A Ryzen 9 9950X3D has reportedly died just an hour after being moved into an ASUS ROG Crosshair X670E Hero motherboard. According to Reddit user SpecialistConcept423, posting in r/GamersNexus, the chip had been running fine for about a year and a half in an ASRock X670E Taichi Carrara before the swap. After switching to the new board, no manual overclocking or voltage tweaks were applied; only one of the board's built-in memory presets was enabled for a set of SK hynix 6200 MHz modules. After saving that setting and rebooting, the board threw a "00" Q-Code and refused to post. Pulling the CPU and inspecting it revealed two brown marks on its contacts, which all but confirmed the catastrophic failure.

Things got stranger when the user resorted to an older Ryzen 5 8500G that had previously worked fine on the same board. That chip apparently now throws a "4D" code too, pointing at the motherboard itself as the culprit, not just the CPU. There's no confirmation yet on whether a faulty BIOS, a bad batch of boards, or something else is to blame, and ASUS hasn't commented on this specific case. It is worth noting that the ASUS board was not new, and it had undergone USB-related repairs and a BIOS rewrite. The user has since contacted AMD in Brazil for an RMA, but has shared no updates yet.

Another Ryzen 7 7800X3D has reportedly swollen and burned, while also damaging the ROG Crosshair X670E Hero motherboard in the process. UNIKO's Hardware flagged the case, citing a video posted to Bilibili as the original source. The video shows a Ryzen 7 7800X3D CPU with clear swelling on the underside where it made contact with the CPU socket. There is discoloration on both the CPU and the socket itself. Moreover, the socket pins are warped and damaged in the middle, presumably due to the pressure of the swelling. One peculiar finding is that one of the notches on the CPU socket looks slightly off. Perhaps more importantly, the board's BIOS version wasn't confirmed, which is directly relevant due to AMD's proposed fix.

This kind of failure first showed up in April 2023, when several 7800X3D and 7950X3D chips bulged and took their sockets with them on X670E boards. AMD pinned it on SoC voltage running too high and rolled out AGESA firmware that capped it at 1.30V across AM5 motherboards. This new case might be straightforward if the BIOS hadn't been updated at all. However, even after the BIOS fix, the reports never fully stopped. Just weeks ago, a 7800X3D reportedly burned out on an MSI PRO X870-P WIFI board running the latest BIOS, with EXPO enabled and nothing else touched. We have even seen reports of Ryzen 7 9800X3D CPUs burning in the exact same manner. If you're running a 7800X3D, it's probably worth checking that you're on the latest BIOS and keeping an eye on SoC voltage.

Motherboard vendors ASUS and MSI began releasing UEFI firmware updates to their AMD 600-series chipset motherboards that introduce support for AMD EXPO-ULL memory profiles. EXPO-ULL is an SPD extension that simplifies memory settings. While AMD Ryzen 7000 series and Ryzen 9000 series processors are relatively behind Intel in memory clock speeds, there is room for memory vendors to release memory kits with significantly tighter timings within their memory speed classes. An example of an EXPO-ULL profile would be DDR5-6000 with CL26, as opposed to the CL30-36 usually available for this speed.

ASUS began by releasing Beta BIOS 3803 version for its motherboards based on AMD X670E spanning the ROG Crosshair, ROG Strix, ProArt, and TUF Gaming product lines. These include EXPO-ULL support, and AGESA 1.3.0.1b. Meanwhile, MSI released a similar firmware update for its top MEG X670E GODLIIKE motherboard featuring EXPO-ULL support and AGESA 1.3.0.1b. More vendors are expected to catch on, as AMD hasn't restricted EXPO-ULL to any chipset generation.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, today announced that its AM5 motherboards fully support the newly launched AMD Ryzen 9 9950X3D2 Dual Edition Processor. The newly introduced AMD Ryzen 9 9950X3D2 Dual Edition processor offers more cache than ever, making it the ideal processor for creators and developers.

