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Rivet Networks Outs Wi-Fi 6-capable Killer AX1650 WLAN NIC

Rivet Networks announced general availability of its Wi-Fi 6 (802.11ax) capable Killer WiFi 6 AX1650 WLAN network controllers for sale to PC motherboard and notebook manufacturers. The AX1650 is based on Intel "Cyclone Peak" PHY, mated with a custom firmware and drivers by Rivet Networks that are optimized for competitive online multiplayer gaming. The controller supports 2x2 MU-MIMO with 160 MHz channels, delivering up to 2.4 Gbps theoretical maximum WLAN bandwidth over the card's main PCIe gen 3.0 x1. It also supports Bluetooth 5.0 over a separate USB 2.0 connection.

Besides minimizing CPU overhead, Killer drivers provide a highly specialized QoS solution called Killer Intelligence Engine, which shapes the Internet traffic of your game and streaming software ahead of other apps that seek Internet access. Advanced Stream Detect 2.0 can detect Internet traffic from thousands of games and gaming websites to optimize your Internet access on the fly. GameFast Technology works to reduce the Wi-Fi controller's CPU overhead by up to 10 percent compared to other WLAN solutions. The controller is also DoubleShot Pro (teaming) capable. The controller ships in M.2-2230 and 1216 modules, with PCIe and USB interfaces.

BIOSTAR Intel 300 Series Motherboards Ready for the New Stepping of 9th Generation Intel Core Processors

BIOSTAR today announced that their entire 300 series motherboards have a BIOS update available that brings immediate, drop-in compatibility with Intel's new 9th generation processors. What kind of update this new stepping (which updates the old P0 stepping to the new R0) brings is unclear - Intel hasn't officially said what this change introduces at the silicon level. TDP fixes, clock increases, fixing mere errata in the CPU ID, or even some other silicon-level changes - these are all fair game for such a nebulous release. Look after the break for the entire list of updated BIOSTAR motherboards.

Intel Packs 3D X-Point and QLC NAND Flash Into a Single SSD: Optane H10

Intel today revealed details about Intel Optane memory H10 with solid-state storage - an innovative device that combines the superior responsiveness of Intel Optane technology with the storage capacity of Intel Quad Level Cell (QLC) 3D NAND technology in a single space-saver M.2 form factor. "Intel Optane memory H10 with solid-state storage features the unique combination of Intel Optane technology and Intel QLC 3D NAND - exemplifying our disruptive approach to memory and storage that unleashes the full power of Intel-connected platforms in a way no else can provide," said Rob Crooke, Intel senior vice president and general manager of the Non-Volatile Memory Solutions Group.

Combining Intel Optane technology with Intel QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors - such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

AMD Outsells Intel 2:1 on European Retailer Mindfactory.de

European PC enthusiasts continue to see value in choosing AMD Ryzen processors over Intel Core, as the latest public data by German retailer Mindfactory.de, which ships across the EU, shows AMD processors outselling Intel 2:1. Although earlier Intel would have the upperhand in revenue despite lower volumes, this time around, AMD shored up revenues on the backs of high-margin products such as the Ryzen 7 2700X and the HEDT Ryzen Threadripper series.

The 6-core/12-thread Ryzen 5 2600 is the most popular processor offering high value under the 200€-mark. It is followed by the 8-core/16-thread Ryzen 7 2700X. Buyers prefer the 2700X to the cheaper 2700 non-X. The Ryzen 5 2600X is another strong seller. Over in the Intel camp, the Core i9-9900K and Core i7-9700K are strong sellers, followed by the i5-9600K and the newly released i5-9400F. Pricing graphs show Intel processor pricing steadily rise over 2018, while AMD chips remained largely flat. These numbers are not indicative of the overall market, since Mindfactory caters to DIY PC gamers and enthusiasts only.

