AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is excited to announce the N9 X870E ATX motherboard, optimized for the new "Zen 5" architecture based AMD Ryzen 9000 series desktop processors. NZXT's latest motherboard combines high-performance features with a stunning new look that is geared towards enthusiast PC gamers building a high-end AMD system.

The N9 X870E boasts overclocking-ready power delivery and optimized thermals, providing gamers with the tools and headroom to overclock their AMD Ryzen 9000, 8000 or 7000 series processors and memory to their highest levels of performance. Additionally, the N9 X870E ensures prolonged compatibility with future and previous generations of Ryzen processors, thanks to AMD's commitment to support the AM5 platform until 2027+.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

AMD released its EPYC 4004 series Socket AM5 processors for small-business servers, which come in unique core and clock speed configurations not found on the client Ryzen series, such as 4-core/8-thread and the 28-lane PCIe Gen 5 I/O die. The EPYC 4124P is such a processor, and it turns out that the chip works on regular AM5 desktop motherboards, but with a special BIOS. Sergmann and Darkgregor built such contraptions, put it under liquid nitrogen cooling, and embarked on an overclocking adventure. They achieved a 6.70 GHz bench-stable all-core overclock, a huge upgrade from the 3.80 GHz base frequency. With this, the user was able to break many benchmark records for native quad-core processors (i.e. processors with 4 cores that aren't higher core-count chips with cores disabled in the BIOS).

With German retailer Mindfactory.de listing the Ryzen 5 7600X3D, European hardware reviewers are beginning to put the chip through its paces on their Socket AM5 test beds still warm from last month's Ryzen 9000 "Zen 5" launch coverage. PCGH is among the first such reviewers, and has an interesting set of findings. The biggest question everyone is looking to be answered is "how does it game?" and here PCGH has some good news. The processor is very fast at gaming, and in fact beats the 8-core Ryzen 7 9700X "Zen 5" chip in gaming benchmarks, ending up 6% faster than when averaged across the games in PCGH's test suite. It's also about 9% slower than the Ryzen 7 7800X3D, which remains the reigning champion.

Being faster than the 9700X also means that the Ryzen 5 7600X3D is faster than every other Ryzen 9000 series processor launched till date, including the flagship Ryzen 9 9950X. The 7600X3D is a whopping 11% faster than the 9950X at gaming. When compared to Intel contemporaries, the 7600X3D ends up about 1% slower than the Core i5-13600K, and 2% slower than the newer i5-14600K. These were the two chips the 7600X3D was sent to beat at gaming, so crowds are drawn to the Ryzen 5 series, and the chip ends up falling a touch short. A lot will depend on whether AMD gives the 7600X3D a wider launch, and what its street price ends up being. Find the complete PCGH review of the Ryzen 5 7600X3D in the source link below.

AMD Ryzen 5 7600X3D Socket AM5 desktop processor isn't a MicroCenter USA-exclusive anymore, with the chip now being available across the pond in Germany. Major German retailer Mindfactory.de has the processor listed at €329 (including taxes). This puts its pricing €60 less than that of the popular Ryzen 7 7800X3D (going for €390 on the site). Unlike the MicroCenter deal, the Mindfactory listing is standalone—you get the processor in a retail PIB package, and not part of a bundle. To sweeten things, you also get an AMD-branded T-shirt.

The 6-core/12-thead processor is based on the older "Zen 4" microarchitecture, but supercharged with 3D V-cache technology, which gives it 96 MB of last-level cache that is known to have a significant impact on gaming performance. The 7600X3D comes with a 4.10 GHz base frequency, and 4.70 GHz maximum turbo frequency. The retail PIB box resembles that of the 7800X3D, but with the Ryzen 5 brand extension. There's no cooling solution included in the box, but the cooling requirements of this processor aren't steep, with its TDP being rated at just 65 W.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

be quiet!, the German manufacturer for premium PC components, is proud to announce the latest AIO series in its cooling portfolio: Light Loop. This water cooling series focuses on cooling capabilities and vivid lighting effects. An ARGB cooling block with a unique diffuser and ARGB-enabled Light Wings LX fans allow for impressively vibrant and colorful illumination. The jet plate and cold plate are optimized for enhanced performance, while a progressive IC keeps the pump noise low, making Light Loop the perfect match for users with overclocked systems. Light Loop is available in black and white versions with 240 mm and 360 mm radiators.

It's hard to overlook Light Loop. With up to 64 LEDs in total on the uniquely illuminated cooling block and the brand-new, visually imposing Light Wings LX 120 mm PWM high-speed fans this AIO series leaves a vibrant, lasting impression in every PC. The included ARGB-PWM-hub connects up to 6 PWM fans and 6 ARGB components to just one PWM and one ARGB header on the motherboard, for full ARGB synchronization of all lighting effects. The hub can be positioned anywhere inside the case with adhesive tape or screw holes that match 2.5" SSD mounting.

Motherboard manufacturers are beginning to roll out UEFI firmware updates that not just patch the Sinkclose critical vulnerability, but enable an experimental "105 W TDP mode" option as part of the processor's custom BIOS settings (CBS). The mode elevates the power limits of the Ryzen 5 9600X and Ryzen 7 9700X "Zen 5" desktop processors, with up to 13%" performance gains being reported by the motherboard vendors themselves. By default, your motherboard will run these processors at their original 65 W TDP, and you're supposed to manually enable the setting in the UEFI firmware setup program. It could either be found in the overclocking/tuning page, or the AMD CBS section.