ASRock's AM5 motherboard is able to support the newly launched processors by simply downloading and installing the latest BIOS from the ASRock official website. In addition to downloading BIOS updates from the official site, users can also take advantage of BIOS Flashback and Instant Flash for quick and convenient upgrades. ASRock strongly recommends updating to the latest BIOS version to ensure optimal compatibility and performance.

AMD creates the top X670E and X870E chipsets by joining two AMD "Promontory 21" FCH chips at the hip. Each of these takes in a PCI-Express 4.0 x4 connection, and puts out 8 PCIe 4.0 lanes and four SATA 6 Gbps ports that can be re-configured as four additional Gen 3 lanes. The X870E/X670E chipset hence has a total of 12 PCIe 4.0 lanes and up to eight SATA 6 Gbps ports on the platform. A company decided to put one of these chips on an add-on card, so you could upgrade your single-FCH platform, such as B650, B850, or X870, with more PCIe lanes wired out as additional M.2 slots, and some SATA ports.

PC enthusiasts in China decided to install this card on an Intel motherboard to hilarious results—utilities such as AIDA64 are confused, thinking these Promontory 21 chips are the platform's main chipset. This gives the appearance of an Intel processor on an AMD chipset motherboard. The card has four M.2 slots, two on each side, and four SATA 6 Gbps ports. At least two of these are Gen 4 x4, while the others could be Gen 3 x4 and M.2-SATA, used when none of the SATA 6 Gbps ports is connected. There's no word on how to get one of these cards.

ASRock has finally acknowledged that the mysterious AMD Ryzen "processor deaths" plaguing its mid- and high-end motherboards weren't caused by defective AMD chips or stray debris but rather overly aggressive Precision Boost Overdrive settings in its BIOS. After more than 100 reports of Ryzen 7 9800X3D and Ryzen 9 9950X CPUs going dark on boards like the X670E Taichi and B650E Steel Legend, the company rolled out BIOS version 3.25 to dial back the Thermal Design Current and Electrical Design Current limits and apologized for initially blaming memory quirks and socket contaminants. ASRock will repair or replace affected motherboards free of charge (including shipping), though users whose CPUs have already failed must seek warranties through their retailer or AMD.

"No, we're not saying it's an AMD issue. We found that it should be related to our BIOS setting — that's the PBO settings, Precision Boost Overdrive. More technically, we adjusted two main settings in PBO. One is TDC (Thermal Design Current) and the other is EDC (Electrical Design Current). We found that our original values for these two settings might have been too high. So now, with BIOS version 3.25, we lowered the PBO values. We believe this can solve the problem."—Chris Lee, ASRock VP of Motherboard Business

Earlier this month, Bryan Bilowol—of Tech YES City fame—was taken aback by the unexpected "death" of his Ryzen 9 9950X processor, at the alleged hands of an ASRock X870 Steel Legend motherboard. Throughout early 2025, widespread news reports and community tracking efforts have largely implicated ASRock boards. AMD's highly popular Ryzen 7 9800X3D gaming CPU has "fallen victim" on numerous occasions, but a smaller number of incidents have affected non-3D V-Cache equipped Ryzen 9000 "Granite Ridge" models. The Taiwanese manufacturer and Team Red have investigated these problems, and have released fixes via BIOS updates. Despite these efforts, unhappy owners have experienced CPU failures in Q2'25. Following the uploading of initial findings and theories, Bilowol promised further reports. Fortunately, a sit-down—with ASRock's motherboard team—happened late last week, at Computex 2025. At the time of writing, the company has not published an official statement regarding their latest findings or fixes. Tech YES City shared a couple of compelling details in a May 26 YouTube upload (viewable below).