Intel Reveals the "What" and "Why" of CXL Interconnect, its Answer to NVLink

CXL, short for Compute Express Link, is an ambitious new interconnect technology for removable high-bandwidth devices, such as GPU-based compute accelerators, in a data-center environment. It is designed to overcome many of the technical limitations of PCI-Express, the least of which is bandwidth. Intel sensed that its upcoming family of scalable compute accelerators under the Xe band need a specialized interconnect, which Intel wants to push as the next industry standard. The development of CXL is also triggered by compute accelerator majors NVIDIA and AMD already having similar interconnects of their own, NVLink and InfinityFabric, respectively. At a dedicated event dubbed "Interconnect Day 2019," Intel put out a technical presentation that spelled out the nuts and bolts of CXL.

Intel began by describing why the industry needs CXL, and why PCI-Express (PCIe) doesn't suit its use-case. For a client-segment device, PCIe is perfect, since client-segment machines don't have too many devices, too large memory, and the applications don't have a very large memory footprint or scale across multiple machines. PCIe fails big in the data-center, when dealing with multiple bandwidth-hungry devices and vast shared memory pools. Its biggest shortcoming is isolated memory pools for each device, and inefficient access mechanisms. Resource-sharing is almost impossible. Sharing operands and data between multiple devices, such as two GPU accelerators working on a problem, is very inefficient. And lastly, there's latency, lots of it. Latency is the biggest enemy of shared memory pools that span across multiple physical machines. CXL is designed to overcome many of these problems without discarding the best part about PCIe - the simplicity and adaptability of its physical layer.

Intel Soaks Up Heather Lennon, AMD RTG Digital Marketing Head

Intel has hired another of AMD's top executives as Raja Koduri hopes to basically rebuild RTG under Intel's banner and its resources. This time it's Heather Lennon, who led AMD Radeon Technologies Group (RTG) marketing and had been with AMD for over 10 years. She directed the Team Red community and won PR Week award for Campaign of the Year 2014. Lennon bagged 40 awards for digital marketing for AMD, and is widely believed to be the brains behind the PR upper-hand AMD enjoys among tech forums and the DIY community.

Lennon now joins Intel as Senior Manager, Digital Marketing for Graphics, and will work closely with Mark Taylor, an ex-NVIDIA exec who now leads technical marketing at Intel Graphics. Other ex-AMD and ex-NVIDIA honchos include Chris Hook and Tom Peterson, respectively. Raja Koduri is overseeing Intel's ambitious project to make inroads to the discrete GPU market under the new Xe brand, not just to serve gamers and PC enthusiasts, but more importantly GPU compute, cloud compute, and AI markets. Koduri is also reportedly lending insights to Intel's new Gen11 integrated graphics architecture, which debuts with its 10 nm "Ice Lake" processors.

Steam Hardware Survey Shows AMD's Continued Struggle to Gain Market Share

Steam's latest hardware survey has been released, and while there is no real head scratching changes, it does continue to give us a glimpse into current market trends. In regards to CPU adoption, both six-core and eight-core processors now account for 12.2% and 2.2% respectively. Looking at just Windows data shows six-core processors gained a bit over 2% market share in 3 months. Meanwhile, eight-core offerings saw a market share increase of roughly 0.5%. Speaking of processors, Intel still dominates the market capturing an 82% share. AMD, while competitive in many tasks besides gaming still only has an 18% share. Looking at the data would lead one to believe AMD is gaining back market share; however looking at previous hardware surveys their current share is mostly holding steady. Considering Intel still offers better gaming performance for the time being its unlikely AMD will make any real gains in the Steam hardware survey until gaming performance reaches true parity.

