MSI, a world leading motherboard brand in high-performance and innovative computing, announces its brand new AMD B650 Series motherboards. MSI is not only tailored for enthusiast gamers, but also offers possibilities for content creation and office use. MSI is fully dedicated to all types of PC users by satisfying their needs. This time, we carefully prepared a variety of advanced technologies and exclusive features to help our customers create the most immersive experiences and maximize every ounce of performance.

"With DDR5 memory boost and an enhanced thermal design, MSI B650 Series motherboards are built to fully support the performance and capabilities of AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "Designed specifically for gamers and content creators, MSI motherboards feature advanced technologies that take full advantage of the AM5 platform."

GIGABYTE released three of the first Socket AM5 server motherboards and barebones, letting you build small-business/home servers using AMD Ryzen 7000 series processors. These boards may feature a client-segment CPU socket, but come with server-grade components for 24/7 or high-uptime operation, and remote-management features. The three are based on the AMD B650E chipset, which means it gets full PCI-Express Gen 5 (for an x16 slot and an x4 Gen 5 NVMe).

The MC13-LE0 and MC13-LE1 motherboards are built in the Micro-ATX form-factor, but with a design optimized for rack airflow. Both boards feature an identical PCB layout, but differ in their network connectivity options. The MC13-LE1 offers two 10 GbE interfaces driven by an Intel X710 controller; while the MC13-LE0 gives you two 1 GbE interfaces, each driven by an Intel i210. Both boards offer an ASPEED AST2600 remote-management chip with its dedicated 1 GbE port; one M.2 PCIe Gen 5 slot, a PCI-Express 4.0 x4 slot, and four SATA 6 Gbps ports. The W332-Z00 is an M-ATX tower server/workstation barebones (you add your own processor, DDR5 memory, and storage). This features a different motherboard than the MC13-LE#, with two M.2 PCIe Gen 5 slots, and Realtek-supplied remote-management and 2.5 GbE chips.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

AMD today released the Adrenalin 22.9.2 drivers. These drivers add support for the Radeon Graphics iGPU of the new Ryzen 7000 desktop processors that go on sale today. Game optimization is added for "Grounded." A handful of issues have been identified with the release. Radeon Super Resolution failing to trigger after changing resolution in games such as Nioh 2, has been identified. Improper rendering of Oculus dashboard menus with RX 6000-series graphics cards has been identified. GPU utilization being stuck at 100% in Performance Metrics after closing games in some cards such as the RX 570, has been identified. Display briefly showing corruption when switching between video and games in some GPUs such as the RX 6700 XT, has been identified. Vertical Refresh Sync being set to "off" globally causing stuttering or driver timeouts, has been identified. Dropped frames in video playback have been identified.

DOWNLOAD: AMD Software Adreanlin 22.9.2 beta

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of their latest AMD X670 motherboards, including two segments of X670E and X670 chipsets which showcase an abundance of notable features. High-end X670E models natively support PCIe 5.0 graphics cards with enhanced slot design, while mainstream X670 models adopt PCIe 4.0 graphics card slot design. The lineup supports PCIe 5.0 M.2 slots with PCIe and M.2 EZ-Latch design, which makes it easier for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, the features of 18+2+2 direct power, 105 Amps Smart Power Stage, and 8 layer PCB provide higher stability, optimal compatibility, and performance for coming AMD Ryzen 7000 Series processors. With the advanced thermal design, VRM temperature is reduced. This stabilizes the power and performance of the PCIe x16 slot and M.2 SSD, avoiding thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, the lineup takes advantage of Active OC Tuner technology and all-new GCC (GIGABYTE Control Center) software to align with GIGABYTE's new PCIe 5.0 M.2 SSD and EXPO/ XMP dual mode DDR, delivering extreme performance with more user- friendly experience.

"The new GIGABYTE X670 motherboard lineup offers exclusive features and new designs, enhancing the excellent performance and multifunctioning capabilities for AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "The AM5 platform is well-supported to bring the best-in-class experience that AMD users have come to expect."