Commenting on the Ryzen 9000 CPU failure situation, Bilowol relayed important ASRock material: (the motherboard team) told me it had to do with the EDC and TDC, which is the electric design current as well as the thermal design current. Essentially, they're saying it's an ampage problem that exists with the precision boost overdrive (PBO) settings. In particular, these mid-range and high-end motherboards—say for instance a B650E or an X670E Taichi or even a B850 Steel Legend—have the ability to run Ryzen 9000 series CPUs at their maximum PBO settings out of the box. What's happening here is ASRock told me they were implementing these settings to what they believe was too aggressive for what the CPUs were able to handle, at least for earlier samples. However, they do promise me that these issues have been fixed with their latest BIOS updates that they're rolling out for these mid-range and high-end motherboards. They also told me that the lower-end boards, say for instance, an A620 HDV or something like that, shouldn't be affected by this issue simply because those PBO settings have been deliberately tuned down, due to the motherboard in question not being a high-end model." Three months back, ASRock's Japanese branch accused the PC hardware community of spreading "misinformation." Hopefully, the latest batch of fixes will bring an end to all Ryzen 9000 CPU + high-end/mid-range ASRock mainboard controversies.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Memory and SSD maker Crucial noticed an uptick in support requests by users claiming that their Gen 5 or Gen 4 NVMe SSDs would drop to PCIe Gen 1 speeds, besides being unable to boot into Windows after a restart. Crucial then did some digging, and localized the issue to users with motherboards based on the AMD X670E chipset, AMD's flagship Socket AM5 platform chipset. While not a function of the chipset itself, it turns out that there is a flaw in the way AMD designed the PCI-Express I/O of the X670E platform, specifically the PCIe Gen 5-capable M.2 NVMe interfaces that are attached to the CPU, causing them to drop in speeds to Gen 1. This problem isn't surfacing on the AMD B650 or the B650E, or even the X670—it is oddly specific to the X670E, despite the Gen 5 M.2 NVMe slots not being wired to the chipset.

While AMD made no public statement on the technical aspect of the flaw, if we were to guess, this could be a faulty implementation of PCIe ASPM (active state power management) at the firmware level, which reduces the speed of the PCIe link layer to reduce power. The default setting for PCIe ASPM in most motherboard UEFI setup programs tends to be "disabled," although there could be a bug in the firmware of X670E motherboards, causing it to engage, and in a buggy manner. Most UEFI BIOS setup programs tend to have two separate sets of PCIe ASPM settings—one for the CPU-attached PCIe root (which includes the x16 PEG and CPU-attached NVMe slots), and the other for downstream PCIe connectivity from the chipset.

According to new latest testing, the latest AGESA (AMD Generic Encapsulated Software Architecture) update, version 1.2.0.2, promises a significant boost in performance for AMD Ryzen 9000 "Zen 5" processors. This update is targeting one of the most crucial aspects of multi-core processing: inter-core latency. The AGESA 1.2.0.2 update addresses challenges initially reported in AMD's Zen 5 architecture, particularly in scenarios demanding rapid communication between multiple cores. Early reports suggest a remarkable reduction in inter-core latency by up to 58%. According to Overclock.net testing, older AGESA 1.2.0.1A showed the cross-CCD latency at around 180 ns. However, with the new AGESA 1.2.0.2 BIOS, the latency is seemingly around 75 ns.

Interestingly, the update has arrived on the ASUS ROG Crosshair X670E motherboard, with BIOS version 2401. BIOS updates with the latest AGESA 1.2.0.2 are still rolling out, so it will be interesting to see further testing and possible improvements. It could be that the cross-CCD latency has just been reported badly, so final testing will conclude the latency increase from Zen 4 to Zen 5 debate.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

MSI released a new AMD AGESA Combo PI-1.2.0.0 BIOS update today for all AMD X670E, X670, B650, and A620 motherboards. This update aims to enhance the overall user experience by addressing several key issues and new improvements. Users simply need to update the BIOS to the latest version to benefit from these enhancements.

Firstly, we have made a few enhancements to the upcoming AMD Ryzen 9000 series CPU, focusing on stability and performance bug fixes. These fixes are to ensure that users will have a smooth and reliable performance with the new CPUs. Additionally, the update includes several compatibility improvements and workaround with NVIDIA's RTX 40 Series graphics cards, especially the 4070 and 4060 GPUs, which were previously causing some instability issues.

