Cavium, Inc., a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking, today announced the introduction of a new game changing category of processors that are workload optimized for a range of applications in the cloud and data center. The 2.5GHz 48 core ThunderX is the world's highest performing low-power 64-bit ARMv8 SoC family of workload optimized processors with a range of SKUs and form factors for high performance volume compute, storage, secure compute and networking specific workloads.

Data center infrastructure transformation is one of the key trends driving IT spending in 2014 and beyond. Analysts predict that the global data center infrastructure market, including servers, storage, networking, security and virtualization, will reach $128 billion in 2014. Key trends driving this disruption include rapid adoption of Software as a Service (SaaS), Platform as a Service (PaaS), and Infrastructure as a Service (IaaS) enabled by Software Defined Data Center (SDDC) with virtualized on demand compute, Software Defined Networking (SDN) and Software Defined Storage (SDS). The continued growth and adoption of Open Source Software with almost 100 billion lines of code and nearly 10 million active developers is also radically changing installed base software requirements.

In Win showed off its big OEM catch at Computex. The company supplies the case for Norwegian online retailer's own 2014 Steam Machine. The case, built mostly with brushed metal, is roughly the size of next-generation game console. Under its hood are an Intel Core i7-4790 quad-core prorcessor, MSI B85I motherboard, NVIDIA GeForce GTX TITAN Black graphics, 16 GB Kingston-made DDR3 memory, 480 GB Kingston-made SSD storage, 802.11 ac WLAN, gigabit Ethernet, four USB 3.0 ports, two USB 2.0 ports, 8-channel HD audio with optical SPDIF output, dual-link DVI, DisplayPort and HDMI from the graphics card, and pre-installed SteamOS operating system.

MSI unveiled its first socket AM3+ motherboard bearing its coveted Gaming Series badge, the 970 Gaming. Based on AMD 970 chipset with SB950 southbridge, the board offers most modern gaming features for the AM3+ platform. It supports FX "Vishera" eight-core processors. The board draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and features a strong 8-phase CPU VRM that's cooled by a massive heatsink. The AM3+ socket is wired to four DDR3 DIMM slots, supporting up to 64 GB of dual-channel DDR3-2400 MHz memory.

Expansion slots include two PCI-Express 2.0 x16 (x8/x8 when both are populated), and two each of PCI-Express 2.0 x1 and legacy PCI. Storage connectivity includes six SATA 6 Gb/s ports. There are four USB 3.0 ports on offer. Things get interesting with its Qualcomm Killer E2200 gaming-optimized wired NIC, the same one featured on its flagship Z97 Gaming 9 AC; and Audio Boost HD audio, which features a 115 dBA SNR CODEC, ground-layer isolation, a 600Ω headphones amp, electrolytic capacitors, and gold-plated jacks. MSI didn't disclose pricing.

Intel announced its much awaited Core i7 and Core i5 "Devil's Canyon" unlocked quad-core processors. Based on an enhanced "Haswell-DT" Refresh silicon, the chips feature binned dies, enhanced thermal interface material between the die and the integrated heatspreader, enhanced on-package electricals, and high voltage limits. Among the models launched today, are the Core i7-4790K, and the Core i7-4690K. The i7-4790K features four cores, with HyperThreading enabling eight logical CPUs, 8 MB L3 cache, Intel HD 4600 graphics, and an integrated dual-channel DDR3 IMC. It comes with clock speeds of 4.00 GHz, with 4.40 GHz Turbo Boost. Apart from unlocked multipliers, it features higher voltage limits than the current i7-4770K. The Core i5-4690K, on the other hand, is a quad-core chip that lacks HyperThreading. It offers clock speeds of 3.50 GHz, and Turbo Boost speeds of 3.90 GHz. The i7-4790K is priced at US $350, and the i5-4690K at $250. Both chips should be available by 25th June, 2014. For now, you can pre-order them on Newegg.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced its memory was overclocked to 4500 MHz, the highest frequency in the world. The mark was set by overclocker "Hicookie" of GIGABYTE. He achieved the frequency using one 4 GB HyperX DDR3 2933MHz module (not yet available) on the new GIGABYTE Z97X-SOC FORCE LN2 motherboard.

The frequency is posted on HWBOT, the premier site for PC enthusiasts looking for news, tips and information on overclocking, benchmarks and competitions. Beginning June 1, HyperX officially became the newest partner with HWBOT. Together with HWBOT, HyperX looks forward to continuing its association with the overclocking community.

