Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8 Gb DDR4 DRAM, developed using Winbond's in-house advanced 16 nm process technology, delivering higher speed, lower power consumption, and better cost efficiency solution for TV, servers, networking, industrial PCs, and embedded applications.

Despite the increasing adoption of DDR5, many industries continue to rely on DDR4 for its proven stability and well-established ecosystem. Winbond's 8 Gb DDR4 DRAM is designed for customers who depend on the DDR4's ecosystem but want faster data transfer and improved system competitiveness.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the launch of the new ARMAX DDR5 gaming memory series. Inspired by the aggressive silhouette of stealth fighter jet defending the skies, the series features a hardcore exterior and delivers high-performance speeds of up to 6,400 MT/s. The lineup includes the ARMAX RGB DDR5 with dazzling lighting effects and the understated, low-key ARMAX DDR5, aiming to be the premier DDR5 upgrade choice for next-gen gamers to conquer all gaming campaigns.

Targeting the DDR5 Performance Sweet Spot with SFF Compatibility
In response to the growing trend of SFF (Small Form Factor) mini-PC modifications, the ARMAX DDR5 features a heatsink height of just 39.5 mm. This design avoids interference with large CPU coolers, cables, or other equipment, allowing for easy installation in various small chassis. Performance-wise, the series locks into the "performance sweet spot" of next-generation platforms with speeds ranging from 6,000 to 6,400 MT/s. Built with strictly selected high-quality ICs and featuring built-in PMIC (Power Management Integrated Circuit) and On-Die ECC (Error Correcting Code), it supports Intel XMP 3.0 and AMD EXPO for easy overclocking. The ARMAX series provides gamers with a perfect experience that balances performance, style, and excellent compatibility. The XPG ARMAX DDR5 memory series is available now through global channels and comes with a limited lifetime warranty.

AMD is finalizing its GPU price increase strategy for end-of-the-year 2025. According to a new report from Chinese Board Channels, AMD is looking to increase its 8 GB SKUs pricing by $20, while the 16 GB models will absorb a $40 price increase. Overall, gamers are expected to see a price increase of 300 RMB ($42) for 8 GB models and 600 RMB for 16 GB SKUs, which is nearly $85. The price increase for memory alone will prompt AIBs to push these aforementioned price increases, confirming what we have been hearing within the industry over the past few weeks, with insights from PowerColor and others.

Board Channels ChinaAMD has officially announced a price increase for its graphics cards, with a significant increase expected this year. It is reported that several AMD graphics card brands have officially notified their channels to prepare inventory. The first wave of price increases will be $20 for 8 GB and $40 for 16 GB, with an estimated overall increase of around 300 RMB for 8 GB and 600 RMB for 16 GB by the end of the year. No new products will be launched throughout 2027.

Jon Peddie Research has released a new report on the market share of discrete GPUs, noting that Intel achieved its first single-digit percentage breakthrough since the launch of its Arc "Alchemist" GPUs for gamers. This is not a small win, as Intel historically had around half a percent share among dGPUs. Intel's late entry into the overall dGPU market has caused it to gain market share glacially slowly. It hasn't been able to disrupt the already established group that includes AMD and NVIDIA, which are commanding the remaining 99% of the market. However, despite it being only a 1% share, Intel's breakout is notable for the first time, giving Intel dGPU gamers and team blue hope to continue investment in this market.

For the remaining 99%, AMD and NVIDIA split the market a bit differently now. AMD's market share increased by 0.8% from last quarter to 7% in Q3 2025, while NVIDIA remained at a strong top with a decrease of 1.2%, putting it at 92% of the overall AIB market share. Market dynamics such as availability and pricing are all impacting the buyer decision-making process, so a slight inventory adjustment from AIBs could translate to a big increase or decrease in market share from quarter to quarter, as we see with NVIDIA here. Hence, smaller fluctuations and market share "exchange" between AMD and NVIDIA are happening often, while smaller players like Intel seem to be rising.

