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AMD Ryzen Die Shot and New Architecture Details Revealed at ISSCC

At the International Solid-State Circuits Conference held earlier this month, some solid information has come to surface on a subject near and dear to many enthusiast hearts right now: AMD's upcoming Ryzen CPU line.

As far as credibility, the information comes in fairly convincing form. AMD's claims are backed with die shots of actual AMD Ryzen cores and further supported by more shots of their CCX (core complex) modules. From these shots, we can guess at several things, and further more see evidence for several of their claims.

Intel Announces the Xeon E7-8894 v4 Processor

Intel today extended the performance capabilities of the Intel Xeon processor E7-8800 v4 product family with the addition of a high-performance SKU in the processor family's Advanced SKU stack. The new SKU delivers the processor family's highest performance to handle the most demanding, mission-critical enterprise workloads. Businesses can use Intel Xeon processor E7-8894 v4-based servers to derive faster insights from the unprecedented amount of data being generated to create new services and improve customer experiences.

The Intel Xeon processor E7-8894 v4 combines high memory capacity and compute performance to deliver quicker results and improved productivity. The processor is targeted at scale-up workloads such as large databases, enterprise resource planning (ERP), customer relationship management (CRM), online transaction processing (OLT) and in-memory analytics. The ability to scale-up allows more resources (more sockets and more memory) to be added to a single node image.

Intel Core i7-7700K Cracks 7 GHz Bench-Stable Overclock

It may have practically no IPC gains over its predecessor, but Intel's 7th generation Core "Kaby Lake" unlocked processors are shaping up to be an overclocker's delight. A Core i7-7700K sample tested by professional overclocker Allen "Splave" Golibersuch was able to breach the 7 GHz barrier. To achieve this feat however, HyperThreading was disabled, and two of the four CPU cores were also disabled.

Paired with an ASRock Z170 OC Formula motherboard, the i7-7700K was bench-stable at 7022.96 MHz, at the chip's maximum base clock multiplier of 69x, and a base-clock of 101.78 MHz. The Vcore voltage was set at a scorching 2.00V. The chip crunched PiFast in 9.02 seconds, SuperPi 32M in 4 minutes 20.25 seconds, wPrime 32M in 2.953 seconds, and wPrime 1024M in 1 minute 33.171 seconds. Paired with an ASUS GeForce GTX 1080 STRIX OC graphics card, it scored 643,316 points in Aquamark, and 86,798 points in 3DMark 05.

Source: OCLab.ru

AMD Ryzen Performance Review Leaked: Promising

French tech print magazine "Canard PC" is ready with early benchmarks of an AMD Ryzen 8-core processor. The scan of a page from its Ryzen performance review article got leaked to the web, revealing three key performance takeaways. In the first selection of tests, Canard PC put Ryzen through synthetic CPU-intensive tests that take advantage of as many CPU cores/threads as you can throw at them. These include the likes of H.264 and H.265 video encoding, WPrime, Blender, 3DSMax 2015, and Corona. Ryzen was found to be faster than the quad-core Core i7-6700K, and the six-core i7-6800K, but somewhere between the i7-6800K and the eight-core i7-6900K.

The next selection of tests focused on PC gaming, with a list of contemporary AAA titles, including "Far Cry 4," "Battlefield 4," "The Witcher 3: Wild Hunt," "Anno 2070," "GRID: Autosport," and "ARMA III." Here, the Ryzen sample was found to be underwhelming - it was slower than the Core i5-6600 quad-core chip clocked at 3.30-3.90 GHz; but faster than the i5-6500, clocked at 3.20-3.60 GHz. The fastest chip in the table is the i7-6700K (4.00-4.20 GHz). The reviewer still notes that Ryzen has a decent IPC gain unseen from the AMD stable in a while.