EVGA designed an enthusiast segment AMD X670E chipset motherboard for the Socket AM5 platform, which never made it to the mass market. It had even planned to give the board its coveted Classified brand, and sell as the X670E Classified. Prototypes of this board fetched over $1,300 in auction. The board is built in the E-ATX form-factor like most of the EVGA Classified series motherboards; and packs a powerful CPU VRM, besides several overclocker-friendly features, such as top-oriented DDR5 memory slots, side-facing I/O (including power inputs), and in general, a decluttered layout that won't get in the way of extreme cooling solutions.

There were four such prototypes with Jiacheng Liu, a hardware enthusiast, each of which went under the hammer. The only trouble with these prototypes is that they're bare—they don't include heatsinks for the CPU VRM or the chipset, let alone heatsinks for the two M.2 Gen 5 NVMe slots that don't eat into the Gen 5 x16 PEG. Another problem with these boards is that they're not supported by EVGA, and only come with their initial BIOS that supports Ryzen 7000 "Zen 4" processors, but not the upcoming Ryzen 9000 "Zen 5." We doubt if these even support the Ryzen 7000X3D series, which is probably the main reason the boards didn't fetch way more than $1,300 a piece at the auctions. Enthusiasts might still figure out a way to BIOS-mod and encapsulate the latest AGESA.

A market research of AMD Socket AM5 motherboards sold in South Korea by Danawa, provide some interesting insights on how gamers approach the platform. This research is confined to Korea, but can be extrapolated to other similar markets. The research studies the chipset model, and form-factor of Socket AM5 motherboards sold in the market. The most interesting finding of the research is that the AMD B650 is by far the most popular chipset for the platform, dwarfing even the entry-level A620 chipset by a factor of 8. A staggering 80% of the Socket AM5 motherboards being sold are based on the B650.

It's important to note here, that this figure does not include the B650E, which is separately shown making up just 2% of the volumes. The B650 (non-E) has nearly all platform features, with motherboards based on the chipset providing at least one Gen 5 M.2 NVMe slot that doesn't eat into the lanes of the x16 PEG slot; and with the current generation of GPUs not featuring the PCIe Gen 5 host interface, customers seem more than happy with the Gen 4 x16 PEG slot provided by B650 motherboards. What's more, you get CPU overclocking and memory overclocking on this mid-range chipset, so it appeals to a very wide demographic. The B650E, on the other hand, provides a Gen 5 x16 PEG slot, and motherboards based on this chipset tend to offer premium I/O features, such as a high-end onboard audio solution, premium wireless networking, among others.

MSI is here to announce the latest AGESA ComboPI 1.1.7.0 Patch A BIOS update for AM5 next gen CPU support on X670E, X670, B650, A620 motherboards. Users would simply need to update the BIOS to the latest version accordingly. MSI will continue to update the latest news for our users. Please follow MSI's official channels and check the product pages for the latest BIOS updates to guarantee optimal experience, heightened performance, and enhanced stability.

For more about MSI AMD 600 series motherboards, please check here.

SafeDisk (AKA SoonHo Jeong) has tinkered with an AMD Ryzen 7 8700G APU and ASUS ROG Crosshair X670E GENE motherboard combination—earlier today, the professional overclocker set a validated/verified memory speed of DDR5-10600 world record on Team Red's AM5 platform. This has surpassed a previous result global-leading from late last week—DDR5-10346 was achieved with the same processor, but on a GIGABYTE B650E AORUS Tachyon board. SafeDisk has a distinct advantage in memory overclocking stakes, due to his workplace being the ASUS ROG labs in Taipei, Taiwan—his closest competitor, Benny Lodewijk Nitolo Lase (an Indonesian overclocker) now sits behind him in second place.

