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Samsung Curved Monitor Sales Pass 1 Million Units

Samsung Electronics announced today that it has sold more than one million curved monitor products worldwide. The global display provider introduced its first curved LED monitor - the 27-inch, 4000R (curvature radius of 4,000 mm) SD590C model - in September 2014, and since has expanded its line-up to include several additional curved monitors. As a result, Samsung currently accounts for more than 85 percent of all global curved monitor sales (Source: International Data Corporation (IDC), 2015 Q4 worldwide sales results for 15"~34" curved monitors).

Designed to match the natural shape of the human eye, Samsung's curved monitors feature uniform center-to-edge viewing distances to create a more comfortable and immersive viewing experience conducive to long-term use. Combined with extra-wide viewing angles and enhanced contrast ratios, these curved displays are ideal for gamers and at-home entertainment users seeking realistic, distraction-free picture quality. As a result, Samsung has capitalized on growing demand from these audiences (many of whom employ several monitors during game play or content viewing).

NVIDIA "Pascal" GP104 Silicon Pictured

A picture of NVIDIA's next performance-segment GPU based on the upcoming "Pascal" architecture, the GP104, was leaked to the web, revealing a heap of raw material to speculate from. To begin with, GP104 retains the traditional component layout of a simple GPU die sitting on a conventional fiberglass substrate package, with memory chips surrounding it. NVIDIA is reserving exotic specs such as stacked HBM2 memory for the high-end GP100 silicon.

Some fairly straightforward trignometry reveals that the rectangular die of the GP104 measures 15.35 mm x 19.18 mm, with one source speculating a transistor-count of 7.4-7.9 billion. The card is expected to feature 8 gigabit GDDR5 memory chips, which tick at 8 GHz (GDDR5-effective). If the memory bus width is 256-bit, then you're looking at a memory bandwidth of 256 GB/s. The CUDA core count of the GP104 could be closer to 2,560, than the 4,096 from an older report.

Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them. DDR4 is quickly becoming the most widely produced memory for personal computers and IT networks in the world, and Samsung's latest advancement will help to accelerate the industry-wide shift to advanced DDR4 products.

Samsung opened the door to 10nm-class DRAM for the first time in the industry after overcoming technical challenges in DRAM scaling. These challenges were mastered using currently available ArF (argon fluoride) immersion lithography, free from the use of EUV (extreme ultra violet) equipment. Samsung's roll-out of the 10nm-class (1x) DRAM marks yet another milestone for the company after it first mass produced 20-nanometer (nm) 4Gb DDR3 DRAM in 2014.

JEDEC Publishes Universal Flash Storage (UFS) Removable Card Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220-2 Universal Flash Storage (UFS) Card Extension Standard. The new removable memory card standard standardizes functionality that aligns with the popular UFS embedded device standard. JESD220-2 is available for free download from the JEDEC website.

UFS is a high performance interface designed for use in computing and mobile systems such as smart phones and tablets where power consumption needs to be minimized. Its high speed serial interface and optimized protocol enable significant improvements in throughput and mobile system performance. The new UFS card standard provides a leading-edge removable storage solution while maintaining sequential and random IOPS performance that is critical for future mobile markets. Even using a single lane the UFS 1.0 card offers 600 MB/s interface speed in both directions and a state-of-the-art queuing mechanism to further increase system throughput.

Samsung Expands the Award-winning Notebook 9 and Galaxy TabPro S Lines

Samsung Electronics America, Inc., today announced availability of the Galaxy TabPro S, a two-in-one device created specifically for on-the-go consumers and mobile professionals. The powerful, sleek TabPro S - which runs Windows 10, and features an Intel Core m3 processor - will be available beginning March 18 starting at $899.99 with a full-size ergonomic keyboard with trackpad.

"Today's consumers and professionals are dynamic and highly mobile, and they demand tablets and laptops to use at the office, at home, or on the go, such as the TabPro S," said Gary Riding, senior vice president, product marketing at Samsung Electronics America. "Through our longstanding strategic partnerships with Intel and Microsoft, our products deliver power and functionality - all in a beautifully designed device."

