Microsoft has just announced a new set of features coming to the ASUS ROG Xbox Ally handheld gaming PCs, addressing game quality, docked mode quality-of-life, Game Bar improvements, and more. The most notable improvement coming to the ROG Xbox Ally is Auto Super Resolution, or Auto SR, which is now in Preview in the Xbox Game Bar. Auto SR, as the name suggests, is a similar to AMD and NVIDIA's FSR and DLSS, allowing game upscaling to increase frame rates without losing image quality. On the ASUS ROG Xbox Ally X, Auto SR is only available in docked mode for now, where it will automatically upscale the game's image to deliver a sharper image, fit for a bigger screen, when docked to something like a TV. This should effectively make for a smoother transition between gaming on the TV and in handheld mode, since you won't have to change resolution or upscaling settings when plugging the ROG Xbox Ally in. Microsoft has an in-depth blog explaining Auto SR in more detail.

[Editor's note: Our in-depth review of the ASUS ROG Xbox Ally X is now live]

Aside from Auto SR, the ROG Xbox Ally also gets the gamepad cursor we previously covered, streamlined controller pairing for docked play, a display widget in Game Bar, where you can quickly adjust display settings, and a handful of automatic enhancements for smart TVs. For starters, when players connect to an external display or TV, the ROG Xbox Ally will now turn off the built-in screen and default to the TV for output. If the connected TV happens to be a smart TV from Samsung, LG, or Vizio, the ROG Xbox Ally will automatically enable certain features on the TV, like Auto Low Latency Mode, Auto Game Mode, or Game/PC Mode. The library consolidation features we previously covered have also officially been added to the Xbox PC App, allowing you to use the ASUS ROG Xbox Ally in handheld mode exclusively if you would like to.

Samsung has reported a record quarterly profit for Q1 2026, with chip division operating income jumping to 53.7 trillion won ($36.15 billion), a 49% increase from the 1.1 trillion won ($745 million) posted in the same quarter last year. That figure accounted for 94% of the company's total operating profit of 57.2 trillion won ($38.7 billion), which itself was up from 6.69 trillion won a year prior. Overall revenue rose 69% year over year to 133.9 trillion won ($90.6 billion). Its record profit came mostly from the AI data center sector that pushed demand for advanced memory well beyond what Samsung and its peers can supply. The company has signed multi-year binding supply contracts with customers looking to lock in capacity, though it hasn't disclosed names or terms. Samsung's memory chief Kim Jaejune told analysts that supply is already falling well short of demand, and that based on orders already received, the gap in 2027 is expected to be even wider than in 2026.

On HBM specifically, Samsung said it began mass-production sales of HBM4 for NVIDIA's Vera Rubin platform in February and is on track to more than triple HBM revenue this year versus last. However, rising memory prices are affecting the profit of other Samsung businesses. Mobile and network division profit fell 35% to 2.8 trillion won, due to higher component costs, and the display division saw operating profit drop 20% to 400 billion won ($270 million). Reuters also reports the risk of a strike, with unions representing a large portion of Samsung's South Korean chip workforce considering work stoppages over pay disputes. For the rest of 2026, Samsung expects that increasing demand will keep pushing memory, foundry, and display businesses.

NVIDIA has officially launched its new GeForce RTX 5070 12 GB laptop edition GPU, featuring higher-capacity GDDR7 memory. This confirms earlier rumors about an upgraded memory configuration. In a quiet release, NVIDIA announced its decision to use 24 Gb (3 GB) GDDR7 memory modules, which offer a 50% increase in memory capacity compared to the current 16 Gb (2 GB) GDDR7 configurations. As demand for GPU memory remains high, NVIDIA can balance the supply of 16 Gb GDDR7 modules by utilizing a new batch of 24 Gb GDDR7 modules from partners like SK hynix, Samsung, and Micron. The company describes this move as a way to ensure a sufficient supply of 16 Gb GDDR7 memory for the remaining GeForce RTX 50-Series "Blackwell" GPUs, maintaining healthy supply levels. The new GPU SKU complements the existing RTX 5070 8 GB Laptop Edition model, providing gamers with more laptop configurations to choose from.

