News Posts matching "LGA2066"

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GIGABYTE Rolls Out Aorus ATC800 CPU Cooler

GIGABYTE rolled out the Aorus ATC800 air CPU cooler. Its design involves a conventional aluminium fin-stack tower-type heatsink that's ventilated by two pre-installed custom-design fans in push-pull arrangement. A plastic shroud covers the top of the fin-stack, and frames the two fans. The top-plate is studded with an RGB LED diffuser. The two fans come with RGB LED lighting, too. All three lighting elements take input from a single 3-pin addressable RGB source.

Six 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. Each of the two 120 mm double ball-bearing fans take in 4-pin PWM input, spin between 600 to 2,000 RPM, push 14.05 to 51.7 CFM of air-flow, with a noise output ranging between 18 to 31 dBA. Measuring 139 mm x 107 mm x 163 mm, the cooler weighs 1.01 kg. It offers 37.4 mm of clearance to the memory module installed closest to the CPU socket. The cooler is rated for thermal loads of 200 W. Among its sockets supported are AM4, LGA2066, and LGA115x. The company didn't reveal pricing.

SilverStone Rolls Out the Krypton KR02 CPU Cooler

SilverStone today rolled out the Krypton KR02, a compact tower-type CPU cooler. This cooler is designed to handle thermal loads of up to 130 Watts, and supports LGA2066 and LGA115x sockets. AM4 support is added by separately purchasing a bracket, which ensures the cooler points in the right direction (towards the rear of your case) when installed. Its base is made of copper and aluminium with some finnage; from which three 6 mm-thick copper heat pipes pass, conveying heat through the aluminium fin-stack, which is ventilated by a 92 mm fan.

Taking in 4-pin PWM connection, this 92 mm fan spins between 800 to 2,800 RPM, pushing 15.12 to 56.1 CFM of air, with a noise output ranging between 13.6 to 34.8 dBA. Its hydraulic bearing offers a rated lifespan of 40,000 hours. Measuring 92 mm x 125 mm x 51 mm with the fan installed, the cooler weighs 380 g. The company didn't reveal pricing.

Spire Intros LCG-HSR Line of AIO Liquid CPU Coolers

Spire today introduced the LCG-HSR line of all-in-one closed-loop liquid CPU coolers, with two models, the CG-AE-LCG-H24SR-P featuring a 240 mm x 120 mm radiator, and the CG-AE-LCG-H12SR-P "Solo," with a 120 mm x 120 mm radiator. These coolers are characterized by a cubical pump-block, Nylon-sleeved coolant tubes, and one or two included CG-AE-H30K3AR-6PM fans. These fans feature RGB LED diffusers along the inner and outer walls of the frame, with 16 diodes taking input from a standard 4-pin RGB connector. Unlike the fan's standalone package, Spire isn't including RGB LED controllers with these coolers.

The included fans take in 4-pin PWM input, spin between 300 to 2,000 RPM with minimum airflow of 30 CFM, and noise-level ranging between 12 to 35 dBA, each. Both coolers support most common CPU socket types, including AM4, AM3(+), LGA2066, LGA2011(v3), LGA1366, and LGA115x. Spire is listing the CG-AE-LCG-H24SR-P at USD $80 and CG-AE-LCG-H12SR-P at USD $70, in 200-unit bulk quantities. Retail prices will be higher than these.

Thermalright Intros Silver Arrow IB-E Extreme Rev. B CPU Cooler

Thermalright today rolled out the Silver Arrow IB-E Extreme Rev. B CPU cooler. Thermalright has made changes to the design to make sure the fin-stack is slightly offset from the base in directions that free up headroom near the memory area and topmost expansion slot of a typical mainstream-desktop motherboard, giving you easy access to the memory and M.2 slots closest to the CPU socket.