SafeDisk's test setup included the aforementioned APU plus motherboard combo, a Thermalright (not ASUS!) AIO, a twin pack of G.Skill Trident Z5 (F5-7800J3646H16G) DIMMs, and an ASUS GeForce GT 730 2 GB Silent graphics card. The ROG Crosshair X670E GENE's default set of VRM heatsinks were removed completely during test conditions. The two memory sticks were set at their default CL36 7800 MT/s speed at 1.45 V—SafeDisk's record breaking DDR5-10600 overclock was achieved with timings of 50-62-62-127-127. Wccftech noted that the: "overclock was able to boot directly into the OS and (SafeDisk) says that the whole OC procedure was very easy."

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, announces its 2024 preconfigured MG-1 gaming PCs, featuring the latest NVIDIA GeForce RTX 40-Series SUPER GPUs. Designed to redefine the gaming experience, these newly announced pre-configured systems, starting at $1,199, offer enhanced performance, diverse options, more memory, larger SSD capacities, and can be had with Windows 11 Pro.

"Refreshing the MG-1 Series to feature the latest gaming hardware and components represents our ongoing commitment to delivering cutting-edge gaming experiences. With the latest Intel & AMD processors, NVIDIA GPUs, including the new SUPERs, and a broader range of options in the MG-1, MAINGEAR continues to set the standard for gaming excellence." - Wallace Santos, CEO of MAINGEAR.

GIGABYTE has continued to push a white aesthetic (ICE) across a good number of displayed products on the show floor at this year's CES. The TPU crew got a close peek at a couple of new motherboard offerings—first up is the Taiwanese manufacturer's Z790 AORUS PRO X model with a white PCB and matching livery. The "X" designation denotes that this motherboard is good-to-go with Intel's latest 14th gen desktop CPU offerings. Their AORUS Z790 X Gen Motherboards boast "leading performance in DDR5 memory, the upgraded DIY-friendly innovations, and the all-new BIOS redesigned as user-centered, the AORUS Z790 X Gen Motherboards are built to fully unleash the next-gen power."

According to GIGABYTE's placard this white Z790 model features a 18+1+2 Twin Digital VRM design on an eight-layer PCB, VRM Thermal Armor Advanced with an 8 mm heatpipe, as well as Thermal Guard XL and Ext. for M.2 slot cooling purposes. EZ-Latch Click and M.2 EZ-Latch Plus are present, therefore creating a "seamless" DIY experience. Wi-Fi 7 connectivity (with an Ultra-high gain antenna) ensure that cutting-edge wireless standards are catered for.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces a new BIOS update for its AMD AM5-based motherboards, specifically tailored to ensure flawless compatibility with the newly released AMD Ryzen 8000 series processors, designed to optimize system performance and reliability, allowing users to fully harness the advanced capabilities of AMD's latest Ryzen processors. Consisting of Ryzen 7 8700G, Ryzen 5 8600G, Ryzen 5 8500G, and the Ryzen 3 8300G, AMD's latest processors bring unrivaled performance at affordable price points. These cutting-edge APUs, grounded in the robust Zen 4 architecture, seamlessly blend high performance with versatility.

Moreover, these processors are equipped with an RDNA 3 GPU, offering superior graphics performance for gaming and content creation. Additionally, Ryzen 7 8700G and Ryzen 5 8600G feature an innovative XDNA Neural Processing Unit (NPU), a significant advancement that directly boosts artificial intelligence processing capabilities at the hardware level. This integration positions these APUs as a formidable choice for users seeking a blend of performance, AI-enhanced capabilities, and affordability.

The AMD Ryzen 8000 and 5000 series desktop processors have been released, broadening system build options. Notably, they are respectively compatible with MSI AM5 and AM4 motherboards, offering enthusiasts expanded possibilities for powerful and customizable setups. The latest AMD Ryzen 8000 series desktop lineup includes the powerful Ryzen 7 8700G, Ryzen 5 8600G, and Ryzen 5 8500G processors. These processors come equipped with built-in AMD Radeon graphics solution, ensuring an exceptional gaming experience for all gamers. Compatible with MSI AM5 platform, including X670E, X670, B650, and A620 series motherboards.

