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Qualcomm FastConnect 6900/6700 Bring 6 GHz Wi-Fi 6E & Bluetooth 5.2 To New Mobile Devices

Qualcomm Technologies Inc, launches a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon our leading Wi-Fi 6 and Bluetooth audio technology features, the Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 mobile connectivity systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, VR-class low latency and Bluetooth advancements delivering immersive audio experiences for classic and emerging LE Audio use cases.

"With the introduction of the FastConnect 6900 and 6700 solutions, Qualcomm Technologies is redefining the mobile experience by extending the power of Wi-Fi 6 into the 6 GHz band and advancing wireless audio with cutting-edge integrated Bluetooth 5.2 features," said Dino Bekis, vice president and general manager, mobile and compute connectivity, Qualcomm Technologies, Inc. "These innovations enable us to further break away from the pack and deliver a connectivity portfolio optimized to accelerate global adoption across multiple smartphone tiers."

Intel Rocket Lake CPU Appears with 6 Cores and 12 Threads

We have been hearing a lot about Intel's Rocket Lake lineup of processors. They are supposed to be a backport of Willow Cove 10 nm core, adapted to work on a 14 nm process for better yielding. Meant to launch sometime around late 2020 or the beginning of 2021, Rocket Lake is designed to work on the now existing LGA1200 socket motherboards, which were launched just a few days ago along with Intel Comet Lake CPUs. Rocket Lake is there to supply the desktop segment and satisfy user demand, in light of lacking 10 nm offers for desktop users. The 10 nm node is going to present only on mobile/laptop and server solutions before it comes to the desktop.

In the latest report on 3D Mark, the hardware leaker TUM APISAK has found a Rocket Lake CPU running the benchmark and we get to see first specifications of the Rocket Lake-S platform. The benchmark ran on 6 core model with 12 threads, that had a base clock of 3,5 GHz. The CPU managed to boost up to 4,09 GHz, however, we are sure that these are not final clocks and the actual product should have even higher frequencies. Paired with Gen12 Xe graphics, the Rocket Lake platform could offer a very nice alternative to AMD offerings if the backport of Willow Cove goes well. Even though it is still using a 14 nm node, performance would be good. The only things that would be sacrificed (from backporting) are die space and efficiency/heat.
Intel Rocket Lake Benchmark Report

SMIC Begins Mass-Production of 14nm FinFET SoCs for Huawei HiSilicon

Semiconductor Manufacturing International Corporation (SMIC), the state-backed Mainland Chinese semiconductor foundry, announced that it commenced mass-production of 14 nm FinFET SoCs for Huawei's HiSilicon subsidiary, a mere one month since Huawei shifting chip orders from TSMC to it. The company is manufacturing Kirin 710A is a revision of the original Kirin 710 SoC from 2018, built on SMIC's 14 nm node. The 4G-era SoC is capable of powering mid-range smartphones for Huawei's Honor brand, and uses an Arm big.LITTLE setup of Cortex A53 and Cortex A57 cores. This represents a major milestone not just for SMIC, but also Huawei, which has seen the company's isolation from cutting-edge overseas fabs such as TSMC. Much of Huawei's fate is riding on the success of SMIC's next-generation N+1 node, which purportedly offers a 57 percent energy-efficiency gain over 14 nm FinFET, rivaling sub-10 nm nodes such as 7 nm; enabling Huawei to build 5G-era SoCs.

Gigabyte Says Intel Z490 Chipset Motherboards Will Support 11th Gen "Rocket Lake-S"

Maybe it's hard to fathom an Intel chipset that actually supports more than a single generation of CPU designs; and if so, you're forgiven, because it seems the blue giant has mostly forgotten of thinking about platform longevity and upgradeability. However, we might be in for a rare treat, if the words from a Gigabyte representative are to be taken seriously. In a Q&A regarding Gigabyte's latest generation Z490 motherboards, a user questioned the Gigabyte representatives whether their Z490-based platforms would support upcoming Rocket Lake designs. The answer, which came with a caveat of "I don't know if this should be made public", was that yes: Z490 will support Rocket Lake-S.

