TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology. This milestone is a strong testimonial to deep collaboration between the two companies and TSMC's commitment to providing industry-leading technology to meet the increasing customer demand for the next generation of high-performance, energy-efficient devices.

TSMC's 16FinFET process promises impressive speed and power improvements as well as leakage reduction. All of these advantages overcome challenges that have become critical barriers to further scaling of advanced SoC technology. It has twice the gate density of TSMC's 28HPM process, and operates more than 40% faster at the same total power, or reduces total power over 60% at the same speed.

Toshiba Corporation and SanDisk Corporation today celebrated the opening of the second phase of the No. 5 semiconductor fabrication facility (Fab 5) and the start of construction of the new No. 2 fabrication facility (Fab 2) at Yokkaichi Operations, Toshiba's NAND Flash memory plant in Mie prefecture, Japan.

Toshiba started construction of the second phase of Fab 5 in August 2013, and Toshiba and SanDisk have overseen installation of production equipment in the expanded facility since July this year. Production in phase 2 began at the start of this month, with 15 nm NAND flash memory process technology, the world's smallest and most advanced node. Toshiba and SanDisk announced deployment of this jointly developed 15 nm NAND flash process in April this year, with initial production in part of Fab 5 phase 1, and now target conversion of the remaining capacity in phase 1 to the new process technology.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the introduction of its next generation DDR4 NVDIMMs. Offering non-volatile memory functionality while utilizing the latest DDR4 DRAM technology, this memory solution is designed to improve application performance and data integrity in server environments.

Unique to these new DDR4-2133 NVDIMMs is SMART's proprietary SafeStor technology, the engine which initiates backup and restore operations upon command from the host controller. The NVDIMM modules also support multiple command delivery options to trigger SafeStor backup during a host-detected power outage and recovery events. The SafeStor engine employs multi-channel fast NAND and high-speed switching circuitry to provide robust backup and restore capability, all while functioning as a JEDEC standard DDR4 RDIMM during normal operation. Temporary power is provided to the NVDIMM during a power loss by a hybrid supercap module, which can be tailored to individual application environments. The new NVDIMMs also feature an end-to-end error checking and correction capability to ensure a high level of data integrity during backup and restore operations.

AMD today announced that Verizon is deploying SeaMicro SM15000 servers for its new global cloud platform and cloud-based object storage service, whose public beta was recently announced. AMD's SeaMicro SM15000 server links hundreds of cores together in a single system using a fraction of the power and space of traditional servers. To enable Verizon's next generation solution, technology has been taken one step further: Verizon and AMD co-developed additional hardware and software technology on the SM15000 server that provides unprecedented performance and best-in-class reliability backed by enterprise-level service level agreements (SLAs). The combination of these technologies co-developed by AMD and Verizon ushers in a new era of enterprise-class cloud services by enabling a higher level of control over security and performance SLAs. With this technology underpinning the new Verizon Cloud Compute and Verizon Cloud Storage, enterprise customers can for the first time confidently deploy mission-critical systems in the public cloud.

Seagate Technology plc, a world leader in storage solutions, today announced that it will be demonstrating its next generation heat assisted magnetic recording (HAMR) technology at CEATEC 2013. Pushing the boundaries of magnetic recording, Seagate's revolutionary HAMR technology is poised to power an astounding 20 Terabyte drive by as early as 2020.

"The world is generating an astronomical amount of data annually and that data needs to be stored. We are approaching the limits of today's recording technology and with HAMR technology, Seagate is on track to continue to increase areal density delivering hard drives with the lowest cost per gigabyte and reaching capacities of 20TB by 2020," said Mark Re, Seagate's chief technology officer.

Acer announces the support for the latest Intel Xeon E5-2600 v2 series processor across its line of high performance Altos servers and Veriton Workstations starting September 2013. With up to 50% more cores per processor, lower thermal design power (TDP), and improved clock speeds, the new line of Intel Xeon E5-2600 v2 processors offers extraordinary performance for companies and researchers alike. "Our professional line up of Altos servers is a cornerstone of our renewed focus on the commercial marketplace," stated Evis Lin, AVP of Commercial Products and Solutions Management at Acer. "Now with complete support of Intel's high-performance Xeon E5-2600 v2 CPUs, the Altos line is positioned perfectly to capitalize on channel and data center markets."