NVIDIADemand for GeForce RTX GPUs remains strong, and memory supply is constrained. In order to maximize memory availability, we are releasing the GeForce RTX 5070 Laptop GPU 12 GB configuration with 24 Gb G7 memory. This gives our partners access to an additional pool of memory to complement the 16 Gb G7 supply that currently ships with most GeForce GPUs. The 12 GB configuration will exist alongside the current 8 GB configuration, and allows our partners to bring a broader range of GeForce RTX 5070 laptops to consumers.

Samsung Electronics and POSTECH have published a research paper titled "Switchable 2D-3D display through a metasurface lenticular lens" in the prestigious journal Nature, marking notable progress in next-generation display technology through industry-academia collaboration.

Rethinking 3D Displays With Metasurfaces
A metasurface lenticular lens-based switchable 2D/3D display uses an ultra-thin metalens composed of nanoscale structures to transition seamlessly between flat (2D) and stereoscopic (3D) images. A metasurface is significantly thinner while enabling complex optical functions—making it key to next-generation displays and camera systems.

Samsung Display announced today that its QD-OLED panels for TVs and monitors have received verification from UL Solutions, a global leader in applied safety science, for their viewing angle performance under the 'Quantum View' standard.

'Quantum View' is a verification program that evaluates changes in luminance and color coordinates as the viewing angle shifts from the front in 10-degree increments up to 60 degrees. According to the assessment results, Samsung Display's QD-OLED panels maintained above 60% of front-facing luminance even at a 60-degree angle, while color shift remained below 0.012, indicating minimal change.

NVIDIA's GeForce RTX 3060 12 GB "Ampere" GPU, which is two generations old, is expected to make a comeback in June this year. Meanwhile, the rumored RTX 5050 9 GB edition is reportedly on hold. According to well-known hardware leaker MEGAsizeGPU on X, NVIDIA is pausing the transition from its 8 GB RTX 5050 "Blackwell" version to a 9 GB model due to the reintroduction of the GeForce RTX 3060 12 GB "Ampere" GPU. Since both of these GPUs compete in the budget segment, the company will reportedly only release the older GeForce RTX 3060 12 GB SKU with a 192-bit wide memory bus. For this, NVIDIA will once again use Samsung's 8 nm DUV node, as it has in the past. The entire NVIDIA "Ampere" architecture lineup was produced on the 8 nm DUV node, and its return after several years was unexpected. However, since NVIDIA has transitioned to TSMC for manufacturing its "Ada Lovelace" and latest "Blackwell" GPUs, becoming TSMC's largest customer using the 5 nm node, this move is intriguing.

The NVIDIA GeForce RTX 3060 features 3,584 CUDA cores and 12 GB of GDDR6 memory. In contrast, the GeForce RTX 5050 has newer CUDA cores on a smaller node with 2,560 cores on the GB207 die, but it has less memory, with only 9 GB of the rumored GDDR7. Since the resurrected GeForce RTX 3060 will use the older GDDR6 memory, sourcing GDDR6 may have been easier for NVIDIA, leaving the more expensive GDDR7 for its other GPUs.

One of the senior executives from Samsung Foundry, Shawn Han, has officially joined Intel Foundry to help secure new customer deals. With over 30 years of experience in the semiconductor industry, Shawn Han has worked through many node designs, transitions to new technologies, and has observed shifts in customer behaviors and trends. He joined Samsung in 1996 as a senior engineer in the Technology Development team, working on multiple nodes, and holds a PhD in Material Science and Engineering from Iowa State University. Over the years, he rose to the position of Executive Vice President at Samsung, where he was responsible for Samsung's U.S. Foundry business, focusing on attracting new customers and securing deals. Now, Intel Foundry will benefit from a significant new team member with decades of experience, deep expertise, and strategic relationships to help secure new customers. Shawn Han will report directly to Naga Chandrasekaran, Executive Vice President and General Manager of Intel Foundry, and will contribute to elevating Intel Foundry to new levels.

Elon Musk announced today on X that Tesla has completed the design of a new generation of its AI chips for Full Self-Driving (FSD). The CEO also mentioned earlier that the AI5 chip will offer performance comparable to NVIDIA's "Hopper" architecture, with two AI5 units matching the power of a single "Blackwell" processor. In late 2025, reports indicated that Samsung had achieved a significant win for its previously struggling foundry business, as Tesla decided to split the manufacturing of its new AI5 accelerator between Samsung and TSMC. The chips will be produced at Samsung's plant in Taylor, Texas, and TSMC's facility in Arizona. This decision is part of a strategy to keep the supply chain diversified and maintain chip supply under control for any demand scenario.

