Advantech (TWSE: 2395), a global leader in IoT intelligent systems and embedded platforms, today announced the expansion of its SQRAM DDR5 7200 MT/s industrial memory module series. Designed to meet the escalating data demands of Edge AI, the new modules offer a 12.5% performance increase over previous generations and a groundbreaking 64 GB per-module capacity, setting a new benchmark for stability and scalability in outdoor deployments.

12.5% Faster, Up to 64 GB per Module
The DDR5 7200 MT/s delivers a 12.5% performance increase compared to the previous DDR5 6400 generation. In addition to higher bandwidth, each module supports up to 64 GB capacity using 32 Gb IC technology. This enables AI PCs and high-end workstations to scale system memory up to 256 GB, fully addressing the growing demands of data-intensive Edge AI and computing applications.

ASUS today announced two new ExpertCenter P600 AiO models, the 27-inch PM640GA and the 24-inch class PM670GA. The ExpertCenter P600 AiO is an all-in-one Copilot+ PC, designed to deliver next-generation AI performance for business. Powered by up to an AMD Ryzen AI 7 processor with up to 50 NPU TOPS, it combines immersive visuals, AI-enhanced collaboration and enterprise-grade security in a sleek and versatile design.

With its edge-to-edge touchscreen, adjustable stand options and built-in security features, ExpertCenter P600 AiO is engineered for the evolving needs of modern offices, retail counters and educational environments—empowering employees to work faster, collaborate smarter and stay more secure.

Gigabyte, the world's leading computer brand, announces the availability of its Z890 Plus series motherboards that support the new Intel Core Ultra 200S Plus series processors. Led by the Z890 AORUS ELITE DUO X, the Z890 Plus series brings next-generation memory capability with CQDIMM support, one-click performance boosting through Ultra Turbo Mode, and an upgraded feature set inspired by previous flagship designs.

Highlighting the CQDIMM and GIGABYTE's exclusive D5 DUO X Technology, the Z890 AORUS ELITE DUO X and Z890M FORCE DUO X WIFI7 models are engineered to achieve uncompromising performance without tradeoffs between memory capacity and speed, enabling full 256 GB capacity with two 128 GB CQDIMM modules. To ensure stable high-frequency operation, D5 DUO X Technology integrates an optimized motherboard circuit design that reduces memory channel loading and enhances signal integrity, alongside advanced BIOS tuning that intelligently manages timing, signal synchronization, and voltage management.

Arm has made a significant move stepping into production silicon for the first time in its history with the launch of the Arm AGI CPU, a data center processor designed specifically for agentic AI workloads. For over three decades, Arm has been purely an IP licensing business. With the launch of its AGI CPU series, Arm made a fundamental shift in how the company positions itself in the market. The AGI CPU is built on a 3 nm process, packs up to 136 Neoverse V3 cores, runs at a 300 W TDP, and delivers 6 GB/s of memory bandwidth per core at under 100 ns latency. It supports up to 6 TB per chip and DDR5-8800 speeds. On the I/O side, the chip features 96 PCIe Gen 6 lanes along with CXL 3.0 and AMBA CHI (Coherent Hub Interface) links. Each core handles a dedicated program thread, which Arm says eliminates throttling and idle threads under sustained load.

Specifically important in the data center business, density figures are notable. Air-cooled systems can fit up to 8,160 cores per rack, while liquid-cooled systems push that above 45,000. Data centers are expected to need more than four times the current CPU capacity per gigawatt to keep up, and Arm is arguing that x86 architecture carries too much overhead and complexity for this new class of workload. Arm claims more than 2x performance per rack versus x86, adding that this can translate to potential savings of up to $10 billion per gigawatt of AI data center capacity.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC website.

LPDDR5/5X memory devices are capable of supporting two sets of timing parameters: a full speed mode and a reduced speed mode that consumes less power. This feature allows for longer battery life for mobile devices which are a common application for LPDDR5/5X chips and modules and may also be leveraged by data centers as the use of LPDDR5/5X devices grows. The updated JESD406-5 standard documents key parameters for calculating the switching time between fast and low power modes, making the feature more efficient and allowing higher system performance.