MSI is diligently working to release the official BIOS version for gamers. The first wave of supported beta BIOS is already available on the MSI official website. More choices for system builds on the AM4 platform as AMD introduces the Ryzen 7 5700X3D, Ryzen 7 5700, Ryzen 5 5600GT, and Ryzen 5 5500GT processors, extending the portfolio for system builds. The MSI AM4 motherboards are fully compatible with the latest AMD Ryzen 5000 series processors. With the current AGESA ComboAm4v2PI 1.2.0.B official BIOS, users can seamlessly upgrade their processors hassle-free.

AMD's upcoming Ryzen 5 8600G Socket AM5 desktop APU will feature the truncated Radeon 760M integrated graphics, and not the previously believed Radeon 780M, or the full iGPU configuration present on the silicon. At this point, there are still conflicting reports on which exact silicon the Ryzen 8000G desktop APUs are even based on, with some of the older reports and Geekbench detecting 8600G engineering samples to be based on "Phoenix," and some of the newer reports suggesting that it's based on "Hawk Point." Both "Phoenix" and "Hawk Point" are nearly identical, except for the latter to feature a faster NPU.

The Ryzen 5 8600G is configured with a 6-core/12-thread CPU based on the "Zen 4" microarchitecture, with 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The CPU base frequency is set to a healthy 4.35 GHz, and maximum CPU boost frequency of 5.00 GHz. These CPU clocks are very similar to those of the mobile Ryzen 5 7640H (which has a base frequency of 4.30 GHz, but the same 5.00 GHz boost), but in case of the 8600G, the 65 W TDP and possible 90 W PPT should help with boost frequency residency. The Radeon 760M gets 8 out of 12 RDNA3 compute units physically present on the silicon, giving it 512 stream processors. Geekbench detects an engine clock (GPU clock) of 2.80 GHz, compared to the 2.60 GHz of the Radeon 760M on the Ryzen 5 7640H. The 8600G ES was running on an MSI MEG X670E Ace motherboard, with 32 GB of dual-channel DDR5-6000 memory.

Yesterday Gigabyte revealed a pair of AMD B650 motherboards in white/silver and today the company has added an entirely new X670E model using the same colour scheme. X670E AORUS Pro X doesn't have an equivalent black SKU and it's the first Pro model using the AMD X670 chipset, although the overall PCB appears to be based on the X670 AORUS Elite AX, with some interesting additions. The obvious changes include a PCIe 5.0 x16 slot, courtesy of the X670E AORUS Pro X using the E version of the chipset and this also means dual PCIe 5.0 NVMe M.2 slots, as well as a pair of PCIe 4.0 ones.

For some reason, Gigabyte also changed the 2.5 Gbps Ethernet chip from Realtek to Intel, but the specific model isn't mentioned. WiFi will apparently be via a Qualcomm QCNCM865 module, or an MTK/AMD MT7927/RZ738 module, both options supporting 320 MHz wide WiFi 7 channels and Bluetooth 5.3. Gigabyte has also thrown in three extra fan headers, as well as headers for external temperature sensors. However, the one really peculiar feature that has been added to the X670E AORUS Pro X is an internal HDMI port. The internal port appears to be limited to 1080p30 and it's intended for use with a smaller display mounted in windowed cases for diagnostics data and we believe this was a feature ASRock was first with if memory serves. Gigabyte calls this feature Sensor panel Link, but it's unclear if Gigabyte will offer suitable displays or not. There's no word on pricing or an availability date.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announced the ultimate memory performance of DDR5 XMP 8000 is achieved with the X670E AORUS MASTER motherboard based on the latest AMD AGESA BIOS code at a SOC voltage of 1.3 V.

GIGABYTE always works closely with AMD to ensure our motherboard designs provide supreme performance and reliability, particularly on the optimum memory performance by exclusively advanced memory layout design. Meanwhile, GIGABYTE is releasing a new beta BIOS for the X670 and B650 AORUS/AERO series motherboards for the most remarkable memory performance on the AM5 platform. The new BIOS will be available at the end of July in succession. Please pay close attention to the GIGABYTE website to download the update for optimal performance.