Intel Core i5-7600K Tested, Negligible IPC Gains

Ahead of its launch, a Core i5-7600K processor (not ES) made its way to Chinese tech publication PCOnline, who wasted no time in putting it through their test-bench, taking advantage of the next-gen CPU support BIOS updates put out by several socket LGA1151 motherboard manufacturers. Based on the 14 nm "Kaby Lake" silicon, the i5-7600K succeeds the current i5-6600K, and could be positioned around the $250 price-point in Intel's product-stack. The quad-core chip features clock speeds of 3.80 GHz, with 4.20 GHz max Turbo Boost frequency, and 6 MB of L3 cache. Like all its predecessors, it lacks HyperThreading.

In its review of the Core i5-7600K, PCOnline found that the chip is about 9-10% faster than the i5-6600K, but that's mostly only due to its higher clock speeds out of the box (3.80/4.20 GHz vs. 3.50/3.90 GHz of the i5-6600K). Clock-for-clock, the i5-7600K is just about 1% faster, indicating that the "Kaby Lake" architecture offers only negligible IPC (instructions per clock) performance gains over the "Skylake" architecture. The power-draw of the CPU appears to be about the same as the i5-6600K, so there appear to be certain fab process-level improvements, given the higher clock speeds the chip is having to sustain, without a proportionate increase in power-draw. Most of the innovation appears to be centered on the integrated graphics, which is slightly faster, and has certain new features. Find more performance figures in the review link to PCOnline below.
Sources: PCOnline.com.cn, WCCFTech

AMD Details ZEN Microarchitecture IPC Gains

AMD Tuesday hosted a ZEN microarchitecture deep-dive presentation in the backdrop of Hot Chips, outlining its road to a massive 40 percent gain in IPC (translated roughly as per-core performance gains), over the current "Excavator" microarchitecture. The company credits the gains to three major changes with ZEN: better core engine, better cache system, and lower power. With ZEN, AMD pulled back from its "Bulldozer" approach to cores, in which two cores share certain number-crunching components to form "modules," and back to a self-sufficient core design.

Beyond cores, the next-level subunit of the ZEN architecture is the CPU-Complex (CCX), in which four cores share an 8 MB L3 cache. This isn't different from current Intel architectures, the cores share nothing beyond L3 cache, making them truly independent. What makes ZEN a better core, besides its independence from other cores, and additional integer pipelines; subtle upscaling in key ancillaries such as micro-Op dispatch, instruction schedulers; retire, load, and store queues; and a larger quad-issue FPU.

AMD Confirms Key "Summit Ridge" Specs

AMD CEO Lisa Su, speaking at the company's Computex reveal held up the most important CPU product for the company, the new eight-core "Summit Ridge" processor. A posterboy of the company's new "Zen" micro-architecture, "Summit Ridge" is an eight-core processor with SMT enabling 16 threads for the OS to deal with, a massive 40% IPC increase over the current "Excavator" architecture, and a new platform based around the AM4 socket.

The AM4 socket sees AMD completely relocate the core-logic (chipset) to the processor's die. Socket AM4 motherboards won't have any chipset on them. This also means that the processor has an integrated PCI-Express gen 3.0 root complex, besides the DDR4 integrated memory controller. With the chipset being completely integrated, connectivity such as USB and SATA will be routed out of the processor. The AM4 socket is shared with another kind of products, the "Bristol Ridge" APU, which features "Excavator" CPU cores and a 512-SP GCN 1.2 iGPU.

Intel Intros "Crystalwell" IGP Based Core "Skylake-R" Embedded CPUs

Intel introduced a trio of embedded CPUs for SFF desktops and industrial PCs (IPCs), based on its "Skylake-R" silicon. This variant of Skylake features the largest integrated GPU Intel ever made - the Intel Iris Pro 580. This IGP features 72 execution units (compared to 24 on, say, the i7-6700K), and relies on a 128 MB eDRAM L4 cache for fast frame-buffering operations. The IGP uses this tiny yet fast cache, in conjunction with its traditional UMA system memory share, as video memory. The "Skylake-R" package is a multi-chip module of the main die with four "Skylake" CPU cores and the 72-EU IGP, and a second die housing the L4 cache.

