Recent moves indicate that Valve is planning an imminent launch for the Steam Machine, but more recently, Valve increased the pricing of its existing Steam Deck hardware across the board by as much as $300. Following the announcement of the Steam Deck price changes, notable industry insider, Brad Lynch, who has previously supplied accurate leaks regarding Valve products, compared the updated Steam Deck pricing to what he had heard about the starting price of the Steam Machine. According to the leaker, the planned Steam Machine pricing from two months ago was "still higher than today's Steam Deck prices."

The implication seems to be that the Steam Machine pricing towards the end of March was higher than the current $949 top-tier Steam Deck OLED, and that the current Steam Machine pricing would likely be even higher, thanks to ongoing memory and general hardware shortages and price hikes over the ensuing months. Best-case scenario, Lynch means to say that the Steam Machine's prior pricing was higher than the entry-level 512 GB Steam Deck OLED, which starts at $789. Of course, while there is speculation that the Steam Machine will launch soon, there has been no official confirmation to support this, and the same is true for pricing. Valve has previously said that it would not be pricing the Steam Machine as aggressively as it had priced the Steam Deck initially, but it may be reconsidering that approach if Steam Machine production units start piling up and hardware prices continue to increase.

MSI introduces the PRO MAX Series, a professional platform built around Modernity, Acceleration, and eXperience. Designed with a unified visual hierarchy, it keeps the focus entirely on content while optimizing multitasking, data-centric tasks, and hybrid collaboration. As workflows transition beyond traditional offices, PRO MAX ensures continuity across home and collaborative environments. Launching with Desktop PCs, All-in-One PCs, and Monitors, the series establishes a streamlined ecosystem engineered for performance, consistency, and visual harmony

PRO MAX 80 Series: Professional Productivity in a Minimalist Form
MSI introduces the new PRO MAX 80 Series, featuring a minimalist and elegant design tailored for modern professional environments. Supporting NVIDIA GeForce RTX graphics for smooth performance, while extensive connectivity with up to nine USB Type-A ports and one USB Type-C port ensures broad device compatibility. Designed with security and usability in mind, the PRO MAX 80 Series features BIOS-level USB control, plus physical protection including Kensington lock support, a padlock loop, and chassis intrusion detection. Combining modern aesthetics, reliable performance, and enhanced security, the PRO MAX 80 Series provides a powerful foundation for professional productivity.

AMD today released Ryzen AI Halo, a compact AI development computer designed by AMD to serve as a nearly full-stack machine for AI development, inferencing, and generative AI content creation. Ryzen AI Halo is designed to strike a unique balance of price, performance, and capabilities that rival Apple Mac Mini and NVIDIA DGX Spark. It is a compact computer that can be used as a standalone PC, or in small clusters talking to your workstation. An advantage it offers over DGX Spark and Mac Mini is that it's based on x86-64, and fully supports Windows. AMD is pricing the Ryzen AI Halo at $3,999. Pre-orders open in June 2026.

At the heart of the Ryzen AI Halo is the Ryzen AI Max+ 395 "Strix Halo" processor that combines 16 "Zen 5" CPU cores with an oversized iGPU powered by the RDNA 3.5 graphics architecture, featuring compute capabilities. There's also a nimble 50 TOPS NPU. Perhaps the most interesting aspect that brings this whole device together, is memory. The processor features a quad-channel (256-bit wide) LPDDR5x memory interface, and AMD has crammed 128 GB of memory into this box. Also helping things is a spacious 2 TB NVMe SSD. The large memory size, helps the processor run AI models with up to 200B parameters, with the right quantization. For reference, the current Mac Mini can only be configured with up to 64 GB of memory. Hardware is less than half the story, the bulk of AMD's engineering effort with the Ryzen AI Halo is on the software side. The company innovated a comprehensive software platform compatible with both Windows and Linux, which helps developers quickly deploy one or more Ryzen AI Halo boxes faster than it takes to set up DGX Spark, AMD says.

ASUS Republic of Gamers (ROG) today announced the ROG Crosshair 2006, a cousin of the Crosshair X870E Dark Hero that is an aesthetic throwback to the first motherboard ROG created 20 years ago.

Its potent gaming power is draped in time-traveling retro style. Decked with eye-catching colors and materials that harken back to one of PC gaming's most important formative eras, the ROG Crosshair 2006 is the new motherboard of choice for gamers who demand the best of past and present. This special edition is armed to the teeth with 2026's most innovative gaming tech, with the latest refinements equipping users for a supremely easy PC building experience. Its marquee feature is a 2-inch OLED screen on the primary M.2 slot, which can display useful system information such as CPU clock speed, device temperatures, or fan speeds. Users can also personalize the OLED display with their own custom images or animations.

