Hours ago, Samsung Semiconductor's website was updated with an extensive Exynos 2600 splash page. This low-key addition provides a fairly detailed rundown of the forthcoming smartphone application processor's credentials. A marketing campaign kicked off at the start of December, but certain industry observers were confused by this initial wave of promo activity. At the time, questions were raised about the South Korean foundry service's 2 nm GAA (SF2) production schedule. The rumored late start of mass production could lead to a delayed deployment of Galaxy S26 products, but the latest inside reports suggest stabilization of foundry performance and yields. According to The Bell SK, satisfactory progress has the emerging Exynos 2600 AP positioned for possible deployment in a next-gen Galaxy Z Flip device. An industry insider reckons that internal tests have produced positive impressions; enough to warrant consideration beyond a debut in Galaxy S26 phones.

Given Samsung's new product release cadence, a Galaxy Z Flip 8 model could arrive at retail by next summer. Bell SK posits that the speculated Galaxy Z Fold 8 smartphone has been linked to Qualcomm's Snapdragon 8 Elite Gen 5 mobile chipset, reaffirming past whispers of Samsung's MX and System LSI departments weighing up mixed selections of in-house and third-party technologies (dependent on product tiers). The Exynos 2600 chip's 32K MAC NPU supposedly exceeded expectations when compared to rival hardware—internal evaluations indicated "AI engine" performance being about six times greater than on Apple's current flagship A19 Pro SoC. When compared to the omnipresent Snapdragon 8 Elite Gen 5 chipset, Samsung's proprietary design (allegedly) did better in NPU and iGPU test scenarios—up to 30% and 29% faster, respectively.

Only yesterday, specs of the new Samsung Exynos 2600 SoC leaked and now the company has unveiled the chip on its website. However, it has done so without any of the usual PR that goes with a new major product release like this. The leaked details were mostly correct and the Exynos 2600 will indeed feature a 3.8 GHz C1-Ultra prime core, three C1-Prox3 3.25 GHz performance cores and six power efficient C1-Prox6 2.75 GHz cores, all based on the Arm's latest v9.3 architecture. The Exynos 2600 will be fabricated using Samsung Foundry's 2 nm GAA process and its low power design and the package will use something Samsung calls heat path block which is using a High-k EMC material which is said to improve heat dissipation.The Exynos 2600 should deliver 39 percent better CPU performance compared to its predecessor according to Samsung.

The GPU will be Samsung's Xclipse 960—which yesterday's leaks also got correct—with support for ray tracing and Exynos Neural Super Sampling (ENSS) or AI-powered frame generation and upscaling. Samsung claims twice the compute performance of its predecessor here. There will also be a separate AI engine with a 32K MAC NPU and Post-Quantum Cryptography (PQC). Other features include support for LPDDR5X memory and UFS 4.1 storage, support for up to 4K or WQUXGA displays with a refresh rate of up to 120 Hz, native 8K 30p video encoding and 8K 60p video decoding and finally support for up to 320 MP single camera resolution and the ability to shoot pictures at 108 MP at 30 FPS and of course there are some AI features here too, that Samsung calls DVNR or Deep learning Video Noise Reduction. All modern video codecs such as AV1, VP9 and Samsung's own APV are supported, but there's no sign of H.266. We'll likely get more details of the Exynos 2600 at CES early next year.

As AI adoption accelerates worldwide, data centers are experiencing explosive growth in computational workloads. With the shift from large-scale model training to continuous inference, the challenge is no longer just about performance - energy efficiency has become equally critical to sustaining next-generation AI infrastructure. This transition is fueling demand for low-power memory solutions capable of supporting continuous AI workloads while optimizing power consumption.

In line with this trend, Samsung has developed SOCAMM2 (Small Outline Compression Attached Memory Module) - an LPDDR-based server memory module designed for AI data centers, with customer samples already being supplied. By combining the strengths of LPDDR technology with a modular, detachable design, SOCAMM2 delivers higher bandwidth, improved power efficiency, and flexible system integration, enabling AI servers to achieve greater efficiency and scalability.