If true, this may shed some light on why motherboard manufacturers have given so much importance to PCIe 4.0 marketing on their Z490 motherboards... Whose chipset doesn't support PCIe 4.0 from the get-go. However, with next-generation Rocket Lake-S expectedly sporting the same 14 nm fabrication process albeit with a new microarchitecture, a wider DMI 3.0 8x band, Intel's high-performance Xe graphics architecture design and PCIe 4.0 support on a platform level, it does begin to make sense that manufacturers would mention PCIe 4.0 support on the current Z490. Because if CPU compatibility is maintained, that means that users looking to drop-in a Rocket Lake-S CPU will at the very least be able to enjoy 20 lanes of PCIe 4.0 in these ready-made motherboards.

Intel 10th Generation Comet Lake Desktop Processors and 400-Series Chipsets Announced, Here's what's New

Intel today launched its 10th generation Core desktop processor family and its companion Intel 400-series chipsets. Based on the 14 nm++ silicon fabrication process and built in the new LGA1200 package, the processors are based on the "Comet Lake" microarchitecture. The core design of "Comet Lake" and its IPC are identical to those of "Skylake," however Intel brought significant enhancements to the processor's clock-speed boosting algorithm, increased core- or thread counts across the board, and introduced new features that could interest enthusiasts and overclockers. The uncore component remains largely unchanged from the previous-generation, with support for DDR4 memory and PCI-Express gen 3.0. Use of these processors requires a new socket LGA1200 motherboard, they won't work on older LGA1151 motherboards. You can install any LGA115x-compatible cooler on LGA1200, provided it meets the thermal requirements of the processor you're using.

At the heart of the 10th generation Core processor family is a new 10-core monolithic processor die, which retains the same basic structure as the previous-generation 8-core "Coffee Lake Refresh" die, and 4-core "Skylake." The cores are arranged in two rows, sandwiched by the processor's uncore and iGPU blocks. A ring-bus interconnect binds the various components. The cache hierarchy is unchanged from previous generations as well, with 32 KB each of L1I and L1D caches; 256 KB of dedicated L2 cache per core, and 20 MB of shared L3 cache. The iGPU is the same Gen 9.5 based UHD 630 graphics. As we mentioned earlier, much of Intel's innovation for the 10th generation is with the processor's microcode (boosting algorithms).
Intel Core i9-10900K 10th Gen Intel Core Desktop Comet Lake Lineup 10th Gen Intel Core Desktop Comet Lake Lineup 10th Gen Intel Core Desktop Comet Lake Lineup

AMD Updates Ryzen 3 1200 CPU with Zen+ Architecture

AMD has reportedly updated its Ryzen 3 1200 CPU with Zen+ architecture and is now offering it to consumers. Featuring a configuration of 4 cores with 4 threads, this CPU can operate anywhere from 3.1 GHz (base) to 3.4 GHz in boost frequency. Having originally launched in July of 2017, just under three years ago, AMD decided to refresh this CPU with Zen+ architecture, which brought improvements like a tiny IPC increase, better turbo boost speeds, faster caches and better memory controller for better support of faster DDR4 modules.

The new "Zen+" revision has the same specifications as the older model, however, the only difference is the newer 12 nm manufacturing process and some of the architecture changes of Zen+. The rest of the specifications like clock speeds are the same. The CPU is listed by a German supplier for €54.73 or about $60. This revision carries a different part number, under the code "YD1200BBM4KAFBOX", where the older 14 nm model was "YD1200BBM4KAEBOX".
AMD Ryzen 3 1200 12nm Zen+ Edition

Huawei Moves 14 nm Silicon Orders from TSMC to SMIC

Huawei's subsidiary, HiSilicon, which designs the processors used in Huawei's smartphones and telecommunications equipment, has reportedly moved its silicon orders from Taiwan Semiconductor Manufacturing Company (TSMC) to Semiconductor Manufacturing International Corporation (SMIC), according to DigiTimes. Why Huawei decided to do is move all of the 14 nm orders from Taiwanese foundry to China's largest silicon manufacturing fab, is to give itself peace of mind if the plan of the US Government goes through to stop TSMC from supplying Huawei. At least for the mid-tier chips built using 14 nm node, Huawei would gain some peace as a Chinese fab is a safer choice given the current political situation.