Lenovo today announced the latest additions to its 2026 ThinkPad portfolio, completing the rollout of its next-generation business devices with new ThinkPad X13 Gen 7 and ThinkPad L Series models. Designed to meet the evolving needs of enterprise customers, the expanded portfolio brings AI-enabled performance, enhanced mobility, and flexible deployment options to organizations of all sizes.

Building on its 2026 portfolio momentum, Lenovo continues to advance its vision of Smarter AI for All through a portfolio of devices designed to support more intelligent and efficient ways of working. Across the latest ThinkPad systems, users benefit from advanced performance alongside the reliability, security, and manageability required in enterprise environments.

AMD today announced financial results for the first quarter of 2026. First quarter revenue was $10.3 billion, gross margin was 53%, operating income was $1.5 billion, net income was $1.4 billion and diluted earnings per share was $0.84. On a non-GAAP(*) basis, gross margin was 55%, operating income was $2.5 billion, net income was $2.3 billion and diluted earnings per share was $1.37.

"We delivered an outstanding first quarter, driven by accelerating demand for AI infrastructure, with Data Center now the primary driver of our revenue and earnings growth," said Dr. Lisa Su, AMD chair and CEO. "We are seeing strong momentum as inferencing and agentic AI drive increasing demand for high-performance CPUs and accelerators. Looking ahead, we expect server growth to accelerate meaningfully as we scale supply to meet demand. Customer engagement around MI450 Series and Helios is strengthening, with leading customer forecasts exceeding our initial expectations and a growing pipeline of large-scale deployments providing us with increasing visibility into our growth trajectory."

LG Electronics USA today announced U.S. availability for its 2026 LG gram laptop lineup. All four new series of laptops—LG gram Pro, LG gram Pro 2-in-1, LG gram and LG gram Book—are now available at LG.com and LG-authorized retailers. To celebrate the 2026 lineup launch, LG is offering a 1-year Premium Care service plan on select LG gram laptops for only $1 until May 10, 2026.

Powered by next-generation Intel Core Ultra and AMD Ryzen AI processors, the 2026 gram lineup combines ultra-light portability, military-grade durability and Dual AI capabilities for professionals, creators, students and everyday users.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors, power supply units, and AIOs, proudly announces outstanding overclocking achievements with its flagship ASRock X870E Taichi OCF motherboard, paired with the powerful AMD Ryzen 9 9950X3D2 Dual Edition processor.

Professional overclockers AKM and l0ud_sil3nc3 have successfully pushed system performance to new heights across multiple benchmark platforms, securing several Global 1st Place records and top global rankings. These results once again demonstrate the extreme overclocking capability and rock-solid stability of the X870E Taichi OCF.

Today, AMD released the AMD Ryzen 9 9950X3D2 Dual Edition processor, the first processor that brings dual AMD 3D V-Cache technology to the desktop, unlocking a new level of performance for developers, creators and gamers.

Built for demanding developers, the AMD Ryzen 9 9950X3D2 Dual Edition processor combines high-performance "Zen 5" core technology with dual 2nd Gen AMD 3D V-Cache technology across all 16 cores, delivering 208 MB of total cache for expanded cache capacity and low latency. The result is exceptional responsiveness, increased throughput and flexibility to power next-generation development and creation workflows.

If you've been refreshing our front page today looking for the Ryzen 9 9950X3D2 "Dual Edition" review, I don't have good news for you: we won't be publishing a review, because we had no access to a review sample. AMD typically reaches out to us, offering to be part of the reviews, but not this time. So, after waiting for a few days, I reached out to them, because I would have loved to test this really interesting SKU, but I was told no samples were available for TechPowerUp.

We're not alone. As VideoCardz noted in their review roundup, Gamers Nexus reacted strongly after being denied a sample, ComputerBase, one of the top publications, was also denied, just like many others that you know for their deep, methodical testing—exactly the kind of reviews that dig into cache behavior, inter-CCD latency, power scaling, and per-game CCD parking quirks, which on a part like this are arguably the whole story.

