Samsung Electronics today announced that its 2026 OLED TV lineup and next-generation Odyssey gaming monitors are NVIDIA G-SYNC Compatible, delivering smoother gameplay to meet the needs of gamers and display enthusiasts alike

NVIDIA G-SYNC technology enables the display's refresh rate to synchronize with the NVIDIA GeForce GPU's frame rate, reducing screen tearing and stuttering for a more seamless visual experience. Models that are G-SYNC Compatible include the OLED S95H, S90H and S85H, as well as the new Odyssey G6 (G60H, G61SH) gaming monitors.

As AI processing capabilities continue to evolve toward on-device and desktop supercomputer applications, the need for ultra-fast yet space-efficient local storage becomes increasingly important. Samsung's recent innovation in AI-optimized storage devices drives this point home. Our PM9E1 SSD—the industry's first PCIe Gen 5 4 TB SSD in M.2 22x42 form factor—complements the NVIDIA GB10-powered NVIDIA DGX Spark desktop AI supercomputer.

While AI accelerators enable systems to harness the vast power of AI, only pairing them with performance-optimized, purpose-built storage technology like the Samsung PM9E1 can provide the massive capacity and blazing access speeds to unleash that power that may lead to the development of tomorrow's killer AI apps.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2025.

In the quarter ended December 31, 2025, the Company posted its highest-ever quarterly consolidated revenue at KRW 93.8 trillion, representing a quarter-on-quarter (QoQ) increase of 9%. Operating profit was also an all-time high, at KRW 20.1 trillion. For the full year, the Company reported KRW 333.6 trillion in annual revenue and KRW 43.6 trillion in operating profit.

Samsung presented its brand-new Exynos 2600 application processor just before Christmas—this big announcement followed many months of leaks, throughout 2025. Weeks later, a mysterious follow-up model—dubbed "Exynos 2700" by South Korean industry insiders—was tentatively linked to an allegedly more refined 2 nm GAA node process. Officially, Samsung has opted into using its own foundry's SF2 production line for the imminent Exynos 2600 SoC-powered Galaxy S26 smartphone series. Lately, the more advanced "SF2P" node process has been uttered in the same sentence as possible AMD, Qualcomm, and Tesla chip making deals. The South Korean megacorporation is very likely keen to drum up interest from new and returning clients, and their latest Exynos mobile chip is being used as a proof of concept for the regular SF2 node (2 nm GAA), along with proprietary "Heat Path Block" technology.

Unsurprisingly, as the Exynos 2600 AP closes in on its release period, pre-launch samples have posted benchmark data. Last week, TechPowerUp covered this next-gen chip's Geekbench 6 OpenCL score of 24,964 points—achieved by the onboard Xclipse 960 iGPU (aka "JUNO"). Earlier today, a slightly mysterious "Samsung Electronics Co., Ltd. Full Android on S5E9975 ERD" test device posted a not-so-impressive OpenCL score of 15618, in Geekbench 6.2.2 for Android AArch64. A Geekbench browser database entry details a 10-core processor candidate that packs a Samsung Xclipse 970 integrated graphics solution. Presumably, the numerical model climb—from 960 going up to 970—implies the "S5E9975 ERD" validation platform hosting an "Exynos 2700" mobile chipset. At first, Ice Universe—a self-described tech expert of global renown—was excited by the seemingly premature appearance of an "Exynos 2700" engineering sample. A lower than expected benchmark score was blamed on the test setup being an "ERD engineering board."

Last week, intriguing early details of Samsung's (up to) 2 nm custom HBM logic die designs turned up via South Korean semiconductor industry insiders. As expected, talk of really futuristic computer memory tech also included comparisons to less distant prospects. According to official roadmaps, development of 4 nm node process-based HBM4 (sixth generation) modules wrapped up in 2025. Last Sunday, an SBS Biz news article claimed that Samsung Electronics had: "recently passed the final quality test for HBM4 from NVIDIA plus AMD, and will begin mass production next month." On the Team Green front, this fresh verification and consequent full-on manufacturing phase, could lead to initial batches getting showcased at the upcoming GTC 2026 AI conference (March 16-19). Industry moles propose that Samsung HBM4 modules will be "immediately used" in the performance demonstrations of next-gen "Rubin" AI accelerator products. NVIDIA's current-gen "Blackwell" AI GPU designs rely on HBM3E. Industry experts believe that Samsung trailed behind main rivals during the era of HBM3 and HBM3E, but newer observations predict the South Korean giant's (potential) return to prominence in the High Bandwidth Memory market sector.