Looking at graphics cards, NVIDIA still reigns supreme holding the same 75% market share they have been clutching for quite some time. AMD, on the other hand, continues to struggle, holding a paltry 15% share with Intel and their integrated graphics still managing to hold a 10% share. Considering AMD's only release as of late was the Radeon VII it is not all that surprising to see no change here. That said, NVIDIA's dominance is indeed not a good thing as it means competition is minimal, and pricing is likely to remain high. Right now according to the Steam hardware survey, NVIDIA currently holds the first 12 spots in regards to today's most popular graphics cards, which combine for a 52.8% share. The most popular of these being the GTX 1060. You have to go all the way down to 13th place to find an AMD graphics card which just so happens to be the Radeon RX 580 with its 1.1% share. To find the next AMD graphics card you have to go all the way down to 19th where the companies Radeon R7 Graphics holds steady at 0.87%. Hopefully, AMD's upcoming Navi graphics architecture can bring them back to prominence and drive more competition.

Intel Partners with Netflix to Deploy AV1 CODEC as its 4K Backbone

At The National Association of Broadcasters Show (NAB Show) today, Intel and Netflix announced a new high-performance video codec that is available as open source and royalty-free to content creators, developers and service providers. Scalable Video Technology for AV1 (SVT-AV1) offers performance and scalability in video processing.

"The SVT-AV1 codec offers both high performance and efficiency. And compared to today's most popular codec (H.264 AVC), SVT-AV1 can help service providers save up to half their bandwidth, delivering leading-edge user experiences that can be quickly and cost-effectively delivered at a global scale. This codec makes it possible for services ranging from video on demand to live broadcast of 4Kp60/10-bit content on Intel Xeon Scalable processors, including the recently launched 2nd-Generation Intel Xeon Scalable processor," said Lynn Comp, Intel vice president of the Network Platforms Group and general manager of the Visual Cloud Division.

Intel Optane Persistent Memory 512GB Module Can be Yours for $7816

Optane Persistent Memory is being touted by Intel as the "hottest" storage medium between DRAM and NVMe SSDs in the short-term, and a successor to DRAM-based memory in the long-term, aided by its ability to hold data even in the absence of power. The company's latest Xeon Scalable "Cascade Lake" processors support Optane Persistent Memory, allowing data-centers to cram larger amounts of data accessible at DRAM-like speeds, even if at much higher latencies. It remains significantly faster than NVMe SSDs. Component retails began listing 512 GB modules of the Optane Persistent Memory, and its prices are nothing like your 512 GB NVMe SSD. CompSource lists the 512 GB module (model: NMA1XXD512GPSU4) for a whopping USD $7,816, although the product is out of stock.

ASUS Intros Prime B365-Plus Motherboard

Response from motherboard manufacturers to the Intel B365 Express mid-range socket LGA1151 chipset has been rather lukewarm, with very few product launches. The B365 Express is a rebadged H270 Express with 8th and 9th generation Core CPU support replacing 6th and 7th gen. ASUS launched one of its first ATX form-factor boards based on this chipset, with the Prime B365-Plus. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 4+3 phase VRM. The CPU socket is wired to four DDR4 DIMM slots, and a PCI-Express 3.0 x16 slot. The board supports 9th generation Core processors out of the box.

Besides the main x16 slot, the board's expansion slots loadout is designed to benefit from the increased 20-lane PCIe budget of the B365 Express. You get a PCI-Express 3.0 x16 (electrical gen 3.0 x4) slot, and four PCI-Express 3.0 x1 slots. There are two M.2 slots on offer. The bottom slot has PCI-Expres 3.0 x4 wiring only, and supports M.2-22110 drives, while the top M.2 slot has PCI-Express 3.0 x2 and SATA 6 Gbps wiring. There are six SATA 6 Gbps ports. Display connectivity includes one each of D-Sub, DVI, and HDMI. USB connectivity includes eight USB 3.0 ports, four on the rear panel, four by headers. The board's sole 1 GbE network interface is controlled by a Realtek 8111H PHY. The onboard audio solution is driven by an entry-level Realtek ALC887 CODEC. Expect this board to be priced around $90.