Among the three "Skylake-R" chips Intel launched are the Core i7-6785R, the Core i5-6685R, and the Core i5-6585R. The i7-6785R features HyperThreading enabling 8 logical CPUs, 8 MB of L3 cache, and 3.30 GHz nominal clock speed, with 3.90 GHz Turbo Boost. The i5-6685R and the Core i5-6585R lack HyperThreading, and feature just 6 MB of L3 cache; the former features clock speeds of 3.20 GHz nominal with 3.80 GHz Turbo Boost, while the latter offers 2.80 GHz nominal with 3.60 GHz Turbo Boost. All three feature iGPU clocks of 350 MHz nominal, with up to 1150 MHz boost. The 14 nm chips further feature TDP of 65W, and feature dual-channel memory controllers that support both DDR4 and DDR3L memory. Sold in the OEM channel, the i7-6785R, i5-6685R, and i5-6585R, are priced at US $370, $288, and $255, respectively, per-piece, and in 1000-unit tray quantities.

Source: AnandTech

Stealth Announces the WPC-725F Waterproof IPC

Stealth, a leader in the industrial rugged computer and peripherals market has released the new model WPC-725F, a waterproof rugged, small footprint, fanless computer for harsh environments where ordinary computer hardware won't survive. The new Stealth WPC-725F is a rugged PC that is completely water-tight, surviving liquids, chemicals, dust and dirt intrusion, meeting IP67/NEMA 6 environmental specifications. Designed without cooling fans the internal CPU is passively cooled through our robust chassis design and provides noise free operation.

Stealth's WPC-725F waterproof PC offers a powerful computing solution in a tiny package and surpasses the performance of most industrial and embedded PCs available today. The system is powered by an Intel Core i7 mobile processor for maximum performance and power efficiency. "Stealth leads the market with high performance rugged solutions that operate in harsh environments," stated Louis Houde, Business Unit Director of Stealth.com. "We continue to develop product offerings with design features that benefit our customers and end users."

AMD Offers New Thermal Solutions and Processors for Near-Silent Performance

AMD today launched new thermal solutions, including the flagship AMD Wraith Cooler, as well as the new AMD A10-7860K and new AMD Athlon X4 845 desktop processors. Designed for the consumer who cares about how their desktop PC runs, sounds, and looks, AMD now offers new thermal solutions that generate less than one-tenth the noise of their predecessors -- running at a near-silent 39 decibels, about as quiet as a library.

The new AMD Wraith Cooler combines near-silent operation with unique styling via a sleek fan shroud and LED illumination. Providing superb cooling, the new design delivers 34 percent more airflow and 24 percent more surface area for heat dissipation than its predecessor.

ADATA Showcases Full Industrial Product Range at SPS IPC Drives 2015

ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, is pleased to confirm participation in SPS IPC Drives 2015, Europe's leading industrial PC and automation trade show from Nov. 24 to 26 in Nuremberg, Germany. ADATA is ready to display a wide selection of industrial products that help customers create smart manufacturing with a high degree of connectivity, automation, and control. Smart industry depends on reliable memory and storage to drive it forward, and ADATA is at the forefront of providing these.

To fulfill the latest market demand, ADATA implements large capacities and high performance specifications, with PCIe Gen 3x4 and up to 2TB density for big data process across industrial sectors. In addition, the support of PLP (Power-Loss Protection), advanced LDPC ECC and wide temperature tolerance ensure great reliability, stability, as well as data security. As for those applications requires ultra-fast computing and high power efficiency, ADATA's DDR4 DRAM modules can offer lower energy draw and faster performance compared to DDR3 while adding robust durability.

Intel Skylake Microarchitecture Detailed

The "Skylake" CPU microarchitecture is as much important to Intel as "Sandy Bridge" was, a few years ago. It allows Intel to facilitate mainstream adoption of the DDR4 memory standard (with DDR3 backwards compatibility encouraging cheap upgrades), and gives users IPC increases over older architectures. While users of Core "Haswell" processors and reasonably fast DDR3 memory will find "Skylake" a hard-sell, it should look appealing to users of much older chips, such as "Lynnfield," and perhaps even "Sandy Bridge."