Samsung and TSMC are not the only partners in this project. Tesla is also sourcing DRAM chips from SK hynix, which appear to be LPDDR5X memory integrated into the package. On both the left and right sides, there are two rows of SK hynix LPDDR5X memory modules, each with three modules. This totals 12 LPDDR5X memory modules per AI5 chip. With 16 GB per module, this results in 192 GB of LPDDR5X memory per single AI5 SoC.

In the latest Q1 2026 quarterly figures, ASML announced plans to ship over 60 EUV units this year, including both High-NA and Low-NA EUV lithography scanners. This is a significant increase from the 48 units shipped in 2025, but it doesn't break any records compared to the company's expectations for 2027. ASML predicts shipping about 80 EUV systems in 2027, driven by massive demand from memory makers. As memory has become the most sought-after commodity in AI data centers, there is simply not enough supply to meet demand. In Q1 2026, ASML reported that nearly half—45% to be precise—of its revenue came from South Korea.

While ASML hasn't provided specific data per manufacturer, we know that South Korean semiconductor makers primarily focus on memory, storage, and to a lesser extent, logic production. More than half of the quarterly shipments, at 51%, are dedicated to memory production. Companies like SK hynix and Samsung are purchasing many EUV systems to support their growing memory and storage businesses, which include the latest technologies like GDDR6, HBM3, HBM4, and DDR4/DDR5, all consumed by AI data centers worldwide. SK hynix plans to install 20 Low-NA EUV units in the next two years, all designed for HBM memory and advanced storage solutions, making SK hynix one of ASML's largest customers.

DDR4 pricing is finally showing signs of easing, as DDR4 16 Gb spot prices experienced a 5% correction in March after a more than 2,200% increase over the past year. The massive demand for AI data center expansion absorbed all available DDR production, making DDR4 and DDR5 pricing widely discussed topics among enthusiast communities. This has impacted PC DIY enthusiasts, laptop makers, PC OEMs, and everyone in between. Over the past year, the rapid price increase has effectively priced out many consumers from upgrading or installing new systems with larger RAM capacity. However, there are signs that the situation might improve as spot pricing has started to decrease.

First, readers need to understand the difference between spot and contract pricing in DDR memory. Contract pricing is what memory makers like Samsung, SK hynix, and Micron agree on with large buyers, such as PC OEMs like Apple, HP, or Dell, or even server makers who purchase DRAM in large quantities. On the other hand, spot pricing is an "on-the-spot" deal that provides immediate pricing without any contract. This spot pricing is typically reserved for smaller DRAM volumes and is usually bought by DRAM distributors and supply chain logistics. In the spot pricing market, DDR4 has fallen about 5% in March compared to February pricing, and the same applies to DDR5 memory spot pricing.

Samsung has developed a new SSD controller based on the open-source RISC-V instruction set, moving away from the Arm ISA in some of its SSD controllers. With the introduction of the BM9K1 PCIe 5.0 QLC NAND SSD, Samsung has officially created a proprietary RISC-V IP that will serve as a foundation for many SSDs the company plans to release. Announced at the China Flash Market Summit 2026, the BM9K1 SSD has been showcased with just one metric: sequential read speed. Achieving a maximum sequential read speed of 11.4 GB/s, Samsung has reached impressive speeds for QLC NAND Flash. While the sequential write speed is unknown, it is expected to be around 10 GB/s, varying slightly depending on Samsung's design. Typically, high-performance SSDs use TLC NAND, as seen in Samsung's own 9100 Pro SSD, which we reviewed. It features 3D TLC V-NAND V8 with 236 layers. While this SSD uses TLC NAND and has a proprietary Samsung Presto 5 nm controller running on Arm-based cores, Samsung might transition a significant portion of its SSD lineup to a RISC-V based design with the BM9K1, offering satisfactory performance with QLC NAND.

Interestingly, Samsung has designed this SSD with considerations for size, power, and AI. For instance, the BM9K1 PCIe 5.0 SSD replaces the previous BM9C1 PCIe 4.0 SSD controller. Although both use QLC NAND, the newer BM9K1 features a new RISC-V controller and a fresh PCIe 5.0 interface, doubling the performance in sequential reads on average. The power efficiency of the new RISC-V design is also improved. Samsung claims a 23% increase in power efficiency, thanks to the flexibility of RISC-V, which allows for greater customization and optimization of the controller firmware to match I/O patterns with the QLC NAND, resulting in nearly a quarter less power consumption. This improvement is expected to have a significant impact on small form factor PCs and client laptops. The main drawback of the design is the use of QLC NAND, but Samsung may introduce TLC NAND SSDs with RISC-V controllers in the future. For now, these remain on the 5 nm Presto Arm-powered controllers.

