Alphacool International GmbH, based in Braunschweig, Germany, is a pioneer in the field of PC water-cooling technology. With one of the most comprehensive product portfolios in the industry and more than 20 years of experience, Alphacool is expanding its CPU cooling lineup with new high-performance Apex 1 CPU Cooler AM5 White.

The Alphacool Apex 1 CPU Cooler AM5 White brings a fresh look to high-performance liquid cooling. Featuring the same proven technology as its black counterpart, the new white edition combines powerful cooling performance with an elegant design, making it the ideal choice for enthusiasts looking to build a stylish, high-performance AMD AM5 system with a light-colored aesthetic.

AMD's Zen 6 just got one of its first rough per-clock comparisons against Zen 5, and the early numbers look good. Leaker HXL spotted a Geekbench 7.1.0 listing for the 256-core EPYC 9996, the flagship "Venice" chip AMD launched in July, scoring 2,847 points in single-core on a Dell PowerEdge R9815 server running Linux. User three twenty six on X then locked a Ryzen 7 9700X to 4.1 GHz, matching the EPYC 9996's maximum boost, and got 2,444 points on the same Geekbench version. That works out to roughly 16.5% higher single-core performance for Zen 6 at the same frequency. Apparently, Zen 6 came out ahead in all 15 single-core subtests, with gains ranging from 8.2% in File Compression to 25.7% in HTML5 Browser.

Of course, these scores only give us a general idea about the gains. The EPYC 9996 uses the dense Zen 6c cores, not the full Zen 6 cores expected in desktop Ryzen chips, so it's hard to say how closely these numbers will carry over. The two systems are also wildly different, with a server platform on one side and a 9700X running DDR5-6000 CL34 under CachyOS Linux on the other, and the EPYC listing has since been pulled from the Geekbench database. Still, a double-digit per-clock gain from the dense core variant is quite encouraging. AMD has already confirmed that "Olympic Ridge" desktop CPUs will stay on AM5, though they reportedly won't arrive until 2027, so we can expect more comprehensive performance leaks well before then.

MSI has launched the MPG COREFROZR AP15, its first air cooler with an integrated display built into the top cover. The cooler uses a dual-tower design with asymmetric tower widths, six 6 mm copper heat pipes, and a copper base. The DIGI-DISPLAY top cover module connects via magnetic POGO-PIN contacts and MSI's EZ Conn single-cable connection, showing real-time CPU, GPU, and memory temperatures, loads, and frequencies without additional software. In terms of dimensions, MSI says that the heatsink measures 168 x 126.5 x 128 mm and has 102 fins. The two included 120 mm ARGB fans operate at different speeds. The front fan runs at 2000 RPM with 66.41 CFM and 1.98 mmH2O static pressure at 31.1 dB(A), while the mid fan is quieter at 1600 RPM, 54.14 CFM, 1.30 mmH2O, and 25.06 dB(A). Both are PWM controlled.

MSI MPG COREFROZR AP15 cooler is compatible with Intel LGA1700 and LGA1851, and AMD AM4 and AM5 platforms. According to MSI, the cooler was designed with AMD Ryzen X3D processors in mind, so even without any official information regarding its thermal capabilities, it should handle pretty much all CPUs well. In China, it's priced at 549 yuan, around $82, however international pricing and availability have not been confirmed yet.

Japanese tech publication MyNavi Tech+ interviewed Travis Kirsch, the client-segment product manager for AMD, and there are some interesting excerpts from the conversation. It turns out that reviving Ryzen 7 5800X3D for the Socket AM4 market earlier this year, was an initiative going as far up as CEO Lisa Su. The effort required certain manufacturing process updates with TSMC to ensure they can build new 5800X3D chips that are identical in specs to the original ones, without having to revive deprecated manufacturing processes.

AMD says that 5800X3D AM4 Anniversary Edition was released as a parting gift to the loyal Socket AM4 crowd that's holding on to DDR4 memory in the wake of brutal overpricing of DDR5. It was planned to help users better plan their transition to AM5 and DDR5 memory. The 5800X3D offers contemporary levels of performance with games, and its re-launch triggered a new wave of product launches from motherboard vendors.