Kingston Server Premier DDR4-2933 RDIMMs Validated on Intel "Cascade Lake"

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2933 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Cascade Lake-SP"). A link to the validation page can be found here.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's six-channel server microarchitecture. At 2933MT/s - the next-generation memory frequency supported in the latest Intel Xeon Scalable processor family - each DIMM provides peak bandwidth of 23.46 GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Intel Driving Data-Centric World with New 10nm Intel Agilex FPGA Family

Intel announced today a brand-new product family, the Intel Agilex FPGA. This new family of field programmable gate arrays (FPGA) will provide customized solutions to address the unique data-centric business challenges across embedded, network and data center markets. "The race to solve data-centric problems requires agile and flexible solutions that can move, store and process data efficiently. Intel Agilex FPGAs deliver customized connectivity and acceleration while delivering much needed improvements in performance and power for diverse workloads," said Dan McNamara, Intel senior vice president, Programmable Solutions Group.

Customers need solutions that can aggregate and process increasing amounts of data traffic to enable transformative applications in emerging, data-driven industries like edge computing, networking and cloud. Whether it's through edge analytics for low-latency processing, virtualized network functions to improve performance, or data center acceleration for greater efficiency, Intel Agilex FPGAs are built to deliver customized solutions for applications from the edge to the cloud. Advances in artificial intelligence (AI) analytics at the edge, network and the cloud are compelling hardware systems to cope with evolving standards, support varying AI workloads, and integrate multiple functions. Intel Agilex FPGAs provide the flexibility and agility required to meet these challenges and deliver gains in performance and power.

Intel Unveils Wi-Fi 6 AX200 "Cyclone Peak" WLAN NIC

Intel formally launched the Wi-Fi 6 AX200 client-segment WLAN card for notebooks and PC motherboards in the M.2-2230 and M.2-1216 form-factors, based on the "Cyclone Peak" PHY powering the Wireless AX-22260 NIC family. The card interfaces with its host over PCI-Express 3.0 x1 and USB 2.0, for the Wi-Fi and integrated Bluetooth interfaces, respectively. As a Wi-Fi 6 adapter, it supports 802.11ax over 2x2 MU-MIMO antennae, and peak bandwidth of 2.4 Gbps, with support for both the 5 GHz and 2.4 GHz bands. The Bluetooth interface is version 5.0.

Intel Unleashes 56-core Xeon "Cascade Lake" Processor to Preempt 64-core EPYC

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

Intel Announces Broadest Product Portfolio for Moving, Storing, and Processing Data

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.

GIGABYTE Upgrades 300 Series BIOS for Upcoming Intel 9th Gen New Stepping

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today released the newest 300 series motherboards BIOS to fully support the newest Intel 9th Gen. Core processors with new stepping. The updates prevent the inability to boot the system during installation of the CPUs, providing full support for the next generation CPUs and ensuring that users can upgrade their processors without compatibility issues.

In Q2, Intel is set to launch new 9th Gen. Core processors with new stepping and motherboard manufacturers will upgrade their BIOS to improve the compatibility of their motherboards with these new processors. GIGABYTE has already upgraded all BIOS at first notice and uploaded the newest updates and all related information to its official website so that users can conveniently and successfully upgrade the BIOS for their GIGABYTE 300 series motherboards. With professional validation and testing carried forth by GIGABYTE engineers, the newest BIOS updates enhance compatibility with these new processors so that users can maximize performance with excellent system stability.
DOWNLOAD: GIGABYTE Intel 300-series Motherboard BIOS Updates.

Intel Hires NVIDIA's Tom Petersen in Latest Move to Bolster GPU Division

Anyone remotely familiar with NVIDIA knows of their now erstwhile distinguished engineer Thomas A. Petersen, better known simply as Tom Petersen or TAP. He was a delight to work with as far as the tech media is concerned, including TechPowerUp, and was a source of technical information on NVIDIA microarchitectures as well as features targeting the general consumer and prosumer alike. The last few keynote presentations have had a visible lack of Tom on screen, and even in person to where we were discussing internally whether he had taken on a more "behind the scenes" approach at the company. As it turns out, Tom is the latest in line to have attracted the eyes of Intel as the latter gears up to the challenge of gaining marketing share in the discrete GPU business in the years to come.