ADATA Technology Co., Ltd., a leading manufacturer of high-performance DRAM modules and NAND Flash application products, collaborated with AsRock to run a demo system equipped with ADATA's overclocking memory modules and AsRock's motherboard, whose performance reached a breakthrough record. ADATA's XPG series DDR3 3100 memory modules going with AsRock's the latest Z97 OC Formula motherboard and Devil Canyon I7 4790K CPU processor reached the 3400MHz outstanding performance, which will be displaying at ADATA's booth and bring you with an amazing experience.

ADATA XPG Series exclusively designed for overslockers can meet the needs of professional gamers with the ultra-high speed performance and ultra-fast cool down function. At this year's Computex, ADATA will be showcasing its latest XPG Series V3, DDR3 3000 8GB x 4, whose 32GB capacity can match ASRock Z97 OC Formula motherboard bringing out a steady speed of 3000MHz, and fulfill overclockers' picky needs of high capacity and high performance as well. In addition, its replaceable heat sink design allows users to customize the memory modules' color to complement their high performance system. ADATA is the first one who is able to steadily provide customers with 8GB x 4 pack memory module house in the industry.

Gigabyte may have struck a superb price-features sweet-spot with the Z97X-SLI, which the company unveiled at its Computex wall. This board, we're hearing, will be priced around $125, and has a feature-set to rival boards much pricier. To begin with, the socket LGA1150 board is based on Intel's Z97 Express chipset. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it using a simple 4-phase VRM, that uses 60A chokes. The VRM area is clad with heatsinks all around. The CPU socket is wired to four DDR3 DIMM slots, supporting up to 32 GB of dual-channel DDR3 memory, and two PCI-Express 3.0 x16 slots, which run at x8/x8, when both are populated. This is also among the few motherboards in its price bracket to support NVIDIA SLI, apart from AMD CrossFire.

Apart from the two PCI-Express 3.0 x16 slots, three PCI-Express 2.0 x1, and a couple of legacy PCI slots make up the expansion area. Its storage area is where the package gains tons of value. You get six SATA 6 Gb/s ports, from which two can convert into a SATA-Express 10 Gb/s port; and an M.2 slot. The board features high-grade audio, including a Realtek ALC1150 HD audio CODEC, which offers SNR as high as 115 dBA; with ground-layer isolation, and a headphones amp. Networking is care of an Intel-made GbE controller. Display outputs include dual-link DVI, D-Sub, and HDMI. Legacy connectivity includes LPT and COM (by headers), and PS/2. AMI Aptio UEFI BIOS, backed by dual-UEFI redundancy, is at this board's helm. For around $125, you can't get this board's feature-set wrong.

GeIL showed off its EVO Leggera line of compact full-height DDR3 memory modules, which offer high memory frequencies using XMPs, without needing over the top heatspreaders that obstruct CPU coolers. The Leggera is characterized by azure blue heatspreaders, and the underlying DIMM is put through GeIL's own trial-by-fire, the DBT, before being packaged. The EVO Leggera will be sold in two-module dual-channel kits of 8 GB (2 x 4 GB) and 16 GB (2 x 16 GB).

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, today announced it has expanded its wide lineup of DDR3 small modules with a cost-effective 8 GB ULP Planar Mini-UDIMM.

With its innovative design, SMART has doubled the number of DRAM placements to 18 on its ULP Planar Mini-DIMM which allows the use of mainstream cost-effective 4 Gb DRAMs. The result is a high density solution contained in a small package effectively lowering the overall cost per module GB.

Gigabyte launched the GA-9SISL, a unique micro-server board in the mini-ITX form-factor. At its center is an Intel Atom C2750 "Avoton" processor. This chip embeds an eight-core "Silvermont" x86-64 CPU clocked at 2.40 GHz, with 2.60 GHz Turbo Boost, a dual-channel memory controller that supports up to 64 GB of memory, 4 MB of L2 cache, and a 6-port SATA AHCI/RAID controller with two 6 Gb/s and four 3 Gb/s ports. Its TDP is rated at just 20W, and so a tiny fan-heatsink is deployed to handle it.