Heat drawn from a heavier mirror-finished nickel-plated copper base is conveyed to the fin-stacks by eight 6 mm-thick heat pipes. The lavish use of heavy copper used in this heatsink make it tip the scales at 850 g, without fans. With both its fans installed, the Silver Arrow IB-E Extreme Rev. B can handle thermal loads of up to 320W. Each of the two included TY-143 140 mm fans spin between 600 to 2,500 RPM, pushing 31.4 to 130 CFM of air, with a noise output ranging between 21 to 45 dBA. Thermalright has updated the CPU socket support to include AM4 and LGA2066, besides LGA115x and LGA2011(v3). The heatsink measures 155 mm x 130 mm x 163 mm (LxWxH). The company didn't reveal pricing.

ENERMAX Announces LIQMAX III AIO Liquid CPU Cooler

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, introduces LIQMAX III, the new generation of LIQMAX, one of the proclaimed AIO CPU cooler series from ENERMAX. Like the award-winning predecessors featuring superior cooling performance as well as rock-solid quality, LIQMAX III is built with a luminous Aurabelt water-block supporting synchronizabale RGB lighting with RGB motherboards from ASRock, ASUS, Gigabyte, and MSI. LIQMAX III is undoubtedly an excellent choice for mainstream water-cooled RGB gaming rigs.

The premium Aurabelt water-block provides luminous RGB lighting; besides, the exquisite water block is able to support RGB lighting synchronization with motherboards that come with 4pin RGB header(s) (12V/G/R/B). Users can select the preferred lighting styles via the RGB motherboard software.

Intel Core i9-9990XE OEM-only, Even Then it's a Lottery

In a sign of just how arid the DIY retail channel has become for Intel, Tom's Hardware reports that the new socket flagship LGA2066 HEDT processor model Intel sneaked into its product-stack, the Core i9-9990XE, is restricted to the OEM/SI (system integrator) channel. Even to OEMs, ordering a tray of i9-9990XE chips isn't as simple as ordering other chips, such as the i9-9900K. Apparently, Intel has been running secret online auctions that are OEM-only, for these chips. OEMs get to bid on the per-chip price in n-unit tray quantities.

Workstation integrator Puget Systems was able to score itself some i9-9990XE inventory at USD $2,300 per chip. Puget Systems last week received its first batch of chips from Intel, and released performance benchmarks. At this price, the i9-9990XE is being sold at a 21% premium over the retail-channel SEP price of the i9-9980XE, and a whopping 65% premium over the i9-9940X. Intel can't shake off comparisons between the i9-9990XE and the i9-9940X because both chips are 14-core/28-thread with 19.25 MB shared L3 cache, with the i9-9990XE only offering significantly higher clock-speeds, but at an astounding TDP of 255W. The i9-9990XE was shown beating the 18-core i9-9980XE in a variety of HEDT-relevant benchmarks.

New Intel Core i9-9990XE Sheds Cores in Favor of High Clock Speeds, Benchmarked

Intel is giving final touches to a new socket LGA2066 high-end desktop processor with an interesting model number for its specifications. The new Core i9-9990XE is positioned above the current flagship i9-9980XE. Normally you'd expect it to be the same 18-core "Skylake-X" chip with a speed-bump, however, the i9-9990XE is a unique proposition. It sheds cores in favor of significantly higher clock-speeds than the i9-9980XE.

The i9-9990XE is a 14-core/28-thread processor, based on a binned "Skylake-X" HCC (high core count) die, and uses STIM (soldered thermal interface material) between the die and integrated heatspreader (IHS). It features some aggressive clock-speeds, with 4.00 GHz nominal clock-speeds, and a massive 5.10 GHz maximum Turbo Boost frequency that beats even the Core i9-9900K. Besides 14 cores, the i9-9990XE is configured with 19.25 MB of shared L3 cache, and 1 MB of L2 cache per core. The four disabled cores alone don't help Intel's efforts to dial up clock-speeds. Intel has increased the chip's rated TDP all the way up to 255 Watts!

