Intel's upcoming "Nova Lake" desktop platform is drawing nearer, and today we have some intriguing details thanks to the Chinese electronics and motherboard maker Decenta. In leaked information about the motherboard SKU "M26-NVLS-ATX09," we see that it uses Intel's new LGA1954 socket and is listed with Q970 and B960 chipset options. The most notable difference between the two chipsets seems to be their expansion capabilities. Previously leaked specifications suggest that the Q970 provides a total of 44 PCIe lanes, including eight PCIe 5.0 lanes supplied by the chipset. In contrast, the B960 reportedly offers 34 lanes, with no additional PCIe 5.0 lanes from the chipset itself.

Both chipsets feature PCIe 4.0 connectivity, although the Q970 offers 12 chipset lanes compared to the B960's 14. Decenta's ATX motherboard supports four DDR5-6400 memory modules, with dual-channel operation and a maximum capacity of 256 GB. Its expansion layout includes PCIe 5.0 slots, two M.2 storage connectors, and a legacy PCI slot for older industrial hardware. For wireless connectivity, we see that Decanta's platform supports expansion through an M.2 E-Key socket that supports Wi-Fi 7 and Bluetooth 6.x modules. VGA, HDMI, and DisplayPort outputs allow up to three displays to operate simultaneously.

Intel's Core Ultra 400-series "Nova Lake" CPUs are reportedly nearing launch as Intel has successfully passed USB and PCIe compliance testing. This means the platform has officially passed testing with the two organizations, and all the advertised specifications are working correctly. Starting with the USB Implementers Forum (USB-IF), a governing body of the USB standard, there are two "Nova Lake-H" device IDs certified for compliance with USB4. These include devices with IDs D331 and D333. Additionally, USB-IF lists ID 6E6E for the "Nova Lake" PCH-S chipset for desktop motherboards, compliant with USB 3.2 Gen 2. Intel likely chose a desktop chipset and a laptop CPU to achieve Qualification by Similarity, where testing one product can earn certification for other products easily. To avoid revealing too much before the launch, Intel opted for this strategy instead of testing a full flagship desktop CPU.

For the PCI-SIG, a governing body for PCIe compliance, Intel's 900-series chipset has long been present with the IDs 6E38-6E3F, 6E30-6E35, and 6E40-6E47. These were added back in April, but in August, another set of entries for CPUs specifically appeared. Certifying the PCIe 5.0 x16 root complex were device IDs D461, D465, and D467-D46A, which are likely "Nova Lake-S" CPUs or some mobile variation. Regardless, the verification process is the final stage that a platform and the CPU usually go through before the launch is finalized.

Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion," the "Company," "we" or similar terms) today announced its financial results for the quarter ended June 30, 2026. For the second quarter of 2026, net sales (GAAP) increased sequentially to $451.0 million from $342.1 million in the first quarter of 2026. Net income (GAAP) also increased sequentially to $136.1 million, or $3.99 per diluted American depositary share ("ADS") (GAAP), from net income (GAAP) of $66.8 million, or $1.97 per diluted ADS (GAAP), in the first quarter of 2026

For the second quarter of 2026, net income (non-GAAP) increased sequentially to $83.1 million, or $2.43 per diluted ADS (non-GAAP), from net income (non-GAAP) of $53.8 million, or $1.58 per diluted ADS (non-GAAP), in the first quarter of 2026. All financial numbers are in U.S. dollars unless otherwise noted.

Maxsun has officially shown off its new iCraft Z890 ITX motherboard at Computex, with active chipset and VRM cooling in an ITX form factor. The Z890 ITX is built for the Intel LGA-1851 socket, with support for Intel's Core Ultra 2 series CPUs in mind. Maxsun claims that the Z890 ITX is capable of powering a CPU with a 250 W TDP, thanks to an 8+1+1 power circuit design, making it powerful enough even for the likes of the Core Ultra 9 285K at stock clocks, according to the testing in the TechPowerUp Core Ultra 9 285K in-depth technical review. Pricing and a launch date have not yet been revealed for the Maxsun iCraft Z890 ITX Wi-Fi motherboard.