The GA-9SISL from Gigabyte draws power from a combination of 24-pin ATX and 8-pin EPS connectors. The Atom C2750 SoC is wired to four DDR3 DIMM slots, supporting up to 32 GB of DDR3-1600 memory. Its lone expansion slot is a PCI-Express 2.0 x16. Storage connectivity includes four SATA 3 Gb/s and two SATA 6 Gb/s ports. An ASPEED AST2400 chip provides remote management capabilities, and its integrated video, over a D-Sub connector. An Intel N354 network controller offers four 1000 Mbit Ethernet connectors, while a 5th one is wired to the management chip. Gigabyte didn't announce pricing, but given that the SoC itself is priced at US $170 a piece in 1000-unit quantities, home NAS builders may not get excited.

Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, announces the new arrival of the PICO121, its extremely compact fanless Pico-ITX SBC with ultra-low power AMD G-Series Embedded SoC GX-210JA dual core 1.0GHz onboard. The PICO121 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). This embedded board supports DirectX 11, Open GL4.2, and Open CL1.2 to provide great graphics performance and features dual-view compatibility through VGA and LVDS with AMD Radeon HD8180 graphics controller. In addition to graphics rich, the PICO121 supports DASH (desktop and mobile architecture for system hardware) for convenient remote management, which means this board can be used as a client device, controlled and managed by a console remotely via a Gigabit LAN port on the rear I/O. Moreover, the single board computer is equipped with one high-speed board-to-board connector that integrates PCIe x1, USB 3.0 and DisplayPort to fulfill various application needs.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.

Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.

Designed to enable the best user experience on today's most popular and innovative PCs, AMD (NYSE: AMD) today announced its 3rd-generation Mainstream and Low-Power Mobile Accelerated Processing Units (APUs). Combining category-leading compute performance with unique features and rich user interactions, the 2014 AMD Mainstream and Low-Power Mobile APUs (formerly codenamed "Beema" and "Mullins," respectively) are the ideal choice for consumer and commercial client devices alike.

These new mobile APUs feature up to four newly-designed x86 CPU cores with updated, industry-leading AMD Radeon graphics and a hardware-level data security solution based on the ARM Cortex-A5, all on a single, power-sipping system-on-chip (SoC). Products based on these new APUs are already announced by Lenovo and Samsung, with many more expected on-shelf in time for the 2014 back-to-school shopping season.

Since the leading memory manufacturer KINGMAX released the Nano Gaming RAM in 2012, it has always received excellent positive reviews. Currently there are four memory clocks available for gamers to choose from: 1333 MHz, 1600 MHz, 2000 MHz, and 2200 MHz. Now, KINGMAX is disclosing its new Nano Gaming Ram to over-clocking enthusiasts before COMPUTEX 2014.

The newly released Nano Gaming RAM strives for better performance in terms of frequency and voltage, and KINGMAX is dedicated to finding the optimal balance between the two to bring an all new usage experience for over-clocking enthusiasts. KINGMAX also used its exclusive Nano cooling technology to make cooling more efficient and to bring better stability for Nano Gaming Ram, allowing gamers to become more excited and hot-blooded because of its the smooth and immersive game play.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its completely redesigned line of its all-purpose performance laptops - the ultra-slim 15.6-inch Satellite S55, desktop replacement 17.3-inch Satellite S75 and highly mobile 14-inch Satellite E45. The laptops deliver powerful capabilities in a premium design built to increase productivity and provide an excellent entertainment experience.

"These new laptops are designed to give power users and entertainment enthusiasts the power and versatility to do more with their laptop," said Carl Pinto, vice president of marketing, Toshiba America Information Systems, Inc., Digital Products Division. "Full-featured, completely customizable with an all-new stunning design, these laptops provide the ultimate audio and visual experience for movies, games and more."

Linksys today announced that it has started shipping the new WRT1900AC, which will be available for sale at Best Buy stores throughout the US or at the Linksys.com store. The new WRT features four external antennas for optimal wireless coverage throughout the home and has been certified for the new 802.11ac Wi-Fi standard. The new wireless standard delivers best-in-class performance and includes intelligent technologies such as beamforming to further improve the wireless signal range. The design of the new Linksys WRT1900AC Dual Band Wi-Fi Router is inspired by the iconic WRT54G that was introduced 11 years ago. The new WRT has been equipped with powerful hardware such as a dual-core 1.2 GHz processor, 128 MB flash memory, eSATA and USB ports. The new WRT ships with Linksys Smart Wi-Fi setup and management tools, and Linksys has also been collaborating with OpenWrt to make sure that an open source alternative is available in the coming weeks.

