Intel's recently announced Core Ultra Series 3 "Panther Lake-H" mobile processor die-shot has been annotated by Kurnal Insights. "Panther Lake-H" is a disaggregated processor, just like its predecessor, "Arrow Lake-H," and "Meteor Lake," but Intel has followed a disaggregation plan resembling that of "Lunar Lake," where an SoC tile contains the CPU cores across both the main compute complex and low-power island; the NPU, and the processor's main integrated memory controllers; the Graphics tile contains the iGPU's number-crunching machinery, the Xe cores; while the I/O tile contains the chip's various platform I/O components.

The SoC tile is built on the Intel 18A foundry node. On the mainstream notebook "Panther Lake-H" processor variants, such as the one annotated below, the Graphics tile contains 4 Xe cores, and is built on the Intel 3 foundry node. On the ultraportable "Panther Lake-U" processor with powerful integrated graphics meant for devices lacking discrete GPUs, the Graphics tile has 12 Xe cores, and is built on the TSMC N3E node. The I/O tile continues to be built on the same TSMC N6 node as the ones on previous-generation "Arrow Lake" processors.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, today introduced that its Z890I Nova WiFi R2.0, paired with two Kingston 4-rank DDR5 128 GB memory modules, has successfully enabled CQDIMM support through optimized circuit design and hardware and software tuning. The platform achieves DDR5-7400 MT/s operation with a total capacity of 256 GB, surpassing the DDR5-7200 MT/s limit commonly seen on most platforms today. This milestone represents a major breakthrough for high-capacity, high-bandwidth DDR5 memory applications.

CQDIMM is based on a 4-rank CUDIMM (Clocked Unbuffered DIMM) design, with a maximum capacity of 128 GB per module and a native speed of DDR5-7200 MT/s, addressing the long-standing challenge of balancing large memory capacity with high bandwidth. With CQDIMM support, the Z890I Nova WiFi R2.0 further pushes memory performance to DDR5-7400 MT/s, delivering a memory configuration that combines both high capacity and high performance to meet the demanding requirements of AI computing, content creation, and professional workloads.

Morefine has announced the N1 NAS, a tower-style NAS solution that packs the AMD Ryzen 7 Pro 8845HS, up to 96 GB of DDR5-5600 ECC memory, dual 10 GbE ports, and built-in PCIe expansion. Pricing starts at $759 for a barebones version, but 32 GB of memory bumps that up to $1,209, while the 64 GB and 96 GB versions come in at $1,569 and $1,929. The Morefine N1 has three M.2 slots for up to 12 TB of SSD storage alongside four hot-swap 3.5-inch HDD bays accessible via the top of the case for an additional 120 TB. The aluminium case itself measured 218 × 193 × 372 mm, making it considerably smaller than many ITX systems but not quite as svelte as a traditional mini PC, like the recently announced Minisforum MS-A2.

The N1 also comes with a built-in 800 W PSU with 400 W dedicated to the GPU power budget, making it adequate for something like an NVIDIA GeForce RTX 5070 Ti, although the included PSU power connectors are not specified. Internal space for the dGPU is limited to 330 mm × 66 mm, too, so SFF GPUs will be the way to go. The port selection is also fairly decent for an SFF PC, packing dual USB 2.0, 1× USB4 port, 1× USB 3.2 Gen 2, 1× USB 3.2 Gen 1, a full size SD card reader, 1× HDMI 2.0, and dual 10 GbE RJ 45 ports. It also has a small 3-inch full color touch screen on the front of the case for displaying things like system information.

Micron Technology, Inc. (Nasdaq: MU) today extended its leadership in low-power server memory by shipping customer samples of the industry's highest-capacity LPDRAM module—256 GB SOCAMM2. Enabled by the industry's first monolithic 32 Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures.

The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint.

ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel Xeon 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen 5 connectivity, and up to 2 TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities. Built for professional computing environments, it includes a robust 1600 W power supply unit, TPM 2.0 security, and Intel vPro manageability. With support for both 4U tower or rack-mount configurations, the series is primed for advanced edge AI computing platforms, powering Gen AI LLMs, AI training and inference, visual computing, data analytics, and compute-intensive industrial applications that demand exceptional processing power and reliability.

iEPF-11000S: Quad-GPU Edge AI Platform with Intel Xeon 600
Powered by Intel Xeon 600 processors, the iEPF-11000S Series delivers high performance for edge AI computing, real-time analytics, and compute intensive industrial automation. Supporting up to 2 TB of quad-channel DDR5 ECC RDIMM memory, it ensures fast, reliable, and memory-intensive processing for AI model training, predictive maintenance, and automation. Designed for AI acceleration, deep learning, and high-performance visual computing, the iEPF-11000S Series supports up to four discrete GPUs, delivering the compute power needed for multimodel parallel inference, AI training, and intensive visual computing. Its powerful computing resources enable accelerated deployment of real-time AI inference, data analytics, and intelligent industrial automation.