Samsung Introduces World's Highest Capacity Enterprise SSD - 15.36 TB

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now shipping the industry's largest solid state drive (SSD) - the "PM1633a," a 15.36 terabyte (TB) drive. First revealed at the 2015 Flash Memory Summit in August, the 15.36TB SSD is based on a 12Gb/s Serial Attached SCSI (SAS) interface, for use in enterprise storage systems. Because the PM1633a comes in a 2.5-inch form factor, enterprise storage managers can fit twice as many of the drives in a standard 19-inch, 2U rack, compared to an equivalent 3.5-inch storage drive

"To satisfy an increasing market need for ultra-high-capacity SAS SSDs from leading enterprise storage system manufacturers, we are directing our best efforts toward meeting our customers' SSD requests," said Jung-bae Lee, Senior Vice President, Memory Product Planning and Application Engineering Team, Samsung Electronics. "We will continue to lead the industry with next-generation SSDs, using our advanced 3D V-NAND memory technology, in order to accelerate the growth of the premium memory market while delivering greater performance and efficiency to our customers."

Samsung Portable SSD T3 Now Available for Purchase

Samsung Electronics America, Inc. today announced availability and pricing of the Samsung Portable SSD T3, a premium, palm-sized, external solid state drive (SSD) that offers multi-terabyte (TB) storage capacity. "Today's consumers and business professionals are increasingly relying on external storage, seeking faster data transfers and larger capacities. The Samsung Portable SSD T3 raises the bar for external storage, safely and securely packing up to two terabytes of data into a robust package that fits in the palm of your hand," said Andrew Sivori, vice president of Consumer IT Marketing at Samsung Electronics America.

The Samsung Portable SSD T3 with vertical NAND (V-NAND) technology enables fast and convenient external storage and transfer of large files across devices. With the T3, users can send content to and from Windows, Mac OS, & Android devices with ease and reliability. Enabling them to access their high quality content on Android smartphones, tablets, and compatible Smart TVs via USB port. The drive is ideal for consumers, content creators, business and IT professionals looking to store and access up to 2TB of data with the peace of mind that their data will be protected across their devices.

Samsung Electronics Unveils Three New 1,800R Curvature Displays

Samsung Electronics launched its new curved monitor line-up including CF591 (27-inch model) and CF390 (23.5- and 27-inch models). Samsung's newest curved displays meet the diverse multimedia and multitasking needs of both professional and individual users, and foster a visually-comfortable environment conducive to long-term use.

Since releasing the industry's first curved LED monitor in 2014, Samsung has continued to refine its design to accommodate growing demand from various user groups. The new CF591 and CF390 monitors feature many of Samsung's latest innovations, including a sharper curve (1800R, translating to a curvature radius of 1,800 mm) and improved picture quality to deliver an optimal presentation that matches the shape of the human eye. Samsung will launch the new curved monitors in the US, Europe and Asia in March and will expand the sales to other regions by April.

Samsung Introduces Industry's First Universal Flash Storage for Mobile Devices

Samsung Electronics, the world leader in advanced memory technology, announced that it is now mass producing the industry's first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. The newly introduced embedded memory features outstanding performance for mobile devices that exceeds that of a typical SATA-based SSD for PCs.

"By providing high-density UFS memory that is nearly twice as fast as a SATA SSD for PCs, we will contribute to a paradigm shift within the mobile data storage market," said Joo Sun Choi, Executive Vice President, Memory Sales and Marketing, Samsung Electronics. "We are determined to push the competitive edge in premium storage line-ups - OEM NVMe SSDs, external SSDs, and UFS - by moving aggressively to enhance performance and capacity in all three markets."