Physically, the new motherboard sports a full-length PCIe 5.0 ×16 slot and two DDR5 memory slots for dual-channel memory configurations, and it has active cooling on both the VRM and in the M.2 heat sink under the PCIe slot. It supports 1× PCIe 5.0 ×4 M.2 SSD on the front of the motherboard, 1× PCIe 4.0 ×4 M.2 SSD in a rear-mounted M.2 slot, and 4× PCIe 4.0 Slim SAS SFF-8654 4i SSDs. As for network connectivity, the motherboard sports Bluetooth 5.4 and Wi-Fi 7, as well as Realtek 5G LAN, and the rear I/O has both DisplayPort 1.4 and HDMI 2.1, 3× USB Type-C 20 Gbps ports, 6× USB Type-A 10 Gbps ports, 2× USB 5 Gbps ports, and 4× USB 2.0 ports. The motherboard also features a built-in 5 v ARGB connector for case and fan customization purposes.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the launch of the Kingston DC3000ME Gen 5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centers.

The DC3000ME leverages a high-speed PCIe 5.0 NVMe interface, delivering sequential read speeds of up to 14 GB/s and random read performance of up to 2.8 million IOPS, enabling faster data access for compute intensive applications. Full backward compatibility with PCIe 4.0 allows organizations to deploy DC3000ME across mixed server environments while preparing for future platform upgrades. Designed with enterprise class reliability in mind, DC3000ME utilizes 3D eTLC NAND and includes on-board power loss protection (PLP) to safeguard data in the event of unexpected power loss. The drive also supports AES 256-bit encryption and TCG Opal 2.0 self-encrypting drive (SED) capabilities to help organizations meet stringent security and compliance requirements.

ASRock the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors, power supply units, and AIOs, announces the new PRO Series Full Modular PSUs. Driven by the slogan "LIKE A PRO," this series is crafted for users prioritizing reliability and performance. It offers an intuitive power solution that empowers your system while maintaining smart, practical value.

Reliability and Simplicity: Setting a New Standard for PC Building
The PRO Series centers on delivering clean and stable output. Available in 1000 W, 850 W, and 750 W, it caters to various system requirements. These PSUs focus on core needs, providing high-quality hardware support at a competitive price. For budget-conscious users, the PRO Series ensures no compromise between quality and expenditure, delivering a professional stable experience with ease.

Gigabyte Technology a leader in innovative cooling solutions, officially announced the launch of the all-new GAMING Series power supply units (PSUs) today. Positioning these units as the ultimate "Hardware Guardian" for high-performance systems, Gigabyte leads the industry by introducing the exclusive "T-Guard" active thermal monitoring technology to address the safety requirements of next-generation 12V-2x6 connectors. The series has earned the prestigious Cybenetics ETA Platinum and LAMBDA A+ certifications, providing gamers and creators with a power solution that balances safety, high efficiency, and ultimate silence.

Exclusive T-Guard Technology: A Triple Line of Defense
As graphics card performance and power consumption continue to rise, the stability of power connectors is critical to system safety. The T-Guard technology in the GAMING series utilizes precision thermistors within the 12V-2x6 connector to evolve from passive protection to active monitoring:

• Detect (Real-time Sensing): Built-in sensors monitor connector temperatures in real-time, triggering immediate alerts if signs of overheating from loose cables or abnormal loads are detected.
• Protect (Isolation Protection): Upon detecting dangerous temperatures, T-Guard intelligently reduces power specifically to the GPU to prevent connector burnout. Meanwhile, other system components remain operational, preventing sudden power loss that could damage hard drives.
• Reconnect (Data Recovery): Users can utilize the processor's integrated graphics (if available) to view the display and save their work before shutting down for inspection.

Seasonic teased the Japan-exclusive FOCUS ATX 3.1 Sakura Limited Edition power supplies. These are design variants of the FOCUS ATX 3.1 line of PSUs that feature a white housing with cherry blossom printed design, Sakura-pink lettering, and a matching white 135 mm cooling fan. The PSU includes white, individually-sleeved modular cables. The PSU offers 80 Plus Gold switching efficiency, and meets both ATX 3.1 and PCIe 5.1CEM specifications, a native 12V-2x6 connector, Seasonic's innovative OptiSink cooling design, and a segment-leading 10-year product warranty. The company didn't reveal pricing or availability information, the PSU is likely to be Japan-exclusive.