AMD has expanded the availability of its Ryzen 5 5500X3D to the Chinese market, giving new life to a processor that first appeared in Latin America last year. There was no formal launch event or major announcement. Instead, the chip appeared through retail channels quietly, with a listing price of 1,199 RMB (roughly $175). At its core, the Ryzen 5 5500X3D is a six-core, 12-thread "Zen 3" processor designed for the AM4 platform. It runs at a 3.0 GHz base frequency and can boost up to 4.0 GHz. What sets it apart from standard Ryzen 5 models of the same generation is its expanded cache configuration. With a combined 99 MB of L2 and L3 cache, it targets gaming workloads that benefit from reduced memory latency and improved data access patterns, as seen with the other X3D SKUs.

AMD lists the processor at a 105 W TDP, and buyers should note that it does not include a bundled cooler and lacks integrated graphics. At $175, this pricing positions the 5500X3D as one of the more accessible X3D options available. AMD revived its AM4 socket with an additional "Zen 3" chip, but this time in an X3D variant to keep up with modern designs in performance. With support for DDR4 memory, PCIe 4.0, and a wide range of AM4 motherboards, including X570 and B550, the 5500X3D offers existing users a relatively inexpensive drop-in upgrade. For those running Ryzen 3 or Ryzen 5 from the 5000 series, this chip could be a very good upgrade without having to switch to a completely new platform and the more expensive DDR5 memory.

She travelled across space and time to fulfil the prophecy bestowed upon her. Now Reva takes her place amongst the legendary OcUK TechForge Gaming PC range with the brand new REVAlution Gaming PC. Built to travel the universe and facilitate high-performance gaming, the OcUK TechForge REVAlution harnesses the latest gaming hardware to delivered 4K AAA gaming with ease.

Hardware built to defy destiny
Reva's Shatterclaws aren't the only tech designed with performance and strength in mind, as under the hood the OcUK TechForge REVAlution houses the very best hardware. Powering the system is AMD's brand new Ryzen 7 9850X3D, the fastest gaming CPU on the market. With 32 GB of Patriot Viper RGB XTREME 5 DDR5 RAM and Kioxia's EXCERIA 2 TB SSD NVMe M.2, the OcUK TechForge REVAlution spared no expense on its journey across space and time.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing the launch of the industry's first and highest-density blade server platform powered by the latest AMD EPYC 4005 series processors. Designed with a flexible, density-optimized blade architecture, Supermicro's new MicroBlade platform is designed for longevity and versatility. By including the latest AMD EPYC 4005 series processors, along with previous versions, the system provides seamless scalability and long-term investment protection, allowing organizations to expand and upgrade as compute requirements evolve.

"Our flexible blade architecture enables customers to mix different node types with different CPUs within a single enclosure and can incorporate up to 320 server nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "Supermicro continues to lead the industry in delivering advanced, energy-efficient platforms to market that maximize scalability, lower total cost of ownership, and protecting data center investments for the long term."

TrendForce's latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to include general-purpose servers. This shift has extended memory procurement beyond HBM3e, LPDDR5X, and high-capacity RDIMMs to RDIMMs across multiple densities. Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q25, up 29.4% QoQ.

Across segments, buyers have struggled to secure sufficient supply amid a widening supply-demand gap. This has significantly strengthened suppliers' pricing power. Conventional DRAM contract prices rose 45-50% QoQ, while blended contract prices for conventional DRAM and HBM increased 50-55%, marking an accelerated upswing across all product categories.

Team Group Inc. today announced its strong return to Embedded World 2026, one of the world's premier events for embedded technologies, following its Embedded Award-winning presence at last year's exhibition. Building on this momentum, Team Group will focus on two core themes, "Edge to Action" and "Military", highlighting AI-driven intelligent applications alongside mission-critical data security solutions for highly sensitive environments.