A few weeks ago—at CES 2026—NVIDIA announced an upgrade of "Vera Rubin" memory bandwidth. It is not (officially) clear whether this jump from 20.5 TB/s (September 2025 spec) to 22 TB/s was enabled by the utilization of Samsung HBM4 modules. SBS Biz outlined one major advantage: "Samsung's HBM4 is said to have the industry's highest specifications (over the closest competition), operating at 11.7 Gb/s, which is faster than the 10 Gb/s (JEDEC standard) required by NVIDIA and AMD. It is said that Samsung demonstrated its technological perfection by passing verification without redesign, despite a customer's request for increased performance last year." Additionally, the publication's anonymous sources reckon that "full-scale supply" will commence by June time, due to HBM4 being closely tied to Team Green's "Vera Rubin" manufacturing schedule. Recently, Quanta Computer's Mike Yang anticipated first shipments of server hardware—heading to hyperscaler customers—starting around late summer.

Lately and supposedly, the Samsung Foundry has "stabilized" yields of its cutting-edge 2 nm GAA node process (SF2); enough to qualify as being "mass production"-worthy. Despite rumors of a yield rate hovering around the 50% mark, the South Korean semiconductor specialist seems to be proceeding with high-volume manufacturing of Exynos 2600 application processors. This next-gen smartphone chip is expected to become the foundry service's SF2 "proof of concept," as finalized silicon gets released within upcoming Galaxy S26 and S26+ devices. A fresh Chosun Daily article cites recent research done by KB Securities—with head analyst, Kim Dong-won, projecting a return to profit—in 2027—for the Samsung's chip making business. Prior to the early success of SF2, the megacorp's foundry division has been "recording trillions of won in losses since 2022," but new deals could lead to much better fortunes in the next financial year. KB Securities reckons that "performance is expected to turn a profit next year from a loss of 7 trillion won last year, thanks to an increase in operating rates following the expansion of Tesla AI chip supply."

One industry insider commented on present-day goings-on with company leadership: "they are accelerating order intake with the goal of turning a profit next year. In addition to the stabilization of yields in advanced processes below 3 nm (<SF3-class), the operating rates of the highly profitable 4-8 nm processes are also at their highest levels." The Chosun Daily news piece brings up Qualcomm and AMD as potential returning (fabless) customers, especially in the context of adopting 2-nanometer wafers—either SF2 or SF2P-class. Last month, Qualcomm was reportedly close to adopting Samsung Semiconductor's HPB technology, another in-house smartphone-centric product. A week ago, the rumor mill mentioned one unnamed "definite" sign-up. As the 2 nm (SF2) process stabilizes, Chosun thinks that Samsung has a better/growing chance of securing Qualcomm's custom in the near future. They outline a current fruitful collaboration: "Qualcomm is a long-time customer of Samsung Foundry, and has a special relationship with Samsung Electronics' Mobile Business (MX) division."

Everyone is aware of the massive memory shortage the industry is currently experiencing, yet prices are reportedly still rising. According to an anonymous Samsung memory distributor, an immediate price hike of 80% has been applied. Later, an employee from the Device Solutions Campus in Giheung, located south of Seoul, confirmed this information. However, we still lack official confirmation from other third-party sources. If the 80% hike is accurate, it will likely apply to the latest batch of contract prices Samsung has imposed on its distributors. As new contract negotiations occur every quarter, it seems the 80% price increase is applied for Q1, given that the effect is noted as immediate.

The scope of this adjustment includes all Samsung memory products, which encompass a diverse range of offerings such as DDR, HBM, LPDDR, and GDDR solutions. These products are used in mobile devices, desktops, embedded systems, graphics cards, AI accelerators, and more. However, since some memory products are supplied directly to Samsung's customers without distributors, it is likely that only certain types of these products will experience a significant price increase, if the reports are accurate. We still have a few weeks left before the trickle-down economics of the supply chain start to manifest, so we will know for sure if these rumors are true.