The "Skylake" core is bigger than "Haswell," owing to wider pipelines, prefetcher improvements, more execution units, a bigger front-end with a higher-capacity branch predictor, cache optimizations, and an update to the way HyperThreading works. The instruction window is nearly 1.5x the size of Sandy Bridge, with an out-of-order execution window size of 224 (vs. 168 on Sandy Bridge), load/store sizes of 72/56 (vs. 64/36 on Sandy Bridge), 97 scheduler entries (vs. 56 on Sandy Bridge), and an allocation queue size of 64/thread (vs. 28/thread). The platform of "Skylake" is similar to that of its predecessor, with four notable changes - an integrated camera ISP with the chipset, DDR4 memory support, double the chipset bus bandwidth (64 Gb/s), and eDRAM support on certain CPU SKUs.

Source: HotHardware

Intel Debuts its 6th Generation Core Processor Family and Z170 Express Chipset

Intel announced its first 6th generation Core processors, codenamed "Skylake." Built on Intel's swanky new 14 nanometer silicon fab process, and in the new LGA1151 package, these processors bring DDR4 memory to the mainstream, and offer IPC improvements over the previous-generation Core "Haswell" and "Broadwell" processors. Making its debut at Gamescom, Intel is starting its lineup off with two chips that are predominantly targeted at the DIY gaming PC crowd, the Core i7-6700K and the Core i5-6600K quad-core processors. More models in the series will be launched towards the end of this month. The company also announced the Z170 Express chipset.

The Core i7-6700K features a nominal clock speed of 4.00 GHz, with a Turbo Boost frequency of 4.20 GHz. It features 8 MB of L3 cache, and HyperThreading. Its integrated Intel HD 530 graphics ticks at 350 MHz, with 1200 MHz Boost. The Core i5-6600K, on the other hand, features clock speeds of 3.50 GHz, with 3.90 GHz Turbo Boost. It features 6 MB of L3 cache, and lacks HyperThreading. It features the same integrated graphics solution as its bigger sibling. The TDP of both chips are rated at 91W. Both chips feature integrated memory controllers with support for DDR3L-1600 and DDR4-2133. The Core i7-6700K is priced around $350, and the i5-6600K around $243, in 1000-unit tray quantities. The retail packages of both chips will lack a stock cooling solution. The LGA1151 cooler mount will be identical to that of the outgoing LGA1150, so you shouldn't have any problems using your older cooler.

IBASE Announces ASB200-908 IPC

IBASE Technology, a leading provider of embedded board and systems, announced the release of its new fanless box system with 12V~24V wide range power input - ASB200-908. The system is built with the IBASE IB908 3.5-inch SBC designed with the 4th Generation Intel Core i7-4650U and i5-4300U processors. ASB200-908 is ideal for industrial automation, transportation, security and retail POS applications that can take advantage of the system's four serial ports as well as the DC-in power input. It supports IBASE's iSMART green technology featuring EuP/ErP power saving and intelligent scheduler.

Measuring only 180x150x66mm, ASB200-908 operates silently and reliably in a small footprint. It has two 1600MHz DDR3L slots that accept up to 16GB of system memory. External I/Os include 5x USB, 4x COM, 2x GbE, DVI-I, CFAST socket, HDD LED and power button. All models are available with 4GB memory and 320GB HDD. A 60W power adaptor and VESA bracket are optional.

Stealth Introduces a New Rugged 21.5" Full HD Touchscreen LCD Monitor for IPCs

Stealth (a Sparton company), a leader in the industrial computer and peripherals market has released a new 21.5" Panel Mount LCD monitor, featuring a high definition widescreen 16:9 format with 1080p resolution (1920 x 1080). The LCD is environmentally sealed to NEMA 4/IP65 specifications providing maximum protection from dirty, wet and hostile operating environments.

The SV-2150WS-PM 21.5" panel mount monitor is an IPS LCD Panel with LED Backlighting for optimal energy efficiency while delivering up to 250 Nits (Cd/m2) of brightness, a contrast ratio of 1000:1 (25000:1 dynamic) and wide viewing angles of 178°. The SV-2150WS-PM is well equipped with Resistive or Capacitive Touch Screen, VGA, DVI-D, HDMI & DisplayPort video input connectors.