ENERMAX Expands LIQFUSION RGB Liquid Cooler Lineup with 360 Version

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is expanding the acclaimed RGB liquid cooler series, LIQFUSION, with the addition of a 360mm AIO cooler. After the launch of the 240 variant, LIQFUSION has got users' attention and recognition for its cooling performance and brilliant lighting effects. With the larger cooling surface, LIQFUSION 360 is able to easily handle a large amount of heat produced by the overclocked CPUs. Moreover, LIQFUSION comes with an addressable RGB-sync waterblock featuring patented flow indicator, which allows the users to monitor the status of coolant flow. Along with ENERMAX addressable RGB fans, LIQFUSION can create visual appealing lighting effects.

LIQFUSION can sync the RGB lighting with motherboards featuring addressable RGB headers (4-pin assignment: +5V/D/-/G). Users can select preferred effects via the motherboard RGB software with 16.8 million color options. On the other hand, for those who use non-RGB motherboards, they can use the included RGB control box to select preferred lighting color, speed, and effects (10 pre-set effects).

Raijintek Refreshes the Pallas CPU Cooler with RGB LED Lighting and More

Raijintek today introduced the Pallas 120 RGB, a refresh of the original Pallas from 2014. Raijintek has made four key changes to its design. To begin with, the mirror finish nickel-plated copper base from the original has been replaced with a direct-touch base, where the cooler's six 6 mm-thick copper heat pipes make direct contact with the CPU. The second big change is the black coated aluminium fin-stack and heat-pipes, which offer a matte appearance. Thirdly, the change reflecting the namesake - the fan featuring RGB LED illumination using 10 diodes (4-pin standard RGB header); and lastly, support for newer sockets AM4 and LGA2066, in addition to LGA115x and AM3+.

The C-type heatsink offers a height of just 68 mm, making it perfect for low-profile builds, provided you can find room around the CPU socket for the cooler's vast width and depth. Measuring 130 mm x 146.8 mm x 68 mm (WxDxH), it weighs 550 g, including the fan. The fan specs are mostly unchanged from the original. Drawing power from a 4-pin PWM header, and featuring a hydraulic bearing, it spins between 200 to 1,400 RPM, pushing up to 41.71 CFM of air, with a maximum noise output of 28.43 dBA. The company didn't reveal pricing.

ENERMAX Launches LIQTECH II, Universal AIO Liquid Cooler with TDP 500+ Watts

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, announces the launch of a new all-in-one liquid cooler series, LIQTECH II. Responding the market demand of cooling solution for high-end CPUs, LIQTECH II can deliver enthusiast-grade cooling capacity of 500+ watts (TDP) and is compatible with both Intel and AMD sockets (except AMD sTR4).

Furthermore, certified by main motherboard makers (ASRock, ASUS, Gigabyte, and MSI), LIQTECH II can support the latest addressable RGB lighting synchronization with advanced motherboards featuring addressable RGB headers (pin assignment: 5V/D/-/G) to create dynamic visual effects. LIQTECH II is perfect for overclocked systems, image editing workstations, and high-end gaming machines.

Raijintek Intros MYA RBW CPU Cooler

Raijintek today introduced the MYA RBW, a large aluminium fin tower-type CPU cooler with addressable RGB embellishments. The cooler was first shown off at Computex 2018. Its design involves a heavy aluminium fin-stack with ridged fins that have increased surface area over flat fins, capped off by a composite top, with a silicone RGB LED diffuser, and a brushed metal top-plate. Heat drawn by six 6 mm-thick nickel-plated copper heat pipes pass through the fin-stack.