Team Group Inc. today announced its participation in Japan IT Week, taking place from April 8 to 10 at Tokyo Big Sight. Under the theme of "Military," the exhibit highlights rugged solutions tailored for defense, security, and military computing applications. The showcase will feature high-reliability DRAM and NAND flash storage solutions with wide-temperature support, as well as data protection technologies that meet stringent military-grade requirements, demonstrating Team Group's strong R&D capabilities in industrial storage and data security. Among the highlights is the Team Group INDUSTRIAL P250Q-M80 M.2 PCIe SSD, featuring a one-click data destruction function that delivers intuitive and irreversible data protection for highly sensitive environments. Team Group welcomes industry partners and visitors to West Hall 4, Booth W25-26, to explore its latest innovations in industrial-grade storage.

The Team Group INDUSTRIAL P250Q-M80 One-Click Data Destruction SSD is designed for high-security environments, including defense and AI edge applications. It features a patented independent destruction circuit that enables dual-mode data destruction function, allowing instant logical erase or physical damage. Furthermore, a built-in power-resume destruction mechanism for harsh conditions ensures the data destruction continues even during unexpected outages, achieving zero data residue upon power restoration. The P250Q also integrates LED indicators and anti-misoperation design, enhancing usability and safety. It has earned the 2025 COMPUTEX Best Choice Award in the Cybersecurity category and the 2026 Taiwan Excellence Award, underscoring Team Group's leadership and innovation in high-security storage solutions.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today announced the official launch of its Rush Crimson Desert Limited Edition PC: a hand-built collector's collab aligned with today's launch of Crimson Desert, Pearl Abyss's open-world action-adventure set across the brutal continent of Pywel. Only 30 units will ever be produced. Orders close April 2, or when the 30th system is sold, whichever comes first.

Crimson Desert is one of the most anticipated open-world titles of 2026, and MAINGEAR crafted a system worthy of this moment. At the center of this collaboration is the Crimson Desert AMD Radeon RX 9070 XT, the Sapphire Nitro+ limited edition GPU featuring a design inspired by the game's visual identity, and the AMD Ryzen 7 9850X3D CPU, the world's fastest gaming processor, for a build that can handle everything Pywel throws at it: massive open landscapes, dynamic lighting, large-scale faction battles, and cinematic boss encounters, all without compromise.

Shortly after it announced the Z890 AORUS Elite WIFI7 Plus and Z890 Eagle WIFI7 Plus motherboards timed alongside Intel's Core Ultra 200S Plus refresh, GIGABYTE introduced what could very well be the Intel Z890 chipset-based motherboard with the leanest feature-set. The board comes with out-of-the-box support for the 250K Plus and 270K Plus. Called the GIGABYTE Z890 D Plus, this board is designed to target a very price-point, but with the top-tier Z890 chipset. It lacks any 40 Gbps USB4 or Thunderbolt 4 ports, lacks any integrated WLAN solution, and focuses on just the basics, such as wiring out up to four M.2 slots.

Built in the ATX form-factor, the GIGABYTE Z890 D Plus draws power from a combination of 24-pin ATX and two 8-pin EPS connectors, conditioning power for the CPU with a 12+1+2 phase VRM. The LGA1851 socket is wired to four DDR5 memory slots, one PCI-Express 5.0 x16 slot with an easy-eject mechanism, an M.2 Gen 5 x4 slot with heatsink, and an M.2 Gen 4 x4 slot. There are two additional M.2 Gen 4 x4 slots that are wired to the Z890 PCH. Besides the main PEG slot, there are two PCI-Express x16 slots, both of which are electrical Gen 4 x4 and wired to the PCH. Other storage features include four SATA 6 Gbps. There are no USB4/Thunderbolt 4 ports, but you get a USB 3.2 Gen 2 type-C (10 Gbps) port on the rear panel. The only networking interface is a 2.5 GbE wired LAN driven by a Realtek controller. The onboard audio solution is basic Realtek ALC887 fare. The only display output is a full-size DisplayPort. You get SMD buttons on the rear panel for power, reset, clear CMOS, and USB BIOS flashback.

Arctic has announced the updated version of its fanless Senza PC with updated internals, connectivity, and a more flexible design. The Senza AI 370 uses a familiar fanless design, with the heatsink integrated into the case of what would otherwise effectively be a mini PC, but now features the AMD Ryzen AI 9 HX 370 APU and its corresponding AMD Radeon 890M iGPU. That somewhat powerful iGPU in a silent form factor is the biggest differentiator compared to other desktops, but the Senza AI 370 is also designed to fit under a desk, virtually eliminating the need for the PC to be small in the first place. According to the Arctic online store, the Senza AI 370 retails for €1,199.99, and there are no optional barebones kits available.