Update 18:36 UTC: : According to UDN, Samsung has denied these price hikes, claiming that the company has not issued a comprehensive price increase across its memory products.

Just before Christmas, Samsung fully unveiled its brand-new Exynos 2600 application processor (AP). The firm's Semiconductor division started teasing this next-gen smartphone chip around late 2025, with pre-launch details being shared via teaser trailers and sparsely populated splash pages. During the winter holiday period, the South Korean giant's foundry business detailed its pioneering "Heat Path Block" (HPB) technology. This intriguing aspect of the Exynos 2600 SoC's design was leaked mid-way through December; when industry moles started whispering about HPB tech being shopped to Apple and Qualcomm. Samsung's FoWLP_HPB (Fan-out Wafer Level Package with Heat Path Block) technology could address the problems faced by rival chip designers—in particular, it is believed that Qualcomm's next-wave Snapdragon 8 Elite mobile SoCs would require more potent heat dissipation solutions.

According to fresh inside track information—courtesy of the "Fixed-focus Digital Cameras" Weibo blog—HPB tech is now adopted by "many chip manufacturers that commonly use Android chips." The leaker believes that stronger heat dissipation will lead to greater overclocking capabilities on (non-Samsung) next-gen mobile chips. According to official descriptions, the development of FoWLP_HPB has improved the thermal resistance: "of the (Exynos 2600) AP die by reducing the size of the DRAM that obstructs the heat dissipation path and attaching Heat Path Block to facilitate heat release. Additionally, High-k EMC is applied to ensure that heat is efficiently transferred toward the HPB direction...With these packaging innovations, Samsung's mobile packaging technology enables efficient outward heat dissipation, resulting in up to a 16% reduction in thermal resistance compared to previous packages and delivering enhanced performance." Current-gen flagship smartphone chips can operate at impressive frequencies, but thermal considerations have set certain limits. The now "old school" placement of a wider DRAM layer—that restricts heat being drawn away from the CPU die—could be considered a major obstacle, going forward.

A report put together by Deutsche Bank analysts has mentioned an ongoing supply-demand imbalance within the semiconductor market. According to Jukan's summary of the financial institute's findings, TSMC's "share of the advanced-node foundry market" could fall from an impressive 95% level, down to a mere 90% in the coming years. The industry-leading chipmaker continues to enjoy a prime position, but its international operation footprint seemingly cannot keep up with requests—mainly from fabless customers—during the ongoing AI hardware boom. Deutsche Bank believes that the Taiwanese foundry business has an order backlog extending way into 2027, with many clients requiring 3 nm wafer products. TSMC reportedly aims to get 3 nm node production lines pumping out around 190,000 wafers per month, by the end of this year. Even if this major target is met, demand is expected to outweigh supply. AI chip production-centric bottlenecks—mostly involving CoWoS packaging—have been dealt with in the recent past, but industry observers posit that VIP customers are considering alternate providers.

Allegedly, the next best options are the Samsung and Intel Foundries, despite rumors of teething problems—both companies will very likely welcome new requests. In modern times, many of Samsung's big clients have switched over to TSMC, due to (the former's) supposedly troubled development of more advanced nodes. Deutsche Bank analysts have outlined a "big six" group of key customers: AMD, Apple, Broadcom, MediaTek, NVIDIA, and Qualcomm. The fabless firms could be pursuing alternate "production capacity" avenues, with Samsung's 2 nm (SF2) and 4 nm node process lines being of particular interest. Like TSMC, the South Korea megacorp's state-of-the-art fabrication sites and staff expertise are concentrated in home territories. A surprise prediction has highlighted Samsung's main North American foundry—the Deutsche Bank report pinpointed a very specific location: "for customers seeking alternative supply, Samsung's Taylor fab is more likely to become the first destination." In addition, analysts think that the big six will select Samsung's Texas-based foundry over Intel's best native site (perhaps dealing in 18A).

