AMD's Madhu Rangarajan, corporate VP of Compute and Enterprise AI, says the company never set out to build its Zen 6 EPYC 9006 "Venice" chips around agentic AI, a not-so-subtle dig at NVIDIA and Arm, which both pitch their latest server CPUs as made for that exact job. Rangarajan still called EPYC 9006 the best CPU for agentic workloads during a media session covered by Tom's Hardware. Chief Zen architect Mike Clark said much the same in a separate talk, admitting AMD didn't see agentic computing coming, though he added that the company always expected the CPU to keep a role in AI software. Here's what Rangarajan said:

We think that the EPYC 9006 CPU is the best CPU for the agentic era, and spoiler alert, we didn't magically know four years ago that agentic was going to be a thing and purpose-built something for agentic. The reality is an agentic workflow is a diverse set of tasks… and in order to execute those tasks well, you need compute that is able to handle a diverse set of workloads with a full portfolio.

MSI today announced a 64 GB configuration of its EdgeXpert desktop AI supercomputer, based on the NVIDIA DGX Spark platform. Grounded in proven deployments across legal IP governance, factory intelligence, offline voice translation, and agentic workflows, the 64 GB model complements the existing 128 GB tier to give enterprises a cost-effective path to scale AI agents. NVIDIA Sync helps teams set up a cluster of connected systems and monitor CPU and GPU activity from one desktop app.

Always-On Agentic AI at the Edge
As AI evolves from chatbots to autonomous agents, workloads require 24/7 residency, multistep reasoning, and direct access to local data. Based on the NVIDIA DGX Spark platform (1 petaFLOP FP4 AI compute), the MSI EdgeXpert 64 GB model runs up to 100B parameter open-source models entirely inside the firewall:

• Manufacturing: Drives visual quality inspection agents for real-time defect detection and corrective actions.
• Banking & Legal: Powers fraud investigation and audit agents with total data sovereignty.
• Healthcare & Retail: Hosts clinical documentation and inventory agents close to operational data.

MSI IPC introduces the MS-C9ZA, a compact fanless Edge AI Box PC powered by NVIDIA Jetson Orin Nano 8 GB for machine vision, robotics, and embedded edge AI applications. It integrates local AI inference, industrial I/O, dual Gigabit Ethernet, M.2 expansion, and 12-24 V DC input.

Powered by a 6-core Arm Cortex -A78AE CPU, NVIDIA Ampere GPU, and 8 GB LPDDR5 memory, the MS-C9ZA enables AI inference and computer vision processing at the edge, helping reduce cloud dependency, bandwidth usage, and network latency.

MSI IPC announces the launch of the MS-CF27, a compact 3.5" single board computer designed to deliver reliable computing performance, wide voltage power input, and versatile connectivity for industrial and embedded solutions.

The MS-CF27 is a newly introduced 3.5" single board computer from MSI IPC that integrates Intel Alder Lake N, Twin Lake N, and Amston Lake processors to deliver efficient performance for industrial computing. Designed for fanless and ultra low power environments, the platform supports processors such as Intel Alder Lake N97, Intel Alder Lake N305, Intel Twin Lake N150, and Intel Amston Lake x7433RE, offering performance levels suitable for both PC client and embedded applications.

The industrial world is transforming fast. As AI moves from the cloud to the edge, demand is rising for high-performance, low-latency computing that can operate reliably in real environments—powering everything from real-time defect detection in smart factories to advanced patient monitoring in healthcare. Edge AI needs hardware that's both intelligent and resilient. To meet this shift, GIGAIPC introduces a versatile lineup of motherboards based on Intel Core Ultra desktop processors (Series 2), enabling flexible system designs across diverse industrial scenarios and helping businesses deploy AI-ready solutions at scale.