At the base, these heat pipes make direct contact with the CPU. A 13 mm-thick slimline hydraulic bearing 120 mm fan compensates for the fin-stack's thickness, as does the vertical offset in the fin-stack itself, freeing up room near your motherboard's memory slot area. The fan spins between 200 to 1,400 RPM, pushing up to 41.71 CFM of air and a 28.43 dBA minimum noise level. Measuring 130 mm x 86 mm x 163 mm (WxDxH), the cooler weighs about 925 g, including the fan. Among the CPU sockets supported are Intel LGA2066, LGA115x, and AM4. The company didn't reveal pricing.

ID-Cooling Releases AURAFLOW X 240 Budget RGB AIO Water Cooler

ID-COOLING a cooling solution provider focusing on thermal dissipation and fan technology research and production for over 10 years, announced AURAFLOW X 240 AIO water cooler, featuring the newly developed powerful pump and 12V RGB lighting on both the pump and fans at the same time synchronizing with motherboard RGB control.

AURAFLOW X 240 is equipped with the newly developed powerful pump which has the flow rate reaching up to 106L/H, lift range 1.3m H2O. The pump block has a micro-fin copper base to ensure the best cooling performance. Power connector is 3pin with a 3pin to Molex adapter to help ensure 12V constant input to ensure maximum cooling performance. It also comes with a standard 12V RGB connector.

GIGABYTE Intros X299 Aorus Master Motherboard

GIGABYTE today announced its almost-flagship socket LGA2066 motherboard, the X299 Aorus Master. The Master brand-extension, if you'll recall, is positioned just a notch below the flagship Aorus Xtreme, which makes this board a successor to the X299 Aorus Gaming 7. The X299 Aorus Gaming 9 and Designare-EX remain the company's flagship LGA2066 products, until they're succeeded by a new Aorus Xtreme product. There's still plenty to go around with the new X299 Aorus Master, beginning with its updated design scheme that's in sync with the company's latest Z390 motherboard lineup. It ships with out-of-the-box support for Core X 9000-series processors. The board is wider than ATX, although not quite E-ATX. It draws power from a combination of 24-pin ATX, two 8-pin EPS, and an optional 6-pin PCIe power. A 12-phase VRM powers the CPU, cooled by a 2-stage heatsink. Expansion slots include four PCI-Express 3.0 x16 (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8). The DIMM and PCIe slots feature metal reinforcement.

Storage connectivity on the GIGABYTE X299 Aorus Master includes three M.2 slots with PCI-Express 3.0 x4 wiring, each with heatsinks; and eight SATA 6 Gbps ports. Networking includes a 2.5 GbE wired interface driven by Realtek Dragon 8125AG controller, a 1 GbE driven by Intel i219-V controller, and 802.11 ac + Bluetooth 5 interface driven by Intel 9260 WLAN card. USB connectivity includes four USB 3.1 gen 2 ports (two on the rear panel including a type-C, two by header), driven by a combination of ASMedia ASM1142 controller and the X299 PCH. The onboard audio solution is quite something. An ESS Sabre 9218 DAC (130 dBA SNR!) drives the main front + headphones channel with Ti Burr Brown OPA2111KP OPAMPs and WIMA capacitors; while a 120 dBA SNR Realtek ALC1220VB pulls the remaining channels. Manually-switchable dual-BIOS, 7-segment POST code readout, USB flash-back, and a boatload of other overclocker-friendly features complete the board. Expect it to be priced around USD $399.

GIGABYTE Intros X299-WU8 Motherboard Capable of 4x PCIe x16

GIGABYTE introduced the X299-WU8, a high-end desktop motherboard being sold as a quasi-workstation-class board, in the CEB form-factor (305 mm x 267 mm). Based on Intel X299 Express chipset, it features out-of-the-box support for Intel's socket LGA2066 Core X 9000-series processors, in addition to existing Core X 7000-series. A design focus with this board is on PCIe connectivity. The board employs two PLX PEX8747 PCIx gen 3.0 x48 bridge chips, which convert two gen 3.0 x16 links from the processor to four downstream x16 links, which can further be switched to x8. All seven expansion slots are PCI-Express 3.0 x16 physically, which are electrically "x16/NC/x16/NC/x16/NC/x16" or "x16/x8/x8/x8/x8/x8/x8." The topmost slot stays x16, while the other six share three x16 links depending on how you populate them. The board has certifications for 4-way SLI and CrossFireX.