When it comes to the high-end SoCs built on 7 nm, and 5 nm in the future, it is is still uncertain how will Huawei behave in this situation, meaning that if US cuts off TSMC's supply to Huawei, they will be forced to use SMIC's 7 nm-class N+1 node instead of anything from TSMC. Another option would be Samsung, but it is a question will Huawei put itself in risk to be dependant on another foreign company. The lack of 14 nm orders from Huawei will not be reflecting much on TSMC, because whenever someone decides to cut orders, another company takes up the manufacturing capactiy. For example, when Huawei cut its 5 nm orders, Apple absorbed by ordering more capacity. When Huawei also cut 7 nm orders, AMD and other big customers decided to order more, making the situation feel like there is a real fight for TSMC's capacity.
Silicon Wafer

Intel Comet Lake Pricing Leaked

Listings for Intel's Comet Lake-S desktop processors have been found on DirectDial a Canadian PC retailer. Comet Lake-S is the next generation of chips using Intel's 14 nm process and will feature up to 10 cores and 20 threads. The leaked prices reveals a significant fall in per core pricing from Coffee Lake chips however Ryzen 3000 will continue to dominate in pricing if this leak is correct, especially considering the lack of including cooling with the new Intel chips. Below are the leaked prices with direct conversions to USD.
  • Core i9-10900 (10 cores / 20 threads, 2.8 GHz to 5.2 GHz): $679 CAD = $486 USD
  • Core i7-10700K (8 cores / 16 threads, 3.8 GHz to 5.1 GHz): $585 CAD = $419 USD
  • Core i7-10700 (8 cores / 16 threads, 2.9 GHz to 4.8 GHz): $506 CAD = $362 USD

Intel Planning 14nm "Ozark Lake" 16-core Processor for Spring 2021

TechPowerUp has learned that Intel is planning to bring 16 cores onto the mainstream desktop platform by Spring 2021 by implementing a similar chip-design philosophy as AMD: MCMs. The new "Ozark Lake" processor will pack up to 16 cores and 32 threads by decoupling the "core" and "uncore" components of a typical Intel mainstream processor.

Intel will leverage the additional fiberglass substrate floor-space yielded from the new LGA1700 package to create a multi-chip module that has two [kinds of] dies, the "core complex" and the "uncore complex." The core complex is a 14 nm die purely composed of CPU cores and an EMIB interconnect. There will be as many as 16 "Skylake" cores in a conventional ringbus layout, and conventional cache hierarchy (256 KB L2$ and up to 2 MB/core L3$). The lack of uncore components and exclusive clock and voltage domains will allow the CPU cores to attain Thermal Velocity Boost Pro speeds of up to 6.00 GHz, if not more.

Intel Core i9-10980HK Detailed: 8-core Mobile Monstrosity that Boosts up to 5.30 GHz

In no mood to cede mobile performance leadership to AMD and its Ryzen 9 4900HS processor, Intel is readying its new flagship mobile part, the Core i9-10980HK. Based on the 14 nm "Comet Lake-H" silicon, this chip packs an 8-core/16-thread CPU with a maximum boost speed (aka "Thermal Velocity Boost") of 5.30 GHz, while maintaining an aggressive power target of 45 W TDP. This should put the chip's performance somewhere between the desktop Core i7-9700K and the Core i9-9900K, both of which have TDP rated at 95 W, although the chip could perform very close to the latter at gaming, thanks to its 300 MHz higher boost frequency. Intel is expected to launch the 10th generation Core i9 H-series processors on April 2nd, around the same time when NVIDIA launches its mobile GeForce RTX 20 Super series.

Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10 nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers," said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."
Samsung EUV DDR4

Intel Rocket Lake-S Platform Detailed, Features PCIe 4.0 and Xe Graphics

Intel's upcoming Rocket Lake-S desktop platform is expected to arrive sometime later this year, however, we didn't have any concrete details on what will it bring. Thanks to the exclusive information obtained by VideoCardz'es sources at Intel, there are some more details regarding the RKL-S platform. To start, the RKL-S platform is based on a 500-series chipset. This is an iteration of the upcoming 400-series chipset, and it features many platform improvements. The 500-series chipset based motherboards will supposedly have an LGA 1200 socket, which is an improvement in pin count compared to LGA 1151 socket found on 300 series chipset.

