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AMD RV770

Default
RV770
Die Shot
Die Shot
Block Diagram
Block Diagram
AMD's RV770 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 256 mm² and a transistor count of 956 million it is a medium-sized chip. RV770 supports DirectX 10.1 (Feature Level 10_1). For GPU compute applications, OpenCL version 1.1 can be used. It features 800 shading units, 40 texture mapping units and 16 ROPs.
Further reading: R700 Series Instruction Set Architecture

Graphics Processor

Released
Jun 16th, 2008
GPU Name
RV770
Codename
Wekiva
Mobile Variant
M98
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
956 million
Density
3.7M / mm²
Die Size
256 mm²
Package
HFCBGA-1492

Graphics Features

DirectX
10.1 (10_1)
OpenGL
3.3
OpenCL
1.1
Vulkan
N/A
Shader Model
4.1
WDDM
1.1
Compute
GFX3
DCE
3.1
UVD
2.0

Render Config

Shading Units
800
TMUs
40
ROPs
16
Compute Units
10
Z-Stencil
64
L1 Cache
16 KB per CU
L2 Cache
256 KB
Max. TDP
160 W

All TeraScale GPUs

AMD GPU Architecture History

Graphics cards using the AMD RV770 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD FireStream 9250
RV770 PRO 1024 MB 800 40 16 625 MHz 993 MHz
AMD FireStream 9270
RV770 XT 2 GB 800 40 16 750 MHz 900 MHz

RV770 GPU Notes

Mobile Variant: M98
Codename: Wekiva
Graphics/Compute: GFX3
Display Core Engine: 3.1
Unified Video Decoder: 2.0
May 20th, 2024 21:35 EDT change timezone

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