AMD at Computex announced the new EXPO Ultra Low Latency memory OC profile standard (EXPO-ULL). This is an SPD profile extension, just like Intel XMP and the original EXPO, but is a standard that prescribes extremely tight memory timings for memory speeds typically marketed to AMD systems, such as DDR5-6000 and DDR5-6400. AMD Ryzen 7000 series and Ryzen 9000 series processors are limited in how fast their memory can be clocked when compared to Intel's DDR5 platforms, but there's room to significantly tighten memory timings.

Memory vendors were simply selling their mid-range DDR5-6000 and DDR5-6400 memory with timings typical of those speeds as AMD EXPO products. AMD's intervention sees memory vendors ship DDR5-6000 and DDR5-6400 kits with significantly tightened timings, so there is a tangible performance benefit being offered to PC enthusiasts versus opting for JEDEC DDR5-6000/6400 kits. Memory vendors onboard with the EXPO-ULL program include G.Skill, Kingston, Klevv, Lexar, Team Group, V-Color, and ADATA XPG. AMD provided first-party testing of how EXPO-ULL memory provides an up to 13% increase in FPS versus generic JEDEC memory kits, and average FPS gains of 4%. The company didn't specify a release date, but we could expect EXPO-ULL memory kit launches from the above vendors throughout 2026.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory, is showcasing an ultra-high speed DDR5 CU-DIMM 32 GB (2× 16 GB) memory kit operating at an impressive DDR5-9200 CL74-74-74-148 speed with only 1.1 V DRAM voltage, validated on the flagship MSI MEG Z890 GODLIKE motherboard platform.

As memory performance continues to advance, balancing high frequency and operation voltage has become increasingly important. Demonstrating the quality of G.SKILL's memory engineering and IC selection process, this DDR5-9200 32 GB (2× 16 GB) CU-DIMM kit is able to achieve an extreme memory frequency while operating at the standard JEDEC voltage level of just 1.1 V. This demonstration highlights the potential of next-generation DDR5 memory technology, where users can benefit from higher bandwidth while maintaining lower power consumption and thermal output.

ASRock has officially announced an update to its fanless iBox mini PC line-up designed for industrial applications. The updated versions of the iBox mini PCs are available with either the Intel Core Ultra X7 358H and the Intel Core Ultra 5 325 CPUs. The Core Ultra X7 CPU variant will be available with dual-channel DDR5-7200 RAM, while the Ultra 5 325 SKU comes with dual-channel DDR5-6400 memory, both are available with up to 128 GB of memory, and all SKUs support in-band ECC. The mini PCs do not ship with storage, but they feature both an M.2 2242 and 2280 slot (M key).

The chassis of the ASRock iBox is made of aluminium and weighs in at 3 kg, with the aluminium housing aiding in cooling the Panther Lake internals. Given its industrial intentions, the iBox fanless PC is quite pragmatic, with a number of high-speed connectivity options. The iBox mini PC's front I/O consists of a single USB 3.2 Gen2 Type-A port, a Thunderbolt 4/USB4 port with DP 2.1 support, a USB 3.2 Gen2 ×2 Type-C port with DP 1.4a support, two USB 2.0 Type-A ports, a 3.5 mm audio jack, and a COM port. On the rear, there are dual HDMI 2.1 ports, two 2.5 Gb Ethernet LAN ports, two USB 3.2 Gen2 Type-A ports, and an OOB port for remote power on/off/reset functionality. Pricing is subject to inquiry on ASRock's product page.

AMD began shipping the first production units of the AMD Versal Prime Series Gen 2 2VM3858 device in late 2025. Since then, the Versal 2VM3558 device has also entered full production, and the Versal 2VM3358 device is now sampling and on track to reach production later this year. With the majority of previously-announced Versal Prime Gen 2 adaptive SoCs now in customers' hands, today AMD is announcing the expansion of this portfolio with three new devices: the Versal 2VM3454, 2VM3254, and 2VM3104. These new adaptive SoCs deliver up to 100k DMIPs of scalar compute in packaging as small as 23 mm x 23 mm for embedded applications in Pro AV, broadcast, industrial IoT, and beyond.