Arctic markets the Senza as a silent gaming and productivity machine and claims that it can operate at temperatures as low as 50° in gaming workloads—although there were no specifics on the ambient temperature or the exact games and settings tested, so take that with a pinch of salt. To its credit, the Senza AI 370 does have 32 GB of DDR5X-8000 memory and a 1 TB PCIe Gen 4 ×4 M.2 SSD. The I/O situation is also interesting, with Arctic opting for a break-away front I/O panel module that features 1 3.5 mm audio combo jack, a USB 3.2 Gen 1 Type-A port, and a USB4 Type-C port—this module is connected to the PC via a cable, so that the ports can be mounted near the front of the desk. The actual PC itself also features the following ports: 2× USB 2.0, 2× USB 3.2 Gen 2 Type-A, 1× USB4 Type-C, 1× HDMI 2.1, 1× DisplayPort 2.1, 1× 2.5 GbE, 1× DC in, and separate 3.5 mm audio jacks for mic in and audio out. Because the PC is designed to be mounted under a desk, what would traditionally be the rear I/O is also front-facing, which should make it easier to reach.

Silicon Power (SP) announces the launch of its latest DDR5 RDIMM module, purpose-built to meet the growing demands of enterprise data centers and AI-driven computing environments. Designed with original high-quality DRAM chips, the new module delivers massive bandwidth and enhanced reliability to support intensive workloads such as artificial intelligence, machine learning, and large-scale data processing. Leveraging a high-density architecture with 32 internal banks across 8 groups, the DDR5 RDIMM maximizes throughput to unlock next-generation server performance. With speeds of up to 6400 MT/s, it empowers enterprises to accelerate data pipelines and fully utilize modern server architectures.

Advanced Reliability, Broad Compatibility, and Power Efficiency
Engineered for uncompromising stability, Silicon Power's DDR5 RDIMM integrates advanced On-Die ECC technology alongside a Registering Clock Driver (RCD), significantly enhancing fault tolerance compared to standard ECC UDIMMs. This robust design ensures superior data integrity, making it ideal for mission-critical enterprise applications that require continuous uptime.

Intel has quietly rolled out a new mobile CPU in the Raptor Lake lineup, the Core i7-13645HX. The chip is built with Intel's 10 nm process and splits its 14 cores across six Performance cores and eight Efficient cores, just like the Core i7-13650HX. That means both share the same 20-thread count, 24 MB of Smart Cache, max turbo clock at 4.9 GHz, and power specs: 55 W base, 157 W peak. However, there are some differences. The i7-13645HX supports DDR5-5600, up from 4800 on its older sibling. With that comes also an increase in memory bandwidth to 89.6 GB/s, up from 76.8 GB/s. It also sports a more capable Intel UHD Graphics P730 with 32 execution units versus just 16 on the i7-13650HX. The older part still has a slight edge in efficiency: its E-cores can boost to 3.6 GHz, while this one tops out at 3.5 GHz. But for users who need faster memory and better integrated graphics, especially those running light gaming or video workloads, the new chip might be the better choice.

Compared to the i7-13700HX, which has eight P-cores, a higher boost clock (5.0 GHz), 30 MB cache, and slightly more power headroom, this one feels like something in between, less raw performance than the top-tier HX model but with better memory support. Intel rebranded Raptor Lake as Core 200 series in late 2024, positioning it for higher-end laptops. The i7-13645HX appears to be part of that push: a refined option for systems targeting mainstream performance without stepping up to the full HX stack. No official pricing yet, as this is likely to show up in select gaming and creator machines over the next few months. Remember that just this Tuesday, Intel rolled out its Core Ultra 200HX Plus mobile processors, including the Core Ultra 9 290HX Plus and Core Ultra 7 270HX Plus. These processors add new features and architectural refinements, including support for the new Intel Binary Optimization Tool that can improve native performance in select games.

Samsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies. The signing ceremony was held at Samsung's most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.

"Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration," said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. "From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD's evolving AI roadmap."

Industry-leading embedded solutions provider AAEON (Stock Code: 6579) has announced the release of the ATX-Q870A, an ATX industrial motherboard supporting Intel Core Ultra Series 2 Processors (formerly Arrow Lake-S) and up to 256 GB of dual-channel DDR5-6400 system memory. Designed to accommodate up to 125 W CPUs from the new Intel CPU platform, the ATX-Q870A can leverage up to 24 cores and 24 threads of computing power alongside up to 36 TOPS of AI performance through the series' integrated CPU, GPU, and NPU. As such, AAEON has positioned the product as a foundation upon which compute-intensive applications such as industrial automation systems and high-performance workstations can be built.