Tom confirmed on his Facebook page this past Friday that he was indeed leaving NVIDIA, with March 29 being his last working day there. He was quick to note his unemployment status on his LinkedIn profile in a humorous manner as well, and this was surely not for long given news broke shortly from Hothardware, and then Gamers Nexus, who both independently verified from their contacts at Intel that Tom Petersen was headed to the blue team sooner than later. Aside from being a media liaison for technical marketing, he has been at the forefront for the development of tools to help benchmark render response and effectiveness (FCAT), contributed to NVIDIA's GPU BOOST technology directly, and no doubt will be an important contributor at Intel to complement the vast number of PR and media personnel joining their ranks in the recent few months. We are excited to see what Tom helps bring to the table, and wish him the best to help create a more open and competing dGPU market for us.

ASRock Rolls Out Intel 300-series Motherboard BIOS Updates to Support New CPU Stepping

ASRock has released BIOS updates for all Z390/H370/Q370/B365/B360/H310 series motherboards to support the soon to be released new stepping 9th Generation Intel Core processors. The latest BIOS updates are available for download now from our website or simply update through ASRock APP Shop. New processors are scheduled to launch in Q2, 2019, the latest BIOS for each motherboard are listed as below. BIOS updates for more models will be added soon.

Robust, Full-Metal Water Blocks - EK-Velocity WS and EK-VRM ASUS ROG Dominus Extreme

EK Water Blocks, the leading premium computer liquid cooling gear manufacturer, is releasing the EK-Velocity WS, a robust premium grade water block for narrow ILM LGA 3647 (Socket P) Intel processors, and the EK-VRM ASUS ROG Dominus Extreme, a VRM water block tailor-made for the ROG Dominus Extreme motherboard. Both are all metal water blocks with nickel plated copper cold plates and nickel plated brass tops. No compromise on quality, durability, and performance!

Intel-Micron Divorce Gets Messy, Micron Employee Served Court Order to Return 3D XPoint IP

Intel and Micron Technology have parted ways from the IMFlash Technology joint-venture that set out to win the emerging non-volatile memory market with limited success. The two are now locked in numerous legal skirmishes arising from the disjointing of a major high-technology alliance, as employees migrate to either company. One such former Intel engineering-manager is in the middle of a legal spat, named Doyle Rivers. Rivers jumped ship from Intel to Micron Technology, allegedly carrying with him a large amount of trade-secrets and IP related to Intel's 3D XPoint memory and Optane products.

Intel Tuesday secured a preliminary injunction from the US District Court for the Eastern District of California, Sacramento Division, which tells Rivers to not possess, use, or disclose any confidential Intel information related to the company's 3D XPoint or Optane products, including personnel working on those products; and to return any such possessions to Intel. Rivers' defense claims Intel gets nothing from this injunction. In a telephonic interview with The Register, Daniel Sakaguchi, a partner at Alto Litigation in San Francisco, representing Rivers, stated "Mr. Rivers doesn't have anything to return," adding "We continue to take the position that Intel's claims are greatly exaggerated."

Intel Readies New Stepping of 9th Gen Core Processors

Intel is readying a new stepping of 9th generation Core processors, which could require motherboard BIOS updates. ASUS released a statement in which it mentions that Intel is preparing to launch processors based on the new stepping of "Coffee Lake Refresh" silicon from Q2-2019. It goes on to say that BIOS updates have been released for its entire line of Intel 300-series chipset motherboards for supporting the new stepping. The company doesn't mention what the stepping ID is, or what's different.

The statement reads: "ASUS has released BIOS updates for all 300 series motherboards, adding support for the forthcoming 9th Generation Intel Core processors based on new stepping. These processors are scheduled for launch in Q2, 2019. The latest BIOS updates are available for download now from the ASUS website." You can find these updated BIOS ROMs on the product page of your motherboard on ASUS website.