Next-Level Performance, Optimized for Area
Versal Prime Series Gen 2 adaptive SoCs combine high-performance embedded CPUs for scalar processing, world-class programmable logic, cutting-edge video encode/decode IP, and support for DDR5 & LPDDR5X memory to enable next-generation embedded systems. The earliest Versal Prime Gen 2 devices, the 2VM3858, 2VM3558, and 2VM3358, feature 8 Arm Cortex -A78AE application cores and 10 Cortex-R52 real-time cores, delivering up to 10X scalar compute vs. previous AMD Versal or Zynq UltraScale+ adaptive SoCs. While this level of compute is compelling for applications such as avionics and robotics that involve complex algorithms, decision-making, and control, it comes with footprint and resource trade-offs that aren't ideal for every use case.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced its complete DDR5 9600 Client Memory Module Chipset for high-performance CUDIMM, CQDIMM and CSODIMM modules in future generation AI PCs. The chipset includes the new Gen 2 Client Clock Driver (CKD02), delivering breakthrough performance with support for PC memory module operation of up to 9600 MT/s, Power Management IC (PMIC5120) and Serial Presence Detect Hub (SPD Hub).

With the rise of agentic AI, PCs now plan, execute, and adapt workflows in real time. These workloads require persistent context, concurrent processing, and continuous data movement between the processor and system memory requiring significant increases in both bandwidth and capacity. At the same time, scaling DDR5 memory beyond 6400 MT/s introduces new technical challenges, including signal degradation, clock jitter, and timing instability. To address these challenges, the industry is transitioning to clocked memory modules, including CUDIMM and CQDIMM for desktops and CSODIMM for laptops, which incorporate an on-module client clock driver (CKD) to condition and redistribute the clock signal.

Global memory and storage technology leader Team Group Inc. is set to showcase its latest innovations at COMPUTEX 2026, taking place from June 2 to 5. Under the themes "100% Secure Your Data, Your Technology!" and "Awaken AI, Drive Evolution," Team Group will spotlight breakthrough advancements at Booth P1225 (TaiNEX 2) and Booth I0407a (TaiNEX 1) of the Taipei Nangang Exhibition Center. Global media and industry partners are warmly invited to visit and witness Team Group's long-term strategic development across the enterprise, industrial, and gaming sectors.

Team Group has remained committed to product innovation and technological advancement, continuously driving the evolution of storage solutions across the industry. Its proprietary "One-Click Data Destruction" mechanism, applied to both industrial-grade and consumer products, has successfully secured invention patents in Taiwan and the United States. Such innovation underscores the company's robust engineering expertise and technological leadership. Leveraging advanced R&D capabilities and internationally recognized certifications, Team Group empowers users worldwide with industry-leading protection for confidential data and reliable data security solutions.

Silicon Power (SP) announces the launch of the ROG certified XPOWER Cyclone R DDR5 memory module, the latest addition to its performance-focused XPOWER gaming lineup. The new module will be showcased at COMPUTEX 2026, underscoring Silicon Power's continued push into high-performance gaming hardware designed for next-generation PC ecosystems.

ROG Certified for Next-Generation Gaming Systems
Developed in close collaboration with ASUS and validated through extensive testing within the ROG ecosystem as part of the brand's 20th anniversary initiatives, the XPOWER Cyclone R carries the prestigious ROG (Republic of Gamers) Certified badge, a validation reserved for components that meet ASUS's rigorous standards for compatibility, stability, and gaming performance across its premium platform ecosystem.

Corsair, a global leader in high-performance gaming peripherals and enthusiast PC components, today announced Corsair SHUGO DDR5, a limited-edition enthusiast memory series created for builders who see the machine as both a performance PC and a personal design statement. At the center of SHUGO DDR5 is a distinctive visual construction that elevates memory from a hidden component into a defining element of the build. Each module features premium aluminium heat spreaders, high-resolution UV printing, and precision pad printing to create a layered, collector-grade appearance. The launch designs, ONYX BLADE and SAKURA NOA, were developed in collaboration with community artists to bring originality, craftsmanship, and visual identity to premium DIY systems.