With only a couple of days to go until the official retail availability of the Ryzen 7000-series CPUs and accompanying X670 and X670E motherboards, early pricing of the motherboards are starting to crop up in Europe. Courtesy of @momomo_us we now have pricing from an unknown European retailer for 11 ASUS models, as well as MSI's Godlike board. We also managed to dig up some additional pricing over at Geizhals, which is a European price comparison site, for five ASRock models and one from Gigabyte. Hopefully we're looking at placeholder pricing here, as it's not looking good in terms of value for money. Admittedly, ASUS is known for charging a premium over its competitors, but it's not looking good anywhere right now.

Starting with @momomo_us pricing and MSI for no specific reason, its upcoming MEG X670E Godlike is listed at €2,399 and that doesn't include any kind of liquid cooling accessories. This has to be one of the most expensive consumer motherboards ever, if this is the actual retail pricing it'll sell for. Moving over to ASUS, its Prime X670-P model is listed at €418.53, with the WiFi version jumping to €446.89. This is the first indicator that these are not the actual retail prices, as WiFi versions of motherboards tend to have a $/€/£10-20 premium over non-WiFi models. We're not going to go over every individual board price here, simply look at the attached pictures, but based on these early prices, ASUS has two models for well over €1,000, the ROG Crosshair X670E Hero and the ROG Crosshair X670E Extreme, with the latter being listed at €1,486.95.

Noctua today confirmed that all its CPU coolers and mounting-kits that support AMD AM4 also support the upcoming AM5 socket, except the NH-L9a-AM4 low-profile cooler and the NM-AM4-L9aL9i mounting-kit. For the latter, Noctua announced the new NM-AM5-L9aL9i kit that will be available free-of-charge from end of October. Mounting upgrade kits for older heatsink models that do not yet support AM4 will also be provided to customers at no additional cost.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Ryzen 7000 series processors and their new AM5 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support AM5 out of the box and don't require any updates, customers will be able to upgrade the NH-L9a as well as most older coolers at no additional cost, so even 15-year-old coolers can be used on the latest processors!"

Leading global motherboard manufacturer, ASRock, is proud to announce its X670E motherboard series, ready for new AMD Ryzen 7000 Series processors. This first wave of AMD Socket AM5 motherboards includes Special Edition X670E Taichi Carrara, flagship X670E Taichi, high-end X670E Steel Legend, mainstream X670E PRO RS, and entry X670E PG Lightning.

"With the AM5 platform we're investing in the next generation of high-performance computing and gaming," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "With the continued support of best-in-class partners like ASRock, AMD is bringing the most advanced features and technologies to desktop. The X670 Extreme is designed to bring the best connectivity and ultimate overclocking with PCIe 5.0 support."

TechPowerUp released the latest version of TechPowerUp GPU-Z, the popular graphics information and diagnostics utility for gamers and PC enthusiasts. Version 2.49.0 adds support for the iGPU of the upcoming Ryzen 7000-series "Zen 4" desktop processors, codenamed "Raphael." CPU temperature monitoring for these processors works the same way as it does for older Ryzens, so no changes needed in that regard. The GPU model reporting for Intel Arc A750/A770 has been fixed. Support is added for the Intel Arc A580. Some rare application crashes with AMD Radeon cards have been fixed. The NVIDIA DLSS game scan we introduced with the previous version doesn't actually "use" DLSS in any way, it only scans for games supporting DLSS, so we made it available on all systems.

DOWNLOAD: TechPowerUp GPU-Z 2.49.0

Bitspower, one of the world's leading suppliers of water-cooling equipment for performance computers, today launched the Bitspower AM5 kit which can transform AMD-based Bitspower CPU water blocks into an AM5-compatible product. More and more setups used by gamers, streamers, and creators will harness AMD's new AM5 platform, which provides native support for up to 170 W—meaning there's power to do more, play more, and create more than ever before. However, with this increased power comes higher temperatures.