Earlier in the month, Samsung's marketing team initiated their Exynos 2600 promotional campaign. At the time, official teaser material did not provide any substantial hints about the next-gen mobile chipset's technical underpinnings. Weeks later, a fresh leak has laid out the cutting-edge mobile processor's fundamentals. PhoneArt's social media post seems to confirm previous predictions about an overall 10-core design, and being based on an important in-house 2 nm node process. Today's prediction did not outline the Exynos 2600 SoC's cluster configuration, but previous outpourings have settled on a "1x Prime + 3x Performance + 6x Efficiency" internal setup. PhoneArt reckons that the prime core will reach a maximum clock frequency of 3.9 GHz. A commenter, Erencan Yılmaz, reckons that this figure should be reduced to 3.8 GHz, due to power consumption considerations when looking at a 2 nm GAA-based design.

Supposedly, max. performance core speed is 3.25 GHz, while efficiency-oriented units can only reach up to 2.75 GHz. In the past Samsung and AMD have co-developed various Xclipse integrated graphics solutions, for proprietary smartphone platforms. Industry observers expected this RDNA-based collaboration to continue into a new generation. The fresh mentioning of a mysterious "AMD JUNO" iGPU has caused some confusion—this new Team Red IP is said to be clocked at 985 MHz. Additionally, PhoneArt claims that "JUNO" supports modern APIs: OpenGL ES 3.2, OpenCL 3.0, and Vulkan 1.3. It is plausible that "JUNO" could be a codename for the speculated "Xclipse 960" integrated graphics processor.

Earlier in the year, Samsung's foundry business reportedly attracted a new set of orders from important clients. Instead of the "still in-progress" cutting-edge 2 nm GAA node process (aka SF2), key customers selected more mature production lines: 5 nm and 8 nm. Approximately seven months later, Intel is reportedly on Samsung Foundry's production order books, with semiconductor industry insiders disclosing details of a major deal. According to a two-day-old Hankyung news article, a next-gen Platform Controller Hub (PCH) design has been linked to a "legacy-grade" 8-nanometer node. Inside trackers reckon that Team Blue's futuristic mainboard chipset is heading towards mass production, with a "full-scale" phase anticipated next year.

Speculation points to the eventual arrival of 900-series chipsets; destined to control "Nova Lake" desktop processors. In theory, a flagship variant—perhaps "Z990"—could be the first of Intel's 8 nm PCH products to reach retail by late 2026. Currently, the foundry service's Taylor, Texas-based facility—aka Samsung Austin Semiconductor—produces a selection of current-gen 14 nm chipsets for Team Blue. Back in South Korea, the Hwaseong 8 nm production line can pump out about 30,000 to 40,000 wafers per month. It is possible that Intel has favored Samsung's native operation due to a high level of node maturity and operational reliability.

The gaming hardware industry has been in a bit of a state of late as a result of increased demand for DRAM causing a supply shortage and massive price hikes. As a result of the aforementioned issues, Samsung has been rumored to be converting some of its HBM3E and NAND production capacity to DRAM in order to meet demand. The ensuing rumors claimed that Samsung was planning an exit from the NAND, and thus SATA SSD market, as a result of the shift in focus. Micron's recent exit from the consumer space, and the closure of its Crucial memory and SSD brand, lent credence to these rumors, however, these rumors have recently been addressed by a Samsung spokesperson directly in a response to Wccftech. The spokesperson simply said "The rumor regarding the phasing out of Samsung SATA or other SSDs is false," apparently declining to expand any further. However, this is just one indication that the DRAM crisis may not be as long-lived as some have claimed.

Around the same time, in an interview with Hardware Unboxed, Edward Crisler, the PR manager for Sapphire, cautioned PC gamers and potential buyers against panic buying, saying that, "the good news is, I don't think the real pain, that we're suffering now and for the next six months or so, is going to last much longer than that," although he goes on to say that the actual issue at hand is uncertainty of the situation. The implication is that the market will eventually begin to stabilize within the next six to eight months. The implication isn't necessarily that DRAM prices will return to normal, but rather that DRAM supply will eventually catch up to supply. It could also be the case that the massive AI and datacenter boom currently causing the shortages will slow in the coming months, which would also help to stabilize things somewhat. Crisler is careful to note that DRAM prices may still remain somewhat elevated after the market stabilizes, but he seems to be convinced that the sky-high prices we're seeing for consumer memory will fall to some degree and that the gaming industry will adapt to whatever the end result is of the market shake-up.

