QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

ASRock Rack Inc., the leading innovative server company, today is set to showcase a comprehensive range of servers for diverse AI workloads catering to scenarios from the edge, on-premises, and to the cloud at booth #1737 at SC 23 held at the Colorado Convention Center in Denver, USA. The event is from November 13th to 16th, and ASRock Rack will feature the following significant highlights:

At SC 23, ASRock Rack will demonstrate the NVIDIA-Qualified 2U4G-GENOA/M3 and 4U8G series GPU server solutions along with the NVIDIA H100 PCIe. The ASRock Rack 4U8G and 4U10G series GPU servers are able to accommodate eight to ten 400 W dual-slot GPU cards and 24 hot-swappable 2.5" drives, designed to deliver exceptional performance for demanding AI workloads deployed in the cloud environment. The 2U4G-GENOA/M3, tailored for lighter workloads, is powered by a single AMD EPYC 9004 series processor and is able to support four 400 W dual-slot GPUs while having additional PCIe and OCP NIC 3.0 slots for expansions.

AMD's "Phoenix" monolithic processor silicon drives the company's Ryzen 7040 series mobile processor lineup, and possible some of its upcoming Ryzen 7000G desktop processor models. It is the first chip from the AMD camp to feature an AI accelerator, besides up to 8 "Zen 4" CPU cores, and a large iGPU based on the latest RDNA3 graphics architecture, with up to 12 compute units, the latest display I/O and media acceleration capabilities. Over the course of its lifecycle, AMD realized that it can't use the nearly 200 mm² silicon built on the expensive 4 nm node to power lower-end processor SKUs, and so developed the smaller 137 mm² "Phoenix 2" silicon that lacks the AI accelerator, has a smaller iGPU with just 4 compute units, and a unique hybrid CPU with 2 "Zen 4" and 4 "Zen 4c" cores. We're now hearing that the company is designing even more derivatives.

The PCI ID Repository discovered two new IDs believed to reference the iGPU models of "Phoenix 3" and "Phoenix 4" chips. At this point we have no clue what the two chips could be, and what the mixture of their CPU, iGPU, and AI accelerator components could be, especially given that AMD is able to carve out Ryzen 3 SKUs from "Phoenix 2." We speculate that "Phoenix 3" and "Phoenix 4" could reference rebranding such as "Escher," although it could even be entirely new chips with different combinations of "Zen 4" and "Zen 4c" cores.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to introduce the best AMD motherboard/GPU combination for professional content creators. BIOSTAR's B650MS2 motherboard, paired with its AMD Radeon RX 7800 XT GPU, is the perfect solution for graphics designers and content creators who desire flawless performance at an attractive price.

The B650MS2 motherboard from BIOSTAR brings features and functionality with globally renowned product quality and durability. Built based on AMD B650 single chip architecture, the B650MS2 is designed to run the latest and greatest AMD Ryzen 7000 series Processors with superior performance. With support for 2-DIMM DDR5 memory up to 96 GB and additional features like PCIe 4.0 M.2 and 2.5 Gigabit LAN, the B650MS2 is an excellent platform for digital creators who prefer a compact system with unparalleled user experience that enhances work efficiency.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

ASUS Republic of Gamers (ROG) today announced the new ROG Strix SCAR 17 X3D, the perfect fusion of cutting-edge silicon and ROG engineering. Featuring the AMD Ryzen 9 7945HX3D mobile processor equipped with AMD 3D V-Cache technology for the very first time, the Strix SCAR 17 X3D takes performance to a whole new level. By doubling the L3 cache of the mighty Ryzen 9 7945HX processor, the Ryzen 9 7945HX3D gives users a boost in games that are hungry for this onboard ultrafast memory. Paired with a 240 Hz QHD display, Conductonaut Extreme liquid metal on the GPU, and a vapor chamber, the Strix SCAR 17 X3D is ready to dominate the leaderboards.