SHUGO DDR5 also introduces Corsair patent-pending light-emitting micro-drilling technology, which allows RGB lighting to shine through the side of the module and become part of the artwork itself. Each SHUGO design incorporates its own micro-hole pattern, creating lighting effects that emerge from the art rather than sitting apart from it. The result is a memory series designed to look intentional from every angle inside a showcase PC.

AMD is giving finishing touches to the "new" Ryzen 7 7700X3D desktop processor. Powered by the older "Zen 4" microarchitecture and compatible with all Socket AM5 platforms with a UEFI firmware update, the 7700X3D is essentially a downclocked 7800X3D—the flagship gaming processor from the Ryzen 7000 series. It is designed to occupy a unique price-performance point between the Socket AM4-based Ryzen 7 5800X3D, which the company recently resurrected, and the current-generation Ryzen 7 9800X3D. The older 7800X3D remains EOL.

The Ryzen 7 7700X3D is an 8-core/16-thread processor, just like the 7800X3D, but comes with lower clock speeds of 4.00 GHz base, and maximum boost frequency of just 4.50 GHz. In comparison, the 7800X3D came with a 4.20 GHz base frequency, and 5.00 GHz boost. The 7700X3D comes with a proper 3D V-Cache implementation, with a total of 96 MB of last-level cache that seamlessly combines the 32 MB on-die L3 cache of the "Zen 4" chiplet with 64 MB of 3D V-Cache stacked on top. Each of the eight cores comes with 1 MB of L2 cache. The armed with larger caches and faster DDR5 memory, the Ryzen 7 7700X3D should be faster than the Ryzen 7 5800X3D in gaming workloads; it should be faster than even the regular Ryzen 7 7700X thanks to 3D V-Cache, but it should be a few percentage points slower than the 7800X3D, which in turn was about 5% slower than the 9800X3D, and about 9% slower than the latest 9850X3D.

addlink Technology Corp. is pleased to introduce the addlink 2026 Virtual Showcase, an online product preview highlighting the company's latest storage and memory solutions for AI PCs, gaming systems, creators, and everyday digital workflows. The 2026 showcase features a focused lineup of upcoming products, including PCIe Gen 5 SSDs, high-performance DDR5 CUDIMM memory, portable SSDs, and SSD docking solutions designed to meet growing demand for faster data access, stable performance, flexible expansion, and efficient storage management.

Samsung is gradually winding down its factory production as an 18-day strike looms over the company facilities. According to South Korean news outlets, Samsung is slowing its manufacturing operations to enter what is referred to as emergency management mode, which essentially limits production capacity. According to the Seoul Economic Daily, about 43,286 factory workers have joined the picket line for the strike, which is more than half of the entire semiconductor division (DS unit) labor force. As factories face worker shortages, production lines are gradually stalling. In emergency mode, Samsung will restrict the number of new wafers introduced into the production process, which is a long and demanding procedure that typically runs 24/7. Interestingly, the factory can still operate at minimum production capacity thanks to the extensive automation involved, but operating machines still requires human involvement.

TrendForce estimates that about 3-4% of the world's global DRAM supply could be disrupted, along with about 3% of the world's NAND Flash supply. At a time when DRAM and NAND Flash shortages are at their peak, this will exacerbate the global supply chain situation. The targeted production lines in the strike are for HBM, (LP)DDR5, and some custom logic production. If Samsung's customers perceive uncertainty from the production capacity stall, many could shift to competitors like SK hynix or Micron. With more than half of the workforce absent, there will not be enough factory workers to keep production lines running, and output will drop significantly.

ASUS is entering the enthusiast PC memory market segment with its first ROG branded DDR5 memory kits. The company has launched these memory kits in China, and VideoCardz reports that BIWIN is the OEM behind the kit. The module comes with the distinct black+red ROG color scheme with gold accents commemorating 20 years of the ROG brand. ASUS recommends pairing the memory with its limited edition ROG Crosshair X870E 2006 20th Anniversary Edition motherboard.