According to a report from Sedaily, cited by TrendForce, Samsung Electronics' Device Solutions (DS) Division is in discussions with AMD over manufacturing its chips on Samsung Foundry's second-generation 2 nm process known as SF2P. Samsung's 2 nm technology is competing directly with TSMC's N2 and Intel's 18A, both using the Gate-All-Around (GAA) transistor architectures. Industry sources say a decision on moving forward with a formal agreement could come as early as January next year, with actual production being more a matter of "when" rather than "if". As part of the talks, Samsung is expected to run AMD designs through a multi-project wafer (MPW) program in the near term. This would allow both companies to evaluate SF2P's performance and yields before committing to volume manufacturing. The chip involved is believed to be AMD's next-generation EPYC "Venice" server CPU, according to Global Economic News. If the MPW results meet AMD's expectations, sources say it could open the door for AMD to adopt a dual-foundry strategy, pairing Samsung with TSMC. Such a move would not be limited to server products, and could eventually extend to future consumer CPUs, including the "Olympic Ridge" Ryzen lineup.

Separately, the report highlights the AI-focused partnership between Samsung and AMD. Despite Samsung's challenges in entering NVIDIA's HBM supply chain, it has secured a strong position with AMD. Samsung is already supplying HBM3E 12-layer memory for AMD's MI350 accelerators and is considered well positioned for HBM4, which is expected to debut alongside AMD next-generation MI450 products. From Samsung's perspective, adding AMD as a foundry customer would further support its recent recovery. Sedaily notes that Samsung Foundry has picked up momentum after winning orders from major clients such as Tesla and Apple. At the same time, industry sources point to TSMC capacity constraints and rising wafer prices, those factors making Samsung an alternative.

Samsung is reportedly considering halting its consumer SATA III SSD production lines due to a growing shortage of NAND flash in the supply chain. According to Moore's Law is Dead, industry insiders have been discussing Samsung's potential stop of regular SATA III SSD production. Most NAND flash is being allocated to datacenter customers, such as AI labs and hyperscalers, leaving limited supply for the lower-margin consumer market, including PC gamers and tech enthusiasts. However, this likely only impacts regular SATA III SSDs and not Samsung's popular M.2 PCIe NVMe drives, which have been a consumer favorite for years. Additionally, there are reports that Samsung is converting its NAND flash production lines in Pyeongtaek and Hwaseong to focus on DRAM production. The upcoming Pyeongtaek Fab 4 (P4) is also expected to operate as a DRAM-only facility using Samsung's latest 1c process.

Earlier industry sources suggest that Samsung is becoming cautious about the NAND market, while demand for standard DRAM has surged. This shift makes NAND flash a less attractive segment, causing the entire supply chain to slow down as inventories are depleted. The demand for AI infrastructure has rapidly depleted inventory across the supply chain, and NAND flash is no exception. The rapid expansion of AI infrastructure has led to NAND flash shortages, which could persist for years. It was noted that the price of a 1 Terabit TLC NAND increased from $4.80 in July 2025 to $10.70 in November 2025, marking an increase of over 100% in less than six months. Other types of NAND flash, such as MLC and QLC, have also seen their spot prices more than double.

SK Hynix held an internal company meeting, where the company reportedly presented some tough pills to swallow for many gamers. The company now forecasts the tight memory supply to last through 2028 for the commodity DRAM, which includes DDR5/DDR4, GDDR6/GDDR7, and LPDDR5x/LPDDR6. All the aforementioned DRAM variants are essential for PC and console components, making millions of gamers at risk of absorbing a massive price increase as a result. As memory supplier inventories deplete, production capacity will not increase to meet demand as it has in the past. This marks a departure from the usual response by memory manufacturers, who typically ramp up capacity in response to demand.

However, an interesting thing that SK Hynix has noted is that this situation will exclude the company's most advanced memory solutions—HBM and SOCAMM. These products are expected to get an additional capacity expansion, without tight supply impacting this part of the DRAM supply chain. These products are even in high demand as they are mostly consumed in higher volume than the regular commodity DRAM, due to their integration into AI products such as GPUs and servers.

TrendForce's latest research indicates that the global foundry industry continued to profit in 3Q25, fueled by strong demand for AI in HPC and new consumer-electronics chips and IC peripherals. Revenue was primarily driven by advanced processes at 7 nm and below, with support from high-value wafers. Chinese foundries also expanded their business through supply-chain diversification. As a result, total revenue for the top 10 foundries increased by 8.1% QoQ to nearly US$45.1 billion.