Stock prices of DRAM manufacturers dipped by as much as 19% over the past 5 days, over the March 24 announcement of Google TurboQuant, a new technology that Google claims will reduce the memory footprint of AI models by a factor of 6, and improve inference speeds by a factor of 8. As of this writing, Micron Technology (NASDAQ: MU) dipped 19.5% over the last 5 days. Over in Korea, SK Hynix saw its stock price drop by 6%, while Samsung Electronics saw a dip by 5%.

TurboQuant is an advanced quantization algorithm developed by Google that delivers massive data compression for LLMs and vector search engines. It effectively tackles memory bottlenecks in the key-value cache and accelerates similarity lookups without sacrificing model accuracy. TurboQuant achieves this efficiency by combining two novel techniques: PolarQuant, which simplifies data geometry using polar coordinates to eliminate traditional memory overhead, and Quantized Johnson-Lindenstrauss (QJL), a 1-bit mathematical error-checker. Capable of compressing the key-value cache to just 3 bits without requiring fine-tuning, TurboQuant enables up to 8x faster runtimes on GPUs, establishing a new standard for AI efficiency.

Samsung Display announced today that it has developed a new low-reflection, high-durability film that further reduces light reflectance while enhancing display durability.

Samsung Display announced the development of 'QuantumBlack,' a low-reflection and high-durability film that reduces light reflection by 20% compared to the company's previous film and increases panel hardness to 3H. The company confirmed that this technology will be fully applied to all new QD-OLED monitor products launched this year. To highlight the unique value of this technology, Samsung Display named it 'QuantumBlack ' and recently completed trademark registration.

Samsung Electronics today announced the official launch of Samsung Browser for Windows, extending its popular mobile browser experience to PC with seamless cross-device continuity and new agentic AI capabilities designed to make the browsing experience easier and more intuitive.

Browse Seamlessly From Mobile to PC
Samsung Browser for Windows bridges the gap between devices, allowing users to seamlessly continue browsing as they move between mobile and PC. Beyond simple synchronization of bookmarks and browsing history, users can pick up exactly where they left off. For instance, users can continue exploring the same webpage when moving between mobile and PC, creating a more seamless cross-device experience. With Samsung Pass integration, users can securely store personal information and sign in to websites or autofill profiles with ease.

TrendForce's latest findings show that global OLED monitor shipments hit 2.735 million units in 2025, a 92% YoY increase. This impressive growth was mainly fueled by aggressive promotional efforts by brands in the fourth quarter. Furthermore, 27-inch 240 Hz QHD models gained considerable popularity due to their excellent price-to-performance ratio, significantly increasing shipments. The launch of new 280 Hz models further energized the market.

Looking ahead to 2026, total shipments are expected to grow by 51% YoY as brands continue to roll out new products and marketing strategies gain further traction.

TrendForce's latest research on the foundry industry reveals that continued investment in the AI arms race by North American CSPs and AI startups will keep demand for AI processors and supporting ICs strong in 2026. Global foundry revenue is projected to grow 24.8% YoY to approximately US$218.8 billion, with TSMC expected to post the largest increase of around 32% YoY.

Demand for advanced nodes will continue to be driven by AI GPUs from companies such as NVIDIA and AMD. Meanwhile, North American CSPs, including Google, AWS, and Meta, and AI startups such as OpenAI and Groq, are accelerating the development of their own AI chips. Many of these designs are expected to enter volume production and begin shipping in 2026, becoming key drivers for 5/4 nm and more advanced process technologies.

Samsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies. The signing ceremony was held at Samsung's most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.

"Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration," said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. "From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD's evolving AI roadmap."

Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry's only semiconductor company offering a total AI solution spanning memory, logic, foundry and advanced packaging, Samsung will exhibit its full suite of products and solutions that enable customers to design and build groundbreaking AI systems. To learn more about Samsung's AI solutions, please visit the company's GTC 2026 booth (#1207).