The showcase will feature a comprehensive portfolio spanning high-performance embedded storage and military-grade physical destruction technologies, demonstrating Team Group's continued commitment to advancing efficiency, stability, and security across industrial and defense-related sectors while delivering end-to-end solutions that seamlessly connect edge computing with real-world deployment. Embedded World 2026 will take place from March 10-12 at the NürnbergMesse Convention Center in Nuremberg, Germany. Team Group cordially invites visitors to Hall 3 / Booth 3-349 to explore its latest embedded breakthroughs designed to enable more precise, trusted, and secure intelligent applications.

Innodisk, a leading provider of industrial-grade memory solutions, announced the CXL Add-in Card (AIC), a major addition to its CXL product portfolio. Innodisk developed this CXL-based expansion card in response to rising memory demands in next-generation computing and the limited scalability of current motherboard designs. Connecting via the widespread and mature PCIe interface, the CXL AIC delivers fast memory access without occupying system DIMM slots. It also provides greater flexibility in memory usage and allocation. Its HHHL form factor, paired with Innodisk's compact DDR5 RDIMM/RDIMM VLP, unlocks new possibilities for microdata centers and edge systems, especially in latency-critical scenarios such as 5G networking, high-frequency trading, and smart medical imaging.

Flexible Memory Expansion Up to 256 GB
The Innodisk CXL AIC features two onboard RDIMM sockets that provide flexible memory expansion up to 256 GB (128 GB x2), allowing easy capacity adjustment by swapping RDIMM modules based on system needs. By connecting through PCIe slots, it not only preserves the system's native DIMM slots but also delivers an additional 32 GB/s of bandwidth via its PCIe Gen 5 x8 interface. This minimizes latency when the CPU accesses shared memory, enabling faster data flow for bandwidth-intensive applications such as AI inference and edge processing.

Retail DDR5 prices in Germany have finally shown a small sign of cooling down after the steep climb in the past months. The decline is small and not yet uniform across models, but it is the first sustained easing many DIY PC enthusiasts and small shops have noticed since prices began to spike in late 2025 and reached astronomical levels recently. A widely shared community chart tracking an average 32 GB DDR5 kit across the European Union captured the climb from autumn into early February and then a late-period dip. That chart is useful as a broad signal, but it leaves open important details such as the exact kit measured, which countries were included, and whether listed prices include taxes.

To add more context, independent checks of historical listings on Amazon Germany using CamelCamelCamel show that several mainstream 32 GB DDR5 kits have dropped from their highs. Two of the larger declines were visible on popular models from Corsair and Kingston, while other brands recorded smaller pullbacks. There are a few likely reasons for the softening. Buyers may be pausing upgrades after a period of rapid price increases. Some retailers could be cutting prices to move stock and reduce inventory risk. It is also possible that a small amount of additional supply has filtered through the distribution chain, away from the AI supply chain. However, any of these explanations still need more substance. For a complete return to normal pricing, we will probably need to see clearer improvements in production capacity or a sustained drop in demand, and this improvement could only be a short term correction.

AMD's next-generation Ryzen "Olympic Ridge" desktop processors are rumored to have been delayed to 2027. Company roadmap slides point to a debut of the "Zen 6" microarchitecture in 2026. This could be a signal that AMD is prioritizing "Zen 6" chiplets for EPYC server processors as the enterprise market has a better-secured supply of memory, and enterprise customers are more likely to stick to their procurement roadmaps for CPUs, in stark contrast to the client segment, which has been grappling with acute shortages of DDR5 memory.

With PC memory selling at prices 5-8 times above normal, 2026 may not present an ideal environment for AMD to debut a new Ryzen desktop processor generation, especially given that AMD processors tend to be heavily favored by the DIY retail channel compared to Intel, which retains a hold over the pre-built OEM market. Besides increased IPC and an updated ISA, "Zen 6" is expected to see AMD increase CPU core counts, as well as update the client I/O die. This new cIOD, likely built on 4 nm, is expected to come with updated DDR5 memory controllers that support higher speeds and have a greater degree of parallelism for dual-channel DDR5, likely with each controller addressing two 40-bit sub-channels from different channels, an approach similar to Intel's with "Arrow Lake." If your best feature is, say, DDR5-9000 support with CUDIMM optimization, you rather hold off when a 32 GB >9000 MT/s CUDIMM kit costs upward of $800.