Despite its impressive processing capabilities, it is the expandability offered by the ATX-Q870A that is most likely to catch attention. Of particular note are the board's two PCIe Gen 5 and five PCIe Gen 4 slots, which allow it to support high-spec GPUs and AI accelerators, NVMe storage, and task-specific modules like serial cards, sensor interfaces, and low-speed NICs simultaneously.

SK hynix Inc. announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing. SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology—the core infrastructure of the AI era.

Under the theme "Spotlight on AI Memory," SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.

Penguin Solutions, Inc. (Nasdaq: PENG), the AI factory platform company, today announced the industry's first production-ready KV cache server that utilizes CXL memory technology to address the critical "memory wall" challenge in AI inferencing—Penguin Solutions MemoryAI KV cache server. This innovative solution delivers up to 11 TB of CXL-based memory engineered to optimize performance of enterprise scale inference, including agentic AI. The result is lower latency, higher throughput, increased efficiency of GPU clusters, consistent achievement of stringent service-level agreements (SLAs), and faster time-to-first-token (TTFT).

While model training and tuning is primarily compute-bound and occurs episodically, the continuous memory-bound and latency-sensitive inference workloads required for inference and agentic AI are complex and fundamentally different. Inference demands are typically 30% compute driven (GPU) and 70% memory driven (RAM), elevating the need for greater memory capacity and causing performance bottlenecks and GPU idle time. Accelerating memory-dependent AI processes, Penguin's MemoryAI KV cache server increases memory capacity by integrating 3 TB of DDR5 main memory and up to eight 1 TB CXL Add-in Cards (AICs).

As PC gamers and enthusiasts, we all know by now that there is a supply shortage of various silicon components in the personal computing market, with the blame largely falling on AI demand and NVIDIA's and AMD's pivots to AI data center supply. In a recent report by Money UDN MSI's General Manager, Huang Jinqing, predicts a 15-30% price increase for its gaming products across the board as a result of the current market conditions. Jinqing goes on to say that there is an NVIDIA GPU supply shortage on the order of 20%.

As a result of the current supply shortages, Jinqing suggests that the overall PC market will shrink by as much as 10-20%. Recent retailer reports paint a slightly grimmer picture, though, with Mindfactory's sales figures pointing to a more significant decline in GPU sales volume. In light of the recent shortages, especially of DDR5 memory, hardware makers have turned to older platforms, with ASUS announcing increased production for DDR4 motherboards. Now, it seems as though MSI will follow ASUS down that path, with Jinqing confirming that it has signed long-term contracts for memory and shifted production to increase DDR4 motherboard output.

GIGABYTE is gearing up to launch a new version of its small-form-factor mini PCs called BRIX, now featuring Intel's "Panther Lake" and up to 128 GB of CSO-DIMM DDR5-6400 memory. The new BRIX GB-BRU9-386H is powered by the Intel Core Ultra 9 386H SoC with a 28 W TDP, offering a total of 16 cores distributed across four P, eight E, and four LPE core clusters (4P+8E+4LPE). It includes only four Xe3 GPU cores running at 2.5 GHz, delivering 40 TOPS. This is one of the less powerful iGPU configurations in the "Panther Lake" lineup, as the flagship Core Ultra X9 388H features 12 Xe3 cores, likely requiring better cooling for the additional GPU power. The strength of GIGABYTE's BRIX mini PC lies in its compactness, making it suitable for any work environment where GPU power isn't the main focus. With dimensions of just 112.6 x 34.4 x 119.4 mm, the volume of this tiny PC is only 0.47 liters.

Despite its small size, it is quite feature-rich, including one M.2 2280 slot for a PCIe Gen 5 SSD and another M.2 2280 slot for a PCIe Gen 4 SSD. As these BRIX PCs are barebones models, users need to add memory and storage. For storage, GIGABYTE offers a choice between two slots that support either two SO-DIMM DDR5 modules with speeds of up to 5,600 MT/s and a maximum capacity of 96 GB, or CSO-DIMM DDR5 modules running at up to 6,400 MT/s with a maximum capacity of 128 GB. The front panel includes a headset jack, two USB 3.2 Gen 2 Type-A ports, and a USB4 port. The back panel is equipped with two HDMI 2.1 ports, a USB4 port, a USB 3.2 Gen 2 Type-C with power delivery input, a USB 3.2 Gen 2 Type-A port, a USB 2.0 Type-A port, and an RJ45 Ethernet connector. Pricing and availability are still not listed, but GIGABYTE is showcasing this model on its website which means that launch is imminent.