Acer's Altos line of professional server products offers robust functionality, best-in-class time to market, and scalable performance to meet a wide range of customer demands. Not only performance minded, the Altos servers can be configured based on customer demands with form factors that emphasize density and power savings, as well as other form factors to meet data-intense demands. Acer also offers its own management software, Acer Smart Server Manager, free of charge, enabling customers to simultaneously manage and rollout updates across multiple systems.

Altera Corporation and Micron Technology, Inc. today announced they have jointly demonstrated successful interoperability between Altera Stratix V FPGAs and Micron's Hybrid Memory Cube (HMC). This technology achievement enables system designers to evaluate today the benefits of HMC with FPGAs and SoCs for next-generation communications and high-performance computing designs. The demonstration provides an early proof point that production support of HMC will be delivered with Altera's Generation 10 portfolio, in alignment with market timing, and includes both Stratix 10 and Arria 10 FPGAs and SoCs.

HMC has been recognized by industry leaders and influencers as the long-awaited answer to address the limitations imposed by conventional memory technology, and provides ultra-high system performance with significantly lower power-per-bit. HMC delivers up to 15 times the bandwidth of a DDR3 module and uses 70 percent less energy and 90 percent less space than existing technologies. HMC's abstracted memory allows designers to devote more time leveraging HMC's revolutionary features and performance and less time navigating the multitude of memory parameters required to implement basic functions. It also manages error correction, resiliency, refresh, and other parameters exacerbated by memory process variation. Micron expects to begin sampling HMC later this year with volume production ramping in 2014.

Plextor, leading developer and manufacturer of high-performance digital storage devices, is slated to give a sneak preview of their new M6 SSD at the Flash Memory Summit and Exhibition August 13-15 to be held at the Santa Clara Convention Center in Santa Clara, CA.

The M6 features the next generation of Plextor's proprietary TrueSpeed technology working in tandem with the Marvell 88SS9187 controller for enhanced performance and reliability. The new drive will also feature the latest generation of A19 Toggle NAND flash from Toshiba and an ultra-slim 5 mm casing. Additional product specifications and a formal release date are expected to be announced in the coming months.

AMD's next generation GPU family that leverages upcoming silicon fab technologies to increase transistor counts, while maintaining or lowering thermal envelopes, is codenamed "Volcanic Islands," and we've known about that for some time now.

The centerpiece of "Volcanic Islands" family is "Hawaii," a high-end GPU that makes up top single- and dual-GPU SKUs; followed by "Maui" and "Tonga." Not much is known about these two. A dual-GPU product with two "Hawaii" chips is confusingly codenamed "New Zealand," which is already used to designate certain Radeon HD 7990 graphics cards. AMD is expected to debut its first "Volcanic Islands" GPUs in Q4-2013, when foundry partner TSMC's swanky new 20 nm node is expected to take flight.

As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Accidents happen, especially when you try to avoid them. But rest assured that ASRock's latest ATX sized OC Formula Series motherboards, including Z87 OC Formula/ac (with 802.11ac WiFi support) and Z87 OC Formula are protected by a special layer of Conformal Coating. As you've probably already heard, Conformal Coating protects the motherboards from conductive liquids, dust, corrosion and extreme temperatures*. And if you still feel skeptical about the lifespan of your overclocking oriented motherboards, fear not! ASRock guarantees 5 year warranty!

ASRock's Z87 OC Formula/ac and Z87 OC Formula are designed by the world famous overclocker Nick Shih. These two motherboards possess both hardware and software features for extreme overclocking, and they are also fully loaded with a set of lifestyle based features named A-Style. ASRock provides the five year warranty package as long as the malfunctions and defects occur under normal use conditions and aren't caused by misuse or abnormal operations**. If unfortunately the motherboard cannot be repaired, ASRock will replace the product with equivalent or next generation products.