Giada Unveils Intel "Skylake" Based NUC

Embedded systems and IPC major Giada is one of the first to openly exhibit a NUC (next unit of computing) compact desktop based on Intel's 6th generation Core "Skylake" processor. The i80 Ultra-Compact Mini PC by Giada features a "Skylake-U" dual-core processor, meant for Ultrabooks and NUCs; and tucks in four USB 3.0 ports, 802.11 ac WLAN, gigabit Ethernet (Intel controller), mini-DisplayPort, and HDMI 2.0, with just enough room for an mSATA SSD; in a compact chassis that measures 116.6 mm x 111 mm x 47.5 mm.

AMD "Zen" Offers a 40% IPC Increase Over "Excavator"

In its Investor Day presentation, led by CEO Lisa Su, and CTO Mark Papermaster, AMD made a slew of careful, near-term product announcements, and market strategies. One of its announcements that strike us, is the company's emphasis on getting the CPU core design right. The company talked about its "Zen" CPU core architecture, not from a technical standpoint, on how it fits into the company's near-term. It turns out that the company is betting on a massive performance increase.

AMD announced that its "Zen" CPU core, will offer a massive 40 percent increase in IPC (instructions per clock) or in other words, performance/clock, over the existing "Excavator" CPU core architecture. Zen will introduce features such as SMT (simultaneous multi-threading), a brand new low-latency cache system, and will leverage the 14 nm FinFET process. The first products based on Zen will be desktop CPUs in the 6th generation FX processor family, which will be launched in 2016. AMD plans to unify the CPU and APU into one socket, which will be called AM4 (and not the previously thought of "FM3"). You'll be able to install both CPUs (which lack integrated graphics, but feature more CPU cores); and the company's 7th generation A-series APUs (which integrate both CPU and iGPUs), on the same kind of motherboards.

AMD "Zen" CPU Core Block Diagram Surfaces

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Source: Planet3DNow, Many Thanks to qubit for the tip.

MSI Announces IPC Motherboard with Embedded Broadwell Processor

As industrial applications increasingly require higher processing performance now than ever before, MSI released MS-98G5 industrial mainboard with superior processing and graphic capability in response. MS-98G5 is a Mini-ITX board based on Intel 4th Gen QM87/HM86 architecture that come support with BGA-type Haswell/Broadwell Mobile Core i7/i5/i3/Celeron Processor, multiple displays, 1 PCIe(x16), 8 USB 2.0 & 4 USB 3.0 ports, 5 COM ports, SATA 3.0 connector, and 2 mini-PCIe slots. The flexible and rich design along with the auto-switch DC 12/19V power inputs bring system integrators more possibilities of display deployment, I/O connection, and extra expansion.

MS-98G5 is also featured with its multiple displays with HDMI, DP, DVI-I, and LVDS outputs and the HD Graphics. The brilliant display capability and the high-performance Intel 4th Gen kernel make it an ideal solution for various industrial applications, such as HMI control, ATM, Kiosk, intelligent transportation system, medical, networking, and many more automation fields.

ADATA Launches IHSS312 Industrial Half-Slim SSD

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the IHSS312, a high-performance SATA III 6Gbps 22-pin half-slim SSD of MO-297 form factor, which is available in 8/16/32/64/128/256GB capacities to meet the varying needs of IPC embedded systems, healthcare, medical devices, kiosk/POS and factory automation.

Utilizing high-speed MLC NAND flash, ADATA's IHSS312 provides excellent performance and reliability with a sequential read/write speed up to 500/125MB per second and MTBF of up to 1 million hours. Thanks to its industrial-grade operable temperature range of -40°C to +85°C, the IHSSS312 is ideal for harsh environments requiring long-term operation.

