2" microarchitecture. The "Matisse" multi-chip module, which received extensive coverage over the past few weeks, will be AMD's main derivative of "Zen 2," designed for the client-segment socket AM4 platform, with up to 16 CPU cores, and the initial flagship product featuring 12 cores. "Rome" is AMD's all-important enterprise-segment MCM for the SP3 platform, with up to 64 CPU cores spread across eight 8-core chiplets interfacing a centralized I/O controller die with a monolithic 8-channel memory controller. It so happens that AMD also wants to update its Ryzen Threadripper line of high-end desktop processors, with "Castle Peak."

"Castle Peak" is codename for 3rd generation Ryzen Threadripper and a client-segment derivative of the "Rome" MCM with a reconfigured I/O controller die that has a monolithic 4-channel DDR4 memory interface, and an unspecified number of CPU cores north of 24. This is for backwards compatibility with the existing AMD X399 motherboards. AMD configures core-count by physically changing the number of 8-core chiplets on the MCM, in addition to disabling cores in groups of 2 within the chiplet. The company could scale core counts looking at its competitive environment. The monolithic quad-channel memory interface could significantly improve the chip's memory performance compared to current-generation Threadrippers, particularly the Threadripper WX series chips in which half the CPU cores are memory bandwidth-starved. The AIDA64 update also improves detection of existing Ryzen/EPYC processors with the K17.3 and K17.5 integrated northbridges.

DOWNLOAD: FinalWire AIDA64 Extreme 5.99.4983 beta

Borderlands 3 Confirmed to be EPIC Games Store Timed Exclusive on PC, Developed in Partnership with AMD

Well, that tweet that fans of the Borderlands series feared meant platform exclusivity on PC actually manifested itself. Gearbox today announced that Borderlands 3, the hit sequel to one of the first loot-shooters, will indeed be releasing on September 13th for all platforms - but will be distributed exclusively on the PC digital platform via the EPIC Games Store. Other storefronts will have to wait until April 2020 to sell copies of the game.

The game will also feature optimized performance for AMD's CPU and GPU portfolio, with AMD aiding in performance optimizations for its Ryzen CPUs, current GPUs and, expectedly, next-generation Navi. The announcement trailer and 2K's press release points to a story-driven shooter, that Gearbox CEO Randy Pitchford pitched (ahem) as "a love letter to fans of the series, but also as an ideal entry point for new players to jump-in alone or cooperatively, on or off-line, in the latest and greatest installment of the definitive best-in-class benchmark shooter-looter." The announcement trailer follows.

AMD to Simultaneously Launch 3rd Gen Ryzen and Unveil Radeon "Navi" This June

TAITRA, the governing body behind the annual Computex trade-show held in Taipei each June, announced that AMD CEO Dr. Lisa Su will host a keynote address which promises to be as exciting as her CES keynote. It is revealed that Dr. Su will simultaneously launch or unveil at least four product lines. High up the agenda is AMD's highly anticipated 3rd generation Ryzen desktop processors in the socket AM4 package, based on "Zen 2" microarchitecture, and a multi-chip module (MCM) codenamed "Matisse." This launch could be followed up by a major announcement related to the company's 2nd generation EPYC enterprise processors based on the "Rome" MCM.

PC enthusiasts are in for a second major announcement, this time from RTG, with a technical reveal or unveiling of Radeon "Navi," the company's first GPU designed from the ground up for the 7 nm silicon fabrication process. It remains to be seen which market-segment AMD targets with the first "Navi" products, and the question on everyone's minds, whether AMD added DXR acceleration, could be answered. Lastly, the company could announce more variants of its Radeon Instinct DNN accelerators.

AMD President and CEO Dr. Lisa Su to Deliver COMPUTEX 2019 CEO Keynote

Taiwan External Trade Development Council (TAITRA) announced today that the 2019 COMPUTEX International Press Conference will be held with a Keynote by AMD President and CEO Dr. Lisa Su. The 2019 COMPUTEX International Press Conference & CEO Keynote is scheduled for Monday, May 27 at 10:00 AM in Room 201 of the Taipei International Convention Center (TICC) in Taipei, Taiwan with the keynote topic "The Next Generation of High-Performance Computing".

"COMPUTEX, as one of the global leading technology tradeshows, has continued to advance with the times for more than 30 years. This year, for the first time, a keynote speech will be held at the pre-show international press conference," said Mr. Walter Yeh, President & CEO, TAITRA, "Dr. Lisa Su received a special invitation to share insights about the next generation of high-performance computing. We look forward to her participation attracting more companies to participate in COMPUTEX, bringing the latest industry insights, and jointly sharing the infinite possibilities of the technology ecosystem on this global stage."