Samsung is reportedly preparing a major shift in its memory production strategy as DRAM demand continues to surge on the back of global AI infrastructure growth. According to Korean industry reports cited by SE Daily, the company plans to convert parts of its NAND flash lines in Pyeongtaek and Hwaseong into DRAM production, and will also run its upcoming Pyeongtaek Fab 4 (P4) as a DRAM-only line using Samsung's latest 1c process. Industry sources say Samsung has become cautious about the NAND market, while demand for standard DRAM has jumped sharply. Prices are rising fast, and some server customers are said to be offering as much as 70% higher prices for 96 GB and 128 GB DDR5 modules but still can't secure enough supply. Big tech firms reportedly expect shortages to run for years and are already negotiating DRAM allocations for 2027.

Samsung currently produces both DRAM and NAND across Pyeongtaek Fab 1, Pyeongtaek Fab 3, and its Hwaseong campus. The hybrid lines at P1 and Hwaseong will shift further toward DRAM as NAND equipment is removed. Fab 4, now in final construction, will start up next year as a dedicated 1c DRAM line, and Samsung is also considering using a second zone of P4, originally planned for foundry production, for DRAM as well. Once the changes are in place, Samsung's DRAM output from P1 (Hwaseong) and Fab 4 (P4) is expected to climb significantly in the first half of next year. Reduced Korean NAND production will reportedly be offset by higher output from Samsung's Xi'an plant in China.

ASUS has cautioned that it might need to raise prices for its PC solutions across the board if component shortages, such as DRAM and NAND flash, continue for a while longer. Speaking for Taiwan's Liberty Times, ASUS co-CEO has made remarks that: "For distribution channel pricing, ASUS will take into account costs, distribution partners and consumer demand, and then adjust the product mix and adjust product prices accordingly." This means that the increase in industry costs will be reflected in the final pricing that ASUS offers its customers. For example, if the price of DRAM increases, a PC with 16, 32, or 64 GB of DDR5 memory will likely see a price increase of a few hundred US dollars.

We recently reported that DRAM prices have surged 171.8% year-over-year, making this "commodity" one of the most valuable assets for applications ranging from data centers to home builds. Even more concerning is the fact that vendors can expect only 70% order fill rate, and smaller OEMs and channel distributors have been told to expect only 35-40% fulfillment through the first quarter of 2026. In addition to DRAM, NAND flash storage has also doubled in the past six months. Phison CEO Khein-Seng Pua recently noted that the price of a 1 Terabit TLC NAND jumped from $4.80 in July 2025 to $10.70 in November 2025, marking an increase of over 100% in less than six months. Other types of NAND flash, such as MLC and QLC, have also seen spot prices double.

Montage Technology today announced the mass production of its Gen 4 DDR5 Registering Clock Driver (RCD04) chip. As a core component of high-performance server and data center memory systems, this chip delivers significant memory performance improvements for next-generation computing platforms.

The RCD04 chip supports data transfer rates of up to 7200 MT/s, an increase of over 12.5% compared to its predecessor. By adopting an innovative power management architecture and advanced signal processing technology, the chip not only achieves higher transfer speed but also enhances power efficiency and signal integrity, thereby ensuring stable and efficient operation of large-scale data centers.

TrendForce reports that following the completion of inventory digestion in the downstream consumer market concluded at the end of Q4 2023, DRAM suppliers shifted focus towards HBM and server DDR5 products, leading to tighter supply for other DRAM types. This increase in demand pushed overall DRAM prices higher, encouraging module manufacturers to replenish stocks and boost procurement. Consequently, the global DRAM module market achieved USD 13.3 billion in revenue in 2024, a 7% YoY increase that reversed the 28% decline experienced in 2023.

In the latter half of 2024, demand momentum declined due to rising module prices. Module manufacturers struggled to transfer these high chip costs to distribution channels, limiting sales. To stay competitive, some aimed to enhance costs structure by increasing their purchase of cheaper server reball chips.