Taiwanese media outlet Benchlife has reportedly obtained information about the pricing of AMD and NVIDIA GPU and memory bundles shipped to their respective add-in-board partners. According to their findings, both AMD and NVIDIA have increased the prices of GDDR6 and GDDR7 memory to reflect the current industry-wide DRAM shortage. However, the report highlights that NVIDIA's pricing for GDDR6 and GDDR7 memory is significantly lower than AMD's. As AMD and NVIDIA bundle their GPU dies with GDDR6/GDDR7 memory, they can set the pricing of these bundles based on several factors. These factors include the cost at which they acquire the DRAM and the desired profit margin for the GPU dies. Typically, the memory is paired with the GPU die, which also influences the final pricing strategy.

BenchlifeOn January 16th, NVIDIA officially notified its AIC partners that all bundled GDDR6 and GDDR7 memory packages are now increasing in price. We have been informed of the price increase through familiar AIC partners, but we won't specify the exact price here. What we can say is that NVIDIA's new prices are still lower than those announced by AMD to its AIB partners.

Tesla has finalized the development of its AI5 automotive processor, allowing for production at TSMC and Samsung facilities. This advancement also revives the previously halted Dojo 3 supercomputer project. CEO Elon Musk announced that the AI5 chip will offer performance on par with NVIDIA's "Hopper" architecture, with two AI5 units equaling the power of a single "Blackwell" processor. The revival of Dojo 3 project was rumored with Intel joining as a key packaging partner, marking a shift from Tesla's earlier dependence on TSMC for complete manufacturing. Intel will manage assembly and testing using its EMIB technology, which connects multiple dies via silicon bridges instead of a full-wafer interposer. This method is better suited to Tesla's large Dojo modules that combine several 654 mm² chips into a single package.

Also based on previous information, Samsung will produce the D3 training chips at its Texas facility using a 2 nm process, leaving Intel to oversee packaging operations exclusively. This division of labor addresses capacity constraints and provides Tesla with more flexibility in customizing interconnect layouts. For the AI5 automotive chips, both Samsung and TSMC will create distinct versions, but Tesla aims to ensure identical software performance across both. Initial projections suggest the AI5 could operate at just 150 W while matching the performance of NVIDIA's H100 accelerator that requires 700 W. This efficiency is achieved by removing general-purpose graphics subsystems and optimizing the architecture specifically for Tesla's neural processing.

Intel's latest "Panther Lake" designs are set to officially debut in the coming days, with the first reviews expected on January 26. These 18A SoCs are anticipated to come with a significant price premium, as indicated by Samsung. The South Korean company reports that Intel "Panther Lake" based Galaxy Book6 Pro and Galaxy Book6 Ultra models will be approximately 20% more expensive than the previous-generation Galaxy Book5 models, which were based on the "Lunar Lake" SoC. This price increase is noteworthy because it is driven by a combination of new manufacturing technologies and the ongoing DRAM shortage. While Intel used TSMC N3B for "Lunar Lake," it has shifted much of the manufacturing to its internal Fab capacity with the introduction of "Panther Lake" on the 18A node.

On its South Korean official website, Samsung lists the Galaxy Book6 Pro series starting at 3,410,000 KRW (approximately $2,315) for a laptop featuring 32 GB of LPDDR5X memory, a 1 TB SSD, and an Intel Core Ultra X7 "Panther Lake" CPU with integrated Arc graphics. The specific model for the Core Ultra X7 is the Core Ultra X7 368H, which includes 16 cores, a boost clock of up to 5.0 GHz, and an Intel Arc B390 integrated GPU. Intel claims this 12-Xe core model is about 77% faster than the previous generation "Lunar Lake" Arc 140V integrated GPU and roughly 73% faster than the Radeon 890M found in AMD's "Strix Point." Additionally, Intel compares the Arc B390 to a discrete NVIDIA GeForce RTX 4050 laptop GPU, but adds that XeSS3 features like multi-frame generation yield an overall performance win.