AMD Speeds up Ryzen APU Support with Radeon 19.2.3 Drivers

AMD today released their latest Radeon Software Adrenaline 2019 Edition drivers. This latest beta, version 19.2.3, brings with it support for AMD Ryzen mobile processors with Vega graphics which see up to a 10% performance boost on average versus the 17.40 launch drivers. Titles included in the performance testing were; Destiny 2, Shadow of War, Rise of the Tomb Raider, Civilization 6, and the Witcher 3. Furthermore, various eSports title have seen performance gains of up to 17%, again when compared to the older 17.40 launch drivers. The games AMD used for testing were; Counter-Strike: Global Offensive, Fortnite, Player Unknown's Battleground, and World of Warcraft. The only other performance gains specifically mentioned in this driver release is a 3% boost in Dirt Rally 2 on the Radeon RX Vega 64.

AMD has fixed a few issues with this release as well including player character outlines being stuck on screen after being revived in Battlefield V being the most significant fix. Otherwise, all other fixes or changes are related to AMD software or features such as ReLive wireless VR, FreeSync, and fan tuning. That said, a few prominent issues remain some of which have been around for some time like mouse lag on multi-monitor systems when one display is turned off. Other problems include Radeon WattMan not applying settings changes on the AMD Radeon VII. Meanwhile, the performance metrics overlay may fluctuate giving inaccurate readings on the previously mentioned Radeon VII. For full details, you can check the changelog after the break.
DOWNLOAD: AMD Radeon Software Adrenalin 19.2.3

AMD May Offer Some Insights on Upcoming Ryzen 3000 Series at GDC 2019

AMD's Ryzen 3000 series is one of the most hotly anticipated hardware launches in recent times. I'd say that the hype surrounding AMD's processor launches, unlike Intel's, has become vested with an actual enthusiasm that is likely in our nature - to see the underdog come out with innovative products that reverse market expectations. AMD's processor launches have seen hype levels rivaling - and even surpassing, all of this anecdotally, of course - some GPU launches. It makes sense for AMD to embrace every opportunity it gets to build hype around its products - and it seems the company will be doing just so at GDC 2019, which will run from March 18th through March 22nd.

AMD will be hosting a time slot at GDC 2019 in San Francisco. Hosted by Ken Mitchell, the presentation that has been slotted in to GDC's panels is titled ""AMD Ryzen Processor Software Optimization (Presented by AMD)". As the announcement reads, this presentation is meant to "Learn about the Ryzen line up of processors, profiling tools and techniques to understand optimization opportunities, and get a glimpse of the next generation of "Zen 2" x86 core architecture. Gain insight into code optimization opportunities and lessons learned with examples including C/C++, assembly, and hardware performance-monitoring counters." So no, there won't be any architecture deep dives. But there will be some new information - and we all know that speculating and running through the breadcrumb trail is a huge part of the fun.

ASRock Readies Nine AMD X570 Motherboards with "Zen 2" Matisse Support

Sometime mid-2019, AMD will launch its 3rd generation Ryzen "Zen 2" processors with core counts of up to 16 cores in the AM4 package. These processors will launch alongside the new AMD 500-series desktop chipset family, led by the X570. AMD assures backwards compatibility of these processors with older chipsets provided motherboard vendors support their customers with BIOS updates. You'll probably need a 500-series chipset motherboard to use PCI-Express gen 4.0 connectivity, while older chipsets will limit connectivity to gen 3.0 (not that there are any GPUs that use gen 4.0).

ASRock is developing as many as nine motherboard models based on the AMD X570, according to a list scored by VideoCardz. These include the X570 Phantom Gaming X and X570 Taichi leading the top-end; X570 Phantom Gaming 6, X570 Phantom Gaming 4, and X570 Extreme4 covering the mid-range, and the entry-level of the lineup consisting of the X570 Pro4/R2.0 and X570M Pro4/R2.0.

AMD Zen 2 12-Core, 24-Thread Matisse CPU Spotted in UserBenchmark

A new development could shake up our expectations on AMD's new Ryzen 2 CPUs, which if true, could mean that previous rumors of much increased core-counts at the top of AMD's offerings were true. User TUM Apisak, who has been involved in multiple information leaks and scouting for the hardware world, has digged enough to find a submitted UserBenchmark that screams of a 12-core, 24-thread AMD Matisse part (an engineering sample at that, so keep your hats on for the presented clock speeds).

The benchmark list the used CPU via product code 2D3212BGMCWH2_37 / 34_N (H2 is indicative of a Matisse CPU The benchmark is listing a base clock speed of 3.4 GHz and an average boost clock speed of 3.6 GHz. The rest of the system specs are very, very basic, with 4 GB of 1333 MHz DDR4 memory being used on a new AMD platform, based on the Myrtle-MTS based chipset. The processor is listed having a 105 watts TDP and 32 MB of L3 cache.
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