TrendForce's latest investigations reveal that the three major DRAM suppliers continue to allocate advanced process capacity primarily to high-end server DRAM and HBM, crowding out capacity for PC, mobile, and consumer applications. Combined with diverging demand across end products, this dynamic is keeping legacy-process DRAM price hikes pronounced, while newer-generation products are seeing more modest gains. Overall, conventional DRAM prices are expected to rise 8-13% QoQ in 4Q25, and when HBM is included, the increase could widen to 13-18%.

PC DRAM prices edge up slightly, U.S. CSPs consider early server DRAM procurement
Shipments of finished PCs are projected to decline with PC promotions and restocking momentum slowing in 4Q25, leading major OEMs to cut DRAM bit procurement. Meanwhile, as the three suppliers aggressively shift capacity toward server DDR5, the supply of both PC DDR5 and DDR4 remains constrained. As a result, PC DRAM prices are forecast to continue edging upward through the quarter.

According to Korean media outlet News Daily, Samsung Electronics has confirmed that it has raised contract prices for DRAM by as much as 15-30% and mobile NAND flash by roughly 5-10%, in response to a noticeably tighter supply/demand balance. Samsung reportedly notified major customers ahead of fourth-quarter contracting, following a market shift, where older-generation parts are being phased down while demand from hyperscale cloud operators and device makers racing to ship AI-enabled PCs and flagship phones has surged. Additionally, Samsung's rivals such as SK Hynix and Micron have signaled similar adjustments, with several suppliers notifying clients of double-digit increases and temporary limits on new quotes. For buyers, the result is immediate price pressure across server and mobile storage purchases, while for vendors, it is a tactical reprioritization of wafer capacity toward higher-margin, next-generation product lines.

Samsung's DRAM LPDDR4X, LPDDR5, and LPDDR5X families, as well as embedded NAND formats such as eMMC and UFS, are among those experiencing contract uplifts. Meanwhile, shortages in commodity DDR4 briefly pushed spot quotes sharply higher. Memory makers have redirected capacity to DDR5 and HBM, prioritizing HBM orders used by AI accelerators, tightening the supply of consumer-focused DRAM. Samsung, which retains roughly a third of global DRAM and NAND market share, is accelerating development of next-generation LPDDR6 even as it tweaks production schedules for legacy nodes. The pricing reset is expected to materially improve semiconductor division margins in the near term, cushioning against earlier cyclical weakness. For customers, it will force revisions to inventory planning and, likely, a renewed focus on design choices for price/performance.

TrendForce's latest investigations demonstrate that global DRAM industry revenue reached US$31.63 billion in the second quarter of 2025, up 17.1% QoQ. This growth was fueled by rising contract prices for conventional DRAM, robust shipments growth, and expanding HBM volumes. Inventory digestion at DRAM suppliers accelerated with stronger procurement momentum from PC OEMs, smartphone makers, and CSPs, driving contract prices for most products back into positive territory.

SK hynix posted bit shipments above its targets in 2Q25. However, the higher share of lower-priced DDR4 shipments limited ASP growth. Even so, revenue surged 25.8% QoQ to $12.23 billion, boosting market share to 38.7% and securing the top spot once again.

TrendForce's latest findings reveal the DDR4 market is set to remain in a persistent state of undersupply and strong price growth through 2H25. Rigid server orders are crowding out supply for the PC and consumer markets, forcing PC OEMs to accelerate DDR5 adoption.

Manufacturers of consumer electronics, meanwhile, are struggling with high prices and material shortages. The tight DRAM supply-demand balance has also pushed up mobile DRAM contract prices, with 3Q25 LPPR4X posting the largest single-quarter increase in nearly a decade.

TrendForce's latest findings show that the three major DRAM suppliers are shifting capacity toward high-end products and have begun announcing end-of-life (EOL) plans for PC and server-grade DDR4 and mobile LPDDR4X. This has triggered aggressive restocking of legacy-generation products, further fueled by traditional peak-season demand. Consequently, average contact prices for conventional DRAM are projected to rise by 10% to 15% in 3Q25. Including HBM, overall DRAM prices are expected to increase by 15% to 20%.