Samsung Display's "Cinematic Experience" OLED experience could make its way to premium Apple laptop pastures. According to fresh inside track info—courtesy of a yeux1122 blog post—the South Korean behemoth's 8.6-generation OLED production line has kicked into high gear. Projections from last year allegedly outlined a mass manufacturing phase starting by the second quarter of 2026, but the yeux1122 post claims that an adjusted production timeline has just come into effect. Reports from last year outlined a significant $3.1 billion investment at this display-oriented fabrication campus; paving the way for mass manufacturing of "8.6G IT OLED" panels—targeting next-gen computer monitors, laptops, tablets and other small-to-medium-sized devices. Apparently, improved yield rates and cost benefits are the result of Samsung's 8.6-generation—taking advantage of larger glass substrates, where differing panel sizes can be cut and extracted from a single sheet.

The first commercial examples of the company's 8.6G OLED panel tech—emerging from their Asan fabrication campus—could debut on higher-end MacBook devices. One of Samsung Display's main customers is Apple; industry insiders believe that futuristic 14/16-inch M6 MacBook Pro and Max models—likely arriving early next year—will feature advanced tandem OLED tech, instead of single-stack structures. A double-stack design is said to consist of a rigid OLED layer and an oxide TFT backplane; both elements are light emitting. This combination is ideal for laptop applications, due to offering higher brightness levels, superior power efficiency, and improved longevity. Noted Apple sleuth Mark Gurman (of Bloomber fame) and tech industry analyst Ming-Chi Kuo—in parallel agreement—predict touchscreen displays being fitted on the first wave of OLED MacBook Pro products.

Late last year, conflicting insider reports provided jumbled details of Samsung's cutting-edge 2 nm GAA node process (SF2). Around that period, the South Korean megacorp's semiconductor business had initiated "mass production" of proprietary next-gen Exynos 2600 mobile processors. Earlier today, a ZDNet news article claims that yields of Samsung's first-generation 2 nm wafer product have been recorded hitting a "relatively stable" 50% milestone. This more recent achievement is puzzling, given that other inside sources disclosed a similar level being reached last September. Ideally, closer to 70% yield rates are preferred for mass manufacturing of finalized chip designs. Throughout 2025, insider reports suggested a not so smooth development of SF2—company leadership was determined to get this technology over the finishing line. Industry observers think that the alleged failure of Samsung Foundry's 3 nm line had caused potentially returning clients to stick with TSMC.

The upcoming launch of Exynos 2600 chip will be a crucial "proof of concept" moment for Samsung—with the opportunity to attract VIP customers away from a main rival's best 2 nm and 3 nm offerings. The ZDNet report mentions a second-gen 2 nm GAA option (SF2P). This refinement could be the result of "additional growth engines," and inside track info posits that guidelines have been sent to design solution partners. When compared to the first iteration, SF2P reportedly does better with: "12% improved performance, 25% improved power efficiency, and an 8% smaller footprint." One anonymous source divulged that SF2P's basic process design kit (PDK) was completed mid-way through last year. ZDNet has linked this second-gen node process to a mysterious "Exynos 2700" SoC.

TrendForce's recent research indicates that as major international NAND Flash producers reduce or halt MLC NAND Flash output and redirect their capital and R&D investments toward advanced process tech, the worldwide MLC NAND Flash capacity is expected to decrease by 41.7% YOY in 2026, leading to increased supply-demand discrepancies.

The significant decline in MLC NAND Flash supply is mainly due to Samsung—formerly the largest supplier—announcing in March 2025 that its MLC NAND products would reach end of life, with final shipments in June 2026. Additionally, Kioxia, SK hynix, and Micron have limited their MLC production primarily to meet existing customer demand, with little motivation to increase capacity. As supply rapidly contracted and no large, quickly ramping replacement capacity appeared, the MLC NAND Flash market experienced strong pull-in demand and early volume commitments from late 1Q25, causing prices to rise sharply and maintain this upward trend.

Samsung Display and Intel have jointly developed SmartPower HDR, which can reduce OLED's emissive power consumption by up to 22% in HDR mode on laptops. As AI PCs become more widespread, the new technology is expected to significantly improve battery efficiency and enhance the HDR viewing experience.

SmartPower HDR allows users to enjoy HDR content on laptops while minimizing power usage. Display power consumption is largely affected by driving voltage. Unlike conventional HDR modes that apply a fixed high voltage regardless of the content type causing unnecessary power loss, SmartPower HDR dynamically adjusts voltage based on the characteristics of the displayed content.

