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AMD Tonga

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Tonga
Block Diagram
Block Diagram
AMD's Tonga GPU uses the GCN 3.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 366 mm² and a transistor count of 5,000 million it is a large chip. Tonga supports DirectX 12.0 (Feature Level 12_0). It features 2048 shading units, 128 texture mapping units and 32 ROPs.
Further reading: GCN 3.0 Instruction Set Architecture

Graphics Processor

GPU Name
Tonga
Architecture
GCN 3.0
Foundry
TSMC
Process Size
28 nm
Transistors
5,000 million
Density
13.7M / mm²
Die Size
366 mm²
Released
Aug 12th, 2014

Graphics Features

DirectX
12.0 (12_0)
OpenGL
4.6
OpenCL
2.0
Vulkan
1.1.101
Shader Model
6.0
Compute
GFX8
ROCm
Yes

Render Config

Shading Units
2048
TMUs
128
ROPs
32
Compute Units
32
Z-Stencil
128
ACEs
8
SEs
4
L1 Cache
16 KB per CU
L2 Cache
768 KB
Max. TDP
265 W

All GCN 3.0 GPUs

Graphics cards using the AMD Tonga GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD Radeon R9 285 Tonga PRO 2 GB 1792 112 32 918 MHz 1375 MHz
AMD FirePro W7100 Tonga PRO GL 8 GB 1792 112 32 920 MHz 1250 MHz
AMD FirePro S7150 Tonga PRO GL 8 GB 1792 112 32 1050 MHz 1250 MHz
AMD FirePro S7150 x2 Tonga PRO GL 8 GB 1792 112 32 1050 MHz 1250 MHz
AMD Radeon R9 285X Tonga XT 3 GB 2048 128 32 1002 MHz 1375 MHz

Tonga GPU Notes

Architecture Codename: Volcanic Islands
CLRX Version: GCN 1.2
Graphics/Compute: GFX8 (gfx802)
Display Core Engine: 10.0
Unified Video Decoder: 5.0
Video Compression Engine: 3.0