The GIGABYTE X299-WU8 draws power from a combination of 24-pin ATX and two 8-pin EPS connectors, conditioning it for the CPU with an 8+1 phase VRM. An additional 6-pin PCIe power input, which is optional, stabilizes slot power delivery to the graphics cards. The CPU socket is flanked by eight DDR4 DIMM slots, supporting up to 128 GB of quad-channel DDR4 memory. Storage connectivity is surprisingly sparse, with just one M.2-2280 slot that has PCIe 3.0 x4 wiring, and eight SATA 6 Gbps ports. USB connectivity includes USB 3.1 gen 2 (including a type-C port), a number of USB 3.1 gen 1 ports, both on the rear panel and via headers; high-end onboard audio including an ALC1220 CODEC and headphones amp; and two 1 GbE networking interfaces. Expect this board to be priced around $600, given that the PEX8747 isn't cheap these days, and this board has two of it.

MSI Intros X299 MEG Creation Motherboard

MSI drew more than a few eyeballs at Computex 2018 when it showcased the X399 MEG Creation motherboard for AMD Ryzen Threadripper processors. With the advent of "new" Skylake-X Refresh processors by Intel, the company has a new high-end motherboard with the X299 MEG Creation. MSI appears to have toned down on the design from its X399-based product, although you still see the metal waveform design along the chipset heatsink that's contiguous with M.2 SSD heatsinks, the VRM heatsink, and the rear I/O shroud. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS power connectors, conditioning it for the LGA2066 processor with a 14-phase VRM.

Expansion slots on the MSI X299 MEG Creation include four PCI-Express 3.0 x16, from which three are wired to the CPU, and the fourth one to the PCH. Between them are three M.2-2280 slots with PCI-Express 3.0 x4 wiring, each. You can add up to four more M.2-2280 SSDs with the included M.2-Xpander Aero accessory, which is a 4-slot M.2 riser with air-cooling, which made its debut with the X399 MEG Creation. Another star attraction with this board is Realtek 2.5 Gbps Ethernet, alongside an Intel i219-V powered 1 GbE interface, and an 802.11 ac + BT 5.0 WLAN. Another interesting accessory is the ThunderboltM3, a Thunderbolt 3.0 card with two type-C ports, and two DisplayPort connectors, for daisy chaining your displays. Storage connectivity, besides the seven M.2 slots, includes eight SATA 6 Gbps ports, and a U.2 port. This board could be priced around the $500-mark.

Intel HEDT Platform to be Forked into Z399 and X599

Intel could very soon fork its high-end desktop platform into two, with the introduction of the new Z399 socket LGA2066 chipset later this quarter; and the fabled X599 chipset powering LGA3647 processors. The move is probably triggered by AMD's introduction of new 24-core and 32-core Ryzen Threadripper processors that wipe out competitiveness of its existing "Basin Falls" X299 platform. The X599 could essentially be a C629 with the addition of some client-segment features (and the subtraction of some enterprise-segment ones), whereas the Z399 is a whole different beast.

With the introduction X599 and LGA3647, Intel could restore competitiveness at the >$1,500 market segment with new 24-core, 26-core, and 28-core "Skylake-X" XCC (extended/extreme core count) processors; whereas the introduction of Z399 could be necessitated with a that of a new 22-core chip for the LGA2066 socket, from which Intel can carve out new 20-core and 22-core SKUs. Existing Skylake-X LCC and HCC chips could be forwards-compatible with Z399, and X299 motherboards could still be eligible for supporting new 20-core and 22-core processors via BIOS updates. The Z399 could introduce a handful of new client-segment features Intel is introducing with the Z390.