As more gamers move toward AMD Ryzen series platforms for modern DDR5 gaming builds, v-color Technology Inc. is introducing a smarter and more flexible upgrade option with its new 1+1 DDR5 Memory and RGB Filler NON-DRAM Solution. Designed for gamers who want a more accessible way into DDR5, each kit includes one active DDR5 memory module and one matching RGB Filler module. This gives users real DDR5 performance today while keeping the clean dual DIMM RGB look that many builders want in their systems.

The concept is especially well suited for AMD Ryzen gaming systems, including the widely recognized Ryzen 7 7800X3D as well as the high-end processors such as the Ryzen 7 9850X3D. With AMD X3D architecture, single module DDR5 configurations remain a practical option for gaming focused users. This allows builders to start with one module now, lower their upfront cost, and upgrade later with a second memory module when needed.

Framework has taken a remarkably transparent approach to recent RAM price increases that affect the pricing of both its laptops and its standalone RAM sales, sticking to monthly price updates throughout the ongoing RAM shortage and maintaining a blog post with monthly updates on the industry situation. Framework's March memory pricing update will see prices on DDR5 SODIMMs increase to as much as $13-18 per GB, with lower capacity sticks seemingly trending towards the higher end of that price bracket. The price increases in question have also affected the Framework Desktop and some pre-built SKUs of the Framework Laptop 16.

Framework also confirmed that it has "started to deplete" its stockpile of low-cost SSDs that were sitting in inventory, and the company predicts that prices for the Laptop 12, 13, and 16 will continue to trend upwards in the coming months as a result of both the storage and RAM price increases. For the time being, the OEM still has supply of 2, 4, and 8 TB SN850X SSDs that are priced below market averages. The impacts of the DRAM crisis on silicon fabrication have also begun to become apparent, since the Intel Core i5-1334U in the Framework 12 is in limited supply.

MSI proudly introduces its latest generation of motherboards, purpose built to pair seamlessly with the new Intel Core Ultra 200S Plus Series processors. MSI 800 Series (Z890/B860/H810) motherboards are engineered to unlock the full potential of the newest desktop architecture, delivering and improved overall performance compared to the existing Intel Core Ultra Series 2 desktop processors. This ensures you can build a powerful, reliable system tailored to your needs.

"MSI bridges the gap between Intel's cutting-edge architecture and the high-speed demands of modern users. By pairing Intel's new Core Ultra 200S Plus Series Processors with its increased core counts and 5.5 GHz clock speeds, MSI's robust 16-phase Duet Rail Power System on the MAG Z890 TOMAHAWK WIFI II, we've created a platform that doesn't just run the latest games; it masters them. This is the definitive foundation for the next generation of high-performance computing", said James Yeh, VP, Computing & Display Group, MSI.

Silicon Power (SP) proudly announces that its XPOWER Cyclone DDR5 RGB gaming memory module has been honored with the iF Design Award 2026, one of the world's most prestigious recognitions, for outstanding product design. The award highlights the Cyclone's successful fusion of high-performance engineering and bold, minimalist aesthetics designed for gamers, overclockers, and PC enthusiasts.

Performance-Driven Design for the Next Generation
The XPOWER Cyclone DDR5 RGB series represents Silicon Power's next step in high-performance gaming memory, including the company's first Clocked Unbuffered DIMM (CUDIMM). Designed to meet the demands of modern gaming systems and performance computing, the modules support ultra-fast speeds of up to 9200 MT/s for smoother gameplay, faster data processing, and improved system responsiveness.

Patriot Memory, a global leader in high-performance memory and storage solutions, is pleased to announce its participation in Embedded World 2026. Under its dedicated industrial and embedded brand, ACPI, Patriot Memory will showcase a comprehensive portfolio of next-generation hardware designed for AIoT, edge computing, and 5G infrastructure. Highlighting the display are the new M2PDR-8LP PCIe Gen 5 x4 SSD, the high-capacity Enterprise NVMe SSD series, and high-speed DDR5 RDIMM modules featuring wide-temperature support.