A Reddit user in the r/watercooling subreddit bought an AMD Ryzen 9 9950X3D2 Dual Edition from Amazon and noticed that something was off. This was his second 9950X3D2 chip, and both chips were sold and shipped by Amazon and arrived in sealed retail boxes, with identical markings on the heat spreader. Flip them over, however, and the newer one looks nothing like the first. It has a large empty area in the middle packed with tiny capacitors, while a genuine AM5 Ryzen chip has gold contact pads covering nearly its entire underside. The user initially assumed AMD had quietly revised the design. Commenters thought otherwise, and the top reply suggests that someone delidded a real 9950X3D2, attached its heat spreader to an old Intel processor, and sent the fake back to Amazon for a refund. That chip has now ended up in our Redditor's hands.

In this case, the layout is a big giveaway, since Intel desktop chips place many of their capacitors on the underside of the substrate, whereas AMD keeps them on top to leave room for contacts. The lettering on the fake also looks smudged, possibly from the delid or a reprint. It's still unclear which Intel CPU sits underneath, and there's no word from Amazon so far on the matter. That's a costly mistake too, considering the 9950X3D2 launched at $899. Amazon has been here before, apparently, with reports of a fake Ryzen 7 9800X3D that turned out to be a 2011-era FX-4100 with a sticker on top. Buyers are advised to record unboxings of expensive parts and, in the case of CPUs, closely inspect both sides of the chip.

Colorful has just released its latest overclocking motherboard, the X870E Ultra-S V14, a new E-ATX unit with 16+2+1 power phases, five M.2 slots, and plenty of high-speed I/O. The new motherboard, as shared by IT Home, is priced at 1,899 CNY, which comes out to around $284 at the time of writing, although it only seems to be available in China for the time being. The iGame X870E Ultra-S V14 is explicitly marketed to overclockers on AMD's AM5 platform, bearing XMP/EXPO memory overclocking and asynchronous BCLK CPU overclocking, a digital debug display, EZ Debug diagnosis, and easily accessible rear I/O buttons for both clear CMOS and BIOS updates.

The motherboard also features Wi-Fi 7 and 5 GbE networking built-in, alongside expansive rear I/O that includes: 4× USB Type-A 5 Gbps, 3× USB Type-A 10 Gbps, 2× USB Type-A 2.0, 2× USB4 40 Gbps, and both 3.5 mm line in/out ports and SPDIF out for audio. Colorful claims that its 16+2+1 VRMs are capable of 80 A, and the VRMs are covered by beefy aluminium heat sinks. It also has five M.2 slots for expanded storage, each with its own heat sink. The Colorful iGame X870E Ultra-S V14 is available on JD.com at the time of writing.

MONTECH, a global leader in PC cases, power supplies, and cooling solutions, proudly announces the global launch of CyberFlow Series, the company's most advanced all in one liquid cooling family to date. Created for builders who expect thermal strength, precision engineering, and a fully resolved design, CyberFlow brings one common performance architecture to two distinct visual identities.

CyberFlow ARGB translates the cooling platform into a bold, cyberpunk inspired centerpiece with immersive ARGB lighting. CyberFlow CORE takes a more restrained direction, pairing the same performance foundation with classic styling for clean, timeless systems. Together, the series gives enthusiasts a meaningful choice in expression without asking them to compromise on the cooling platform beneath it.

An engineering sample of AMD's never-released Ryzen 9 5900X3D has surfaced on the Chinese forum Chiphell, and it looks quite different from the prototype AMD has shown before. The 12-core, 24-thread Zen 3 chip carries the code 100-000000652 and reports 128 MB of L3 cache, split as 96 MB on one CCD and 32 MB on the other. That means only one of its two six-core chiplets has the 64 MB 3D V-Cache stack. The Ryzen 9 5900X3D and 5950X3D prototypes that AMD showed to Gamers Nexus in 2023 had cache stacked on both CCDs, for 192 MB in total. The single-stack layout apparently lets the chip clock higher. CPU-Z screenshots from the owner show it running at around 4.7 GHz with a 105 W TDP, while the dual-stack 5900X3D topped out at a 4.4 GHz boost.