Fortunately, AMD has ensured that existing AM4 cooling solutions can be supported with their newest motherboards, with the product's height and port distance being managed in a 7 mm increment. With the new AM5 kit, Bitspower's current range of AMD CPU blocks can directly migrate to AM5 socket motherboards. The company's latest generation CPU water blocks, such as the M Pro Water Blocks, are optimized for cooling Ryzen 7000-series CPUs, allowing users to take that already-powerful processor to new heights.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is pleased to announce that a selection of its current all-in-one (AIO) liquid and air coolers will be fully compatible with AM5 (LGA1718) socket designed for the upcoming AMD Ryzen 7000 Series CPUs. A list of compatible ENERMAX coolers is provided in the table below. For users who already own the selected ENERMAX CPU coolers and plan to switch motherboard to AMD Ryzen 7000 series, you may contact your ENERMAX local branch for assistance. For the latest installation guide and video, please visit this page.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

GeIL is readying a fairly large lineup of its EVO V and Polaris RGB DDR5 memory lines featuring the AMD EXPO technology. These modules will pack both AMD EXPO and Intel XMP 3.0 profiles, but their advertised specs will apply on AMD Ryzen 7000-series platforms, whereas the XMP 3.0 profiles included will be an approximation of these specs. GeIL's lineup includes 32 GB dual-channel kits of two 16 GB modules. Frequencies include DDR5-4800 (JEDEC native), DDR5-5200 (JEDEC native), and EXPO-backed DDR5-5600, DDR5-6000, DDR5-6000 with tighter timings, DDR5-6200, and DDR5-6400. The exact part number, timings, and module voltages, are in the table below.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of DOMINATOR PLATINUM RGB DDR5 for AMD, VENGEANCE RGB DDR5 for AMD and VENGEANCE DDR5 for AMD, featuring new AMD EXPO technology and ready to power the next generation of Ryzen 7000-series powered PCs.

Available in frequencies up to a screaming-fast 6,000MT/s, and even higher in the future, all CORSAIR DDR5 for AMD kits offer AMD EXPO (Extended Profiles for Overclocking), allowing these modules to be set to their rated speed and performance in just a few clicks. AMD EXPO technology makes setup simple and ensures users can easily run their memory at the speed it was created to run at.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

AMD is allegedly ready with a working "Zen 4" chiplet that has stacked 3D Vertical Cache (3DV cache) memory, which supplements the on-die L3 cache, and is found to massively improve gaming performance. "Moore's Law is Dead" reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC "Genoa" SKUs.

The 3DV Cache deployed with the "Zen 4" chiplet is a second-generation to the one on the "Zen 3 + 3DV cache" chiplet, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the generationally-faster on-die L3 cache of the "Zen 4" chiplet. Unlike the CCD below it that's built on TSMC N5 (5 nm EUV), the L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 nm), since it only contains a slab of memory and doesn't warrant N5. "Moore's Law is Dead" reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel's 13th Gen "Raptor Lake" processors. This was echoed by another reliable source, greymon55.

ASUS Republic of Gamers (ROG) today announced the latest gaming gear at Gamescom 2022, including the AMD X670E series motherboards, AIO coolers, PSU, displays, networking products, and peripherals. Along with these products, ROG released its first music single Reality, with vocals by renowned voice actor and musician Troy Baker, more commonly known for his roles in video games like The Last of Us and Uncharted series. An anime-inspired interactive 360° music video featuring the song is available on YouTube.

ROG Swift OLED PG42UQ / PG48UQ: The 42-inch ROG Swift OLED PG42UQ is designed for immersive desktop gaming and features 4K visuals at an overclocked 138 Hz refresh rate. The OLED panel ensures the deepest hues, as well as vibrant colors thanks to a 98% DCI-P3 color gamut and Delta E < 2 color difference. An ultrafast 0.1 ms (GTG) response time ensures great viewing and gaming experiences. The larger, 48-inch ROG Swift OLED PG48UQ is ideal for those looking to play their games on an even bigger scale. ROG OLED monitors include a custom heatsink that offers more surface area for heat exchange, resulting in up to 8% lower operating temperatures compared to ROG monitors without a heatsink to ensure better OLED performance and longevity.