ASUS DDR4 "Double Capacity DIMM" Form-factor a Workaround to Low DRAM Chip Densities

32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.

Intel Stuck with 14nm Processors Till Holiday 2019

Wrap your head around this: at some point in 2019, AMD will be selling 7 nm processors while Intel sells 14 nm processors. That how grim Intel's 10 nanometer silicon fabrication process development is looking. In the Q&A session of its Q2-2018 Earnings Call, Intel stated that the first products based on its 10 nm process will arrive only by Holiday 2019, making 14 nm micro-architectures hold the fort for not just the rest of 2018, but also most of 2019. In the client-segment, Intel is on the verge of launching its 9th generation Core "Whiskey Lake" processor family, its 5th micro-architecture on the 14 nm node after "Broadwell," "Skylake," "Kaby Lake," and "Coffee Lake."

It's likely that "Whiskey Lake" will take Intel into 2019 after the company establishes performance leadership over 12 nm AMD "Pinnacle Ridge" with a new round of core-count increases. Intel is also squeezing out competitiveness in its HEDT segment by launching new 20-core and 22-core LGA2066 processors; and a new platform with up to 28 cores and broader memory interface. AMD, meanwhile, hopes to have the first 7 nm EPYC processors out by late-2018. Client-segment products based on its architecture, however, will follow the roll-out of these enterprise parts. We could see a point in 2019 when AMD launches its 7 nm 3rd generation Ryzen processors in the absence of competing 10 nm Core processors from Intel. Posted below is an Intel slide from 2013, when the company was expecting 10 nm rollout by 2015. That's how much its plans have derailed.

Corsair Intros 2nd Gen Hydro H75 AIO Liquid CPU Cooler

Corsair today rolled out the second generation Hydro H75 all-in-one liquid CPU cooler (model: CW-9060035-WW). A successor to the original H75 from 2013, the new 2018 Hydro H75 has four major design changes. First, you get the modern octagonal pump-block with ceramic bearings, higher coolant pressure, and white LED illumination. Second, you get more durable tubing with braided fiber outer layer. Third, you get the slightly thicker (27 mm) 120 mm aluminium radiator. You get not one, but two SP120 PWM fans that spin up to 1,900 RPM, pushing up to 64 CFM of air, at up to 31 dBA noise output, each. You install these fans in a push-pull configuration. Lastly, there's support for some of the newer CPU sockets, such as AM4 and LGA2066. Available now, the new Corsair Hydro H75 is priced at USD $89.99.

Intel to Kill off The "Extreme Edition" Brand Extension

Intel is allegedly killing off the "Extreme Edition" brand extension it has been using to denote its flagship client-segment products, such as processors and NUCs. This, according to industry observer François Piednoël. This could also mean the retirement of related elements such as the iconic Intel Skull, and the black and silver packaging. What Intel is replacing this moniker with, remains a mystery.

Intel currently assigns the "Extreme" extension to only one client-segment product, the Core i9-7980XE. With the advent of the 28-core client-segment processor on a new motherboard platform, Intel could find itself tough to justify the extension on the "Basin Falls" (LGA2066) platform. The company is planning to launch new 20-core and 22-core LGA2066 processors, besides its 28-core processor on the new platform. The Extreme extension is also used on the company's "Skull Canyon" NUC.

ID-Cooling Announces DASHFLOW 360 Liquid CPU Cooler

ID-COOLING a cooling solution provider focusing on thermal dissipation and fan technology research and production for over 10 years, announced DASHFLOW 360 AIO water cooler, featuring an ever enhanced pump and RGB lighting on both the pump and fans at the same time synchronizing with motherboard RGB control. The newly developed pump is designed to provide extreme cooling performance with 450L/H water flow and 3m flow lift. Metallic pump cover with the linear cuttings allows amazing RGB lighting through. A big copper base contacts CPU to help the heat transfer. Micro fin submerged design increases the heat dissipation surface.