Getting it to boot took some effort, though. The sample reportedly refuses to work on current BIOS versions and only started with an older one carrying SMU firmware 56.70.0. The owner has apparently asked ASRock to add support in a newer BIOS. At retail, the Zen 3 X3D lineup started with the eight-core Ryzen 7 5800X3D in 2022 and never included a dual-CCD chip. Interestingly, the one-CCD approach seen here is the same one AMD later used for its Ryzen 9 X3D chips on AM5, before the Ryzen 9 9950X3D2 Dual Edition put cache on both chiplets this year. AMD hasn't confirmed anything about this sample, of course, but it's interesting to see from an archival standpoint.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors, power supply units, and AIO liquid coolers, today announced that the DeskSlim X600 and DeskSlim B760 compact desktop platforms support NVIDIA RTX PRO 4000 Blackwell SFF Edition and NVIDIA RTX PRO 2000 Blackwell professional graphics cards.

Designed for professional users who require desktop-class expandability in a space-saving form factor, the DeskSlim series features a PCIe 5.0 x16 expansion slot that supports a low-profile, dual-slot graphics card up to 200 mm in length. In a compact 5L chassis, the systems can be configured for AI-assisted workflows, content creation, 3D visualization, engineering applications, and data analysis.

Thermal Grizzly has launched the Mycro Pro Stainless Steel CPU water blocks, which list support for Intel's upcoming LGA1954 socket. The AMD version covers AM4 and AM5, while the Intel version covers LGA1700, LGA1851, and LGA1954. Thermal Grizzly sells both at $116.88, and European listings show €99.90. LGA1954 is the socket for Intel's upcoming Nova Lake-S desktop CPUs, which Intel seems to have confirmed through an internal validation tool listing, and recent leaks point to a Q1 2027 launch. Cooler makers have been signaling compatibility for a while, with Thermaltake's leaked installation guide and Noctua's FAQ update both saying LGA1851 coolers should carry over. Since the socket is expected to keep the same mounting as LGA1851, this block looks like it follows suit.

As for the block itself, the main change from the existing Mycro Pro RGB line is the materials. These blocks use an unplated copper coldplate with 0.2 mm microfins (68 on AMD, 70 on Intel), a stainless steel housing, and an anodized aluminium mounting frame. Thermal Grizzly dropped the nickel plating, which it says can give a slight thermal edge and lowers production costs. The tradeoff is that the bare copper will probably discolor over time, and there is no RGB. Neither block is meant for direct-die use, and the Intel inlet is tuned for LGA1851 chips with the stock heat spreader. However, the key point remains that Intel's new LGA1954 socket is now appearing in official product listings.

Maxsun has launched three new B850 microATX motherboards for the AM5 platform supporting AMD Ryzen series processors: MS-B850M I-CAFE, B850M-P WIFI and B850M-B WIFI. The Maxsun MS-B850M I-CAFE measures 245 x 210 mm and features two DDR5 DIMM slots supporting up to 128 GB at DDR5-8000 OC. It has one PCIe 5.0 x16 and one PCIe 4.0 x4 slot, two M.2 slots (PCIe 5.0 and PCIe 4.0), two SATA ports, 2.5 GbE, and HDMI 1.4 for integrated graphics. The board has no Wi-Fi but includes four USB 5 Gbps and two USB 2.0 Type-A ports at the rear. The two Challenger models share most of their specs. Both have PCIe 5.0 x16 and PCIe 4.0 x4 expansion slots, two M.2 slots, two SATA ports, Wi-Fi 6 and Bluetooth 5.2 via MediaTek MT7902, 2.5 GbE, a USB-C 20 Gbps front header, and four USB 5 Gbps plus four USB 2.0 on the rear. The main difference is memory support and size: the B850M-P WIFI is the larger motherboard at 245 x 245 mm and supports four DIMM slots for up to 256 GB of DDR5. The B850M-B WIFI is more compact at 245 x 215 mm with two slots supporting 128 GB. Both motherboards feature HDMI 2.0 and dual DisplayPort 4K at 60 Hz for integrated graphics output.