ASUS has introduced the TUF Gaming B850I WiFi Neo motherboards, marking the first time the TUF Gaming brand has appeared in a Mini-ITX 17 x 17 cm form factor. The board is an AMD AM5 platform built around the B850 chipset and supports Ryzen 7000, 8000, and 9000 series processors. The two memory slots support up to 128 GB DDR5 modules, with speeds varying by CPU: up to DDR5-8200 with Ryzen 9000, DDR5-9600 with Ryzen 8000, and DDR5-8000 with Ryzen 7000. Both EXPO and ASUS AEMP profiles are supported. The PCIe x16 slot runs at Gen 5 with Ryzen 7000 / 9000 chips and at Gen 4 with Ryzen 8000. The motherboard features two M.2 slots and two SATA 6 Gb/s ports. Worth noting that ASUS labels both M.2 slots as PCIe 5.0, but the spec sheet tells a different story: the first slot is CPU-attached PCIe 5.0 x4 on Ryzen 7000 and 9000, while the second is chipset-attached PCIe 4.0 x4 regardless of CPU.

Power delivery is handled by an 8 + 2 + 1 phase VRM rated at 80 A and built on a 10-layer PCB. The rear came with a pre-mounted I/O shield and offers a USB 20 Gbps Type-C port, two USB 10 Gbps Type-A, one USB 5 Gbps Type-A, two USB 2.0 ports, DisplayPort 1.4, HDMI 2.1, 2.5 GbE via Realtek, Wi-Fi 6E, three audio jacks, BIOS FlashBack, and Clear CMOS. Internally, there are two ARGB Gen 2 headers, front panel USB headers, and the usual fan connectors including an AIO pump header. Audio is powered by a Realtek 7.1 HD codec with dedicated PCB layers and shielding, supporting up to 24-bit/192 kHz playback.

The latest in a recent flurry of AMD Ryzen AI Max+ 395 mini PCs is OneXPlayer's ONEXStation—a new AI mini PC that should be just as capable at everything from gaming to workstation and creative workflows. Aside from the already known benefits of the massive AMD APU, with its Radeon 8060S iGPU and 128 GB of LPDDR5X memory on a 256-bit bus, the new mini PC boasts a decent selection of I/O ports in an impressively compact aluminium chassis, measuring in at just 186 × 193 × 62 mm. By default, the ONEXStation will be equipped with a single 1 TB PCIe Gen 4×4 M.2 SSD, but there is a second M.2 slot easily accessible for up to 8 TB total storage.

With 13 ports in total, the ONEXStation's front I/O features dual USB 3.2 Gen 2 ports, a USB4 port, a UHS-II SD card slot, and a 3.5 mm audio combo jack. There's also a turbo button that presumably boosts the fan speed for improved thermal capabilities at the cost of noise. Around back, the ONEXStation has a DC power barrel plug, a 3.5 mm audio combo jack, a 2.5 GbE RJ45 port, one USB 3.2 Type-A port, a USB4 Type-C port, one DisplayPort, an HDMI port, and dual USB 2.0 ports—the latter presumably for peripherals. It also features both Wi-Fi 7 and Bluetooth 5.4 onboard. Cooling is handled by a custom solution with three heatpipes and a tri-fan ventilation system, and OneXPlayer says the TDP can be configured to 55 W, 85 W, or 120 W from within the mini PC's software. The launch price is $2,999, but the MSRP will seemingly increase to $3,599 after the launch offer. It's worth noting that, due to current market conditions, pricing and availability of systems like those based on Strix Halo and similarly powerful SoCs, like Intel's recent Panther Lake chips, is highly volatile, with Ayaneo already having suspended pre-orders for its Strix Halo-powered Next 2 handheld and Khadas having recently bumped up the price of its Panther Lake mini PC.

Thermalright, generally known for making cooling hardware and DIY PC gear, has just announced the AI HydroNous R1, a 2.6 L mini PC powered by AMD's mighty Strix Halo Ryzen AI Max+ 395 APU and cooled by a custom closed-loop water cooling system, which is said to be able to handle up to 176 W of TPD, thanks to a 180 mm radiator. Thermalright has so far revealed the mini PC (via IT Home), but it doesn't seem as though it is commercially available just yet, at least not outside of China.

The Thermalright HydroNous R1 has a fully CNC-machined aluminium chassis decked out with a full-color 4.6-inch LCD on the front for system monitoring. The IT Home post makes mention of dual USB4 ports and 10 Gb Ethernet, but no other ports are visible in the teaser images shared by the publication. Presumably, the rest of the I/O is on the back of the tower, which itself is designed to stand upright in a vertical orientation, sucking cold air in from below and from the left side and exhausting via the right side panel, where the radiator is located.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today marks a defining moment in computing aesthetics with the introduction of the X870E AERO X3D DARK WOOD—a groundbreaking motherboard that transcends technological achievement to become a true design statement. Building on the acclaimed success of the X870E AERO X3D WOOD, the X870E AERO X3D DARK WOOD carries that legacy boldly forward, deepening the experience into something more immersive and emotionally resonant.