TrendForce notes that expectations for 2026 demand have become cautious amid geopolitical headwinds. Furthermore, DRAM shortages and quarterly price increases since mid-2025 continue to strain downstream production costs. Even though automotive and industrial-control segments are preparing to resume restocking toward the end of 2025, the 4Q25 uptick in foundry utilization will be limited. Consequently, revenue growth among the top 10 is projected to narrow significantly in the fourth quarter.

Samsung Foundry's "Heat Path Block" (HPB) technology is reportedly a key aspect featured within the upcoming Exynos 2600 application processor (AP). The South Korean's previous flagship mobile chipsets have often been beset with thermal issues, leading to the deployment of rival chipsets within certain generations of Samsung Galaxy smartphones. The South Korean seems to be pinning its hopes on the emerging Exynos 2600 across a number of fronts. Most notably as a confident "proof of concept" demonstration of the foundry business's cutting-edge 2 nm GAA process (aka SF2). According to a freshly-published ET News SK article, Samsung's innovative "semiconductor heat-suppressing technology" has already attracted interest from Apple and Qualcomm.

In the recent past, these VVIP clients have been on the order books for TSMC's best modern node processes. Samsung's SF2 line is seemingly being dangled as a carrot; designed to entice the return of former customers. Semiconductor industry trackers reckon that the Exynos 2600 SoC—enhanced with HPB tech—will serve as a strong demo of Samsung's 2 nm chip making capabilities. The foundry's in-house Heat Path Block is a copper heatsink that is packaged on top of a mobile AP. Heat dissipation is further maximized by moving DRAM to the side—previous Exynos layouts had this aspect placed atop APs. Insiders believe that a 30% improvement has been observed when comparing the Exynos 2600 to a predecessor. Samsung's System LSI division supposedly co-created the HPB design with an internal packaging development organization.

New research from Omdia shows that the semiconductor market delivered a record breaking performance in 3Q25 with industry revenue reaching $216.3bn, up 14.5% quarter-over-quarter (QoQ). This marks the first time the global semiconductor market has exceeded $200bn in a single quarter, following an already strong 2Q25, which saw 8% QoQ growth. At this pace, the industry is on track to exceed $800bn in total revenue for 2025.

3Q25 far exceeds seasonal expectations
Demand for AI and memory products remains strong, with both segments continuing to outpace the wider market. While AI has dominated recent industry narratives, Omdia notes that more segments contributed to growth in 3Q25 than in previous quarters.

Interesting developments are unfolding in the world of DRAM and NAND flash, as one of the largest players, SK Hynix, has announced product updates for 2026. The company appears to be following its competitor Samsung by slowing the ramp-up of its next-generation HBM4. Initially, SK Hynix planned to increase its HBM4 capacity in the second quarter of 2026. However, this has been postponed to the third quarter of 2026, as the company plans to expand its HBM4 manufacturing capacity. The delay is due to the high demand for its current HBM3E capacity, necessitating the continued operation of HBM3E manufacturing sites longer than expected. SK Hynix's largest customer for HBM chips, NVIDIA, is reportedly facing challenges with the volume production of "Rubin," delaying the need for HBM4, while the HBM3E-equipped "Blackwell" remains in strong demand.

Mid-week Samsung's smartphone marketing division kicked off an Exynos 2600 marketing campaign. A short video teaser proclaimed that the upcoming flagship mobile processor has been "refined at the core" and "optimized at every level." Industry experts believe that the 2 nm chip will be deployed within a portion of next wave Galaxy S-series devices. A new product launch window could be scheduled for the first quarter of 2026. Despite freshly optimistic promotional fanfare, certain South Korean industry insiders have expressed doubt about the megacorp's present day foundry capabilities.

Buried at the bottom half of a Money Today SK news article—mostly covering Samsung HBM developments—is a short paragraph that proposes an alternative perspective of the foundry service's SF2 production line status. The report posits that the cutting-edge facility is cutting things a little fine: "Exynos 2600, a 2 nm (GAA) application processor (AP) for smartphones, is expected to enter mass production soon. It is expected to feature in the Galaxy S26 series, which will be released next year. In an unusual move, Samsung Foundry recently released a teaser video for the Exynos 2600." Going back to late September, semiconductor industry insiders believed that high-volume production had started ahead of schedule—citing pleasing progress with "50% yield rates." Partially reaffirming Money Today SK's freshest claim, DigiTimes Asia reported (last week) about a late November initiation of mass production.