Accelerating Industrial AI with Intel Core Ultra Series
Built around the Intel Core Ultra desktop processor (Series 2), this platform brings higher efficiency, stronger performance, and expanded connectivity to industrial and edge applications. This new architecture reduces package power by up to 58% in typical workloads, enabling IPC and embedded system developers to build more energy-efficient, thermally optimized, and reliable products for space-constrained and demanding environments. At the same time, performance improves over the previous generation, with up to 6% faster single-thread and up to 14% faster multi-thread performance to support real-time control, edge analytics, and multitasking workloads. Furthermore, the Intel 800 Series chipset extends platform compatibility with up to 24 PCIe 4.0 lanes, 8 SATA 3.0 ports, and 10 USB 3.2 ports, empowering industrial systems with superior scalability for I/O expansion, storage, and diverse connectivity.

The Intel Binary Optimization Tool (BOT) has been launched alongside the "Arrow Lake Refresh" series of processors, which includes the Core Ultra 5 250K Plus and Core Ultra 7 270K Plus models. While the tool is beneficial for gamers looking to extract a few extra frames from their setups, it may be a nightmare for makers of benchmarking tools like Geekbench by Primate Labs. Recently, Primate Labs testing found that BOT changes the way .exe applications run and concluded that Geekbench runs will now flag these BOT-enhanced runs. However, in deeper testing, Primate Labs discovered that Intel's BOT may deliver significant boosts in some applications like Object Remover and HDR, increasing performance by up to 30%. This is thanks to the deep vectorization that the BOT performs behind the scenes to optimize performance.

For example, Primate Labs used Intel's own Software Development Emulator (SDE) to measure how many instructions were executed and which types of instructions the program executed. Without BOT, Geekbench 6 required a total of 1.26 trillion instructions to finish, while a BOT-enhanced run completed with 1.08 trillion instructions. This is an impressive 14% reduction. However, when examining the execution by type, we see that BOT makes heavy use of vector instructions like SSE2 and AVX2. The number of scalar instructions needed to execute a program fell from 220 billion to 84.6 billion, while the number of vector instructions increased from 1.25 billion to 18.3 billion, a 13.7x increase. This means that Intel BOT finds a way to turn inefficient scalar code into vectorized instructions that are processed much more efficiently inside Intel CPUs. These techniques indicate a very complex behind-the-scenes process than was originally believed. The Geekbench v6.7 update will include a flag for BOT, allowing future Geekbench results to be easily distinguished as BOT-enhanced or not.

The rumor mill has started grinding about NVIDIA's next-generation gaming GPU, and it looks like NVIDIA does not want to allow the current market environment to get in the way of implementing its product roadmap, with a roughly 2-year GeForce generation product launch cadence. The next-generation GeForce RTX 60-series will be powered by the "Rubin" graphics architecture. "Rubin" already debuted on NVIDIA's bread-winning AI GPU series, and is making its way to GeForce, reports RedGaming Tech.

The first slice of rumors about GeForce RTX 60-series predicts that NVIDIA will stick to a more conservative approach with foundry nodes, and not go with a sub-2 nm nanosheet-based node. GeForce "Rubin" will be built on some variant of the current TSMC 3 nm FinFET node. They need not be the same N3 node that's in use by Apple, Intel, and others; and NVIDIA might collaborate with TSMC on an exclusive variant just the way it created the NVIDIA 4N node, derived from TSMC N5. Chips in the series will follow the numbering scheme "GR20x," with examples being "GR202" for the biggest part powering the flagship product. The 3 nm node will allow NVIDIA to maintain GPU clock speeds ranging between high 2 GHz and low 3 GHz, which is a minor increase over the current "Blackwell."

Alongside "Arrow Lake Refresh," Intel released a new Binary Optimization Tool, available for Core Ultra 270K Plus and 250K Plus SKUs. However, since the tool essentially changes the way .exe applications run, scores on popular benchmarking applications may be deemed invalid. According to Primate Labs, the developer behind Geekbench, the use of Intel's binary optimization tool will result in a special flag on Geekbench scores. Reportedly, as the tool modifies the instruction sequence that the CPU exhibits, benchmark scores will deviate from the standard range. In a standardized benchmarking environment, this is a massive negative consequence, as the inner workings of the Binary Optimization Tool are unknown and resemble a black box that benchmark makers like Primate Labs have to deal with. To combat the use of this tool, Geekbench will now display the message "This benchmark result may be invalid due to binary modification tools that can run on this system" as a warning.