"The WRT is a cornerstone in the history of Wi-Fi and synonymous for many people with going wireless at home since it was their first wireless router. Since the introduction of the original WRT, we have sold more than 50 million units worldwide and are still selling it very successfully even with wireless technology advancing rapidly," said Mike Chen, vice president product management for Linksys. "The WRT has a cult status for many because of the open source aspect that made it so immensely popular. We are honored to have collaborated with OpenWRT to ensure the open source readiness of the product and building a WRT-worthy successor with cutting-edge hardware and iconic design."

MSI, world leader in motherboards, debuts its first AMD AM1 Socketed Kabini Mini-ITX motherboard, the MSI AM1I. With Kabini being sold separately, the MSI AM1I is fully upgradable and gives the user flexibility when looking for a ultra-low power dual or quad core solution. With MSI AM1I's rich feature set and support for the powerful power efficient Kabini APU, packed with high performance DirectX 11.2-support, it is the ideal motherboard to use in a compact desktop, HTPC or other multimedia solutions.

Kabini is the first x86 quad-core System on a Chip solution for mainstream use with improved performance per watt and best-in-class graphics. Now being sold separately, instead of soldered to a motherboard, the AM1 platform offers a complete, customizable package together with the MSI AM1I motherboard.

Eurocom is launching the M4, the world's most powerful 13.3" QHD+ notebook. It is equipped with a breathtaking 3200x1800 QHD+ display, an Intel Core i7 Extreme Processor and NVIDIA GeForce GTX 860M Maxwell graphics. The 5,760,000 pixels of the 13.3" 3200x1800 QHD+ display are powered by the NVIDIA GeForce GTX 860M graphics with 2GB DDR5 VRAM, 640 CUDA Cores, with a GPU core able to run at up to 1029MHz +boost. Weighing just two kilograms and being only 1.2 inches thin makes the EUROCOM M4 extremely easy to carry and transport, with no need for a power cord due to the great battery life brought on by supported NVIDIA Optimus Technology.

Gaming is all about refresh rates and great visuals, the M4 does not disappoint with a beautiful 13.3" 3200x1800 QHD+ display powered by powerful NVIDIA GeForce GTX 860M graphics. Audio is enhanced thanks to the Sound Blaster Cinema audio platform featuring SBX Pro Studio. Powered by a full line of 4th Generation Intel Core i7 processors utilizing the Intel HM87 Express Chipset including the Intel Core i7-4940MX Processor Extreme with 4 cores and 8 threads running at 3.1 GHz (up to 4 GHz max turbo frequency) with 8 MB L3 cache. A menacing silver Backlit keyboard makes gaming or working in the dark a breeze. Up to 16 GB DDR3-1866 SODIMM memory is supported via two slots with 8 GB modules that are easy to access to upgrade or replace.

SAPPHIRE Technology has just introduced three new mainstream models to its highly successful R-Series of graphics cards based on AMD Graphics Core Next (GCN) architecture. The new SAPPHIRE R5 230 series includes three low profile PCI-Express graphics cards that require no additional power connector, making them ideal for entry level systems or for upgrading existing PC systems and providing additional monitor support. Two basic models have 160 Stream processors and core clocks of 625MHz, and offer a choice of 1GB or 2GB of DDR3 memory to deliver excellent performance and great value. Outputs are Dual-link DVI, VGA and HDMI, supporting a choice of monitor types and the cards ship with optional backplates for use in standard or low-profile chassis.

The third model is the R5 230 FleX, which also has 160 Stream processors and 625MHz core clocks, but has 1GB of DDR3 memory with the enhanced clock speed of 800MHz (1600MHz effective). The FleX model adds the SAPPHIRE exclusive ability to support three DVI monitors in Eyefinity mode without the need for any active adapters and deliver a true SLS (Single Large Surface) work area. The first two monitors are connected to the two DVI outputs. A third DVI monitor can be connected to the HDMI output with the passive cable adapter supplied.

Thecus is pleased to announce the expansion on the company's SMB and Enterprise NAS line with the 10GbE Ready N7710 and N8810U. These new models offer identical hardware and performance to the recently released N7710-G and N8810U-G, differing only in stock support for 10GbE connectivity. These models offer excellent value for companies who do not currently have the need or infrastructure for 10GbE speeds, and are looking for powerful performance and an attractive architecture. Both units are fully upgradable if a company decides to make the jump to 10GbE down the line.