The centerpiece of Samsung's showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform. Samsung's HBM4 is expected to help accelerate the development of future AI applications, delivering consistent processing speeds of 11.7 gigabits-per-second (Gbps), which exceeds the industry standard of 8 Gbps, and can be enhanced to 13 Gbps.

Memory manufacturers are forecasting that memory shortages will persist until the end of 2028, when the supply chain balance is expected to be restored and memory will once again reach its commodity status. However, according to the South Korean Chosun Biz newspaper, memory manufacturers are reconsidering their expansion plans to ensure they don't overinvest in building new capacity after demand cools down. Reportedly, Samsung's internal projections indicate that demand for DRAM in forms like HBM and regular DDR will peak in the next few quarters, up until the end of 2028. This is the point where Samsung expects industry-wide demand to cool down and balance to be restored.

When the AI expansion began, memory manufacturers received massive orders from hyperscalers around the world, ordering DRAM supply months in advance. With no end in sight, SK Hynix, Micron, and Samsung started ordering more lithography tools from ASML to expand their wafer manufacturing capacity to meet their customers' needs for more HBM, DDR, and GDDR memory. According to ASML, the company estimates that in 2027, based on current order information and demand, it will deliver 56 Low-NA EUV scanners. This includes seven units for Samsung and as many as 20 units for SK Hynix, specifically for memory and storage. According to South Korean media, SK Hynix plans to install 20 Low-NA EUV units in the next two years, all designed for HBM memory and advanced storage solutions. However, as the demand is expected to stay in line with previous expansion plans, this is stopping memory makers from considering taking the fab capacity expansion further than initially planned.

The widespread adoption of AI inference workloads in 4Q25 significantly raised requirements for data storage systems, according to TrendForce's latest findings on the enterprise SSD market. Meanwhile, enterprises accelerated upgrades to their general-purpose servers, while shortages in HDD supply pushed some demand toward SSD solutions. These factors together drove combined revenue for the world's top five enterprise SSD vendors up 51.7% QoQ to more than US$9.9 billion.

Among leading vendors, Samsung retained its top position, reporting nearly $3.66 billion in revenue in 4Q25, up 49.7% QoQ. The company demonstrated the strength of its vertically integrated business model. As concerns grew over potential DRAM shortages, many customers turned to Samsung because it can rely on its own DRAM and NAND Flash production to ensure stable SSD supply.

Samsung is reportedly planning to bring its 2 nm process to the base die of HBM4E, its 7th-generation high-bandwidth memory. This comes just a month after the company shipped the industry's first commercial HBM4, and alongside a separate effort to redesign the HBM4E power delivery network to handle the increase in power bumps from 13,682 to 14,457 within the same footprint. Until HBM3, the base die had a somewhat passive role, sitting at the bottom of an HBM stack and handling power and signal control. Starting with HBM4, it took on a more active role by handling some compute tasks directly, making the underlying process node increasingly important. For HBM4, Samsung already had an edge here, using 4 nm logic base dies from its own foundry paired with its latest 1c DRAM, well ahead of the 12 nm (N12) process SK hynix sources from TSMC. Moving to 2 nm for HBM4E would extend that lead further, improving power efficiency, thermal management, and area utilization.

The other key players in the industry are also focusing on custom HBM4E as the next battleground, with TSMC stating it plans to use its 3 nm process for custom HBM4E, and SK hynix also working on its own variant. With its latest 2 nm node push, Samsung appears to be making a deliberate move to stay a step ahead on process technology. Standard HBM4E is expected mid-year, with custom product tape-in following in the second half of the year. The Business Korea report also points to the foundry angle. Producing HBM base dies internally helps Samsung Foundry keep fab utilization high, and the 2 nm node is expected to play a major role in ramping production at the Taylor fab in Texas. There, equipment installation is already underway, with the first wafer tape-in targeted before year-end.

TrendForce's latest research on the semiconductor foundry industry reveals that advanced-node demand remained strong in 4Q25, driven by the tight supply of AI server GPUs and Google TPUs. Furthermore, the launch of new smartphones boosted wafer orders for mobile application processors (APs), supporting solid shipment performance.

On the mature-node side, PMIC orders related to servers and edge AI continued to keep 8-inch fabs running at high utilization rates, with some suppliers even considering price increases. Meanwhile, utilization rates at 12-inch fabs remained largely stable. Together, these factors pushed the combined revenue of the world's top ten foundries up 2.6% QoQ to nearly US$46.3 billion in 4Q25.