During the 2025 Korea Tech Festival in Seoul, Samsung's 40 Gbps GDDR7 memory received a presidential recognition medal. This next-generation memory chip is built on Samsung's 12 nm (10 nm class) DRAM node and operates at 40 Gbps with a 3 GB (24 Gb) capacity. This announcement follows Samsung's recent sampling of its fastest-ever GDDR7 memory, which runs at 36 Gbps. With a 24 Gb capacity per chip, this translates to 3 GB of capacity, designed for the next generation of graphics cards. These are not Samsung's only 3 GB modules. The South Korean company is also producing 28 Gbps 3 GB modules, which are now in mass production, likely for NVIDIA's upcoming mid-cycle SUPER refresh.

As 3 GB modules are uncommon, the confirmation of mass production, especially starting at 28 Gbps, is a welcome addition to faster VRAM options. However, with Samsung already testing 40 Gbps GDDR7 memory modules with 3 GB capacity, it will be interesting to see where these modules will be used. For NVIDIA's mid-cycle SUPER refresh of the GeForce RTX 50-series GPUs, the company is likely to use chips that are already in mass production, as the sampling stage alone is not sufficient for a product rollout. Ensuring a proper supply is crucial, so a proper stock of GDDR7 chips must pile up first.

Samsung's next-gen flagship Exynos 2600 5G mobile chipset seems to be closing in on a launch window. Yesterday, a teaser trailer appeared online—the 30-second-long presentation mentioned that the South Korean giant's top SoC offering has been "refined at the core" and "optimized at every level." Contrary to this present day positive messaging, a steady flow of inside track information has indicated a problematic development. The Exynos 2600 processor's gestation has been linked to a troubled 2 nm GAA process (aka SF2), going back over a year. Late August reportage signalled that Samsung's foundry business was "going all in" with its cutting-edge 2 nm production line—future success could hinge on further node refinements; allegedly dubbed "SF2P" and "SF2P+." The Samsung Galaxy S26 series could be the first set of smartphones to land at retail with 2 nm silicon onboard. Previous Galaxy S generations—three in total—have relied entirely on Qualcomm chips.

Older in-house chip-powered efforts were viewed as inferior to rival flagship devices; normally operating with the best Snapdragon chipsets inside. According to a fresh Korea Joongang Daily article, a "dual-chip strategy" has been arranged for the forthcoming S26 models. The report alludes to yet another reliance on Qualcomm, although reduced for specific territories: "it is widely suspected by industry observers that the S26 and S26 Plus will be mounted with the Exynos 2600 in Europe and Korea, while the Snapdragon 8 Gen 5 Elite (3 nm) will be installed in the same models across the United States, China and Japan. For the S26 Ultra, Qualcomm chips will be used across all markets." Samsung's Exynos 2600 chip is expected to feature a 10-core design (1+3+6), paired up with a brand-new Xclipse 960 iGPU. This information was gleaned from early benchmark results; alleged evaluation sample data was discovered during the summer months.

Samsung's semiconductor unit and its smartphone division have reportedly agreed to continue mobile DRAM supplies on a quarterly basis rather than locking in annual prices, according to industry sources close to SE Daily. The Device Solutions (DS) team has set baseline volume commitments for next year, aiming to prevent shortages before the launch of Samsung's Galaxy S26 series. However, this agreement comes with a downside. The three-month pricing windows expose the Mobile Experience (MX) group to market volatility, especially as memory costs are rising. Samsung is not exempting even its own divisions from the fluctuations in DRAM and NAND prices.

Examining the figures, the situation appears challenging for the DS Team. Mobile DRAM prices have more than doubled, with 12 GB LPDDR5X modules reaching around $70 in late November, up from about $33 in January. Processors, already the most significant expense in any smartphone, have increased by 25.5% compared to the previous year, raising the DX division's Q3 procurement bill to 10.9 trillion Korean won from 8.7 trillion won. Together, processor and memory now account for about 35% of the total device cost, a 5% increase from historical levels, putting pressure on the MX team. This tension reflects an internal shift, as the DS Division seeks higher profits from HBM for AI accelerators, reallocating wafers and resources away from standard mobile chips. Buyers who signed longer DRAM contracts earlier might regret it if spot prices continue to rise.