The main improvement is the CPU core itself, which is supposedly a 14 nm adaptation of Tiger Lake-U based on Willow Cove core. This design is representing a backport of IP to an older manufacturing node, which results in bigger die space due to larger node used. When it comes to the platform improvements, it will support the long-awaited PCIe 4.0 connection already present on competing platforms from AMD. It will enable much faster SSD speeds as there are already PCIe 4.0 NVMe devices that run at 7 GB/s speeds. With RKL-S, there will be 20 PCIe 4.0 lanes present, where four would go to the NVMe SSD and 16 would go to the PCIe slots from GPUs. Another interesting feature of the RKL-S is the addition of Xe graphics found on the CPU die, meant as iGPU. Supposedly based on Gen12 graphics, it will bring support for HDMI 2.0b and DisplayPort 1.4a connectors.
Intel Rocket Lake-S Platform

AMD Radeon RX 590 GME is a Dressed Up RX 580: No more 12nm, Lower Performance

When AMD pushed out the Radeon RX 590 in late-2018, its key spec was that the "Polaris 20" die had been ported to GlobalFoundries 12LPP (12 nm) silicon fabrication node, yielding headroom to dial up clock speeds over the 14 nm RX 580. The underlying silicon was labeled "Polaris 30" as it was the second major version of the "Polaris 10" die. NVIDIA's GeForce GTX 16-series beat the RX 590 both in performance and price, with even the GTX 1650 Super performing on-par, and the GTX 1660 beating it. It turns out that AMD has a lot of unsold 14 nm "Polaris 20" inventory to go around, and it wants to release them out as the new RX 590 GME.

An Expreview review of an XFX-branded RX 590 GME confirms that the the chip is indeed based on the "Polaris 20 XTR" silicon which is built on the 14 nm process. The card has GPU clock speeds that appear similar to reference clock speeds of the RX 590, with 1460 MHz base compared to 1469 MHz of the original RX 590. But this is where the similarities end. In its testing, Expreview found that the RX 590 GME is on average 5% slower than the RX 590, and performs halfway between the RX 580 and the original RX 590, which are differentiated by a roughly 10% performance gap. The 5% performance deficit would put the RX 590 GME on par with the new RX 5500 XT 4 GB, and trading blows with the GTX 1650 Super. Thankfully, the RX 590 GME is priced lower than RX 590 cards (about 7.7% cheaper), and could be very region-specific. The fact that the RX 590 GME is being sold with full AIB partner branding and retail packaging, shows that this isn't an OEM-only product. Read the complete review in the source link below.
RX 590 GME Front View RX 590 GME PCB RX 590 GME Polaris 20 GPU RX 590 GME GPU-Z RX 590 GME Performance

Intel Restarts 14 nm Operations in Costa Rica, Aims to Increase Capacity for Xeon Output

Intel has decided to restart operations in its previously winded-down Costa Rica facilities. An Intel Product Change Notification (PCN) for their Cascade Lake Xeon Scalable processors shows that the company has added Costa Rica to its three other "Test and Finish" sites - the other three are located in Penang (Malaysia), Kulim (Malaysia) and Vietnam. Intel's aim is to guarantee a "continuous supply" of the affected processors - namely, Cascade Lake second-generation Xeon Scalable processors in the Silver, Gold and Platinum lines (in both boxed and tray SKUs).

This move, which will be done in phases. The first implementation of the Costa Rica operations will be effective on April 19th, with the remaining operations to come online on August 3rd. Intel expects to reduce dependency on their other three Test and Finish sites, while being able to bolster final production capacity by some 25% with this move.

NVIDIA GeForce MX350 and MX330 Surface, Pascal Based Entry mGPUs

NVIDIA's GeForce MX-series mobile GPU line exists so notebook manufacturers can put the NVIDIA logo on their products and boast of gaming capabilities. The company is giving finishing touches to its new GeForce MX330 and MX350 chips, based on the "Pascal" architecture. The MX330 is the company's second rebrand of the MX150 that's based on the 14 nm "GP108" silicon. It's equipped with 384 CUDA cores, and up to 2 GB of GDDR5 memory across a 64-bit wide memory interface. NVIDIA increased the clock speeds to 1531 MHz base, and 1594 MHz GPU Boost (compared to 1227/1468 MHz of the MX150), while remaining in the 25 W TDP envelope.