At an industry event in Taipei today, Hermann Eul, general manager of Intel's Mobile and Communications Group, unveiled new details about the company's forthcoming Intel Atom processor-based SoC for tablets ("Bay Trail-T") due in market for holiday this year. Based on the new Silvermont microarchitecture, the next generation 22nm Intel technology for tablets and ultra-mobile devices will enable sleek designs with 8 or more hours of battery life2 and weeks of standby, as well as support Android* and Windows 8.1*.

Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia. "The mobile category is undergoing a tremendous amount of innovation and constant change," said Eul. "As we look at growing it, we continue to invest in and accelerate our efforts across all aspects of mobility with a focus on smartphones, tablets and wireless communications. Intel's unique assets will enable more compelling and differentiated products and experiences, while at the same time helping to shape and lead markets in the future."

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures. Production of the next generation 40nm eFlash MCUs will take place at different GLOBALFOUNDRIES sites, initially in Singapore with subsequent transfer to its site in Dresden, Germany.

"Next generation embedded Flash microcontrollers with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets," says Arunjai Mittal, Member of the Management Board of Infineon Technologies. "We trust in GLOBALFOUNDRIES with their excellent manufacturing background and sites on different continents to fulfill Infineon's stringent quality, infrastructure security and business continuity requirements."

Samsung Electronics America, Inc. today announced it will expand the ATIV brand to include all of its Windows based PCs. ATIV, previously the brand for the company's Windows based convertible PC devices, now unites all of Samsung's Windows devices under one cohesive brand, representing the convergence of PC and mobile technologies. The new product names under the ATIV brand will provide customers an easy way to understand the product segments across Samsung's PC portfolio. Samsung ATIV will also offer users a consistent and seamless computing experience across Samsung's diverse PC line.

"Samsung has been the fastest growing PC brand for the past three years1, in part because of our commitment to developing solutions that meet and exceed the ever-evolving needs of our customers," said Mike Abary, senior vice president of consumer IT product marketing at Samsung Electronics America. "Our expanded ATIV brand and the introduction of solutions like SideSync create the necessary synergy between our mobile and PC lines to create real ease of use for consumers. These synergies enable us to maintain our momentum and continue to offer our customers innovations that enhance the way they live and work."

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Havok, a leading provider of interactive 3D game technology, today announced the launch of a major new version of its industry-leading Havok Physics technology. The release is the culmination of more than 5 years of internal R&D effort. It features significant technical innovations in performance, memory utilization, usability and simulation quality, and represents a major leap forward in physics simulation for games.

Designed from the ground up for the computing architectures that will define games for the next decade, this release targets next-generation home consoles, mobile and PC while continuing to offer full support for current generation consoles.

LucidLogix (Lucid) today announced the next generation of its GPU Virtualization software, Virtu MVP 2.0, is now available for direct sale to all gamers, videophiles and PC enthusiasts who own Intel Sandy Bridge and Ivy Bridge motherboards, with an NVIDIA or AMD discrete graphic card, by download on the Lucid online shop.

"Virtu MVP allows our customers to get the maximum multimedia experience from their dual core system, while preserving energy consumption," said Offir Remez, president of Lucid. "With MVP 2.0, games simply look better and respond quickly, video encoding is faster and multi-screen computing is more manageable."

Patriot, a global pioneer in high-performance memory, NAND flash, storage, and mobile accessories today announces the next generation in its ecosystem of wireless storage solutions, the AERO wireless mobile hard drive.

Load up, go mobile, and share. With the ever expanding tablet and smartphone landscape, the AERO is the definitive mobile storage solution that allows you to take your full media collection on the go and stream to any tablet, smartphone, or laptop. The Patriot AERO truly lets you share content to your mobile devices like never before, even if you don't have access to the internet or cloud storage.