Update December 3rd 20:10 UTC: A Samsung spokesperson reached out to confirm: "Recent reports that Samsung's DS division has rejected certain customer requests are baseless and not true. We are in close communication with global customers to address industry needs."

Samsung is teaming up with Amazon, Bethesda Softworks and Xbox to celebrate the arrival of Fallout Season Two, offering fans more ways to Watch, Experience and Play on Samsung TVs. Watch Season One subscription-free on Samsung TV Plus, experience Season Two in stunning detail on Samsung TVs and play Fallout, including the newest update to the hit game Fallout 76, through the Xbox app on Samsung Gaming Hub. Across streaming, gaming and culture, Fallout comes together on Samsung TVs, creating a single destination for fans to experience the story in full.

WATCH - Stream Prime Video's Fallout Season One Subscription-Free on Samsung TV Plus for a Limited Time
Ahead of the highly anticipated Season Two premiere on Prime Video, fans can return to the post-apocalyptic world of Fallout, from Kilter Films, streaming free on Samsung TV Plus. Based on one of the greatest video game series of all time, Fallout is the story of haves and have-nots in a world in which there's almost nothing left to have. Two hundred years after the apocalypse, the gentle denizens of luxury fallout shelters are forced to return to the irradiated hellscape their ancestors left behind - and are shocked to discover an incredibly complex and gleefully weird universe waiting for them. The new season will pick up in the aftermath of Season One's epic finale and take audiences along for a journey through the wasteland of the Mojave to the post-apocalyptic city of New Vegas.

As Samsung transitions from its HBM3 and HBM3E variations of HBM memory to HBM4, the company is reportedly reallocating some of its HBM production capacity to regular DRAM to meet demand. Discussions within the company focus on converting approximately 30-40% of the current capacity from the 10 nm-class, fourth-generation 1a DRAM process to the 10 nm-class, fifth-generation 1b lines used for general-purpose DRAM. This includes DDR5, LPDDR5X, LPDDR6, and GDDR7 memory. With additional investment to repurpose mature process nodes like 1z, Samsung expects to free up the equivalent of about 80,000 wafers per month of 1b capacity.

While HBM typically offers higher margins for companies like Micron and SK Hynix, Samsung's internal estimates show that the operating profit for a 12-hi HBM3E stack is around 30%. In contrast, the near-term expectations for general-purpose DRAM exceed 60%. These margin differences, along with forecasts of a significant decline in average selling prices for 12-hi HBM3E and limited incremental demand from the largest HBM customer, have reduced the incentive to expand HBM3E production.

Transcend has reportedly issued an internal company notice, shared by @jukan05 on X, indicating that they have recently received a notice from their NAND Flash suppliers, Samsung and Sandisk, about postponed shipments. According to the letter, Transcend has not received a NAND Flash shipment since October, significantly affecting its product availability. Due to the widespread NAND flash shortage impacting the industry, Samsung and Sandisk were unable to supply sufficient NAND chips to storage product manufacturers, affecting both their revenue streams and customer commitments. The company stated:

TranscendThe situation worsened in Q4 due to increased demand from large data centers and hyperscalers driven by major cloud service providers' expansion plans. All major chip manufacturers are prioritizing supply for these customers, which has led to price increases and extremely limited availability. Just last week alone, we were notified that costs had risen by 50-100%. The price-up trend continues at a very rapid pace and at an abnormal rate.

TrendForce's recent research indicates that the ongoing expansion of AI infrastructure by CSPs fueled strong demand for enterprise SSDs in 3Q25. As a result, the combined revenue of the top five NAND Flash vendors grew by 16.5% QoQ, approaching US$17.1 billion. The production cuts enacted earlier in the year are now impacting the market, helping to balance supply and demand in the latter half. Additionally, the rising proportion of enterprise SSD shipments contributed to increased ASPs among suppliers.

A forecast for 4Q25 indicates that demand driven by AI for high-performance TLC and QLC enterprise SSDs will keep growing. However, as suppliers' inventories normalize and node migrations cause typical yield-related losses, the growth in shipments will be more restrained. Ongoing shortages in HDD supply will continue to push NAND Flash prices upward. TrendForce predicts total NAND Flash prices will rise by 20-25%, further boosting quarterly revenue.