The MX350, on the other hand, is based on the 14 nm "GP107" silicon, is equipped with 640 CUDA cores, and 2 GB of GDDR5 memory across the same 64-bit bus width as the MX330; but has aggressive power-management that lends it a TDP of just 20 W, despite 66% more CUDA cores than the MX330. Both chips are easily capable of handling non-gaming tasks on typical 1080p / 1440p notebooks; but can game only at 720p thru 1080p, with low-to-mid settings.

Intel Rumored to be Courting GlobalFoundries for Some CPU Manufacturing

With its own silicon fabrication facilities pushed to their capacity limits, Intel is looking for third-party semiconductor foundries to share some of its supply load, and according to a WCCFTech report, its latest partner could be GlobalFoundries, which has a 14 nm-class fab in Upstate New York. If it goes through, the possible Intel-GloFo deal could see contract manufacturing commence within 2020.

GloFo's fab offers 14 nm FinFET and 12LPP, a refinement that's marketed as 12 nm. According to the report, Intel could use GloFo for manufacturing CPU dies, specifically its entry-level chips such as Core i3, Pentium, and Celeron. Intel is also known to shed its own manufacturing workload by contracting foundries for 14 nm core-logic (chipsets). In a bid to maximize 14 nm fab allocation for its CPUs, Intel also started making some of its 300-series chipsets on the older 22 nm process, which goes to show the company's appetite for 14 nm.

Intel 400-series Chipset Motherboards to Lack PCIe Gen 4.0, Launch Pushed to Q2

Intel's upcoming 400-series desktop chipset will lack support for PCI-Express gen 4.0. The motherboards will stick to gen 3.0 for both the main x16 PEG slots wired to the LGA1200 socket, and general purpose PCIe lanes from the PCH, according to a Tom's Hardware report. It was earlier expected that 400-series chipset motherboards will come with preparation for PCIe gen 4.0, so even if the upcoming 10th gen "Comet Lake" desktop processors lacked gen 4.0 root-complexes, the boards would be fully ready for the new bus standard in 11th gen "Rocket Lake" desktop processors.

10th gen "Comet Lake" desktop processors are built on 14 nm process, and implement Intel's current-gen CPU core design Intel has been implementing since 6th gen "Skylake." It's only with 11th gen "Rocket Lake" that the mainstream desktop platform could see a new CPU core design, with the company reportedly back-porting "Willow Cove" CPU cores to the 14 nm process. "Rocket Lake" is also expected to feature a small Gen12 iGPU with 32 execution units, and a new-gen uncore component that implements PCIe gen 4.0. PCIe gen 4.0 doubles bandwidth over gen 3.0, and while only a handful GPUs support it, the standard is made popular by a new generation of M.2 NVMe SSDs that are able to utilize the added bandwidth to push sequential transfer rates beyond M.2 PCIe 3.0 x4 limitations.

NVIDIA to Reuse Pascal for Mobility-geared MX300 Series

NVIDIA will apparently still be using Pascal when they launch their next generation of low-power discrete graphics solutions for mobile systems. The MX300 series will replace the current crop of MX200 series (segregated in three products in the form of the MX230, MX250 10 W and MX250 25 W). The new MX300 keeps the dual-tiered system, but ups the ante on the top of the line MX350. Even though it's still Pascal, on a 14 nm process, the MX350 should see an increase in CUDA cores to 640 (by using NVIDIA's Pascal GP107 chip) from the MX250's 384. Performance, then, should be comparable to the NVIDIA GTX 1050.

The MX330, on the other hand, will keep specifications of the MX250, which signals a tier increase from the 256 execution units in the MX230 to 384. This should translate to appreciable performance increases for the new MX300 series, despite staying on NVIDIA's Pascal architecture. The new lineup is expected to be announced on February.