MSI announced the ProBox line of compact desktop barebones, the first of which is the ProBox23. Its chassis, which measures 202 mm x 204 mm x 54.8 mm (WxDxH), includes a slim mini-ITX motherboard based on the Intel H81 Express chipset, supporting LGA1150 processors (TDP of up to 65W), room for up to two DDR3 SO-DIMM slots, two 2.5-inch SATA drives, and an mSATA slot. A half-height mPCIe x1 slot is also featured, so you can drop in your own wireless communications card. The unit draws power from an external power brick. Connectivity includes stereo HD audio, gigabit Ethernet, two USB 3.0 ports, six USB 2.0 ports (two on the rear panel, four on the front), eSATA 3 Gb/s, and HDMI display output.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB and 32 GB DDR3 Registered DIMM (RDIMM) modules aimed at maximizing memory in Apple Mac Pro 2013 systems. With four user-upgradeable memory slots available, Transcend's latest high-performance DDR3 RDIMMs can boost Mac Pro 2013 Intel Xeon E5 3.5 GHz 6-Core, 3.0 GHz 8-Core, and 2.7 GHz 12-Core models to 64 GB, 96 GB, and even 128 GB total memory capacity.

"The new Mac Pro 2013 is advertised to support up to 64 GB of memory, and we understand that pro users running applications that place high demands on RAM have a need to meet and most likely exceed this threshold," said Angus Wu, Director of Research and Development at Transcend. "For this reason, we have developed and fully tested higher density modules to give users the option of raising their Mac Pro system memory to the advertised 64 GB right up to 128 GB."

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the most advanced DDR3 memory, based on a new 20 nanometer process technology, for use in a wide range of computing applications. Samsung has pushed the envelope of DRAM scaling, while utilizing currently available immersion ArF lithography, in its roll-out of the industry's most advanced 20-nanometer (nm) 4-gigabit (Gb) DDR3 DRAM.

With DRAM memory, where each cell consists of a capacitor and a transistor linked to one another, scaling is more difficult than with NAND Flash memory in which a cell only needs a transistor. To continue scaling for more advanced DRAM, Samsung refined its design and manufacturing technologies and came up with a modified double patterning and atomic layer deposition.

There are people in our world, who are ashamed of their dusty computer and they mostly hide it under a desk. They don't want to look at it everyday, cause they don't consider it beautiful or interesting. Thankfully there are also people who put their computer on the desk. They choose elegant and nice looking chassis with window, adequate cooling, motherboard, memory and matching cables. All selected very carefully, so the entire set looks like a real state of the art, something of what we can be truly proud of
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If your computer is placed under your desk, there is no sense for you to read the rest of this news. However if you belong to the proper group, there is today a release of new interesting memory series named Avexir Blitz 1.1 Red Dragon. Modules are built from a black PCB and superimposed black and red color heatspreaders with unique stylistic design showing a red dragon. At the top of memory manufacturer installed red lights, which gently pulsates as if our RAM was actually breathing. This gives a particularly striking effect in the evening, when our computer becomes the main source of light in our room.

Israel-based system builder Compulab announced the fourth generation Fit-PC, the Fit-PC4, which builds on the proven nettop platform. Fit-PC4 comes in two main variants, the $299 Fit-PC4 Value, and the $380 Fit-PC4 Pro. The Value variant runs an AMD A4-1250 APU, with a manageable 8W TDP to speak of. The Pro variant, on the other hand, runs a peppier AMD GX-420CA quad-core SoC, with Radeon HD 8400E graphics.

Both variants feature two DDR3 SO-DIMM slots, which can hold up to 16 GB of memory; an internal 2.5-inch drive bay with SATA 6 Gb/s interface, an mPCIe+mSATA 6 Gb/s slot, and a micro-SDXC card slot, wrapping up the storage department. Display outputs include two HDMI 1.4a ports on both variants, with 7.1-channel digital audio streams. 7.1-channel digital audio is also given out by TOSLINK SPDIF, on both variants. Analog audio outputs include just the stereo headset jacks. Networking includes two gigabit Ethernet interfaces on both variants. While the Value variant offers 802.11 b/g/n WLAN with Bluetooth 3.0, the Pro variant tops that with 802.11 ac and Bluetooth 4.0. The Pro variant measures 16 cm x 19 cm x 3.7 cm; while the Value variant is more compact, at 16 cm x 16 cm x 2.5 cm.