TrendForce notes that DDR4 demand remains strong in 3Q25, and suppliers are aiming to raise prices more aggressively. As Taiwanese manufacturers currently lack the capacity and product specifications to fully meet market needs, DDR4 supply is expected to remain tight in the short term. Moreover, DDR4 output is being prioritized for server applications, leaving limited availability for consumer-grade user.

Usually for newer technology rollout, prices are significantly higher compared to the last-gen. However, with DRAM, the story is the opposite. For the first time since the launch of DDR5, buyers are paying more for DDR4 memory modules than for the newer standard. A combination of tariff uncertainty and rapidly depleting DDR4 inventories is the main driver behind this. TrendForce data show that some high-demand DDR4 kits rose by as much as 40% in just one week, while DRAMeXchange reports that the average spot price for a 16 Gb (1Gx16) DDR4 module at 3,200 MT/s from Samsung and SK Hynix climbed to $12.50, with peak offers hitting $24. By contrast, dual-8 Gb DDR5 kits running between 4,800 MT/s and 5,600 MT/s remain near $6 on average, rarely exceeding $9. This unexpected surge follows Micron's announcement that it will wind down DDR4 production by year's end, accelerating the depletion of existing stocks over the next six to nine months.

Samsung also announced plans earlier this spring to retire its DDR4 lines and shift its focus to DDR5 and high-bandwidth memory, while China's CXMT confirmed it will scale back its DDR4 output despite recently reaching peak production levels. Taiwan's Nanya Technology is among the biggest beneficiaries of this topsy-turvy market. In the first quarter, the company held a DDR4 inventory valued at approximately NT$37.6 billion ($1.2 billion). Nanya even paused public price quoting to manage sales at these elevated levels. Many in the tech industry worry that renewed US-China trade tensions could spark another wave of panic buying. If additional tariffs target China's remaining DDR4 supply, module costs could climb to more than three times the price of DDR5, extending this rare pricing inversion well into the next quarter.

When we heard the news that NVIDIA will be halting shipments to Chinese customers for its GeForce RTX 5090D GPU in Q2, there were some speculations that the company is preparing to make a comeback. Leaving out the Chinese market is a tough decision from a business standpoint, but NVIDIA complies with export regulations imposed by the US administration under Donald Trump. However, the company now plans to keep its presence in China with the release of the export-abiding GeForce "RTX 5090DD" GPU. Carrying a GB202-240 die, it will be a cut-down version with reportedly only 14,080 CUDA cores present, paired with 24 GB of GDDR7 memory.

Chinese gamers will notice a significant difference, but so will anyone trying to acquire these GPUs for non-gaming purposes. As the US administration has banned shipments of high-end chips to China to stop them from training military-grade AI, gaming GPUs have been a target of AI firms. Now, a modified GeForce RTX 5090 DD, which not only cuts with raw compute but also firmware, should be sufficient for gaming. Carrying a PG145 SKU 40 board, the new RTX 5090DD GPU will also feature a modified 384-bit bus for its 24 GB of memory, down from the original RTX 5090D's 512-bit bus.

Update 09:45 UTC: According to one of the most accurate NVIDIA leakers, kopite7kimi, the core count for this GPU is supposed to be 21,760 CUDA cores, with 575 W TDP. The leaker did note that there is some surprise, so NVIDIA has definitely changed something big under the hood to comply with export regulations.

TrendForce's latest investigations find that DDR4 contract prices for servers and PCs are expected to rise more sharply in the second quarter of 2025 due to two key factors: major DRAM suppliers scaling back DDR4 production and buyers accelerating procurement ahead of U.S. tariff changes. As a result, server DDR4 contract prices are forecast to rise by 18-23% QoQ, while PC DDR4 prices are projected to increase by 13-18%—both surpassing earlier estimates.