Guided by the philosophy of Technology with Warmth, the X870E AERO X3D DARK WOOD envelops the user in a quiet, grounded mood that feels less like a hardware upgrade and more like coming home. The authentic dark wood texture finish brings natural warmth and character into high-performance computing; the supple leather pull tab adds tactile intimacy; and the understated dark metal tones offer calm and breathing room—a deliberate counterpoint to the noise of modern life.

ASUS today announced two new ExpertCenter P600 AiO models, the 27-inch PM640GA and the 24-inch class PM670GA. The ExpertCenter P600 AiO is an all-in-one Copilot+ PC, designed to deliver next-generation AI performance for business. Powered by up to an AMD Ryzen AI 7 processor with up to 50 NPU TOPS, it combines immersive visuals, AI-enhanced collaboration and enterprise-grade security in a sleek and versatile design.

With its edge-to-edge touchscreen, adjustable stand options and built-in security features, ExpertCenter P600 AiO is engineered for the evolving needs of modern offices, retail counters and educational environments—empowering employees to work faster, collaborate smarter and stay more secure.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the release of its new AMD AGESA 1.3.0.0a BIOS, bringing full support and performance optimization for the AMD Ryzen 9 9950X3D2 Dual Edition processor across GIGABYTE's entire AM5 800 Series and 600 Series motherboard lineup.

The Ryzen 9 9950X3D2 Dual Edition processor doubles the L3 cache stacked below the processor cores, delivering a massive leap in data-intensive and latency-sensitive workloads. GIGABYTE's latest BIOS is specifically tuned to unlock the full potential of this expanded cache architecture.

Last week, we reported that Intel is preparing to increase CPU prices by 10% across its client PC sector. However, a new report from Nikkei Asia suggests that AMD is also joining this trend, with plans for a PC CPU price hike as well. Reportedly, AMD Ryzen CPUs could see prices rise by 15% compared to the same time last year, when prices were typically around the MSRP at retailers. Now, as CPU demand has depleted inventories and the focus remains on server and data center CPU production, capacity for the client segment has been significantly reduced, leading to little to no inventory for PC enthusiasts. Large OEMs like HP and Dell are among the first to feel the pressure from the dwindling supply chain and have reported a significant gap between demand and supply for their PC systems.

Nikkei also notes that both AMD and Intel have informed their clients that CPU price increases will take effect by the end of March and into April, which should start to manifest very soon. What used to be a one or two-week wait from order to CPU shipment has now stretched to a process lasting eight to twelve weeks. This means that a CPU batch ordered in April might not arrive until June. This period is expected to be the worst in terms of supply in the second quarter of this year. Even if OEMs are willing to pay extra to secure CPU supply, availability is lacking. The CPU shortage is worsening daily, coinciding with the ongoing memory and storage shortage we are already experiencing.

AMD's RDNA 4m graphics might be the company's most mysterious GPU IP, as they are reportedly rebranding some of their RDNA 3.5 IP to fit INT8 data types and support FSR 4 technology. We previously reported that AMD designated the GFX1170 target for RDNA 4m. However, in the latest merge request for the LLVM compiler, AMD added two new software IDs: GFX1171 and GFX1172 GPUs. These targets are not true RDNA 4 GPUs, which belong to a GFX12 branch, but rather extensions of RDNA 3. What was thought to be RDNA 3.5 has now evolved into RDNA 4m, which will power AMD's Ryzen 500 "Medusa Point" series of APUs. With RDNA 3.5 / RDNA 4m expected to be used by AMD until 2029, it makes sense for AMD to adapt RDNA 3.5 into RDNA 4m with support for FSR 4 upscaling technology.

In contrast, "Medusa Halo" will utilize AMD's next-generation RDNA 5 / UDNA GPU microarchitecture. "Medusa Point" will introduce a desktop-exclusive RDNA 4 with the new RDNA 4m variant. Although we initially lack comparisons between the two, some instruction set extensions, such as WMMA and SWMMAC instructions, indicate support in the new "GFX1170" GPU, which should be associated with the GFX11 generation, also known as RDNA 3. Currently, this is believed to be an upgraded RDNA 3 with many RDNA 4 modules, enabling FSR 4 support even on the less powerful "Medusa Point" APU.