Making great processors even better
While the original 2023 ROG Strix SCAR 17 came equipped with AMD Ryzen 7000 Series processors, the AMD Ryzen 9 7945HX3D is truly in a league of its own. It leverages the power of AMD 3D V-Cache technology, a stacking of extra ultra-high-speed L3 cache vertically on top of one of the two core compute dies (CCD). This extra cache enables the eight cores to perform certain calculations quickly and efficiently, notably in gaming. For situations where increasing CPU frequency simply doesn't show significant performance gains, 3D V-Cache technology holds the potential to unlock extra compute power.

Best Buy has slashed $100 off of the AMD Ryzen 5 7600X's normal asking price—North American customers can obtain these 6-core/12-thread processors for $199.90 a piece. Amazon US price matching the consumer electronics store's offer earlier today, but their stocks were depleted at some point this afternoon. AMD's Ryzen 5 7600 (non-X) processor is still stuck at MSRP ($229), so its X-model sibling presents a better deal at its current lower price. Buyers will have to splash out extra on a CPU cooling solution, since Team Red does not include a Wraith Stealth or Prism air cooler as standard with the Ryzen 5 7600X's retail package. AMD + Bethesda's Starfield Game Bundle partnership campaign kicked off last week, and all of the AM5 desktop Ryzen 7000-series models qualify for the active promotion. This plays a part in boosting customer interest, but a nice discount also goes a long way—hence the quick run on Amazon's supplies of the Ryzen 5 7600X.

Last week Bethesda announced AMD as its exclusive partner for Starfield on the PC platform, although the short video presentation did not tease upcoming hardware/software bundles. Details of a Ryzen 7000-series CPUs promotional campaign emerged seven days later thanks to a mini-store page appearing on Newegg's retail site. The Starfield promo was not active at the time, but AMD Taiwan has made it official that the event will be going live on July 11 (at least in that territory).

According to the freshly published event site their offer will be running until September 30, and product serial numbers will not be redeemable after October 28. Eligible hardware includes the aforementioned Ryzen 7000 processor family, as well as Radeon GPUs. Thankfully Team Red has made sure to make a significant number of RDNA 2 models eligible for the Starfield incentive, with the entry point being RX 6600. All discrete RDNA 3 cards qualify—starting with RX 7600 and jumping up to the expensive RX 7900 XT and 7900 XTX GPUs. AMD Taiwan's info graphics show a two tier system—Standard Edition (NT$1990) applies to buyers of Ryzen 5/7 7000 series CPUs or Radeon 6600 through 7600 cards. Premium Edition (NT$2890) will grant a 5-day early access period—exclusive to buyers of Ryzen 9 7000 CPUs or Radeon cards starting at RX 6700.

American online retailer, Newegg, has perhaps jumped the gun a little by readying CPU listings for an "AMD Starfield Game Bundle Promotion." The store page was noticed by some eagle-eyed folks over the weekend, and news sites were soon tipped off to the early announcement. AMD was revealed as Starfield's exclusive partner on PC last week, but upcoming promotions/bundles were not mentioned during presentation proceedings. Newegg's mini-site only functions as a promo product container (at the time of writing) for all available Ryzen 7000-series CPUs—individual SKU pages are void of any Starfield material, and the previous Star Wars Jedi: Survivor campaign ended on June 30.

The Newegg promo page includes everything in the mainstream Zen 4 lineup—from the entry-level Ryzen 5 7600 model going all the way up to the flagship Ryzen 9 7950X3D, but internet sleuths were unable to track down anything representing an equivalent campaign for AMD's latest Radeon RX graphics cards. Team Red's Zen 4 and RDNA 3 technologies got plenty of shout-outs in last week's partnership presentation: "Making this game even more special, is the close collaboration between Bethesda and AMD to unlock the full potential of Starfield. We have worked hand-in-hand with Bethesda Game Studios to optimize Starfield for both Xbox and PC with Ryzen 7000 series processors and Radeon 7000 series graphics. The optimizations both accelerate performance and enhance the quality of your gameplay using highly multi-threaded code that both Xbox and PC players will get to take advantage of."