All three motherboards use a Realtek ALC897 audio codec. Pricing and availability for the full lineup have not been officially announced, though the MS-Challenger B850M-P WIFI has appeared listed on the Chinese market at CNY 799 (around $119) at the time of writing.

Today, AMD quietly launched new CPUs for both the AM4 and AM5 platforms in a surprising twist. Starting with the Ryzen 5 7500, it joins the Ryzen 7000 lineup as a slightly different take on the Ryzen 5 7500F. Meanwhile, the Ryzen 5 5500F introduces another Zen 3 chip to the increasingly hard-to-retire Ryzen 5000 family. Focusing on the newer platform, the Ryzen 5 7500 is a 6-core, 12-thread "Zen 4" processor running at 3.7 GHz by default and reaching up to 5.0 GHz under boost. Its 65 W TDP and 38 MB of combined cache, split between 6 MB of L2 and 32 MB of L3, remain unchanged from the 7500F. The key distinction is the integrated GPU; AMD has equipped the chip with a small RDNA 2 graphics unit containing two Compute Units clocked at up to 2.2 GHz.

However, AMD is apparently not ready to let the Ryzen 5000 series disappear just yet. The new Ryzen 5 5500F adds another 6-core, 12-thread "Zen 3" processor to the AM4 platform, but it is not simply a rebranded Ryzen 5 5500. The 5500F is based on AMD's "Vermeer" silicon, whereas the standard Ryzen 5 5500 uses the "Cezanne" design. Curiously, AMD has paired the "Vermeer"-based chip with just 16 MB of L3 cache, which is half the amount found on 6-core Vermeer parts such as the Ryzen 5 5600. Clock speeds range from 3.0 GHz to 4.4 GHz, with a 65 W default TDP, so the difference is more pronounced compared to the non-F design.

XERON, a technology brand guided by its "From Origin, Beyond Boundaries" philosophy of returning to first principles through purposeful design and user-focused innovation, introduces the NEX A61 ARGB, a next-generation single-tower air CPU cooler engineered around the thermal characteristics of AMD AM5 processors. Combining direct-touch heatpipes, triple-parallel-pipe precision coverage, and dual silent ring-blade fans, the NEX A61 ARGB is designed to manage concentrated heat from high-performance CPUs while maintaining low noise and broad platform compatibility.

The offset single-tower design provides improved memory clearance, allowing tall-profile RAM to be installed without compromise. Full-spectrum ARGB lighting, a magnetic top cover, and motherboard ARGB synchronization add a distinctive visual element, making the NEX A61 ARGB a versatile cooling solution for performance-focused and aesthetically driven PC builds.

The TechPowerUp team is on the ground at IFA 2026, and the Chieftec booth had some interesting offerings. Chieftec used the floor to show off a new air cooler alongside its case and PSU lineups: the CAC-S120PWM-T150. It's a tower-style air cooler with an all-black matte finish, standing 148 mm tall. Socket support is broad, covering Intel's LGA 1851, LGA 1700, LGA 1200, and LGA 115X, plus AMD's AM5 and AM4, so it should slot into current and slightly older builds without issue. I spotted five heatpipes running through the heatsink array, which should give it enough grunt to handle some serious CPUs.

The single 120 mm PWM fan spins between 500 and 2,400 RPM (±10 percent), pushing up to 74.54 CFM of airflow at 3.51 mm H₂O of static pressure. That puts it in a similar performance bracket to Chieftec's Single Tower CAC-SI2-BLK from Computex 2025, though this new model trims one heat pipe and adds a bit more height. Chieftec hasn't announced pricing or availability yet, but we'll know more soon. The company has been steadily expanding its air and liquid cooling range this year, following the announcement of the Iceberg PRO series AIOs earlier.