The kit comes with a capacity of 48 GB, with two 24 GB DIMMs. These run at DDR5-6000 with tight timings of 26-36-36-76. The module includes both AMD EXPO and Intel XMP profiles for broad compatibility, but with a special "ROG Mode" profile extension that works on ASUS ROG Crosshair, ROG Maximus, and ROG Strix motherboards. The modules are crowned by an ARGB LED kit that's compatible with ASUS Aura Sync RGB controls through the company's Armoury Crate application. The special edition kit is priced at RMB ¥5,999, or USD $880. ASUS also announced the ROG-certified memory program, where popular consumer DDR5 memory vendors can offer ROG-themed (and badged) memory with ROG Mode profile extensions for special timings, and Aura Sync RGB support.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the B850 AORUS ELITE-P ICE, the newest addition to its AORUS ARI lineup and the brand's boldest step yet into anime-inspired PC hardware. Building on the massive success of the microATX B850 AORUS ARI motherboard, GIGABYTE now brings the same cultural energy to a full ATX B850 platform—proving that self-expression and uncompromising performance are not a trade-off.

The B850 AORUS ELITE-P ICE is more than a motherboard with an anime aesthetic—it is a cultural statement designed for a new generation of PC builders who demand both personality and power from their rigs. Featuring the most distinctive anime-inspired design on any B850 platform in the market today, the board ships with an exclusive ARI doll blind box accessory, turning the unboxing into an experience that rivals the build itself. For enthusiasts who see their rig as an extension of who they are, the AORUS ARI edition was not designed to fit their world—it was built from it.

Framework, the maker of various modular laptops, has updated its blog post regarding the pricing and availability of consumer memory and storage configurations for its products. As the company collaborates with its supply chain to equip its laptops and mini-PCs with necessary components, it possesses inside knowledge of pricing trends that ultimately affect consumer purchases. According to the update, Framework notes that the price of DRAM has stabilized for now, and the latest DDR5 memory has remained relatively unchanged in recent weeks. This is noteworthy as memory is one of the most expensive PC components these days. This means that suppliers are offering stable prices without requiring long-term contracts, although high demand is keeping prices elevated compared to the same period last year.

However, the situation is different for NAND Flash, as Framework notes that SSD prices are facing significant challenges. The company mentions that its inventory of SSDs purchased in 2025 still exists, and they have been selling these SSDs at prices well below the current market value. Essentially, Framework honored the pricing it set when acquiring these SSDs, providing customers with some relief when purchasing storage expansion. However, this will not remain the case for much longer, as Framework expects the old inventory to be depleted as soon as next month. The company will then have to sell SSDs at current acquisition prices, which are several times more expensive than those acquired last year. Framework previously sourced SSDs from Western Digital but is now introducing new modules from Sandisk, which now owns Western Digital SSDs, as well as from ADATA, Phison, and possibly other suppliers.

V-Color Technology Inc., a global provider of high-performance memory solutions, today announced full-range compatibility of its OC RDIMM memory with Intel Xeon 6 processors and Intel W890 chipset workstation platforms. This expanded lineup strengthens V-Color's next-generation workstation memory portfolio, offering capacities from 16 GB to 256 GB per module with support for both 4-DIMM and 8-DIMM configurations, delivering flexible deployment options for professionals who require higher memory bandwidth, scalable capacity, and reliable performance under sustained workloads.

The latest V-Color OC RDIMM lineup for Intel W890 platforms is built with the new SK hynix 8000 MT/s DDR5 Chips. This enables to achieve higher frequency performance while maintaining efficient operating voltage for workstation-class deployment. With these advanced ICs, V-Color OC RDIMM memory is capable of reaching speeds of up to 9600 MT/s with 64 GB 8-DIMM configuration on ASUS Pro WS W890E-SAGE SE. This high-speed 8-DIMM capability allows professionals to combine both performance and installed capacity, supporting advanced workloads that require faster data throughput and reliable multi-module operation.

Lenovo announced the ThinkStation P4, the first workstation in the world to feature the power and efficiency of the latest AMD Ryzen PRO 9000 Series processors, the extreme AI compute of the NVIDIA RTX PRO 6000 Blackwell Workstation Edition GPUs, a cutting-edge thermal design and future-ready expandability. A desktop engineered to set new benchmarks in its class, the ThinkStation P4 is optimized for AI tasks and designed for professionals tackling increasingly complex workflows.