Premium coated G1/4 fittings are equipped on both ends of the premium sleeved tubing, more reliable & performance efficient. Inside the tubing is self-contained highly efficient and eco-friendly liquid coolant. Users are not suggested to twist the fittings unless you know how to work with customized water cooling kits. A newly developed square radiator has bigger heat dissipation area to support the superb cooling of DASHFLOW 360. Equipped with a set of RGB DF-12025-RGB-TRIO high airflow fans, DASHFLOW 360 is able to cool down 400W TDP processors. Fan speed is PWM controlled from 900 to 2000RPM, pushing max. airflow of 56.5CFM each. On four corners are mounted with rubber dampeners to absorb operating vibration. Each fan has 9 LEDs around the motor center. Fan blades and frame are made of lighting emitting materials to help an evenly spread RGB lighting.

Intel Readying 22-core LGA2066 and 8-core LGA1151 Processors

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

Intel's 28-core HEDT Processor a Panic Reaction to 32-core Threadripper

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. With frantic increases in core counts, the practicality of these chips to even the most hardcore enthusiast or productivity professional diminishes. The Computex 2018 demos reek of a pissing-contest between the x86 processor giants, with AMD having an upper hand.

The HEDT segment is intended to occupy the space between client desktops and serious scalar workstations. Intel is frantically putting together a new HEDT platform positioned above its current LGA2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA3647 socket (this chip + your X299 motherboard is no bueno). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. The company put up a live demo at the teaser of this unnamed processor, where it was running at 5.00 GHz, which led many to believe that the processor runs at that speed out of the box, at least at its maximum Turbo Boost state, if not nominal clock. Intel admitted to "Tom's Hardware," that it "forgot" to mention to the crowds that the chip was overclocked.

Zalman Unveils a New Line of CNPS Series CPU Coolers

The CNPS (computer noise prevention system) line of CPU coolers from Zalman have decades of reputation, but the company hasn't launched much under this banner, in recent times. The company finally got around to new products, all of which are tower-type heatsinks. Leading the pack is the CNPS10X Optima II. This cooler is a successor of the original CNPS10X Optima from way back in 2011. The heatsink design is unchanged from the original - a conventional tower-type fin-stack with four 8 mm-thick copper heat pipes making direct contact with the CPU at the base. What's changed is an improved fan and support for newer CPU sockets such as AM4 and LGA2066.

The included 120 mm fan of the CNPS10X Optima II comes with a new split-blade impeller (or dual-blade as Zalman likes to call it), which improves air-flow, that is then traded for lower RPMs, and noise. The impeller is translucent, and illuminated by white LEDs. It also has a The cooler is rated for thermal loads of up to 200W TDP. Next up, is the CNPS9X Optima. This cooler features a narrower aluminium fin-stack than the CNPS10X Optima II, but a similar direct-touch base, and four copper heat pipes branching out through various points of the fin-stack. It has the 120 mm "Shank Fin" fan that debuted with the original CNPS10X. This cooler can handle thermal loads of up to 180W, and like the Optima II, it supports newer sockets such as AM4 and LGA2066.

Intel Unveils 28-core/56-thread HEDT Processor

It was only a matter of time before Intel maxed out the "Skylake-X" silicon on the client segment, by bringing its "Skylake XCC" (extreme core count) 700 mm² die on a client-segment package, and here we are. Without taking model names, Intel made it clear that it's launching a new client-segment 28-core/56-thread processor. The company didn't specify the processor's package, and we're doubtful if it's LGA2066 for the simple reason that the Skylake XCC die has 6-channel memory interface. Nevertheless, this processor is clocked at 2.70 GHz (nominal), and without revealing Turbo speeds, Intel managed to overclock it bench-stable to 5.00 GHz, at which it scored 7,334 nT Cinebench points. This product will launch in Q4-2018.
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