AMD's Excavator Core is Leaner, Faster, Greener

AMD gave us a technical preview of its next-generation "Carrizo" APU, which is perhaps the company's biggest design leap since "Trinity." Built on the 28 nm silicon fab process, this chip offers big energy-efficiency gains over the current-generation "Kaveri" silicon, thanks to some major under-the-hood changes.

The biggest of these is the "Excavator" CPU module. 23 percent smaller in area than "Steamroller," (same 28 nm process), Excavator features a new high-density library design, which reduces die-area of the module. Most components are compacted. The floating-point scheduler is 38% smaller, fused multiply-accumulate (FMAC) units compacted by 35%, and instruction-cache controller compacted by another 35%. The "Carrizo" silicon itself uses GPU-optimized high-density metal stack, which helps with the compaction. Each "Excavator" module features two x86-64 CPU cores, which are structured much in the same way as AMD's previous three CPU core generations.

Logic Supply Announces ML400 Series Rugged IPCs

Logic Supply, a leading provider of industrial and embedded computer hardware, has unveiled a new series of rugged PCs which breaks free of the 'black box' paradigm in the industrial hardware market. The new ML400 series combines a sleek, exciting aesthetic with ultra-reliable, fanless and ventless engineering to create the company's smallest full-size Mini-ITX system. The product of years of experience designing rugged, solid state computers, the ML400 series is the next step in the evolution of the Logic Supply product line and a distinct break from the norm in embedded computing.

"The ML400 series represents the evolution of not only our own product line, but the embedded industry as a whole," said Logic Supply CEO Roland Groeneveld. "These systems are the brains inside some of today's most cutting edge technologies, and we believe their capabilities and aesthetics should reflect that. We've worked closely with our clients to better understand what they need and want in an embedded PC, and we believe the ML400 series delivers on that research."

Intel Updates Desktop CPU Roadmap, Haswell-E, Broadwell, Devil's Canyon Blip

At GDC, Intel announced a backpedal from its plans to eventually reshape desktop CPUs into components that come hardwired to the motherboards across the line, by announcing three new CPU families. It includes the Haswell-E HEDT platform, Broadwell performance platform, and Devil's Canyon. The three are expected to launch in reverse order, beginning with Devil's Canyon. A variant of existing "Haswell" silicon in the LGA1150 package, Devil's Canyon is codename for a breed of hand-picked chips with "insane" overclocking potential. In addition to binned dies, the chips feature a performance-optimized TIM between the die and the integrated heatspreader (IHS). The dies will be placed on special "high tolerance" packages, with equally "special" LGA contact points. The chips will be designed with higher voltage tolerance levels. Devil's Canyon is expected to branded under the existing Core i7-4xxx series, possibly with "Extreme" brand extension. It will be compatible with motherboards based on the Z97 chipset.

Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.

MSI Announces MS-9A29 Fanless IPC

MSI, the leading provider of industrial PC, has released a new embedded system to the market. The newly launched MS-9A29 is an ultra compact size fanless embedded system with low-power Intel Atom processor, offering a perfect cool solution for industrial applications. The versatile installation options of wall mounting, display-attaching, and cabinet installation allow the embedded system to be easily integrated in various field sites, especially fits to space-critical application sites. Great flexibility can also be found in this product with its rich networking, storage, and expansion options. Thanks to all the friendly design, the MS-9A29 offers great cost-effectiveness with maximum flexibility and convenience for your future maintenance or expansion.

Huntkey Releases Power Supplies for Servers and Industrial Personal Computers

Huntkey Enterprise Group, a global professional power supply provider, has delivered numerous industrial power supplies to meet various demands from servers, communication, workstation, storage, networking application or any other automation applications.

Huntkey has released all kinds of form factor power supplies, such as 1U, 2U, 4U, ATX, FLEX, SFX, TFX, and so on. The high-load electrical components adopted by Huntkey industrial PSUs make them work perfectly in an industrial environment. In addition, with its full range of input and output electrical features, Huntkey products also comply with the latest safety and EMC standards, and therefore meet various regulations all over the world. Customers will be impressed by the longtime working and stable performance of Huntkey industrial PSUs.
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