Supermicro Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is introducing a new server that gives IT and data center owners a high performance and scalable solution to meet the needs for E-commerce, cloud gaming, code development, content creation, and virtual private servers. The new systems are designed to use AMD Ryzen 7000 Series processors optimized for server usage, based on the latest "Zen 4" core architecture, which has a max boost speed of up to 5.7 GHz, including PCIe 5.0 support, DDR5-5200 MHz, and up to 16 cores (32 threads) per CPU. The new Supermicro MicroCloud is designed to use the latest system technology for a wide range of applications, including web hosting, cloud gaming, and virtual desktop applications.

"We are expanding our application optimized server product lines to include the latest AMD Ryzen 7000 Series processors," said Michael McNerney, VP of Marketing and Security, Supermicro. "These new servers from Supermicro will give IT administrators a compact and high-performance option in order to offer more services with lower latencies to their internal or external customers. By working closely with AMD to optimize the Ryzen 7000 Series firmware for server usage, we can bring a range of solutions with new technologies with PCIe 5.0, DDR5 memory, and very high clock rates to market faster, which allows organizations to reduce costs and offer advanced solutions to their clients."

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC designed and branded mini PC product family called Moonstone. Equipped with the latest AMD Ryzen 7000 processors in a compact 4x4 design with an innovative cooling solution, Moonstone delivers top-tier computing performance for a wide range of usages. Supporting up to 64 GB of DDR5-4800 high-speed RAM and up to 16 TB of storage, Moonstone will increase your computing output while keeping a minimal footprint on both your desk and energy bill.

"Perfect for working or gaming, we saw an opportunity to set the new standard of innovation-driven mini PC performance," said Aaron Rowsell, Simply NUC co-CEO, "Moonstone is the highest performing 4x4 ever launched."

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

ASUS today announced the refreshed Vivobook 16 OLED (M1605), a slim-and-light laptop featuring up to an AI-enabled AMD Ryzen 7000 H-Series processor, and expertly engineered for everyday entertainment and productivity. Perfect performance is delivered by up to an AMD Ryzen 7000 H-Series processor with 16 GB RAM and up to a 1 TB SSD. Quiet and efficient cooling is provided by the dual-vented cooling system with two heat pipes and an IceBlade fan. The long-lasting up to 70 Wh battery gives users more freedom, and there's up to WiFi 6E for ultrafast connectivity.

This latest model features a superb OLED NanoEdge Pantone Validated display with 3.2K resolution, a 120 Hz refresh rate and a 0.2 millisecond response time - plus an 16:10 aspect ratio display for an extended view. The NanoEdge OLED displays offer up to a 1.000,000:1 contrast ratio with a screen-to-body ratio of up to 86.5%. It also benefits from TÜV Rheinland low blue-light certification to ensure eye comfort during long viewing sessions. The eye-catching slim and lightweight design is finished in a selection of on-trend colors. The 180° lay-flat hinge allows easy collaboration and sharing, and the comprehensive I/O capabilities include up to a USB-C 3.2 Gen 1 port with Power Delivery, two USB 3.2 Gen 1 Type-A ports, a USB 2.0 port, an HDMI output, and an audio combo jack.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with stunning design and blazing performance.

Sporting an elegant, fresh new design and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

ASRock, a global leader in motherboards, graphics cards, monitors, and small form factor PCs, is excited to announce its participation in the upcoming COMPUTEX Taipei 2023 after years of anticipation. ASRock will showcase a range of breathtaking innovative products and highly anticipated technology demonstrations. Attendees will have the opportunity to explore the ASRock latest products and solutions firsthand; also, get the immersive gaming experience at ASRock booth.

Unveiling the Next-Gen ASRock Monitors
ASRock is set to showcase an exciting lineup of monitors at COMPUTEX 2023, featuring six existing products along with new gaming and business models. The spotlight will be on the PG558KF and PG32UMF, two high-end monitors.

This update is a continuation of our response to this issue. As mentioned, ASUS has been working with AMD on defining new rules for the new BIOS updates. These updates will continue to be completed as necessary. The BIOS updates address concerns regarding potential damage that may occur when using Ryzen 7000 series processors with our AM5 motherboards by following the latest guidance from AMD. This includes a cap on SOC voltage at 1.3 V. Please download the latest version of the BIOS updates from asus.com/support.