NVIDIA is reportedly preparing to update its GeForce RTX 5050 GPU with a new variant featuring 9 GB of GDDR7 memory. A well-known leaker on X, @kopite7kimi, confirmed that the upcoming card will maintain the same 130 W TDP and thermal envelope as the current GeForce RTX 5050, which has 8 GB of GDDR6 memory. The current RTX 5050 uses 8 GB of 20 Gbps GDDR6 memory on a 128-bit bus, providing 320 GB/s of bandwidth. The new model is expected to use three modules of GDDR7 memory, each with 3 GB of capacity, resulting in a total of 9 GB across a 96-bit memory bus. While the narrower bus decreases the interface width, the switch to new 28 Gbps GDDR7 memory would increase total memory bandwidth to 336 GB/s, a roughly 5% improvement, along with a 12.5% boost in VRAM capacity. The new leak also claims that NVIDIA is using GB206 as a GPU base, while the older RTX 5050 8 GB with GDDR6 used GB207 die. However, the core count remains at 2,560 CUDA cores, suggesting that lower-binned GB206 dies found in RTX 5060 and other mid-range SKUs are repurposed for the new RTX 5050.

NVIDIA's switch to GDDR7 memory likely helps the company manage supply chain procurement better, as memory modules are in short supply. Instead of using four GDDR6 modules with 2 GB capacity each, NVIDIA is switching to three modules of GDDR7 with 3 GB capacity each, reducing the number of memory modules needed for this GPU. Interestingly, memory makers like Samsung, Micron, and SK hynix could now produce more of the 3 GB GDDR7 modules, with GDDR6 being in much shorter supply, forcing manufacturers to focus on the newer memory technology while GPU makers have to adapt. This has resulted in a situation where procuring three modules of 3 GB GDDR7 memory is now easier than finding a sufficient supply of GDDR6 modules, which NVIDIA needs to secure for each RTX 5050 GPU. As we approach Computex 2026, this GPU is expected to arrive sometime during that period.

Samsung Electronics America today shared its plan to expand support for glasses-free 3D gameplay on the Samsung Odyssey 3D gaming monitor at GDC Festival of Gaming 2026 in San Francisco. Samsung will spotlight Hell is Us and Cronos: The New Dawn as part of its expanding 3D gaming ecosystem, demonstrating how leading titles are embracing immersive displays without the need for special glasses.

"The Odyssey 3D is designed for gamers who want to experience their hobby in a way that feels like they're completely embedded in the action," said Kevin Lee, Executive Vice President of the Visual Display (VD) Business at Samsung Electronics. "Through partnerships with leading gaming studios, we are committed to creating an ecosystem of top-tier titles, making great games extraordinary."

NVIDIA's GeForce RTX 3060 is making a comeback, expected around mid-March. For this, NVIDIA will once again use Samsung's 8 nm DUV node, as it has in the past. This has been confirmed by the Korean media outlet Hankyung, which reports that Samsung is restarting its 8 nm node production to meet NVIDIA's needs. Originally, Samsung manufactured these GPUs back in 2021. The entire NVIDIA "Ampere" architecture lineup was produced on the 8 nm DUV node, and we didn't anticipate its return after several years. However, since NVIDIA has transitioned to TSMC for manufacturing its "Ada Lovelace" and latest "Blackwell" GPUs, and has become TSMC's largest customer, utilizing the 5 nm node, this move is intriguing.

We still lack concrete information about which version of the RTX 3060 will be reintroduced—whether it will be the original 12 GB model with a 192-bit wide memory bus or the newer 8 GB variant with a 128-bit bus. Additionally, the decision to use a two-generation-old GPU architecture in 2026 is puzzling, as the reason NVIDIA has chosen the RTX 3060 instead of a newer model like the RTX 4060 remains unclear. Speculatively, it could be because the RTX 4060 is based on the same NVIDIA 4N (5 nm-class) node at TSMC as the current RTX 5060, while the RTX 3060, along with the rest of the GeForce "Ampere" generation, is built on the Samsung 8N (8 nm DUV) foundry node, which would leave the 5 nm capacity for "Blackwell" and its enterprise variants. Finally, it is worth pointing out that when GPU IP design is done, it is usually hard-linked with the node it has been prepared for, so NVIDIA is sticking with Samsung again to avoid any potential upfront costs of adapting this GPU for a different node.