In TechPowerUp's own testing of the Binary Optimization Tool, we found that Intel's Binary Optimization Tool boosts Geekbench v6 single-core performance by 8.2%, while the multi-core score has risen by 7.8%, resulting in about an 8% average uplift in Geekbench testing. Games like Cyberpunk 2077 experience smaller uplifts, while some select titles like Shadow of the Tomb Raider can see up to a 22% increase using the Binary Optimization Tool. In reality, Intel only supports 12 games for now, which will expand further as the company labs release more optimizations. For gamers, this is fantastic news as the performance uplift is essentially free without any drawbacks, but for benchmarks, it is a potential issue as it represents an execution mystery since no one outside Intel knows exactly how the tool runs and how the code paths get modified.

AMD is preparing to launch its "Medusa Point" APU in early 2027. However, more benchmarks are emerging to showcase what the actual SoC can do as AMD and its OEM partners test the chip. In the latest Geekbench v6 run, AMD's 10-core, 20-thread "Zen 6" chip appeared with the AMD Engineering Sample number 100-000001713-21_N, achieving a 2,300 single-core and 13,002 multicore score while officially running at only a 2.4 GHz base frequency. In real-world operation, it ran within the range of 2.0-2.1 GHz during the benchmark. The most surprising factor is that this "Medusa Point" test system can match a 10-core, 20-thread AMD Ryzen AI 9 365 "Strix Point" APU that operates at more than double the frequency. When comparing the two, "Medusa Point" scores slightly lower in single-core performance, while the multicore score is surprisingly higher.

This phenomenon could be attributed to the fact that the "Zen 6" cores in the "Medusa Point" APU are much better performing and more optimized for the workloads that Geekbench tests. The IPC improvement target from "Zen 5" in "Strix Point" to the newest "Zen 6" could be a high single-digit to low double-digit gain on average. It is likely that the combination of new instructions and IPC improvements is what is pushing "Medusa Point" so high. Since the new APU also appeared in firmware running AVX-VNNI in FP16 precision, we might be seeing these workloads getting accelerated thanks to the lower precision of the floating-point operations. For now, the situation remains a mystery, at least until more benchmarks are available in the coming months. AMD is expected to launch this new APU around CES 2027, so we still have a lot of time before official and third-party benchmarks are released.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, is showcasing its latest IPC and edge AI computing solutions at Embedded World 2026, currently taking place from March 10 to 12 at NürnbergMesse in Germany. Visitors can explore BIOSTAR's newest industrial computing platforms, including edge AI systems powered by Intel Core Ultra processors, NVIDIA Jetson-based AI solutions, and advanced industrial networking technologies. Built to support high-performance edge processing and reliable industrial deployment, these platforms enable intelligent computing for applications such as smart manufacturing, smart cities, and smart retail. Attendees can experience BIOSTAR's latest innovations at Hall 3, Booth 3-456.

Among the technologies on display at Embedded World 2026 is BIOSTAR's next-generation edge AI platform based on Intel's Panther Lake platform, powered by the latest Intel Core Ultra Series 3 AI processors. The MT PRO-U325 platform is designed to deliver strong AI processing capability and efficient edge computing performance for industrial environments. Supporting real-time data processing and AI-driven analytics at the edge, the platform enables a wide range of embedded applications and edge AI deployments across areas such as smart manufacturing, smart city infrastructure, and smart retail environments.

Intel is preparing to launch its Core Ultra Series 4 "Nova Lake" processor generation toward the end of 2026, CEO Lip-Bu Tan confirmed. This processor generation would span various form-factors, including importantly, desktop. Intel is building its next-generation "Nova Lake-S" desktop processor around the new Socket LGA1954 platform that replaces the current LGA1851. The company is planning to release Core Ultra Series 3 "Arrow Lake Refresh" for LGA1851 in the run-up to "Nova Lake-S" by yearend.