SK Hynix has showcased its most advanced high-bandwidth memory, packaged as a 16-high 48 GB HBM4, designed for high-capacity AI and HPC accelerators that require lots of memory. This is the first time SK Hynix has shown a memory module more advanced than the 12-high 36 GB HBM4, which used to run at 11.7 Gbps. For the new 16-high HBM4, we don't have official data or any speed references, but we can assume SK Hynix managed to extract a bit more bandwidth from the four additional DRAM layers. Interestingly, the announcement was somewhat vague, possibly because Micron and Samsung are also enhancing their HBM4 modules before they become available to companies like AMD and NVIDIA, allowing for potential increases in speed if needed.

The company also demonstrated the custom base die HBM called cHBM. This includes a customized base die sitting at the bottom of the DRAM stack that includes some logic usually associated with the GPU/ASIC logic die, and not memory. For example, this could include HBM PHY and memory controllers that are usually embedded on the GPU die and occupy space, which could be used for more compute logic on the die and maximize performance. In SK Hynix's demonstration and illustration, this is manifested as die-to-die PHYs, embedded memory controllers, HBM PHY, and much more. Customers can basically choose whatever they want and can even embed processing logic inside the die area.

Last week, MSI teased the return of its famous MSI Lightning GPU brand, last seen in the now distant MSI GeForce RTX 2080 Ti Lightning Z. Thanks to the CES 2026 Innovation Awards, we now have more details ahead of the official launch, as the MSI GeForce RTX 5090 Lightning Z has been showcased. Documentation confirms a liquid-cooled AIO system featuring a 360 mm radiator and dual 12V-2×6 power connectors, each capable of delivering 600 W, totaling 1600 W. One of its most notable features is a front-mounted display that covers nearly the entire surface of the card. MSI has equipped the card with a reinforced PCB, premium voltage regulation modules, and a companion mobile app for remote monitoring and overclocking adjustments.

Elite overclockers worldwide are already submitting HWBOT results showcasing the RTX 5090 Lightning Z variant reaching 3,742 MHz, making it the highest-clocked RTX 5090 GPU globally. These benchmarks, conducted with exotic cooling methods such as liquid nitrogen or custom water loops instead of the retail AIO solution, show memory operating at 36 Gbps in various tests. This indicates that the memory modules used in this GPU are also suitable for overclocking. Samsung GDDR7 modules are now sampling at 36 Gbps speeds straight out of the box, but it requires LN2 for older modules to achieve these speeds. Of course, MSI has reportedly readied a XOC VBIOS that allows the card to consume 2,500 W of power, which will require additional PCB modification to the power input. With 40-phase power delivery, 2,500 W of load seems like a good choice for extreme overclocking runs.Update Jan 6th: At MSI's CES booth we went hands-on with the Lightning Z and also got photos of its PCB, too.

NVIDIA is rumored to be bringing back production of its GeForce RTX 3060 graphics card in Q1 2026. Based on the two generations old "Ampere" graphics architecture, the RTX 3060 could address the sub-$300 market. There is no word on which exact memory variant is on offer—whether it's the 12 GB original with a 192-bit wide memory bus, or the newer 8 GB variant with 128-bit bus. Why it has to be the RTX 3060 and not something newer, such as the RTX 4060, is anyone's guess, but if we have to speculate, it could have something to do with the fact that the RTX 4060 is based on the same NVIDIA 4N foundry node at TSMC as the current RTX 5060, whereas the RTX 3060, like the rest of the GeForce "Ampere" generation, is built on the Samsung 8N (8 nm DUV) foundry node.

Samsung Electronics today announced the global launch of The Freestyle+, its latest AI-powered portable projector designed to deliver a more flexible and personalized entertainment experience across a wide range of spaces. Unveiled ahead of CES 2026 in Las Vegas, The Freestyle+ builds on the distinctive design of the original Freestyle while introducing smarter AI capabilities, improved brightness and expanded entertainment features—allowing users to enjoy content more freely, with minimal setup or adjustment.