Samsung Intros the SSD T3 Portable Solid State Drives

Samsung announced the SSD T3 line of portable solid state drives. Measuring 74 mm x 58 mm x 10.5 mm (LxWxH), and weighing in at 51 g, the drives are more compact than the T1 line of portable SSDs by the company. Available in capacities of 250 GB, 500 GB, 1 TB, and 2 TB, the drives take advantage of USB 3.0 interface, with a single cable handling both power and host connectivity, and serving up sequential transfer-rates of up to 450 MB/s. The drives feature 256-bit AES native encryption, and a password authentication that works on Windows (Windows 7 and above), OS X (OS X 10.7 and above), and Android (4.4 "KitKat" and above). Backed by 3-year warranties, the 250 GB variant is priced at US $130, the 500 GB variant $220, 1 TB variant $430, and 2 TB variant $850.

TSMC Damaged by Earthquake, Could Impact AMD and NVIDIA GPU production

The recent 6.4 magnitude Taiwan earthquake, which hit the island nation on February 6th, affected TSMC worse than expected. Taiwan's premier semiconductor foundry, TSMC, had initially expected semiconductor wafer shipments to be down by less than 1%, but it is now emerging that the drop in shipments could be higher, because the damage to one of its facilities, Fab-14, is worse than originally assessed.

TSMC, in an official communication to its clients, assured that 95% of the foundry machines could return to functionality within 2-3 days after the earthquake. To that effect, machines in Fab-6 and Fab-14B have been fully restored. Despite the disaster, the company appears confident of reaching revenue targets of US $5.9-6.0 billion for Q1-2016. TSMC is the primary foundry partner of major fabless semiconductor companies, such as Qualcomm, NVIDIA, and AMD. AMD recently moved its next-generation GPU manufacturing to Korean silicon giant Samsung, while NVIDIA is building its next "Pascal" GPU family on TSMC's process.

Samsung Readies 144 Hz 3440 x 1440 Ultra-wide Monitors

Samsung is giving finishing touches to a new fleet of high-speed ultra-wide monitors. These monitors will be among the first to leverage DisplayPort 1.3, to serve up blazing fast 144 Hz refresh rates, on resolutions as high as 3440 x 1440 pixels. Samsung has plans of at least two monitors with these specs - a 30-inch, and a 35-inch display. The two will feature VA (vertical-alignment) panels. It's likely that the two could also feature adaptive-sync features, such as AMD FreeSync. The two could come out later this year.

Samsung Begins Mass-Producing 4-Gigabyte HBM2 Memory Stacks

Samsung Electronics Co., Ltd., announced today that it has begun mass producing the industry's first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung's new HBM solution will offer unprecedented DRAM performance - more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

"By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies," said Sewon Chun, senior vice president, Memory Marketing, Samsung Electronics. "Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market."

The newly introduced 4GB HBM2 DRAM, which uses Samsung's most efficient 20-nanometer process technology and advanced HBM chip design, satisfies the need for high performance, energy efficiency, reliability and small dimensions making it well suited for next-generation HPC systems and graphics cards.

Samsung Announces Mass Production of 2nd Gen. 14-Nanometer FinFET Logic Process

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has begun mass production of advanced logic chips utilizing its 14 nm LPP (Low-Power Plus) process, the 2nd generation of the company's 14 nm FinFET process technology.

In leading mass production of advanced FinFET logic process, Samsung announced in Q1 of 2015 the launch of the Exynos 7 Octa processor built on the industry's first 14 nm LPE (Low-Power Early) process. With the new 14 nm LPP process, Samsung continues to demonstrate its process technology leadership, and unparalleled performance and power efficiency for its Exynos 8 Octa processor and its many foundry customers including Qualcomm Technologies, Inc. The Qualcomm Snapdragon 820 processor uses Samsung's new 14 nm LPP process and is expected to be in devices in the first half of this year.

"We are pleased to start production of our industry-leading, 2nd generation 14 nm FinFET process technology that delivers the highest level of performance and power efficiency," said Charlie Bae, Executive Vice President of Sales & Marketing, System LSI Business, Samsung Electronics. "Samsung will continue to offer derivative processes of its advanced 14 nm FinFET technology to maintain our technology leadership."

New Samsung Notebook 9 Laptops Continue to Redefine Mobility

Samsung Electronics America, Inc. today added two new laptops to the award-winning Notebook 9 line: the 13.3-inch Notebook 9 and the 15-inch Notebook 9. These PCs meet the needs of today's mobile users through premium ultra-lightweight magnesium design, connected mobility, productivity and all-day battery life.