Thank you again for choosing our product. If you still have any questions, or are concerned that your motherboard may have been affected by this issue, please contact our ASUS support team in your region. If an issue is identified, your motherboard will be covered by our warranty. Our support teams are ready to assist you.

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

ASUS today announced ExpertCenter PN53, a mini PC that harnesses the power of the latest AMD Ryzen 7000 series processors and AMD Radeon 600M series graphics. ExpertCenter PN53 features a triple-storage design that can accommodate a variety of storage combinations. Two PCIe 4.0 M.2 SSDs and DDR5 memory ensure fast boot-up and app loading times. In addition, ExpertCenter PN53 includes cleverly designed cooling features, AI-powered noise-cancelation technology for improved voice communications, and can support a single 8K monitor or up to four 4K monitors.

ExpertCenter PN53 offers up to 34% better single-thread performance and up to a 29% boost in multithread performance, compared to the previous PN51 model. In PCMark 10 Essentials group tests, ExpertCenter PN53 showed a 10% improvement in web browsing, videoconferencing, and app start-up times. It also performed 10% better than ExpertCenter PN51 in the Productivity test group that measures system performance with everyday office applications, including spreadsheets and writing workloads.

Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.

Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.

AMD is late in releasing its Phoenix Zen 4 lineup of mobile APUs - the original April launch has been missed, and laptops bearing Ryzen 7000HS & H-series are expected to arrive at some point this month. Preview hardware has made its way into the hands of testers, and one particular outlet - Golden Pig Upgrade, a content creator on the Chinese Bilibili video site - has performed benchmark tests. He seems to be the first reviewer to get hands-on time with AMD Ryzen 7040 Phoenix APUs, and his findings point to class leading performance results in terms of graphical capabilities - the 7840HS (packing a Radeon 780M RDNA3 iGPU) is compared to the Rembrandt-based 7735H, as well as a pair of Intel Raptor Lake CPUs - the 13700H and 13500H models.

AMD's newest Phoenix APU is the group leader in GPU performance stakes, but the jump up from the last-gen Rembrandt (RDNA2 iGPU) chip is not all that significant. VideoCardz reckons that the Radeon 780M integrated GPU is roughly equivalent to an NVIDIA GeForce MX550 dGPU and not far off from a GeForce GTX 1650 Max-Q graphics card (in terms of benchmark performance). According to AMD's internal documentation the RDNA 3 core architecture utilized in Phoenix APUs is referred to as "2.5" so this perhaps explains why the 780M is not doing laps around its older silbing(s).

According to investigations undertaken by Igor's Lab and Hardware Busters this week it seems that AMD's problematic lineup of Ryzen 7000 & Ryzen 7000X3D CPUs are consuming unexpected levels of power in short bursts when running in idle mode. In conducting more in-depth tests over the past few days, Igor Wallossek and (outgoing TPU PSU expert) Aristeidis Bitziopoulos have both found that that the aforementioned AMD processors are producing (to the testers' slight concern) power spikes in situations involving minimal computing activity. It is not currently known whether the sharp climbs in power consumption are in any way related to the burnout issues experienced by unlucky overclockers this week.

Aris/crmaris (at Hardware Busters) says that he has tested many of the affected processors in the past, but was not privy to any major problems relating to burnout or power consumption spikes. By running new tests this week, using his own Powenetics v2 board, Aris has found out that: "There are some interesting facts here, which I didn't pay much attention to during the reviews because I only look at the average values and not the peak ones in idle. In the 7950X3D, there is a high spike during idle at 130 W, which is unjustified because the peak CPU load is only 3.53%. Even with the Curve Optimized enabled and a -15 setting, the idle power spike is close to 125 W, so something is happening there. On the 7800X3D, the spike during idle stays low, but this is not the case for the 7900X, which has an idle power spike at 109 W, while the peak CPU load at idle was at 5.12%, so these 109 W are not justified, either."

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.