AMD Rolls Out Athlon 3000 Gold and Silver "Zen" 15W Mobile SoCs

The "Zen 2" based Ryzen 4000-series mobile processors and Threadripper 3990X HEDT chip dominated headlines throughout AMD's CES 2020 event, but an important product announcement slipped past us: the mobile Athlon 3000 Gold and 3000 Silver families of entry-level mobile SoCs. These are 15-Watt SoCs targeting low-cost ultraportables, convertibles, and straight up Windows x64 tablets, competing against Intel's Pentium Gold 5000U "Whiskey Lake" and Pentium Silver "Gemini Lake Refresh" series. The family currently only consists of two SKUs, the Athlon Gold 3150U and Athlon Silver 3050U.

The two chips are based on the "Dali" silicon, and feature "Zen" CPU cores. The Athlon Gold 3150U features a 2-core/4-thread "Zen" CPU clocked at 2.40 GHz with 3.30 GHz boost. The Athlon Silver 3050U, on the other hand, is configured with a 2-core/2-thread CPU clocked at 2.30 GHz with 3.20 GHz boost. The CPUs on both models is configured with 4 MB of L3 cache, which takes their "total cache" (L2 + L3) figure up to 5 MB. The iGPU on the 3150U is a Radeon Vega 3 with 192 stream processors, clocked at 1.00 GHz. The one on the 3050U, is AMD's smallest, with just 2 compute units, working up to 128 stream processors, but the engine clock is set at 1.10 GHz.

Intel's Comet Lake Absence at CES Reportedly Related to Power Consumption Wall

Reports are flooding the web regarding Intel's total lack of reference to their upcoming Comet Lake family of CPUs, which will be branded under the Intel Core 10000 series. As reports would have it, motherboard makers had stock of LGA 1200 motherboards ready to showcase at CES, but were told to pull them in what is equivalent to a logistical "last minute". It seems that both Intel's lack of commitment to Comet Lake on its CES presentation and absence of ecosystem showcase at this year's CES might have something to do with, well, close to shame on Intel's parts.

Comet Lake will increase the maximum core count for their desktop CPUs up to 10 cores and 20 logical threads. But being built on the same 14 nm process as previous Intel generations since Skylake, there isn't much that can be done to offset increased power consumption. This is why industry sources are claiming Intel decided to skip Comet Lake at this CES - a difficulty to rein in the processors' power consumption in time for the event, with power consumption hitting 300 W. And with Intel's Core i9 10900K being configured with a PL2 (Power Level 2) of 250 W, a maximum 300 W under full load seems more than plausible.

Core i9-10900K up to 30% Faster than i9-9900K: Intel

Intel's upcoming Core i9-10900K desktop processor is up to 30 percent faster than the Core i9-9900K according to the company, which put out a performance guidance slide that got leaked to the web. Based on the 14 nm "Comet Lake-S" silicon and built for the new LGA1200 platform (Intel 400-series chipset motherboards); the i9-10900K is a 10-core/20-thread processor that leverages increased TDP headroom of 125 W to sustain higher clock-speeds than 9th generation "Coffee Lake Refresh," while also offering a 25% increase in processing muscle over the i9-9900K, thanks to the two additional CPU cores.

In its performance guidance slide, Intel shows the i9-10900K scoring 30% more than the i9-9900K in SPECint_rate_base2006_IC16.0. There's also a 25% boost in floating-point performance, in SPECfp_rate_base2006_IC16.0, which roughly aligns with the additional core count, as both these tests are multi-threaded. Other noteworthy results include a 26% gain in Cinebench R15, and 10% in SYSMark 2014 SE. In tests that don't scale with cores, Intel appears to rely entirely on the increased clock-speeds and improved boosting algorithm to eke out performance gains in the low-to-mid single-digit percentages. Intel is introducing a new clock-speed boosting technology called Thermal Velocity Boost, which can dial up clock-speeds of the i9-10900K up to 5.30 GHz.

Intel 10th Gen Core "Comet Lake" Lineup and Specs Revealed

Ahead of a possible reveal in the sidelines of CES, followed by an early-Q2 2020 product-launch, company slides detailing Intel's 10th generation Core desktop processors in the LGA1200 package, codenamed "Comet Lake-S," leaked to the web courtesy Informatica Cero. They confirm that HyperThreading will play a key role, with Intel enabling it across the lineup. The range-topping Core i9 series will be 10-core/20-thread along with 20 MB of L3 cache. The Core i7 series will be 8-core/16-thread, along with 16 MB L3 cache. The all-important Core i5 series will be 6-core/12-thread, equipped with 12 MB of L3 cache. The Core i3 series will have two sub-tiers: i3-103xx series with 4-core/8-thread and 8 MB L3 cache; and i3-101xx series 4-core/8-thread with 6 MB L3 cache.