"Having a laptop that is easy to carry around but doesn't sacrifice functionality or style is no longer just a luxury - it's a necessity for many people," said Gary Riding, senior vice president, Mobile Computing at Samsung Electronics America. "The new Notebook 9s offer the features Samsung is known for - extraordinary displays, premium performance, all-day battery life and seamless connectivity with other devices - all in the ultraportable package demanded by today's mobile consumers."

Samsung Electronics Announces Portable SSD T3

Samsung Electronics America, Inc., today announced the Samsung Portable SSD T3, a premium, palm-sized, external solid state drive (SSD) that offers multi-terabyte (TB) storage capacity. Equipped with Samsung's proprietary Vertical NAND (V-NAND) and SSD TurboWrite technology, the T3 drive provides advanced performance, enabling consumers, content creators, business and IT professionals, to quickly and easily store and transfer large multimedia content across a variety of devices.

"Following the successful worldwide launch of the Portable SSD T1 in 2015, we made several significant upgrades to the T3 based on the feedback and needs of our customers, which included content creators and business professionals in particular," said Un-Soo Kim, Senior Vice President of Brand Product Marketing, Memory Business at Samsung Electronics. "As such, the T3 delivers the outstanding performance, storage capacity and durability needed from an external storage device for today's mobile lifestyle, without compromising on style or security. It's the new portable external storage drive users can depend on in any situation or environment."

Lenovo Unveils Pioneering Modular ThinkPad X1 Tablet

Lenovo today unveiled its newly expanded and highly innovative X1 portfolio. Designed for forward thinkers, the series includes new additions such as the brilliantly adaptable ThinkPad X1 Tablet with its unique modular design; the immersive ThinkPad X1 Yoga with world's first OLED display; and the award-winning ThinkPad X1 Carbon is even thinner and lighter, strengthening its superiority in the ultrabook market. Furthermore, desktop users will be wowed by the stunning new ThinkCentre X1 all-in-one, the must-have design centerpiece for any office with outstanding performance to match.

The full size ThinkPad keyboard with the iconic TrackPoint has three adjustable typing angles and recreates the classic ThinkPad keystroke feel. Keyboard and tablet together weigh just 2.4 pounds for an ultra-light laptop experience. What's more, it is the first Windows tablet with LTE Advanced support for superfast connectivity from virtually anywhere. The ThinkPad X1 Tablet also features a removable rear panel for serviceability and upgrades.

4th Generation Graphics CoreNext Architecture Codenamed "Polaris"

The fourth generation of AMD Graphics CoreNext GPU architecture has been reportedly codenamed "Polaris" by the company. It makes its debut later this year in the company's "Arctic Islands" GPUs, built on Samsung's 14 nm FinFET node. According to the company, Polaris will provide a "historic leap in performance/Watt" for Radeon GPUs. Chips based on Polaris will feature improvements to not just the compute units, but will also come with generational improvements to pretty much every other component, including a new front-end, display controllers, and a new memory controller supporting HBM2.

AMD debuted its first generation GCN architecture with the Radeon HD 7000 series, notably the "Tahiti" silicon. Its second-generation, GCN 2.0, (reported in the press as GCN 1.1), debuted with the R9 290 series, notably the "Hawaii" silicon. The third-generation, GCN 3.0 (reported in the press as GCN 1.2), debuted with the R9 285, notably the "Tonga" silicon; making "Polaris" the fourth-generation. GCN 4.0 will form the core micro-architecture of the "Arctic Islands" family of GPUs, which make their debut in mid-2016.

Samsung Addresses a Growing Mobile Health Market with First Smart Bio-Processor

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it is addressing the growing trend of quantified health with an all-in-one advanced system logic chip for the health-oriented wearables market, the Bio-Processor. The Samsung Bio-Processor, now in mass production, is specifically designed to allow accelerated development of innovative wearable products for consumers who are increasingly monitoring their health and fitness on a daily basis.