With "Nova Lake," Intel is expected to make fundamental changes to its processor design to help the company claw back performance leadership over AMD in the desktop segment. These changes include a doubling in CPU core counts going up to 16P+32E, a new iGPU based on the Xe3 "Celestial" graphics architecture, a new NPU that meets Copilot+ requirements, and the introduction of special SKUs with BLLC (big last-level cache), Intel's answer to AMD's 3D V-Cache. Intel will update the CPU complex with new "Coyote Cove" P-cores, and "Arctic Wolf" E-cores, both of which are expected to improve IPC over the current "Lion Cove" and "Skymont" combo. "Coyote Cove" does not feature HyperThreading, something the Intel CEO wants to see restored on the company's P-cores, but "Nova Lake" will make up for it with a numerical increase in P-core counts.

SolidRun has announced the first industrial PC based on the AMD Ryzen AI 9 HX 370 with support for the latest AMD ROCm 7 stack. The combination of high-performance Zen 5 cores, Radeon iGPU, XDNA NPU and high memory capacity in a compact and ruggedized x86 device provides secure and robust edge AI processing capabilities.

AMD Ryzen AI 9 HX 370 processor contains a 12C/24T Zen 5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU. Up to 128 GB of DDR5 capacity allows for the local execution of large AI models.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today announces a refined dual-track edge computing strategy for its EdgeComp industrial computing portfolio, addressing the evolving demands of IoT deployments and edge AI applications.

As edge computing adoption accelerates across industrial automation, smart infrastructure, and intelligent systems, market requirements have become increasingly segmented. IoT deployments often prioritize compact design, low power consumption, and long-term stability, while edge AI applications demand significantly higher compute performance and real-time processing capability. Recognizing these distinct requirements, BIOSTAR has formalized its EdgeComp portfolio around a clear dual-track approach, enabling system integrators and solution providers to deploy purpose-built platforms tailored to specific application needs.

MSI IPC announces the launch of its latest edge AI system, the MS-C910E, a high-performance industrial computer engineered for robust AI inference, demanding I/O tasks, and real-world industrial deployments. The MS C910E is built on the LGA 1700 Intel R680E platform and supports up to Intel Core Processors (Series 2) for strong and scalable performance. It offers 2 DDR5 SO- DIMM slots for up to 96 GB memory with ECC for reliable data handling. The system supports 4 independent displays through 2 HDMI and 2 DP outputs and delivers fast networking with four 2.5 GbE LAN ports for demanding AI and industrial tasks.

The MS C910E is built for reliability with strong resistance to vibration and shock and supports wide range DC input from 12 to 48 volt. It operates in environments from -10 °C to 40 °C, making it ready for harsh industrial conditions.

The MS-CF20 V2.0, a high-performance industrial ATX motherboard built for the demands of modern computing. With native support for 15th Gen Intel Arrow Lake-S processors and extensive I/O options, this board brings together cutting-edge performance and legacy compatibility in a single rugged platform. SI IPC's MS-CF20 V2.0 is optimized to support the latest Intel Arrow Lake S processors, including Core Ultra U9, U7, U5, Pentium and Celeron models, by using the Intel W880 chipset. It provides exceptional memory bandwidth through 4 DDR5 UDIMM slots that support both ECC and non-ECC memory, at speeds up to 5600 MT/s and with a maximum capacity of 256 GB.

On the visual front, the MS-CF20 V2.0 supports 3 independent displays via VGA, DP, and HDMI connectors, making it ideal for environments that require multiple simultaneous outputs. In addition to strong display capabilities, this motherboard offers robust networking, featuring 4 2.5 GbE RJ-45 LAN ports that support high-throughput and redundant connections. Its storage architecture is similarly flexible: 2 M.2 M-Key slots, 4 SATA 3.0 ports, and support for RAID 0/1/5/10 enable both high-speed and redundant data handling.