Leaker Roland Quandt has posted on Bluesky that AMD is preparing to launch another AM5 socket Ryzen 5 processor, a standard 7500. This Zen 4 (Raphael) CPU will sit between the existing Ryzen 5 7500F and 7500X3D. The leaked specifications show a six-core, 12-thread CPU running at a 3.7 GHz base clock, with up to 5.0 GHz boost, 38 MB of total cache (likely 32 MB L3 + 6 MB L2) and a 65 W TDP. These specs are largely similar to the 7500F variant, even at the clock-speed level, the 5.0 GHz boost matches the 7500F, while the 7500X3D is capped at 4.5 GHz due to the V-Cache overhead. Compared to the other two existing variants, the pricing, if true, is debatable. The Ryzen 5 7500F can be found at around $130-140 (initially launched at $180 for the retail PIB package), while the 7500X3D is listed now at around $285. The new 7500 is reportedly coming in at around €230 (roughly $267), which puts it uncomfortably close or even above the 7500X3D.

The higher price over the F variant and the matching/higher one over the 7500X3D suggest two things. First, it could have the Radeon Graphics integrated graphics solution as the X3D variant. Second, it will ship as a boxed version with a cooler included, unlike the 7500F, which comes as OEM/Tray. No official confirmation from AMD yet, however, the leaker is known for some accurate information in the past.

Another Ryzen 7 7800X3D has reportedly swollen and burned, while also damaging the ROG Crosshair X670E Hero motherboard in the process. UNIKO's Hardware flagged the case, citing a video posted to Bilibili as the original source. The video shows a Ryzen 7 7800X3D CPU with clear swelling on the underside where it made contact with the CPU socket. There is discoloration on both the CPU and the socket itself. Moreover, the socket pins are warped and damaged in the middle, presumably due to the pressure of the swelling. One peculiar finding is that one of the notches on the CPU socket looks slightly off. Perhaps more importantly, the board's BIOS version wasn't confirmed, which is directly relevant due to AMD's proposed fix.

This kind of failure first showed up in April 2023, when several 7800X3D and 7950X3D chips bulged and took their sockets with them on X670E boards. AMD pinned it on SoC voltage running too high and rolled out AGESA firmware that capped it at 1.30V across AM5 motherboards. This new case might be straightforward if the BIOS hadn't been updated at all. However, even after the BIOS fix, the reports never fully stopped. Just weeks ago, a 7800X3D reportedly burned out on an MSI PRO X870-P WIFI board running the latest BIOS, with EXPO enabled and nothing else touched. We have even seen reports of Ryzen 7 9800X3D CPUs burning in the exact same manner. If you're running a 7800X3D, it's probably worth checking that you're on the latest BIOS and keeping an eye on SoC voltage.

AMD's upcoming "Zen 6" desktop processors are moving closer to release as the company begins Linux kernel support in the latest version 7.3. According to Phoronix, AMD has updated the Host System Management Port (HSMP) kernel module, adding protocol version 7, which is used by the Zen 6 Family 1Ah Model 80H processors. Additionally, there are new AMD PMF platform driver features for these processors, likely referring to the "Zen 6" desktop "Olympic Ridge" processors. The AMD PMF driver now also offers device metrics through a new ioctl interface.

With the "Zen 6" generation, AMD is reportedly increasing its CCD core count to up to 12 instances, whereas the previous-generation CCDs maxed out at 8 cores. For versions with two CCDs, the core count starts at 12 cores and continues with 16 and 20-core models, topping off with the flagship 24-core dual CCD SKU. AMD is able to pack more cores per CCD due to the new manufacturing technology, which is TSMC's N2 2 nm node, providing better transistor density compared to the older nodes used in previous generations.

AMD's technical documentation page was updated today to emphasize ongoing compatibility with the AM5 platform. For the upcoming Ryzen 10000 series "Olympic Ridge" desktop processors, the company confirmed that these CPUs will also be compatible with the AM5 platform, bringing the already-announced "Zen 6" CPU technology to the consumer market. Interestingly, the documentation page also lists "Medusa1" as compatible with the AM5 desktop socket, suggesting we might see "Medusa Point" or "Medusa Halo" APUs in a socketed design as well, likely launching after the Ryzen "Olympic Ridge" family becomes available for consumer desktop PCs.