Intel Board of Directors Extends Andy Bryant's Term as Intel Chairman until 2020

Intel Corporation today announced that its board of directors had unanimously decided to extend Andy Bryant's term as Intel chairman for one additional year, to help support Intel's leadership transition. If Bryant is re-elected at Intel's 2019 annual stockholders' meeting, his term as chairman would continue through the conclusion of Intel's 2020 annual stockholders' meeting. Bryant has informed the board that he does not expect to stand for re-election again in 2020.

"I am honored to be nominated to serve as a director and Intel's chairman for another year," Bryant said. "If re-elected by the stockholders at our annual meeting in May, I look forward to continuing to work with Bob, the board and the entire executive team to continue Intel's historic transformation to a data-centric company. I expect this would be my last year of service as a member of Intel's board."

"I am ecstatic that the board has extended Andy's term for another year," Intel CEO Bob Swan said. "He has been a great sounding board for me since I joined the company, and has been especially invaluable to me while I have served in the interim and now permanent CEO roles."

Several Gen11 GPU Variants Referenced in Latest Intel Drivers

The latest version of Intel Graphics drivers which introduce the company's latest UWP-based Graphics Command Center app, hide another secret in their INF. The file has pointers to dozens of variants and implementations of the company's next-generation Gen11 integrated graphics architecture, which we detailed in a recent article. Intel will implement Gen11 on two key processor microarchitectures, "Ice Lake" and "Lakefield," although later down the line, the graphics technology could trickle down to low-power Pentium Silver and Celeron SoC lines, too, with chips based on the "Elkhart Lake" silicon.

There are 13 variants of Gen11 on "Ice Lake," carved using execution unit (EU) count, and LP (low-power) aggressive power management. The mainstream desktop processors based on "Ice Lake," which are least restrained in power-management, get the most powerful variants of Gen11 under the Iris Plus brand. Iris Plus Graphics 950 is the most powerful implementation, with all 64 EUs enabled, and the highest GPU clock speeds. This variant could feature on Core i7 and Core i9 brands derived from "Ice Lake." Next up, is the Iris Plus Graphics 940, with the same EU count, but likely lower clock speeds, which could feature across the vast lineup of Core i5 SKUs. The Iris Plus 930 comes in two trims based on EU count, of 64 and 48, and could likely be spread across the Core i3 lineup. Lastly, there's the Iris Plus 920 with 32 EUs, which could be found in Pentium Gold SKUs. There are various SKUs branded "UHD Graphics Gen11 LP," with EU counts ranging from 32 to 64.

Intel Introduces its New Graphics Command Center App, Paving the Way For Intel Xe

Intel has revealed the layout and overall look (as well as functionality, though that one is always changing) of their new Graphics Command Center app, which showcases the company's vision for a graphics control hub. The design is thematically coherent (read: it's blue), and is, for now, of a simple layout. Enthusiast options are expectedly going to be added closer to or upon release of the company's discrete-level graphics architecture with Intel Xe, but the Command Center as it is showcases Intel's overall spirit to their graphics push. For now, features keep the minimalist approach of Intel's integrated graphics - this is more of a new coat of paint than a new enthusiast-grade Command Center.

Intel made a video available on its Twitter account, and announced an early access program for users that want to partake i the feature and usability development of the new Command Center. The new app is available through Microsoft's App Store on Windows.

Without Silicon, Intel Scores First Exascale Computer Design Win for Xe Graphics - AURORA Supercomputer

This here is an interesting piece of tech news for sure, in that Intel has already scored a pretty massive design win for not one, but two upcoming products. Intel's "Future Xeon Scalable Processors" and the company's "Xe Compute Architecture" have been tapped by the U.S. Department of Energy for incorporation into the new AURORA Supercomputer - one that will deliver exascale performance. AURORA is to be developed in a partnership between Intel and Cray, using the later's Shasta systems and its "Slingshot" networking fabric. But these are not the only Intel elements in the supercomputer design: Intel's DC Optane persistent memory will also be employed (in an as-of-yet-unavailable version of it as well), making this a full win across the prow for Intel.
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