Samsung has reportedly finished development of its first sixth-generation HBM (HBM4) chips and is now in the final pre-mass-production stage. According to new reporting from AjuNews and Korean industry sources, Samsung's Device Solutions division has cleared Production Readiness Approval (PRA), the last internal checkpoint before full-volume manufacturing. HBM4 is expected to deliver roughly 60% higher bandwidth than the current HBM3E chips. Samsung has already shipped HBM4 samples to NVIDIA, which is evaluating them for use in its upcoming Rubin platform. Initial samples have already exceeded NVIDIA's next-gen GPU requirement of 11 Gbps per pin. The company is using improved 1c-class DRAM paired with a 4 nm logic base die, a combination that helps close the gap with rivals while keeping thermals and power in check at these higher speeds. Once NVIDIA signs off, Samsung can move straight into volume production, with manufacturing lines already prepared.

Samsung had already signaled strong progress during its Q3 2025 earnings call on October 30, noting that HBM4 samples were in the hands of global customers and that mass production is planned for 2026. "HBM3E is currently in mass production and being sold to all related customers, while HBM4 samples are simultaneously being shipped to key clients," the company said at the time. Samsung also confirmed that its foundry arm will prioritize stable 2 nm GAA output and HBM4 base-die production in 2026, alongside the ramp of its new Taylor, Texas fab. The company is also said to be working on a faster HBM4 variant targeting another 40% performance uplift, with an announcement possible as early as mid-February 2026.

Samsung Electronics today announced the launch of Galaxy Z TriFold, further expanding Samsung's leadership in new form factors for the mobile AI era. Built on a decade of foldable category innovation, Galaxy Z TriFold showcases engineering mastery with its most advanced foldable technologies optimized for the unique demands of a multi-folding design. Its slim profile ensures the portability of a premium phone that provides ultra performance and, when unfolded twice, it reveals an immersive 10-inch display that elevates productivity and cinematic viewing—offering a best-in-class mobile experience never before seen in any other form factor.

"Samsung's relentless pursuit of new possibilities continues to shape the future of mobile experiences," said TM Roh, Chief Executive Officer, President and Head of Device eXperience (DX) Division at Samsung Electronics. "Through years of innovation in foldable form factors, Galaxy Z TriFold solves one of the mobile industry's longest-standing challenges—delivering the perfect balance between portability, premium performance and productivity all in one device. Galaxy Z TriFold now expands the boundaries of what's possible for mobile work, creativity and connection."

HARMAN today announced the official closing of the previously announced sale of its Digital Transformation Solutions (DTS) business unit to Wipro Limited, following all required regulatory approvals. The transaction advances HARMAN's strategic focus on strengthening its core Automotive and Lifestyle businesses while ensuring continuity and opportunity for DTS employees and customers.

"This milestone reflects our disciplined approach to portfolio management and our commitment to long-term growth," said Carolin Reichert, Chief Strategy Officer at HARMAN. "We appreciate the contributions of our DTS colleagues, and we are confident the business will continue to thrive as part of Wipro." With the transition finalized, DTS will now operate as part of Wipro's Engineering Global Business Line. As part of the acquisition, Wipro will enter into a multi-year strategic agreement with HARMAN and Samsung, further deepening the relationship and creating new avenues for joint growth and transformation.

Samsung Electronics today announced the release of its latest external storage device, the T7 Resurrected Portable Solid State Drive (PSSD), special addition to the company's Portable SSD family. With the same performance compared to the previous T7 model, the new PSSD delivers high-speed storage options and demonstrates a responsible approach to material use.

Responsibility at Its Core
Unlike previous portable SSD lineups, the T7 Resurrected features a unique body case design crafted from 100% recycled aluminium certified by TÜV Rheinland. The body case of the T7 Resurrected, fabricated from aluminium discarded generated during the production of Samsung Galaxy mobile devices, encourages the cross-division circulation of resources. By eliminating the coloring process, the product showcases the natural luster of aluminium while minimizing chemical use and streamlining its manufacturing process. Furthermore, the packaging design utilizes 100% recycled paper and ASA-certified soy ink, underscoring Samsung's ongoing efforts toward responsible manufacturing practices. Thanks to these efforts, the T7 Resurrected won the 2026 CES Innovation Award in the Sustainability & Energy category.