Apple's M-series of SoCs continues with generational performance improvements, and the upcoming M5 SoC will be no exception. A Russian YouTuber Wylsacom obtained an unreleased iPad Pro based on the M5 SoC and published benchmark data for it. As a reminder, the same source correctly previewed last year's M4 MacBook Pro. The early numbers suggest that Apple's next-generation tablet silicon focuses more on graphics than on a raw CPU jump. A single-core CPU IPC performance improves by roughly 12% relative to frequency, and multi-core performance improves by approximately 15% over the standard M4 in iPad Pro. Meanwhile, GPU performance shows significantly larger gains in some tests, reaching as much as 35% in graphics workloads. That kind of uplift won't transform every task, but it could deliver noticeably smoother frame rates in games and more sophisticated visual effects in creative apps.

Given Apple's habit of carrying phone-class architecture into its M-series chips, the M5's strengths align with improvements first seen in the family's A-class parts, where advances in neural and graphics subsystems have increasingly been used to augment traditional rendering pipelines. Digging into the sample that surfaced, the leaked iPad Pro is listed as a 256 GB model with 12 GB of RAM, which is a step up from last year's comparable 8 GB configuration. It is reasonable to expect Apple to reserve 16 GB or higher for larger storage tiers as it has in past launches. If the M5 really pairs modest CPU boosts with a substantial GPU jump, the benefits would extend beyond the iPad form factor, with thinner MacBook Air and Pro models that receive the chip also seeing improved CPU and GPU data scores, thanks to bigger cooling capacity. Especially with active cooling, Apple could push these chips way past this point, and again claim the performance crown.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today introduces the EdgeComp MU-N150, a compact, fanless industrial PC designed to meet the versatile demands of modern industrial applications. Engineered for system integrators, automation systems, edge computing, HMI terminals, and digital signage, the MU-N150 delivers powerful performance, silent operation, and broad connectivity in a rugged, space-saving form factor.

Designed for seamless integration into a wide range of industrial and commercial environments, the EdgeComp MU-N150 is ideal for system integrators managing customer data and business workflows, automation engineers developing real-time control systems, and edge computing solutions that demand high-speed local processing. With its dual Intel 2.5GbE LAN, robust I/O options, and fanless reliability, the MU-N150 also excels in HMI applications and kiosk systems, supporting essential peripherals like barcode scanners, receipt printers, and card readers. For digital signage deployments, its triple 4K display support enables crisp, multiscreen output in a compact, low-maintenance form factor.

ADLINK Technology Inc., a global leader in edge computing, proudly announces the launch of a comprehensive portfolio of industrial computing solutions built on Intel Core 200S series processors. These new platforms deliver major gains in AI performance, energy efficiency, and I/O flexibility—empowering next-generation applications in industrial automation, infotainment, edge AI systems, and immersive computing.

The new upgrade spans form factors Mini-ITX, ATX, PICMG 1.3 boards, edge AI systems, and COM-HPC modules, engineered to leverage the hybrid-core architecture and AI-enhanced compute of the Intel Core 200S series processors.

AMD will transition its next-generation "Zen 6" desktop Ryzen and server EPYC processors to a split-node strategy, placing CPU core complex die (CCD) on TSMC N2P 2 nm node variant and building the I/O die (IOD) on the N3P 3 nm node. At TSMC, volume ramp for the 2 nm node is around the third quarter of 2026, opening the door for limited shipments as early as late Q3 or broader availability in Q4 2026. Under the split approach, the compute chiplet will house the Zen 6 cores and a substantially larger shared L3 pool, while the IOD will continue to host memory controllers, PCIe lanes, USB, and the integrated GPU. Earlier rumors suggest that each CCD could contain 12 Zen 6 cores with support for SMT, and a shared L3 cache that may increase to roughly 48 MB per CCD compared with prior generations. Typical consumer configurations would pair up to two CCDs with a single IOD, creating chips with up to 24 cores and 48 threads, while server variants could scale further depending on packaging.

