Tuesday, May 29th 2018

Western Digital Reinforces Commitment to 96-layer, BiCS4 3D NAND

Even as researchers expect 3D NAND flash to achieve the 140-layer level by 2021, technology and manufacturers still have to take all the intermediate steps before we're actually there. In that sense, Western Digital has just announced that they're well on their way in producing 96-layer 3D NAND and distributing it to customers. For now, the memory will be used for inexpensive storage solutions, but the idea is to eventually ramp um production for other, higher-performance products.

Western Digital CEO Steve Milligan kept the production ramp-up (and the expectation of BiCS4 production eventually surpassing BiCS3) under wraps, but it seems all is going well with the production. He added that "(...) if you look to where we at from a yield curve perspective, because [BICS4] is not too mature, we are very pleased with where we are. Because once you get to a certain point, you can project where you are going to end at (based on cycles of learning, etc)." As announced by Western Digital before, it's likely this initial production run is delivering 256 Gb capacity chips, with improvements in yields to allow for increased capacity down the road, eventually, up to 1 Tb capacity per chip.
Sources: Western Digital Investor Call, via AnandTech
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3 Comments on Western Digital Reinforces Commitment to 96-layer, BiCS4 3D NAND

cucker tarlson
wd black 2018 and sanddisk extreme pro are already kickin ass on 64-layers bics. looks like samsung has finally got a true contender in the "premium mid-range" segment.
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We're already at $150/TB SSDs, the dream of $100/TB (10¢/GB) is coming soon. After that, in a few years, SSDs will be cheaper than HDDs. Now if they'd do the same with RAM prices, we could afford to build a PC.
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More layers>more capacity>lower prices>:)
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