Pricing for the ASUS ROG Xbox Ally X has increased dramatically in Japan, according to recent reports by Automaton, likely indicating an imminent price increase for Western markets as well. The price increase sees the listed price jump by 21%, from ¥139,800 to ¥169,000 including tax. The increase only applies to the ASUS ROG Xbox Ally X models, which are specced with 24 GB of LPDDR5X memory, as opposed to the regular ASUS ROG Xbox Ally, which uses 16 GB of regular LPDDR5 RAM. This has led to speculation that the reason for the price increase is the ongoing DRAM shortage, which has caused widespread price increases, delays, and general hardware shortages in the ailing PC market.

Hardware price increases often take place in Asia first, and this is hardly the first price increase we've seen occur in recent weeks. Acer Japan also just announced a price increase for both its laptops and desktop PCs in the same week as ASUS's price increase. For now, pricing for the non-Xbox-branded ASUS ROG Ally X remains stable, and pricing for the Xbox Ally X seems to have remained the same in the US on both the ASUS online store and third-party retailers, as well.

Last week, computer memory industry observers noted the US Government's "very brief" removal of ChangXin Memory Technologies (CXMT) from a trade blacklist. In early 2026, leading North American OEMs were reported as seeking alternative suppliers of consumer-grade DDR5 and DDR4 memory. China's CXMT seems to be an ideal frontrunner for brands that are currently struggling with procurements of more mainstream modules—as produced by Micron, SK hynix, and Samsung. Australia's Hardware Unboxed is in a fortunate geographical position; where CXMT IC-based kits are (kind of) readily available via big box stores. The ongoing "DDR pricing nightmare" has prompted Steve Walton's recent purchase of a cheaper KingBank KFRW DDR5-6000 CL36 32 GB (2 x 16 GB) White RGB kit. The KFRW range seems to be an Aussie market exclusive, derived from KingBank's Soarblade UDIMM product family.

Primarily, Walton compared this less familiar Chinese brand set to a "sweet spot" G.Skill Trident Z5 Neo DDR5-6000 CL30 32 GB (2 x 16 GB) kit. Prior to the present-day crisis, this former price-to-performance champ was available as low as $115 in North America. Fast-forward to February 2026, and the kit's price tag has reached a $490 high. A few weeks ago, Walton managed to pick up one of the cheapest KingBank kits, that happened to feature CXMT's homegrown modules—he did not disclose how much was forked over for review candidate ownership. Today's Hardware Unboxed investigative video notes that KingBank prices have increased around the mid-February period—Australians have to pay a minimum of AU$649 (~$458 USD) for currently in-stock CMXT-based sticks. Curiously, a screenshot of Mwave store listings shows a KingBank Hynix M-die-based kit being sold for a relatively reasonable AU$599 (~$423 USD). Overall, Walton recommends that locals pick up Chinese-made DRAM, if price tags are reasonable.

Corsair published a low-key blog entry earlier this month (February 2), that described their recent updating of DRAM packaging that is "security and transparency"-focused. As depicted in a lone preview shot, the new container is plastic, but Corsair insists that this change—that ditches signature yellow cardboard boxes—will still retain "environmental responsibility." Interestingly, this move was implemented at the start of the year, so recent customers could be the first to receive revised retail packaging. The company's recycled plastic clamshell-style container, reminiscent of Kingston's present-day efforts, is adorned with a yellow sleeve. A familiar set of minimal text and branding is visible, but Corsair has not included product renders on the new design, at least not printed on front/top sections. The new design offers Electrostatic Discharge (ESD) protection. So far, the North American gaming hardware/accessory firm has implemented a shift from cardboard to plastic for the VENGEANCE DDR5 (non-RGB, RGB and RGB RS) product range, specifically in two module configurations.

The official blog states that the new packaging design: "allows customers to see the actual memory modules before opening the package. Making it easier to confirm the exact product and helping ensure genuine Corsair DRAM is being returned when applicable...To further improve protection, the packaging includes a tamper-evident belly label that tears when opened, making any attempt to reseal the package immediately visible. With the current value of DRAM kits, this added layer of security helps protect customers and retailers from return fraud involving non-genuine modules, or Light Enhancement Kits being passed off as real RAM." Additionally, Corsair's still-in-rotation paper box format is due to receive a small update—the company intends to reintroduce a security label system that aims to provide a higher level of protection. Given the current street value of four module kits, this is a wise decision.