IPv6 may no longer be a protocol without a product line thanks to a growing number of manufacturers designing and tweaking their products to support the next generation Internet standard. As one of the most competitive providers of networking solutions, TP-LINK is carrying through with its plan to improve its routers to ensure compliance with IPv6. TP-LINK is ready with a family of new and established networking products that comply with IPv6 by default or through firmware upgrades.

With the increasing number of new devices being connected to the Internet, the number of available IP addresses using the original IPv4 standard has been depleted. In fact, all IPv4 addresses have been assigned and there are no new addresses left. The exhaustion of IPv4 addresses makes support for IPv6 essential to satisfy the growth of IP address users and also important for the next generation of Internet.

According to a new market research report, "Global Micro Servers Market (2013 - 2018), By Processor Type (Intel, Arm, Amd), Component (Hardware, Software, Operating System), Application (Media Storage, Data Centers, Analytics, Cloud Computing) & Geography (North America, Europe, Asia Pacific, Row)", published by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018.

In a simpler terminology, micro servers can be termed as servers that multiple mobile processor chips, consume low power, use less space and are specifically used by small to medium - sized businesses. Micro servers find their major application in media storage and internet data centre especially for applications like lightweight web serving, simple content delivery nodes and low end dedicated hosting. It was identified that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in the next five years it is expected to reach 25 to 30% per cent of the global server market.

Mushkin Inc., An industry-leading designer and manufacturer of high-performance and mission-critical computer products, unveils its latest and most exciting range of products ever at the world's largest consumer electronics show, CES 2013.

Mushkin will host meetings at their 1,800 square foot suite, where they will showcase their entire lineup of next generation products. On-site pr esentations will be held to introduce the new and coming product lines. Mushkin representatives from the product, sales, and global teams will be on hand to answer any questions regarding these new and upcoming products for the digital home, office, and beyond.

Intel's next-generation SSD 530 series, which sees a single product line covering 2.5-inch and compact form-factors, arrives in the second quarter of 2013. The new series is being designed to offer high-performance even at smaller card form-factors, which is particularly important for the ultra-thin/Ultrabook ecosystem. The drive has been pictured in the newer NGFF (next generation form-factor), which is designed to be even smaller than mSATA.

While mSATA drives typically measure 51 x 30 mm, NGFF measures 42 x 22 mm. NGFF is a single interface featuring pins for both SATA and PCI-Express x2 or x4, and cards designed around its specification can either be SATA SSDs, or other bandwidth-heavy devices (such as 802.11ac WLAN controllers). Cards can even be designed to have an SATA SSD subunit on one side, and a PCI-Express device on the other, saving swathes of PCB real-estate in the process. The form-factor even supports double-sided SSDs such as this one from Lite-On, which features an independent SSD subunit on each side, which is striped in RAID 0. The NGFF Intel SSD 530 family will be introduced in Q2-2013, in two capacities - 80 GB and 180 GB.

Adapted from technology that GE researchers originally developed for commercial jet engines, GE (NYSE: GE) has announced a major technology breakthrough, called DCJ, which adapts this technology for the cooling of consumer electronics. DCJ will support the next generation of thinner, quieter and more powerful tablets, laptops and other electronic devices.

GE's DCJ (Dual Piezoelectric Cooling Jets), behave as a micro-fluidic bellows that provide high-velocity jets of air to cool electronic components. The turbulent air flow of the DCJ increases the heat transfer rate to more than ten times that of natural convection.

Leading mainboard and graphics card maker MSI and the world's best system benchmarking software developer Futuremark have partnered up to jointly announce the newest version of the 3D benchmarking program 3DMark. The new version of this 3D benchmarking utility supports Windows, Windows RT, Android and iOS platforms, and has an all new user interface that will provide enthusiasts with a rich and novel user experience.

The 3DMark series has long been acclaimed among gamers for its original visual design and wide range of special effects. 3DMark 11 in particular has been the No.1 choice for testing graphics card performance since it was released in 2010, and remains the benchmarking utility of choice for enthusiasts today. Due to the previous successful cooperation on 3DMark 11, MSI has partnered with Futuremark again to release the next generation of the world renowned 3DMark benchmarking utility.