As industrial applications transition toward data-heavy workloads involving AI training and autonomous systems, the demand for extreme bandwidth and thermal stability has reached a critical point. ACPI's latest offerings are engineered to address these challenges by combining cutting-edge interface standards with industrial-grade reliability.

Intel's upcoming "Nova Lake-S" has been spotted in the wild for the first time. During the Embedded World 2026 event, German media outlet ComputerBase spotted an Intel Core Ultra 400 series "Nova Lake-S" mini-PC, featuring Intel's upcoming B960 chipset and support for DDR5 memory running at 8,000 MT/s. This suggests that Intel is upgrading its integrated memory controller on the "Nova Lake" platform to support these DDR5 speeds before any XMP and factory-overclocked memory are used. The support for higher-speed memory indicates that even Intel's current memory controller, which reportedly achieves DDR5 speeds of 7,200 MT/s in the upcoming "Arrow Lake Refresh," will receive an upgrade alongside the new core IP and configuration.

Speaking of configurations, ComputerBase confirmed that the 52-core top SKU of "Nova Lake" will have a TDP of 175 W, while other configurations with a TDP of 65 W will also be available. This is a significant boost of the base TDP rating that Intel is delivering, as the current flagship "Arrow Lake" Core Ultra 9 285K carries a base TDP of 125 W, a whole 50 W less. As this CPU is a 52-core model in its top-configuration, boost frequencies are going to push the power usage much higher as the processor runs a heavier load. Graphics output is powered by Xe3P GPU IP, as previously rumored, confirming that Intel's next-generation graphics is there. For AI capability, "Nova Lake" will deliver more than 100 TOPS using the 8-bit INT8 data type, thanks to the onboard NPU and the powerful Xe3P GPU IP.

ASUS today announced ExpertCenter P700 Mini Tower (PM700MG) with AMD Ryzen AI 400-series processors, a refreshed 15-liter business desktop designed to deliver exceptional performance, scalability, and reliability for professional creators, engineers, and small businesses. With cutting-edge hardware, business-grade security, and comprehensive manageability, ExpertCenter P700 Mini Tower is engineered to be the trusted backbone of business-critical workloads.

Blending next-generation AI performance with whisper-quiet thermal design, P700 Mini Tower is built to tackle modern professional tasks with ease—from generative AI and content creation to advanced data analysis. As Copilot+ PCs, these new desktops bring intelligence and creativity to the forefront of everyday business, while the exclusive ASUS MyExpert all-in-one AI platform boosts productivity in multiple innovative and flexible ways. They also benefit from ASUS ExpertGuardian, providing all-around protection for sensitive data, plus military-grade durability to ensure long-term reliability.

Given the current state of the gaming industry, rumors have started to emerge about the next-gen gaming console launches, with previous rumors claiming that the PlayStation 6 would launch alongside a new standalone PlayStation Portable gaming handheld, and that the PS6 would have less graphical processing power than the upcoming Xbox console. In a new post on YouTube, ubiquitous leaker and industry insider, Moore's Law is Dead, claims that the PS6 Orion—the living room console—will feature 2.5-3× the rasterization performance of the PS5 and 6-12× the ray tracing performance of the PS5, or 3-6× faster ray tracing than the PS5 Pro and roughly twice the raster performance of the PS5 Pro. This is thanks to a significantly faster RDNA 5 GPU with 52-54 CUs running at around 2-3.6 GHz and delivering around 34-40 TFLOPS of theoretical performance.

The leaker also shot down rumors that recently surfaced claiming that the PlayStation 6 may be delayed to as late as 2029 due to the ongoing memory crisis, stating that the nature of memory and APU fabrication contracts make it unlikely that the PS6 will be delayed that long. Instead, we may see a brief period of increased pricing or scarcity at launch. Apparently, according to his sources, Sony has a contract with TSMC to start mass-producing the PS6 as early as Q2 2027. MLID also mentions the AMD "Canis" APU slated to arrive in the PS6 handheld console, claiming that it will feature four Zen 6c cores, two Zen 6 LP cores (for running the operating system), and 16 RDNA 5 CUs running at 1.6-2 GHz with a 15 W total board power, all being fed by LPDDR5X memory over a 192-bit bus. All of this will allegedly be targeting 1080p gameplay with a significantly higher power limit when docked. He also speculates that the handheld will feature "vastly better" ray tracing than the PS5.