Laptop and Mini-PC maker Framework is sharing another update with the community about the company's cost base for acquiring DRAM, such as DDR5 memory. In its latest February update, the company notes that the cost for DDR5 memory in its systems is now priced at $12-16 per GB of capacity, depending on the kit size and total capacity. This means that for a 16 GB kit, customers are expected to pay anywhere between $192-256, and as much as about $400 for 32 GB of DDR5 memory in its Laptop 12/13/16 models. According to the company blog post, this represents an average price that Framework is charging depending on the kit, as there is different pricing for a single higher-capacity sticks or dual lower-capacity DIMMs going into the system.

In late December 2025, we reported that Framework's pricing was $10 per GB for 8 GB, 16 GB, and 32 GB modules, and a bit higher for dual rank non-binary 48 GB modules. However, just two months later, the situation is now much worse, as we are seeing Framework's suppliers increasing memory costs anywhere from 20-60%, depending on the configuration.

Avalue Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, provides innovative, value-based motherboards that empower industries to enhance operational efficiency. In today's competitive landscape, choosing the right industrial motherboard can significantly boost productivity, streamline operations, and enable faster, more efficient outcomes across various industries. Avalue continues to lead the way in providing cutting-edge motherboard solutions by introducing Intel Panther Lake H Core Ultra (Series 3) H Series Processors motherboard.

Avalue's EMX-PTLP supports up to 64 GB of DDR5 7200 MHz SoDIMM/CSoDIMM max. memory, delivering a significant leap in data processing speeds. Optimized for the burgeoning AI market, the board delivers up to 180 TOPS of AI performance. With the integration of PCIe 5.0, users benefit from doubled bandwidth and ultra-low latency, providing the essential foundation for AI acceleration and high-performance computing (HPC) in embedded applications.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, announces the upcoming launch of its new COLORFUL EVOL P15 gaming laptops, expanding the EVOL lineup with next-generation NVIDIA GeForce RTX 50-series graphics. Designed for gamers, creators, and performance-focused users, the EVOL P15 series combines modern processors, high-refresh-rate displays, and refined industrial styling in a versatile 15.6-inch form factor.

The EVOL P15 series will be available in two configurations, featuring NVIDIA GeForce RTX 5060 and RTX 5050 Laptop GPUs. Both models emphasize smooth gameplay, responsive multitasking, and color-accurate displays, supported by DDR5 memory, PCIe SSD storage, and advanced cooling solutions. With Windows 11 Home pre-installed alongside WPS productivity software, the EVOL P15 laptops are built to deliver balanced performance for gaming, content creation, and everyday computing.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16 GB UDIMM memory, available in 4800 and 5600 MT variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.

Designed to support a wide range of computing environments, BIOSTAR DDR5 16 GB UDIMM memory offers a balanced and dependable solution for every day and professional use. From home entertainment and office productivity to HTPC systems, NAS deployments, system integration projects, content creation, and casual to mid-range gaming, this memory delivers smooth multitasking and consistent system responsiveness across diverse workloads.

According to Nikkei Asia, some of the biggest PC makers like ASUS, Acer, Dell, and HP are exploring alternative memory suppliers amid industry-wide memory shortages, which are forcing PC OEMs to seek supply even from Chinese memory maker CXMT. Late last year, CXMT unveiled its homegrown DDR5-8000 and LPDDR5X-10667 memory modules at the 2025 China International Semiconductor Expo. This has likely prompted many OEMs to start finding alternatives to the traditional triad of SK Hynix, Samsung, and Micron, whose supply has been very limited outside AI accelerator workloads.

CXMT offers 12 Gb and 16 Gb LPDDR5X capacities, while DDR5 scales to 16 Gb and 24 Gb module formats. The 16 Gb DDR5 chips from CXMT measure 67 square millimeters, with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20% smaller than CXMT's previous G3 generation. Reportedly, CXMT manufactures these chips using a 16 nm node, which is three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. However, CXMT is progressing quickly, and its DRAM modules adhere to the official JEDEC specifications and even exceeding the specification, making them ideal for OEM PCs depending on the use case.

TrendForce's latest memory industry survey indicates that persistent AI and data center demands in 1Q26 are further worsening the global memory supply and demand imbalance, thereby increasing suppliers' pricing power. As a result, TrendForce has significantly raised its 1Q26 price forecasts for both DRAM and NAND Flash products. The quarter-over-quarter increase in conventional DRAM contract prices has been revised upward, from a previous estimate of 55-60% to now 90-95%. Similarly, NAND Flash contract prices are now expected to rise from 33-38% to 55-60%. Further upward adjustments may still occur.