To remove the last bit of hesitation among users go turn this setting on, AMD is working to extend its processor warranty to cover the 105 W TDP mode, reports Wccftech editor Hassan Mujtaba. Currently, the setting is being shipped with AM5 AGESA version 1.2.0.1, which includes the Sinkclose vulnerability patch, but will "officially" release it with AM5 AGESA 1.2.0.2, along with warranty coverage. Mujtaba reports that firmware updated with AGESA 1.2.0.2 are expected to begin rolling out in late-September.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

We've known for the past couple of weeks that AMD is working on the Ryzen 5 7600X3D—a 6-core/12-thread processor based on the older "Zen 4" microarchitecture, but featuring 3D V-cache that enables significant gaming performance uplifts. The company finally launched the chip, but here's the bummer—it's only available in the US, and is a MicroCenter exclusive, where's it's going for $299.99. Here's the second bummer—you can't buy the processor on its own, but in a 3-part bundle that includes it, an ASUS TUF Gaming B650-Plus Wi-Fi motherboard, and an unspecified brand of 32 GB (2x 16 GB) DDR5-6000 memory kit. When you add up the prices of the three parts when purchased separately, you arrive at $630, but MicroCenter is selling the bundle for an impressive $450—a $180 discount.

The AMD Ryzen 5 7600X3D comes with a maximum boost frequency of 4.70 GHz, which is a steep 600 MHz fall from that of the regular Ryzen 5 7600X, and 400 MHz less than that of the 65 W Ryzen 5 7600 (non-X). Much like the 7600, the 7600X3D comes with a 65 W TDP. Where it loses on clock speeds, it makes up for with its large cache—1 MB of L2 cache per core, and 96 MB of L3 cache (or 102 MB of L2+L3 "total cache."). The bundle could offer good value for those building PCs from scratch, or coming in from the older Socket AM4 platform. The TUF Gaming B650-Plus Wi-Fi is a fairly feature-packed mid-range ATX motherboard.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

Phanteks today launched the Polar ST line of air-type CPU coolers. These include the Polar ST4 (chrome) and the Polar ST5 (black). The aluminium fin-stack tower type fan-heatsinks. The Polar ST4 features four nickel plated copper heat pipes, and is rated for a maximum thermal load of 235 W, while the Polar ST5 has a more upmarket appearance with its black powder coating, and a die-cast metal top plate. The Polar ST5 has five nickel-plated copper heat pipes instead of four, which takes its thermal load value up to 255 W.

Both the Phanteks Polar ST4 and Polar ST5 include a 120 mm fan, specifically the Phanteks M25-120 PWM DRGB. As its name suggests, this is a conventional 25 mm-thick 120 mm fan with PWM control, and addressable RGB lighting control. Its ARGB LEDs are located in the impeller hub. The fan turns between 400 and 2,000 RPM, pushing up to 84.26 CFM of airflow, at up to 2.67 mm H₂O static pressure, and a maximum noise output of 35.7 dBA. Phanteks is including a thermal paste with 4.3 W/m-k thermal conductivity. Among the CPU socket types supported are LGA1851, LGA1700, LGA1200, AM5, and AM4. The company didn't reveal pricing.

ASRock has released the AGESA 1.2.0.0a patch A BIOS update for its AM5 motherboards, enhancing compatibility and performance for AMD Ryzen 9000 series processors. The update is available for ASRock's AM5 motherboard lineup, including models with X670E, B650E, B650, and A620 chipsets. This new BIOS version allows users to fully leverage the capabilities of the Ryzen 9000 series processors, providing improved system performance and stability.

Users can easily download and install the update from the ASRock official website or use features like BIOS Flashback and Instant Flash. ASRock recommends updating to the latest BIOS version to ensure optimal system compatibility and performance for AMD Ryzen 9000 series processors.

MSI is excited to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the AM5 platform. Powered by advanced 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unmatched performance, efficiency, and versatility for gamers and content creators. At launch, August 8th, AMD Ryzen 7 9700X, and Ryzen 5 9600X are available while the Ryzen 9 9950X and 9900X will launch on August 15th. These processors will feature up to 16 cores and 32 threads, with a theoretical maximum boost clock speed of 5.7 GHz, 64 MB of L3 cache, and a maximum TDP of 170 W.

AMD Ryzen 9000 Series will also support PCIe 5.0 for the GPU and M.2 while enhancing DDR5 memory speed. Notably, the AMD Ryzen 7 9700X offers approximately 12% better overall performance than the first-gen AMD 3D V-cache CPU. All these processors are compatible with the AM5 socket, and existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate by updating to the latest BIOS, available on MSI's product support page.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

Thermalright introduced the Royal Knight 120SE, a dual fin-stack CPU cooler with a design focus on clearance with the memory area of your motherboard. It does this by offsetting its two fin-stacks away from the memory area, with one of them being almost directly above the CPU base, and by using a slim 15 mm-thick intake fan. The heatsink measures 122 mm × 114 mm × 155 mm (DxWxH), with the intake fan adding another 15 mm depth. The cooler features a nickel-plated copper base, from which six 6 mm-thick copper heatpipes pass through, skewering the two aluminium fin-stacks on both ends.

The intake fan is a Thermalright TL-C12015B. This 15 mm-thick 120 mm spinner features a 2nd generation fluid dynamic bearing, turns at up to 1,800 RPM, pushing up to 59 CFM of airflow at 1.24 mm H₂O static pressure, and 26.1 dBA maximum noise. The second fan is meant to be installed between the two fin-stacks. It is a TL-C12B V2, a 120 mm fan of conventional 25 mm thickness, and featuring a fluid dynamic bearing. It turns at speeds of up to 1,500 RPM, pushing up to 66.17 CFM of airflow, at 1.53 mm H₂O static pressure, and 25.6 dBA maximum noise. Both fans lack any kind of lighting, and use a standard 4-pin PWM power input. Among the CPU socket types supported are LGA1851, LGA1700, AM5, and AM4. The company didn't reveal pricing.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.