Ayaneo, a well-known handheld gaming PC maker, has suspended its preorders for the Next 2 gaming handheld PC due to what the company describes as unsustainable pricing of its materials, making manufacturing and sales impossible. In an update on its Indiegogo page for the Next 2 device, Ayaneo states that the cost of storage has been higher than the company anticipated, surpassing an already inflated price quote. However, after the Chinese New Year, suppliers began providing quotes that exceeded every reasonable level, making Ayaneo's original lowest price of $1,999 for a device with an AMD Ryzen AI Max 385 processor, 32 GB of LPDDR5X memory, and 1 TB of SSD storage unfeasible. While the company offered more expensive variants with up to a Ryzen AI Max+ 395 SoC, 128 GB of RAM, and 2 TB of storage, even a price tag of $4,299 was insufficient to offset the losses from the costly components. The expensive RAM, very expensive NAND Flash, and AMD SoCs meant Ayaneo would be selling these handheld PCs at a massive loss.

This is where the advantage of larger OEMs comes into play, as they can secure slightly better contracts with memory and storage manufacturers, allowing them to get memory pricing into a somewhat decent range and even absorb losses until they can no longer sell their new PCs. Smaller makers like Ayaneo are not in such a position, and the company was forced to stop offering the Next 2 handheld for sale.

Arctic has announced the updated version of its fanless Senza PC with updated internals, connectivity, and a more flexible design. The Senza AI 370 uses a familiar fanless design, with the heatsink integrated into the case of what would otherwise effectively be a mini PC, but now features the AMD Ryzen AI 9 HX 370 APU and its corresponding AMD Radeon 890M iGPU. That somewhat powerful iGPU in a silent form factor is the biggest differentiator compared to other desktops, but the Senza AI 370 is also designed to fit under a desk, virtually eliminating the need for the PC to be small in the first place. According to the Arctic online store, the Senza AI 370 retails for €1,199.99, and there are no optional barebones kits available.

Arctic markets the Senza as a silent gaming and productivity machine and claims that it can operate at temperatures as low as 50° in gaming workloads—although there were no specifics on the ambient temperature or the exact games and settings tested, so take that with a pinch of salt. To its credit, the Senza AI 370 does have 32 GB of DDR5X-8000 memory and a 1 TB PCIe Gen 4 ×4 M.2 SSD. The I/O situation is also interesting, with Arctic opting for a break-away front I/O panel module that features 1 3.5 mm audio combo jack, a USB 3.2 Gen 1 Type-A port, and a USB4 Type-C port—this module is connected to the PC via a cable, so that the ports can be mounted near the front of the desk. The actual PC itself also features the following ports: 2× USB 2.0, 2× USB 3.2 Gen 2 Type-A, 1× USB4 Type-C, 1× HDMI 2.1, 1× DisplayPort 2.1, 1× 2.5 GbE, 1× DC in, and separate 3.5 mm audio jacks for mic in and audio out. Because the PC is designed to be mounted under a desk, what would traditionally be the rear I/O is also front-facing, which should make it easier to reach.

AMD is preparing to launch its "Medusa Point" APU in early 2027. However, more benchmarks are emerging to showcase what the actual SoC can do as AMD and its OEM partners test the chip. In the latest Geekbench v6 run, AMD's 10-core, 20-thread "Zen 6" chip appeared with the AMD Engineering Sample number 100-000001713-21_N, achieving a 2,300 single-core and 13,002 multicore score while officially running at only a 2.4 GHz base frequency. In real-world operation, it ran within the range of 2.0-2.1 GHz during the benchmark. The most surprising factor is that this "Medusa Point" test system can match a 10-core, 20-thread AMD Ryzen AI 9 365 "Strix Point" APU that operates at more than double the frequency. When comparing the two, "Medusa Point" scores slightly lower in single-core performance, while the multicore score is surprisingly higher.

This phenomenon could be attributed to the fact that the "Zen 6" cores in the "Medusa Point" APU are much better performing and more optimized for the workloads that Geekbench tests. The IPC improvement target from "Zen 5" in "Strix Point" to the newest "Zen 6" could be a high single-digit to low double-digit gain on average. It is likely that the combination of new instructions and IPC improvements is what is pushing "Medusa Point" so high. Since the new APU also appeared in firmware running AVX-VNNI in FP16 precision, we might be seeing these workloads getting accelerated thanks to the lower precision of the floating-point operations. For now, the situation remains a mystery, at least until more benchmarks are available in the coming months. AMD is expected to launch this new APU around CES 2027, so we still have a lot of time before official and third-party benchmarks are released.