During the Computex 2026 international show, AMD confirmed that Socket AM5 would continue to be supported through 2029. In 2022, AMD introduced Socket AM5 alongside the Ryzen 7000 series powered by the "Zen 4" architecture. At that time, the company promised at least two processor generations on the socket, extending support up to 2027 (five years in the market). The company subsequently launched the Ryzen 8000 series APUs and its current Ryzen 9000 series powered by the "Zen 5" architecture. Its latest product line includes the introduction of Ryzen AI 400 series desktop APUs.

More than ten years since the introduction of the HEATKILLER IV, Watercool is presenting a new generation of its CPU water coolers with the HEATKILLER V PRO and ULTRA. Developed from the ground up for the latest AMD processors on the AM4 and AM5 sockets, these models complement the existing product line. The proven HEATKILLER IV remains part of the lineup.

Key features of the new HEATKILLER V series include a completely redesigned cooling structure, a new pre-assembled mounting system, and indirect aRGB lighting. Right from its market launch, the HEATKILLER V ULTRA impressed PC Games Hardware and emerged as the top performer in their comparison test. The independent test confirms the development goals of the new generation: high thermal performance with efficient airflow and a cooling structure specifically tailored to current AMD processors.

GAMDIAS, a premier brand in high-performance gaming hardware, proudly announces two new additions to its liquid cooling lineup, the CHIONE M5-360 and CHIONE P5-360 PRO, engineered to deliver powerful cooling performance with a fully customizable visual experience. Designed for gamers and PC builders who demand both performance and personality, the CHIONE M5-360 and CHIONE P5-360 PRO feature built-in IPS LCD displays for real-time system monitoring and personalized visuals, backed by a 360 mm radiator and three ARGB PWM fans for reliable, high-efficiency cooling. With advanced thermal performance, customizable displays, and efficient airflow, the CHIONE M5-360 and CHIONE P5-360 PRO are built to provide the thermal headroom and visual flexibility required for today's high-performance gaming systems.

"With the CHIONE M5-360 and CHIONE P5-360 PRO, we wanted to prove that a cooler doesn't have to choose between performance and personality," said Stimson Wang, CEO of GAMDIAS. "These coolers deliver the thermal headroom serious builders demand, while giving every user a genuinely personal display to make their system their own."

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, announces the iGame X870E VULCAN W OC, an all-white flagship overclocking motherboard designed for enthusiasts seeking uncompromising performance, advanced tuning capabilities, and distinctive aesthetics. Building on the success of the iGame X870E VULCAN OC launched earlier this year, the new white edition combines an extensively engineered power delivery system, high-speed memory support, advanced connectivity, and a striking iridescent finish that produces subtle, rainbow-like reflections that shift with the viewing angle and lighting.

Refined for more than half a year following the launch of the original VULCAN OC, the iGame X870E VULCAN W OC is built to unlock the full potential of AMD Ryzen processors on the AM5 platform. Its 18+2+2-phase 110A DrMOS power design, graphics card-inspired heat pipe and fin cooling system, and 10-layer server-grade PCB provide a strong foundation for demanding overclocking workloads. Dedicated overclocking controls, combined with a user-friendly one-click overclocking button, give experienced enthusiasts precise tuning options while making performance optimization more accessible to first-time overclockers.

AMD's flagship desktop processor until the Ryzen 9 9950X3D2 Dual Edition upstaged it, the 9950X3D, is now selling in the US at an all-time low price of $569. This amounts to an 18.5% drop from its launch price of $699.99. The $569 price can be found on both Amazon (US) and Newegg. The 9950X3D is a 16-core/32-thread Socket AM5 desktop processor based on the "Zen 5" microarchitecture, and powered by 3D V-Cache technology on one of its two 8-core chiplets.