Performance expectations center on achieving double-digit IPC gains, higher sustained clock speeds, and improved power efficiency, thanks to the advanced process nodes. The choice of N3P for IOD helps AMD cut some costs for non-core logic, while the N2P compute die aims to extract greater generational gains. However, as with any new TSMC node, it will carry a premium over the N3P, so using it only for the compute side is the most viable choice. Platform compatibility remains for one more generation, with Zen 6 expected to support the existing AM5 socket. Users can upgrade CPUs without a full platform replacement. If the ramp timing holds, Zen 6 will arrive into a crowded second half of 2026 desktop window. For datacenter applications, the EPYC "Venice" generation, based on Zen 6, will utilize sIOD (server I/O die), implementing PCIe Gen 6, which provides a generational doubling in bandwidth to GPUs, SSDs, and NICs. AMD is also claiming memory bandwidth of up to 1.6 TB/s for these CPUs, so we could see some of that trickling down into consumer configurations.

The AI revolution is no longer confined to the cloud. In an ever more connected and intelligent world, conserving energy is critical. GIGAIPC's new QBiP-155UB and QBiP-125UB 3.5" boards are engineered to meet this demand. Powered by Intel Core Ultra 7 and Intel Core Ultra 5 processors, they run AI workloads faster, smarter, more power-efficient and reliable. Boasting a remarkable 2.5-fold increase in power efficiency over previous generations, they are the ideal choice for power-constrained edge deployments, including smart parking systems, precision medical devices, and intelligent retail solutions.

Built on the advanced Intel Meteor Lake-U architecture, the QBiP-155UB and QBiP-125UB integrate a Neural Processing Unit (NPU) to deliver up to 11 Tera Operations Per Second (TOPS) of AI performance. This incredible processing power is achieved through a low power design, operating at a base TDP of just 15 W. This efficiency enables the boards to sustain demanding AI workloads over extended periods, providing consistent, long-duration performance that is crucial for power-sensitive edge applications.

AMD is reportedly sampling its next-generation Ryzen desktop processor powered by the "Zen 6" microarchitecture, codenamed "Medusa Ridge," to close industry partners, such as platform designers and OEMs, says Yuri Bubliy, aka 1usmus, author of the Hydra tuning software, and the now-retired DRAM Calculator for Ryzen. The processor sees AMD update both the CCDs and client I/O die, he says. AMD confirmed that it is building the "Zen 6" CCD on the TSMC N2 (2 nm) node, which entered risk production earlier this year. The node is expected to be ready for mass-production of 2 nm chips later this year. The 2 nm node presents a significant jump in transistor densities from the current TSMC N4P node on which AMD builds its 8-core "Zen 5" CCD, which 1usmus and other sources say, that AMD will use to increase CPU core counts per CCD.

Sources point to the possibility of AMD increasing core counts per CCD to 12, and giving the CCD 48 MB of L3 cache. At this point we don't know if all 12 cores will be arranged in a single CCX with a monolithic slab of 48 MB L3 cache, or if there's a dual-CCX layout with 6 cores per CCX sharing 24 MB of L3 cache, each. The other big upgrade with "Medusa Ridge" is its client I/O die (cIOD). AMD is expected to build its new generation cIOD on a newer EUV node such as 5 nm N5 or 4 nm N4P, a significant upgrade from the current 6 nm N6. 1usmus says that the biggest reason for AMD to update its cIOD is the memory controller architecture. AMD is expected to give "Medusa Point" a new dual memory controller architecture. There are still two DDR5 channels per socket, but this is redesigned for increased memory speeds, letting AMD catch up with Intel in this area. As for the CPU frequency boosting technologies, such as PBO and Curve Optimizer, there are no updates expected, and 1usmus concludes that it Hydra support should be straightforward.

