JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power, high-bandwidth memory for AI CPU servers and accelerated computing platforms. JESD328 will define a compact, serviceable LPDDR5X-based module, Small Outline CAMM2 (SOCAMM2).

JESD328 SOCAMM2 is set to introduce an optimized, compact form factor for servers with a mechanical outline designed for high-density data center chassis and board layouts, with scalability to provide a path to support the large module capacities required by AI training and inference servers.To support the high-performance demands of these data center applications, the standard is forecast to support the full LPDDR5X data rate, including configurations up to 9.6 Gb/s per pin where platform signal integrity allows. The use of low power LPDDR5/5X memory devices reduces system energy and cooling requirements, a key feature in efficient large data processing.

As planned, SOCAMM2 will introduce a Serial Presence Detect (SPD) configuration device supporting module-level identification and telemetry, with qualification flows designed to meet stringent field-reliability targets required in enterprise deployments.

"JEDEC members are actively shaping the standards that will define next generation modules for use in AI data centers, driving the future of innovation in infrastructure and performance," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-45 Committee for DRAM Modules.