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AMD Zen 4 Reportedly Features a 29% IPC Boost Over Zen 3

While AMD has only released a few Zen 3 processors which are still extremely hard to purchase for RRP we are already receiving leaks on their successors. Zen 3 Milan processors will likely be the final generation of AM4 processors before the switch to AM5. AMD appears to be preparing a bridging series of processors based on the Zen 3+ architecture before the release of Zen 4. Zen 3+ is expected to be AMD's first AM5 CPU design and should bring small IPC gains similar to the improvements from Zen to Zen+ in the range of 4% - 7%. The Zen 3+ processors will be manufactured on TSMC's refined N7 node with a potential announcement sometime later in 2021.

Zen 4 is expected to launch the next year in 2022 and will bring significant improvements potentially up to 40% over Zen 3 after clock boosts according to ChipsandChesse. A Zen 4 Genoa engineering sample reportedly performed 29% faster than an existing Zen 3 CPUs at the same clock speeds and core counts. The Zen 4 architecture will be manufactured on a 5 nm node and could potentially bring another core count increase. This would be one of the largest generational improvements for AMD since the launch of Ryzen if true. Take all this information with a heavy dose of skepticism as with any rumor.

AMD Talks Zen 4 and RDNA 3, Promises to Offer Extremely Competitive Products

AMD is always in development mode and just when they launch a new product, the company is always gearing up for the next-generation of devices. Just a few months ago, back in November, AMD has launched its Zen 3 core, and today we get to hear about the next steps that the company is taking to stay competitive and grow its product portfolio. In the AnandTech interview with Dr. Lisa Su, and The Street interview with Rick Bergman, the EVP of AMD's Computing and Graphics Business Group, we have gathered information about AMD's plans for Zen 4 core development and RDNA 3 performance target.

Starting with Zen 4, AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

Distant Blips on the AMD Roadmap Surface: Rembrandt and Raphael

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

Sharkoon Announces the AM5 Case Series

With the AM5 case series, Sharkoon introduces a new Midi tower with a front panel finished with a glossy metallic car paint and available in two versions: The Sharkoon AM5 Silent offers pre-installed damping mats; the AM5 Window comes without damping mats, but with an acrylic side panel. Both versions are available with front panels painted in a mirror finish in the colors red, blue or titanium.

Airflow is possible thanks to the numerous air vents on both sides of the front panel, behind which is also a removable dust filter. The Silent version has two pre-installed 140 mm fans in the front, while the Window version comes with one pre-installed 140 mm fan. Additional pre-drilled holes for more fans are also available. Alternatively, a 280 mm or 360 mm radiator with a total height of up to 5.5 cm, including fan, can be installed. Microphone and headphone audio ports as well as two USB 2.0 and USB 3.0 ports are all located on the top panel.

Sharkoon Flaunt Their AM5 Case, Pacelight RGB System at Computex 2017

At5 Computex 2017, Sharkoon took the opportunity to set customer's eyes on their AM5 case, which features a modular front panel that can be swapped at will (provided you acquire the other options.) One of the most interesting characteristics of this case is that it will be sold in two options with differing materials for the side panels: one with an acrylic sheet, which is already a well-known material for those who want to gorge their eyes on their hardware; or with soundproof panels, which make sure not a whisper from your system's cooling can escape the confines of your case (at least from this particular side.)

Other characteristics are as usual, with a maximum 40 cm length for the graphics card, 16.7 cm for the CPU cooler, 20.5 cm for the power supply, support for 2x 140 mm fans on the front panel (pre-installed) or one of those 240 mm radiators; 1x 120 mm fan support on the back of the chassis; and up to 3x 120 mm fans or 2x 140 mm on the top of the case (we posit 280 mm AIOs can also be fit there).
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