System76 has refreshed its Thelio Mira desktop series with a focus on better thermals, easier serviceability, and a cleaner overall design, while it's still all built in-house at the company's facility in Denver. The new chassis mixes aluminium, steel, and a tempered glass front panel, with a vertical control bar consolidating the power button and front I/O into one clean strip. System76 uses steel fasteners throughout, and the panels are designed for quick access when you need to get inside for upgrades or maintenance. On the cooling side, System76 made improvements, the company claims up to 19% higher sustained CPU clock speeds and temperature drops of up to 13.5°C thanks to liquid cooling and revised airflow.

System76 also made changes to the specs as it is built around an ASRock X870 Pro RS WiFi motherboard. Processor options top out at the Ryzen 9 9950X or 9950X3D, memory goes up to 192 GB of DDR5, and storage can reach 28 TB spread across NVMe and SATA drives. As for the GPU, you can choose a single graphics card up to an RTX 5090 or Radeon RX 9070 XT over PCIe 5.0. Connectivity includes USB4, 2.5 GbE, and Wi-Fi 7, with a mix of front and rear USB ports. PSU requirements start at 750 W and go up to 1000 W for the beefier GPU configs. As with other System76 products, the Thelio Mira carries open-source firmware elements and is built with long-term usability in mind.

As the era of pervasive AI reshapes industries worldwide, ASRock Industrial today announced the AI BOX-A395, a compact yet powerful AI box that brings the performance of an ultimate AI workstation into a single system. Powered by AMD Ryzen AI Max+ 395 processors, delivering up to 50 TOPS of AI acceleration while integrating CPU, GPU, and NPU within a compact system. With support for up to 128 GB LPDDR5x-8000 unified memory, it enables large AI models and data-intensive workloads to run directly on-device, delivering responsive AI processing while reducing reliance on cloud infrastructure.

Designed for enterprises, developers, and system integrators, the AI BOX-A395 supports the AI everywhere ecosystem by translating large-scale AI capabilities into practical local deployment. By combining high compute density, integrated AI acceleration, and rich I/O connectivity, the system provides a scalable foundation for applications ranging from AI model and application development, engineering and 3D design, and high-resolution content creation and media production.

ASUS is proud to announce the launch of the 2026 TUF Gaming A16, F16, and A18 gaming laptops. The TUF Gaming A16 and F16 boast two impressive display options, either a gorgeous 2.5K 120 Hz OLED panel or an ultra-fast 2.5K 300 Hz IPS display. Both models feature advanced anti-reflection coatings on the panel for increased immersion, while the TUF Gaming F16 also comes equipped with the all-new Intel Core Ultra 9 processor 290HX Plus. The larger TUF Gaming A18 sports up to an NVIDIA GeForce RTX 5070 Ti Laptop GPU and a lightning-fast 2.5K 300 Hz IPS display for a truly impressive and immersive gaming experience.

16-inch upgrades
The 16-inch TUF Gaming A16 and F16 receive major upgrades this generation, headlined by two premium new display configurations designed to elevate both immersion and competitive play. Users can choose between a stunning 2.5K 120 Hz OLED panel featuring a Corning DXC advanced anti-reflection coating, or an ultrafast 2.5K 300 Hz IPS panel enhanced with ACR anti-reflection technology for clearer visibility in bright environments. These advanced coatings significantly reduce glare while preserving color accuracy and contrast even when viewed at off angles, ensuring gameplay remains sharp and distraction-free and increasing immersion across your entire gaming library.

Lenovo introduces the next-generation of AI workstations optimized for on-device AI development, inference and creation, including the ThinkPad P14s i Gen 7, ThinkPad P14s Gen 7 AMD, ThinkPad P16s i Gen 5, ThinkPad P16s Gen 5 AMD, ThinkPad P1 Gen 9 and the powerhouse desktop ThinkStation P5 Gen 2.

Designed for students, engineers, data scientists and everyone in between, the new workstations pack unprecedented performance capable of tackling even the most demanding workflows, including CAD, BIM, data science, AI development and more. Part of Lenovo's new Hybrid AI Advantage solutions with NVIDIA, the systems accelerate AI adoption, boost business productivity, and bring faster ROI from AI deployments, reflecting Lenovo's commitment to deliver smarter, more adaptive solutions to meet modern challenges.