TrendForce notes that DDR4 has been in the market for over a decade, and demand is increasingly shifting toward DDR5. Given the significantly higher profit margins for HBM, DDR5, and LPDDR5(X), suppliers have laid out EOL plans for DDR4, with final shipments expected by early 2026. Current EOL notifications largely target server and PC clients, while consumer DRAM (mainly DDR4) remains in production due to continued mainstream demand.

TrendForce's latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes. Samsung's redesign of its HBM3e products eased the HBM production squeezes. This prompted downstream players to clear inventories and extended the price declines seen since 4Q24.

Looking ahead to 2Q25, as PC OEMs and smartphone makers complete inventory corrections and ramp up system production ahead of the 90-day U.S. reciprocal tariff grace period, bit procurement momentum is expected to strengthen significantly. This will drive notable increases in supplier shipment volumes. On the pricing side, TrendForce forecasts a rebound across major application contract prices, with both conventional DRAM and combined DRAM (including HBM) contract prices expected to rise.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs.

These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients.

Biwin, a global leader in storage and memory solutions, announces its participation in Computex 2025, held in the Taipei Nangang Exhibition Center from May 20th to 23rd. In Hall 1, Booth #J1028, Biwin will showcase its latest products setting new benchmarks for speed, reliability, and performance in the consumer storage market. Visitors to the booth will see cutting-edge custom PC builds equipped with Biwin storage products and hands-on live product demos. With the theme "Built to Win," Biwin's booth will feature a wide array of innovative storage products designed for work, play and mobility-- with top-of-the-range Biwin Black Opal SSDs and DRAM modules sure to satisfy even the most competitive gamers, modders and overclockers.

FEATURED PRODUCTS FROM BIWIN AT COMPUTEX 2025
Black Opal X570 PRO & X570
Biwin Black Opal X570 PRO and X570 harness the power of PCIe Gen5x4 to deliver groundbreaking speeds, setting a new benchmark for high-performance storage. The X570 PRO delivers read speeds up to 14000 MB/s and write speeds up to 13000 MB/s. With a 6 nm controller and 8-channel architecture, it maximizes data throughput while maintaining exceptional power efficiency. Featuring up to 4 GB DRAM cache, it reaches 2000K IOPS random read speeds for faster high-load scenarios. While the X570 delivers impressive read speeds up to 14500 MB/s in an efficient, DRAM-less design. By leveraging Host Memory Buffer (HMB) and dynamic SLC cache, it enables faster application launches, quicker game loading, and smoother file transfers.

As a global leader in memory modules and flash memory, ADATA Technology will join forces with its new enterprise storage brand, its industrial-grade embedded storage brand ADATA Industrial, and gaming brand XPG under the theme "Advancing AI Innovation" at COMPUTEX TAIPEI, the world's largest computer industry trade show, from May 20 to 23. The exhibition will focus on three key areas—AI Computing, Smart Living, and Gaming Lifestyle—showcasing innovative products that shaping the next generation and inviting consumers worldwide to experience the future firsthand.

"The AI Computing Zone" will spotlight the debut of ADATA's new enterprise storage brand, delivering SSDs optimized for AI servers and data centers with exceptional performance and energy efficiency. For industrial applications, the company will showcase high-capacity, low-latency industrial SSDs and patented software offering full lifecycle monitoring and stable, efficient performance. Also featured are JEDEC-compliant DDR5 LPCAMM2 modules and high-capacity memory, engineered to deliver fast, energy-efficient AI computing for next-generation laptops.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

TrendForce's latest investigations reveal that the DRAM market is expected to face downward pricing pressure in 1Q25 as seasonal weakness aligns with sluggish consumer demand for products like smartphones. Additionally, early stockpiling by notebook manufacturers—over potential import tariffs under the Trump administration—has further exacerbated the pricing decline.

Conventional DRAM prices are projected to drop by 8% to 13%. However, if HBM products are included, the anticipated price decline will range from 0% to 5%.