"With improvements in smart, fitness devices and an increase in consumer health consciousness, more and more people are looking for ways to monitor various personal bio-data, or fitness data, to constantly manage their health" said Ben K. Hur, Vice President of marketing, System LSI business at Samsung Electronics. "Samsung's Bio-Processor, which can process five different biometric signals, is the most versatile health and fitness monitoring chip available on the market today and is expected to open up many new health-based service options for our customers."

NVIDIA Stares at Sales Ban as US-ITC Rules in Samsung's Favor in Patent Dispute

The ongoing patent dispute between NVIDIA and Samsung over mobile SoC patents, in which NVIDIA fired the first shot, is not going to well for team-green. With Samsung counter-suing NVIDIA over infringing its own bouquet of patents, NVIDIA is staring at a possible sales ban. A United States International Trade Commission (US-ITC) judge held that NVIDIA is violating at least three Samsung patents.

This decision is due for review in a few months from now. If upheld, NVIDIA is staring at a sales-ban on all products violating the three Samsung patents. Luckily for NVIDIA, one of the three patents expires in 2016, and the sales-ban could last a few months, at best. NVIDIA predictably stated that it is disappointed in the decision. Samsung hasn't commented.

Samsung to Fab AMD "Zen" and "Arctic Islands" on its 14 nm FinFET Node

It has been confirmed that Samsung will be AMD's foundry partner for its next generation GPUs. It has been reported that AMD's upcoming "Arctic Islands" family of GPUs could be built on the 14 nanometer FinFET LPP (low-power Plus) process. AMD's rival NVIDIA, meanwhile, is building its next-gen "Pascal" GPU family on 16 nanometer FinFET node, likely at its traditional foundry partner TSMC.

It gets better - not only will Samsung manufacture AMD's next-gen GPUs, but also its upcoming "Zen" family of CPUs, at least a portion of it. AMD is looking to distribute manufacturing loads between two foundries, Samsung and GlobalFoundries, perhaps to ensure that foundry-level teething trouble doesn't throw its product launch cycle off the rails. One of the most talked about "Arctic Islands" GPUs is codenamed "Greenland," likely a successor to "Fiji." Sales of some of the first chips - GPUs or CPUs - made at Samsung, will begin some time in Q3 2016. Some of the other clients for Samsung's 14 nm FinFET node are Apple and Qualcomm. The company plans to speed up development of its more advanced 10 nm node to some time in 2017.

G.Skill Announces TridentZ and RipJaws4 DDR4-3200 MHz Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce new DDR4 specifications based on 16GB and 8GB modules, upgrading the speed from DDR4 3000MHz CL14 16GB (2x8GB) up to a blazing DDR4 3200MHz CL14 64GB (4x16GB) extreme speed memory kit, assembled with ultra-high performance Samsung ICs.

Seeing the future trend of DDR4 16GB module-based kits becoming the mainstream in the hardcore PC enthusiast communities, G.SKILL is now providing higher speed in ultra-high density memory solutions. The flagship DDR4 3200MHz CL14 64GB (4x16GB) memory kit provides enthusiasts with the perfect combination of higher capacity and faster frequency, with an incredible CL14-14-14-35 low CAS Latency. This memory kit represents the fastest DDR4 64GB memory kit by far.

Samsung Unveils SSD 750 Series with Special Corporate Warranty

Samsung launched the 750 EVO line of mainstream SSDs, designed for the OEM channel, particularly business desktops and notebooks. These 2.5-inch drives, featuring SATA 6 Gb/s interfaces, offer extended corporate warranty periods. Some models offer warranties as high as 6-year, others 5-year. The drives are available in two capacities, 120 GB and 250 GB, with variants based on warranty policy on offer. Under the hood, these drives offer a feature set similar to the 850 EVO series - up to 540 MB/s sequential reads, up to 520 MB/s sequential writes, 97,000 IOPS 4K random access for the 250 GB variant, and 94,000 IOPS random access for the 120 GB variant.

Samsung Mass-producing First 128GB DDR4 RDIMM for Servers

Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."
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