"As workflows become more complex and AI-driven, professionals of all levels require systems that keep pace with their evolving needs," said Tom Butler, Vice President, Commercial Portfolio and Product Management, Lenovo Intelligent Devices Group. "According to the CIO Playbook 2026, two thirds of companies prefer hybrid AI as their primary model, making workstations capable of handling AI workflows on-device a must. The ThinkStation P4 provides a strong balance of performance and value, packing flagship workstation capability in a scalable offering for engineers, designers, architects, creators and more."

IBASE Technology Inc., a leading manufacturer of embedded and edge computing solutions, unveils the ES1002 Edge AI Server, a high-performance platform engineered to accelerate next-generation edge AI and data-intensive applications. Powered by AMD EPYC Embedded 8004 (Siena) series processors, the system delivers up to 64 cores and 128 threads, enabling efficient real-time analytics, AI inference, and large-scale data processing at the edge.

With support for up to six DDR5-4800 RDIMM slots with a maximum capacity of 576 GB ECC memory, along with five PCIe Gen 5 x16 slots, the ES1002 provides exceptional computing power and scalability for demanding workloads. It features a 4U rackmount chassis design with a spacious internal layout that significantly improves thermal efficiency and overall system stability. This robust architecture is ideal for long-duration, high-load operations in mission-critical environments. In addition, multiple PCIe expansion slots enable flexible integration of network interface cards, GPUs, and a wide range of AI accelerator cards, allowing the system to adapt to diverse edge AI deployment requirements.

Micron Technology, Inc. (Nasdaq: MU), today announced it has sampled 256 GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company's leading-edge 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production today. Micron's module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron's 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256 GB module can reduce operating power by more than 40% versus two 128 GB modules, enabling greater efficiency for modern AI data centers.

Ecosystem partner validation
Micron is collaborating with key ecosystem enablers to validate the 256 GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale.

Origin Code, a performance-driven brand pushing the boundaries of hardware, today announces the latest expansion of its Vortex DDR5 family: a newly optimized 48 GB (24 GB × 2) kit running at 6200 MT/s CL28, in the striking Meteorite Black finish, will be launched at Computex 2026.

Complementing this launch, Origin Code also introduces a purpose-built independent watercooling block, designed to further enhance thermal efficiency and unlock sustained performance for high-end systems

The Chinese DRAM market has just gained another player with POWEV entering the DDR5 market. POWEV is a sub-brand of the Chinese company Jiahe Jinwei, which announced its entry into the DDR5 market almost half a decade ago but is delivering now when it is needed most. POWEV has introduced DDR5 DRAM in form factors like UDIMM, SODIMM, and RDIMM, capable of up to 64 GB capacity and available in either 4,800 MT/s or 5,600 MT/s speeds. At these speeds, modules have different latencies, so it is best to refer to the specification table below. Firstly, POWEV separates its DDR5 products into "pure domestic" memory modules and industrial memory modules. This likely refers to some modules being for PC DIY and OEM applications, while others are for servers and industrial applications.

Both categories come with non-ECC unbuffered memory modules, while RDIMMs carry registered ECC on their own DIMMs. Every module operates at a voltage of 1.2 V, with a specific pin count depending on the form factor. Interestingly, it is unclear what technology POWEV uses to manufacture these DDR5 modules and create these DIMMs, as the underlying technology is undefined. South Korean memory makers such as SK hynix and Samsung usually reveal which iteration of their 10 nm manufacturing technology is used for chip manufacturing, but that is not the case here. Jiahe Jinwei has entered mass production of DDR5 memory, but no underlying technology has been disclosed. For many, this doesn't matter as long as the performance meets JEDEC's DDR5 specifications.

HPE (NYSE: HPE) today announced the availability of HPE Compute Scale-up Server 3250, a purpose-built server for in-memory databases, engineered to deliver scalability, resilience, performance, and security for critical business transactional and analytics workloads. Powered by Intel Xeon 6 processors, HPE Compute Scale-up Server 3250 delivers the highest memory available as the first scale-up server validated by the SAP BW Edition HANA benchmark with at least 48 terabytes (TB) of memory.