TrendForce reports that PC shipments in 4Q25 exceeded expectations, resulting in a widespread shortage of PC DRAM. Even tier-1 PC OEMs with secured allocations from memory suppliers are experiencing declining inventory levels. In a market dominated by sellers, which is driving contract prices higher, PC DRAM prices in 1Q26 are projected to increase by over 100% QoQ, setting a new record for a quarterly surge.

Maingear has officially announced its latest retro-themed pre-built desktop PCs, the Retro98. The new pre-built desktops are built in SilverStone FLP02 chassis, replete with a functional turbo button—for setting PWM-controlled fans to max speed—and a big red power toggle switch, and they can be had with either a 360 mm AIO or open-loop liquid cooling designed in collaboration with Alphacool. The entire build looks rather authentic, with classic ketchup and mustard cables and classic 5.25" drive bay covers for the HDD bays tying the look together. The open-loop version is called the Retro98α, and the version that features AIO cooling is just the Retro98. Both versions of the Retro98 are limited edition, though, with only six units of the Retro98α and 32 units of the Retro98 available—by the looks of it, each specific SKU is limited to these quantities, not the series as a whole. Prices start at $2,499 for the Retro98, with the Retro98α topping out at $9,799.

Internally, the Retro98 series starts with the Intel Core Ultra 7 265K paired with 32 GB DDR5-6400 RAM, a 2 TB NVMe Gen 5 SSD, and an NVIDIA GeForce RTX 5070, with the AMD Ryzen 7 9800X3D and RTX 5080 available from $3,499. Stepping up again to $4,999 gets you an RTX 5090, a Ryzen 7 9850X3D, and the $9,799 Retro98α coming equipped with an AMD Ryzen 9 9950X3D, 64 GB of RAM, a 4 TB SSD, and an RTX 5090. All versions of the Retro98 also come with onboard Wi-Fi 7 and Bluetooth 5.4, and the cooling configuration consists of dual 120 mm front intakes, a single 120 mm rear exhaust, and three top-mounted 120 mm exhaust fans for the radiator. The Intel variant ships with an MSI Z890 Gaming Plus WiFi motherboard, while the AMD versions are all built around the MSI X870E Gaming Plus WiFi, and they all come with appropriately sized 80+ Gold-rated PSUs ranging from 650 W to 1600 W.

MS-Terminator B850M PRO II WIFI7 AM5 motherboard with support for latest AMD Ryzen processors. Despite being a microATX form factor motherboard, it comes with a 12+2+1 VRM with support for up to 300 W CPUs, which means it can easily handle the new Ryzen 9 9950X3D CPU. In addition, it also got upgraded to Wi-Fi 7, 2.5G Ethernet, and Bluetooth 5.4 for connectivity, as well as got two PCIe 5.0 x4 M.2 slots and single PCIe 4.0 x4 M.2 slot.

Since it is a microATX motherboard, the Maxsun MS-Terminator B850M PRO II WIFI7 comes with one PCIe 5.0 x16 and one PCIe 4.0 x4 slots, and four standard DDR5 DIMM slots with support for up to 192 GB of DDR5-8000 memory. In case you are wondering, it uses Realtek's RTL8125D 2.5 Gb Ethernet and MTK MT7825 Wi-Fi 7, as well as Realtek's ALC897 audio. It also supports up to 16 USB ports, with dual front and rear USB-C 10G ports, six USB 5G, and eight USB 2.0 ports.

GIGABYTE, the world's leading computer brand, proudly announces the availability of its flagship X870E AORUS XTREME X3D AI TOP motherboard after its debut alongside the X3D series in September. This model is designed to level up performance for AMD Ryzen X3D processors, featuring X3D Turbo Mode 2.0, powered by a built-in dynamic AI overclocking model and hardware chip, and equipped with GIGABYTE's D5 Bionic Corsa to unleash DDR5 performance. By leveraging advanced AI technology, XTREME cooling solution, and enhanced DIY-friendly design, as the flagship, the X870E AORUS XTREME X3D AI TOP integrates the newest, industry-defining capabilities to deliver uncompromising performance for PC enthusiasts.

At the core of this motherboard, X3D Turbo Mode 2.0, is powered by a dynamic AI overclocking model and hardware chip to adjust voltage, frequency, and temperature in real time. Resulting in a up to 25% significant performance enhancement for AMD Ryzen X3D processors in gaming and multi-tasking. While equipped with the revolutionary D5 Bionic Corsa, integrating software, hardware, and firmware to boost DDR5 memory performance up to 9000+ MT/s, pushing performance boundaries even further.