The 9950X3D2 Dual Edition features 3D V-Cache on both its 8-core chiplets. In our testing, the 9950X3D was found to be about 3% slower than the 9950X3D2 at gaming (1080p, averaged), and about 2.5% slower averaged across all our application benchmarks; but it holds significant leads in our Physics Simulation, console emulation, AI ML, and rendering benchmarks.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its full lineup of DDR5 motherboards now supports CXSH (CXMT) chip-based memory, giving consumers more options and greater availability amid an ongoing industry-wide memory shortage. The BIOS optimization enables AM5 800/ 600 series motherboards to run CXSH (CXMT) chip-based memory stably at 8200 MT/s, while Intel 800/ 700 series platforms support CXSH (CXMT) chip-based memory out of the box.

Following AMD's release of AGESA 1.3.0.1c and Gigabyte's own memory optimization technology, AM5 motherboards across both the 800 series and 600 series now support CXSH (CXMT) chip-based memory, including 16 Gb and 24 Gb densities. With this update, Gigabyte AM5 motherboards can now stably run these DIMMs at speeds of up to 8200 MT/s, breaking the previous AM5 platform limitation and giving builders more performance headroom on AMD's platform. Meanwhile, Gigabyte's Intel 800 and 700 series motherboards already support CXSH (CXMT) chip-based memory through their current shipping BIOS, with no additional update required.

GIGABYTE today introduced the B850M AORUS Stealth, a Socket AM5 motherboard based on the AMD B850 chipset that offers backside connectors for better cable management and aesthetics. This is among the first of the company's motherboards in the microATX form-factor to feature backside connectivity. The board draws power from a combination of 24-pin ATX and a single 8-pin EPS connector. It uses an 8+2+2 phase CPU VRM design. The socket is wired to four DDR5 DIMM slots, the board's sole PCI-Express 5.0 x16 slot, and two M.2 NVMe slots, one of which is Gen 5 x4, and the other interestingly is Gen 4 x4 even though it comes from the CPU. There is a third M.2 Gen 4 x4 slot that's wired to the B850 chipset. Other storage connectivity includes two SATA 6 Gbps ports.

USB connectivity of the GIGABYTE B850M AORUS Stealth includes four 5 Gbps USB 3.2 Gen 1 type-A on the rear panel; four USB 2.0 type-A, also on the rear panel; two 10 Gbps USB 3.2 Gen 2, one of which is type-A and the other type-C, on the rear panel; two 5 Gbps USB 3.2 Gen 2 ports from a header; and a 20 Gbps USB 3.2 Gen 2x2 port from header. Network connectivity includes a Wi-Fi 7 160 MHz and Bluetooth 5.4 provided by a Realtek RTL8922AE WLAN module; and a 5 Gbps wired Ethernet interface driven by a Realtek RTL8126 series PHY. The onboard audio solution is driven by a Realtek ALC1220 HDA codec. The company didn't reveal pricing.

Back in March, I wrote a detailed editorial on how hardware-accelerated audio is possible in Windows 11, and it's possible for sound card manufacturers to put native audio stack processing on the card to overcome issues with DPC latency spikes. Today, I'll talk a bit about USB-based onboard audio codecs, and how the Intel platform is better suited to handle them than the AMD platform, particularly given how motherboard designers handle the latter. The Intel "Azalia" high-definition audio (HDA) bus, introduced in the early-2000s, laid the foundation for high-quality onboard audio, offering consumers high-resolution 24-bit/192 kHz audio. This is a low-latency interface designed to ensure the quickest possible movement of audio data between the system and the DAC. On Intel platforms, the HDA bus tends to be wired out from the PCH (the chipset), whereas on the AMD platform, the HDA bus is located on the SoC (the processor), and not the FCH (the chipset). This was a deliberate choice by AMD, and has to do with the chipset bus the company uses.

Unlike Intel, AMD's platform designers adopted a "SoC first" strategy. Modern Ryzen client-segment processors are fully-fledged SoCs in their own right; while the chipset only serves to increase downstream platform connectivity. Ryzen SoCs put out not just PCIe lanes, but also certain platform connectivity, such as USB and SATA; while the FCH puts out additional USB and SATA connectivity. Traditionally, on the Intel platform, the processor only puts out PCIe lanes, while the PCH handles all other forms of connectivity, including USB and SATA; and of course the HDA bus. Intel is able to place the HDA bus on the chipset, while AMD avoids this. The HDA bus is instead put out by the SoC.