"The Freestyle+ reflects Samsung's vision to create displays that adapt naturally to how people live and move between spaces," said Hun Lee, Executive Vice President of the Visual Display Business at Samsung Electronics. "By combining true portability with intelligent AI that optimizes both the viewing environment and the content itself, The Freestyle+ makes it easier to enjoy a consistent, high-quality experience wherever you are."

Samsung Display today announced that it has begun the mass production of the world's first 34-inch 360 Hz QD-OLED panel, featuring a "V (Vertical)-Stripe" pixel structure. The company has been supplying the panels to seven global monitor manufacturers including ASUS, MSI, and Gigabyte since December 2025.

The new V-Stripe structure aligns Red, Green, and Blue (RGB) sub-pixels vertically, shifting from the conventional triangular sub-pixel arrangement used in current QD-OLED technology. Developed independently by Samsung Display for quantum dot elements, the V-Stripe structure improves the clarity of text edges, making it ideal for users engaged in text-intensive tasks such as document editing, coding, or content creation.

Samsung Electronics America today introduced two new additions to its mobile portfolio: Galaxy A17 5G and Galaxy Tab A11+, expanding Galaxy experiences for every kind of user while offering fun and helpful new experiences at an incredible value. As the starting point for the Galaxy smartphone experience, Galaxy A17 5G introduces several updates for the Galaxy A series including improved cameras, enhanced durability, and innovative AI experiences.

Galaxy Tab A11+ is a do-it-all device offering excellent performance for everyday use. Designed to fit a wide range of needs, it's a great option for a shared device with features to keep everyone in the house connected.

We've already seen the myriad far-reaching effects of the DRAM crisis play out in a number of ways, including bring-your-own-RAM offerings from custom PC builders and rumors of delayed next-gen consoles. However, a new report out of DigiTimes claims that DRAM producers, specifically mentioning Samsung and SK Hynix, are now selectively prioritizing certain hardware makers. Allegedly, large brands like Apple, ASUS, Dell, and Lenovo are receiving priority access to DRAM, which may result in smaller vendors—the likes of Framework—without DRAM supply.

The report also mentions that DRAM suppliers are starting to change their approach to the supply agreements, more frequently re-assessing the situation in order to take advantage of the limited capacity and likely adjust pricing and supply accordingly. Previously, we covered a report that claimed PC hardware vendors may have to adjust pricing, specs, and potentially launch dates of upcoming laptop and smartphone offerings, and these agreements are likely being pursued by mainstream brands, like Apple, ASUS, Dell, and Lenovo, in order to avoid or mitigate that eventuality.

We have already reported on the outsized impact that the AI industry's demand for RAM and the ensuing RAM shortage have had on the PC gaming industry—including everything from price hikes to potential launch delays for next-gen PC hardware products—but now it seems as though console gamers may have to join PC gamers at the back of the line. According to a recent report by Insider Gaming, console hardware makers, likely referring to Microsoft and Sony, are in talks to delay the next console hardware generation.

Originally, the next-gen Xbox and PlayStation consoles were slated to launch sometime in 2027 or 2028, and a new launch window has not yet been revealed, but hardware makers are seemingly considering the delay in the hopes that RAM prices and availability will stabilize ahead of the launch. Currently, brands like Samsung are planning on pivoting some of their NAND production to DRAM, and other makers are scurrying to build out their supply chain to meet demand, but that takes time. We have already seen the RAM shortage impact console makers, with increasing NAND and DRAM prices resulting in slimmer margins, while some brands have had to start considering increasing the retail prices of their hardware.

Samsung Electronics today unveiled its most advanced Odyssey gaming monitor lineup yet, introducing five new models that push the boundaries of resolution, refresh rates and immersive visual performance. Led by Samsung's first 6K 3D Odyssey G9, the 2026 lineup debuts world-first display technologies for gamers and creators, including the next-generation Odyssey G6 and three new Odyssey G8 models.

"With this year's Odyssey lineup, we're introducing display experiences that simply weren't possible even a year ago," said Hun Lee, Executive Vice President of the Visual Display (VD) Business at Samsung Electronics. "From the industry's first 6K glasses-free 3D monitor to breakthrough 1,040 Hz speed, we designed these monitors to meet the ambitions of today's gamers and deliver a level of immersion that fundamentally changes how content looks and functions on screen."