"HPE Compute Scale-up Server 3250 raises the bar for business-critical infrastructure," said Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "Designed for complex business applications like enterprise resource planning and customer relationship management systems, this system helps customers in ways competitive offerings cannot - allowing them to run faster transactions, gain insights in real time, and support analytics without slowing down business. With simpler operations, always-on reliability, and chip-to-cloud security - we're redefining what scale looks like for workloads with zero-tolerance downtime."

Avalue Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, announces the launch of its next-generation value Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, announces the launch of its next-generation ECM-PTL 3.5" Micro Module, powered by the latest Intel Core Ultra Series 3 processors. Purpose-built for AI-driven edge computing and industrial automation, ECM-PTL brings AI PC architecture to the edge, delivering powerful AI acceleration, enhanced energy efficiency, and advanced heterogeneous computing capabilities.

Extending AI PC Architecture to the Edge
Designed in line with the evolution of AI PCs, ECM-PTL integrates CPU, GPU, and a dedicated NPU to enable efficient workload distribution. The built-in NPU is optimized for sustained AI workloads, allowing real-time AI inference while reducing CPU and GPU utilization. This architecture makes ECM-PTL ideal for edge scenarios requiring continuous AI processing, including machine vision, smart surveillance, and intelligent automation, where performance, efficiency, and responsiveness are critical.

PC motherboard sales are on track for some of the biggest corrections in recent times as manufacturers struggle with weak demand, according to a DigiTimes report. What began as AI data center expansion quickly started affecting consumer PC DIY endeavors, as severe silicon shortages across the industry drove DRAM and CPU demand so high that prices have increased significantly for DDR4 and DDR5 memory kits, while regular CPUs have also seen a large price increase. In response, PC motherboard makers are caught in the middle of this shortage, seeing their motherboard unit sales revised down significantly. The report notes that all Taiwanese motherboard makers have significantly lowered their 2026 shipment targets, with some experiencing more than a 25% decrease in projected unit sales.

Interestingly, it's not only CPU and memory shortages driving this lowered demand; there are indications that consumers have slowed down their NVIDIA GPU upgrade cycles, which is impacting new motherboard sales. Particularly with the "Blackwell" GPU generation, consumers began purchasing PCIe 5.0 motherboards to achieve the greatest performance increase. However, as these GPUs became rarer and more expensive due to the global DRAM shortage, consumers have become reluctant to upgrade. ASUS is projected to sell about 10 million motherboards in 2026, while MSI and GIGABYTE are now projecting sales of less than 10 million units each. This represents about a 25% yearly decrease from 2025 sales. The worst position is estimated for ASRock, which is expected to see a 30% decrease according to the report.

Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, is proud to announce its latest breakthrough in high-performance computing at Computex 2026. Leading the charge is the industry-first DDR5 8000 MT/s JEDEC Standard memory, alongside the global debut of the AQUARIUS Diamond RGB product line.

Witness 8000 MT/s: Simply Truly Plug & Play
GeIL is redefining the boundaries of high-speed DRAM by introducing the DDR5-8000 MT/s specification that fully adheres to JEDEC standards. Unlike traditional high-frequency modules that require manual BIOS adjustments or overclocking profiles, GeIL's JEDEC 8000 MT/s modules offer a "True Plug & Play" experience.

AMD's next-generation 900-series chipset to launch alongside Ryzen desktop processors powered by the "Zen 6" microarchitecture, could be fundamentally the same chipset as the current 800-series, based on the same "Promontory 21" silicon designed by ASMedia. What differentiates the platform from current 800-series and previous 600-series chipset could be a series of add-on features, new BIOS-level software features AMD is introducing with its next-gen processors, and a significantly overhauled memory support.

With its next-gen Ryzen "Olympic Ridge" desktop processors, AMD is introducing a new client I/O die, probably built on the 4 nm foundry node. This new cIOD is expected to feature a new set of DDR5 memory controllers that support higher DRAM clock speeds, tighter timings, and come with native support for CUDIMMs and CAMMs. The motherboard-side readiness for CUDIMMs and DDR5 CAMMs could be exclusive to AMD 900-series chipset models. AMD is readying the new EXPO 1.2 standard for overclocking DDR5 memory modules. With these upgraded memory controllers and native support for CUDIMMs backed by EXPO 1.2, AMD can catch up with Intel in terms of DDR5 memory speeds.