Instructions per clock is a metric used to define and compare CPU architecture performance usually. However, enthusiast colleagues at ComputerBase had an idea to test the IPC improvement in GPUs, comparing it across current and past generations. NVIDIA's Blackwell-based GeForce RTX 50 series faces off against the Ada Lovelace-based RTX 40 generation, while AMD's RDNA 4-powered Radeon RX 9000 lineup challenges the RDNA 3-based RX 7000 series. For NVIDIA, the test used RTX 5070 Ti and 4070 Ti SUPER, aligning ALU counts and clock speeds and treating memory bandwidth differences as negligible. For AMD, the test matched the RX 9060 XT to the RX 7600 XT, both featuring identical ALUs and GDDR6 memory. By closely matching shader counts and normalizing for clock variations, ComputerBase isolates IPC improvements from other hardware enhancements. In rasterized rendering tests across 19 popular titles, NVIDIA's Blackwell architecture delivered an average IPC advantage of just 1% over the older Ada Lovelace.

This difference could easily be attributed to normal benchmark variance. Ray tracing and path tracing benchmarks showed no significant IPC uplift, leaving the latest generation essentially on par with its predecessor when normalized for clock and unit count. AMD's RDNA 4, by contrast, exhibited a substantial IPC leap. Rasterized performance improved by around 20% compared to RDNA 3, while ray-traced workloads enjoyed a roughly 31% gain. Path tracing results were even more extreme, with RDNA 4 delivering nearly twice the FPS, a 100% increase over its predecessor. These findings suggest that NVIDIA's performance improvements primarily stem from higher clock speeds, increased execution unit counts, and enhanced features. AMD's RDNA 4 represents a significant architectural advance, marking its most notable IPC gain since the original RDNA launch.

The BCM RX880W is a new microATX motherboard built on Intel's latest Core Ultra platform, formerly known as Arrow Lake-S/Arrow Lake-S Refresh, pairing the Intel W880 chipset with the LGA1851 socket to support the 15th Gen Intel Core Ultra processors (Series 2). This board is designed to deliver cutting-edge performance while retaining robust legacy support, making it ideal for hardware and system engineers in the fields of medical & healthcare, industrial & automation, smart retail, digital signage, intelligent Kiosk, Edge AI server, security, and electronics distributors seeking next-generation solutions.

RX880W microATX New Design Features for Edge AI Computing and Compact Storage Servers
High-Performance with AI enabled CPU Support:

• LGA1851 socket supports Intel's latest Core Ultra 5/7/9 processors (Series 2), up to 125 W TDP
• Dual SlimSAS Connectors - High-Speed Storage in Compact Systems
  • The RX880W integrates two SlimSAS (SFF-8654) connectors—a standout feature rarely seen on industrial Micro ATX motherboards. Each SlimSAS supports PCIe Gen 4 x4, enabling flexible, high-bandwidth storage options ideal for dense, compact edge and storage platforms.

MSI IPC, a global leader in industrial computing and AI-driven solutions, is set to unveil its latest innovations at COMPUTEX 2025, held from May 20 to 23 at the Taipei Nangang Exhibition Center. Visitors can explore MSI IPC's cutting-edge technologies at Booth J0506, Hall 1, 1F.

Introducing the EdgeXpert MS-C931: A Desktop AI Supercomputer
MSI IPC will unveil the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGX Spark platform. Powered by the NVIDIA GB10 Grace Blackwell Superchip, the EdgeXpert MS-C931 delivers 1,000 AI TOPS FP4 performance, equipped with high-speed ConnectX 7 networking, 128 GB unified memory, and support for large language models. Designed for AI developers and researchers, it is ideal for applications in education, finance, and healthcare industries.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and storage devices, is excited to introduce the EdgeComp MS-J6412 industrial PC, a powerful new addition to its EdgeComp series built specifically for industrial automation and edge computing applications.

Designed to excel in demanding industrial settings, EdgeComp MS-J6412 combines powerful performance, energy efficiency, and versatile connectivity in a compact, fanless design. Powered by the Intel Elkhart Lake J6412 SoC, a quad-core processor with speeds up to 2.6 GHz and an ultra-low 10 W TDP, the system ensures stable, round-the-clock operation with minimal heat generation and silent performance. Its embedded architecture makes it ideally suited for space-limited and noise-sensitive environments where reliability is paramount.