The Core i7 and Core i9 "Comet Lake" chips will feature native support for dual-channel DDR4-2933, while the Core i5 and Core i3 will make do with native DDR4-2667 support (memory overclocking possible). Besides core/thread counts, and cache size increases, Intel will dial up clock speeds across the board by as much as 300 MHz per SKU (vs. their 9th gen predecessor), and introduce Turbo Boost Max 3.0, which has been exclusive to its HEDT processors. The introduction of Turbo Boost Max 3.0 could also bring about modern favored-core capability (benefiting Windows 10 1909 and later). The classic Turbo Boost is also available. There's also a mysterious new feature called "Thermal Velocity Boost," with its own set of clock-speeds depending on core/thread load. The chips could also feature Modern Standby C10 power-state support (first to the desktop platform). Intel is said to have also added several new core and memory overclocking features on the K-SKUs.

Intel Enthusiast-Grade K Processors in the Comet Lake-S Family Rumored to Feature 125 W TDP

This piece of news shouldn't surprise anyone, except for the fact that Intel is apparently signing on a TDP of 125 W for even its K-series unlocked processors for their next-generation Comet Lake-S family. Intel's current Comet Lake 9900K CPU features a TDP of "only" 95 W - when compared to the rumored 125 W of the 10900K), whilst their current top offering, the i9-9900KS, features a 127 W TDP. Remember that Intel's 10900K should feature 10 cores and 20 threads, two extra cores than their current 9900K - this should explain the increased TDP, a mathematical necessity given that Intel can only count on marginal improvements to its 14 nm fabrication process to frequencies and power consumption of its CPUs.

A leaked slide from momomo on Twitter shows, if real, that Intel's future enthusiast-grade CPUs (likely i5-10600K, i7-10700K and i9-10900K) will feature this 125 W TDP, while other launches in that family will make do with the more traditional 65 W TDP (interesting to see that Intel has some 10-core CPUs with 65 W TDP, the same as their current 9900, despite two more cores). A footnote on the leaked slide shows that these K processors can be configured for a 95 W TDP, but this would likely come at a significant cost to operating frequency. Intel seems to be bringing a knife to a gunfight (in terms of core counts and TDP) with AMD's Ryzen 3000 and perhaps Ryzen 4000 CPUs, should those and Intel's future offerings actually coexist in the market.

Samsung Starts Production of AI Chips for Baidu

Baidu, a leading Chinese-language Internet search provider, and Samsung Electronics, a world leader in advanced semiconductor technology, today announced that Baidu's first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year. Baidu KUNLUN chip is built on the company's advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung's 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model. Leveraging the chip's limit-pushing computing power and power efficiency, Baidu can effectively support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

Intel CPU Based on New Architecture Leaks

Today Intel's CPU based on yet unannounced architecture got revealed in the SiSoft benchmark database. Featuring six cores and twelve threads running at 3 GHz, it appears like a regular 14 nm CPU that's already available, however, when digging through the details, many things are revealed. The newly submitted CPU has a different L2 cache configuration from previous CPU offerings, with this chip featuring 1.25 MB of L2 cache per core, it is unlike anything else Intel currently offers. Ice Lake mobile chips feature 512 KB, while the highest amount of L2 cache is currently present on i9-10980XE, which features 1 MB of L2.

It is unknown where this CPU fits in the whole 14/10 nm lineup, as we don't know if this is an iteration of 10 nm Tiger Lake or the rumored 14 nm Rocket Lake CPU. All we know is that this CPU features new architecture compared to Skylake iterations that are currently being used, judging by L2 cache bump, which usually happens on new architectures. The platform used for benchmarking this CPU was SuperMicro X12DAi-N SMC X12 dual-socket motherboard, which featured two of these new CPUs for a total of 12 cores and 24 threads.
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