AMD's RDNA 4-based Radeon RX 9070 and RX 9070 XT graphics cards have finally reached reasonable pricing, as German retailers report that these GPUs are now selling below MSRP. In Germany, the European MSRP for Radeon RX 9070 cards is €629, including 19% VAT. For its bigger sibling, the Radeon RX 9070 XT, the European MSRP is listed at €689, also including the sales tax. However, according to multiple listings from German online retailers, both cards are trading below their European MSRP pricing, marking the first occurrence since the memory shortage fiasco began, which took a toll on the gaming community. The cheapest Radeon RX 9070 non-XT model is listed at €539.00 in the form of the ASUS Prime Radeon RX 9070 OC SKU, while the cheapest Radeon RX 9070 XT model is listed at €640 for the ASRock Radeon RX 9070 XT Challenger GPU. Do note that this is not the first time that these GPUs are priced below MSRP in Germany, but just the first time since the memory shortages started.

Interestingly, this price drop in Germany is not consistent with the markets in the United States, where GPU pricing for the Radeon RX 9070 and RX 9070 XT still ranges around $810-$820 for the non-XT SKU and about $880-$890 for the Radeon RX 9070 XT model. This represents a large premium in the U.S. market, considering that the Radeon RX 9070 and Radeon RX 9070 XT graphics cards have MSRPs of $549 and $599, respectively. Perhaps a fresh supply of GPUs has hit the German market, causing supply to overwhelm demand and significantly pushing prices down. In the U.S., that is not the case, where prices remain high and on an upward trajectory, according to PCPartPicker. In contrast, the German market is experiencing some of the lowest pricing in recent months, finally giving gamers a break.

Kioxia America, Inc. today announced the development of its Super High IOPS SSD, a new type of SSD enabling the GPU to directly access high-speed flash memory as an expansion to High Bandwidth Memory (HBM) in AI systems. The new Super High IOPS SSD, the KIOXIA GP Series, is purpose-built to meet the growing performance demands of AI and high-performance computing, providing larger GPU-accessible memory capacity for faster data access to AI workloads. Evaluation samples of KIOXIA GP Series will be available to select customers by the end of 2026.

The NVIDIA Storage-Next initiative addresses the anticipated shift from compute-intensive to data-intensive workloads and the expanded need for GPU-accessible memory space, currently limited by HBM size. Expanding the GPU's usable memory space allows access to larger data sets and improves GPU utilization by moving more data closer to compute resources.

The widespread adoption of AI inference workloads in 4Q25 significantly raised requirements for data storage systems, according to TrendForce's latest findings on the enterprise SSD market. Meanwhile, enterprises accelerated upgrades to their general-purpose servers, while shortages in HDD supply pushed some demand toward SSD solutions. These factors together drove combined revenue for the world's top five enterprise SSD vendors up 51.7% QoQ to more than US$9.9 billion.

Among leading vendors, Samsung retained its top position, reporting nearly $3.66 billion in revenue in 4Q25, up 49.7% QoQ. The company demonstrated the strength of its vertically integrated business model. As concerns grew over potential DRAM shortages, many customers turned to Samsung because it can rely on its own DRAM and NAND Flash production to ensure stable SSD supply.

Intel used its MWC conference in Barcelona to showcase its most core-dense Xeon 6+ processor, codenamed "Clearwater Forest." As one of Intel's most complex chiplet designs, the package combines 12 compute chiplets manufactured on an Intel 18A node with three active base tiles on Intel 3 and two I/O tiles on Intel 7. In this configuration, each compute tile contains six modules of four "Darkmont" efficiency cores, providing 24 E-cores per tile and a maximum of 288 "Darkmont" E-cores on a single socket. A two-socket system, therefore, approaches 576 cores. The design connects clusters with a high-bandwidth on-chip fabric and stacks die using Foveros Direct 3D, while EMIB links connect multiple tiles in a 2.5D arrangement.

Each "Darkmont" E-core comes with a 64 KB instruction cache, a wider front end, and a larger out-of-order window to sustain more in-flight work. Execution resources and the number of execution ports have been increased to improve parallel integer and vector throughput. Physically, clusters are grouped in four-core units sharing about 4 MB of L2 cache per group, and the package-level last-level cache can exceed a gigabyte, with about 1,152 MB of combined last-level cache across the package. "Clearwater Forest" supports the existing Xeon server platform socket, 12 memory channels, and broad I/O, including 96 PCIe 5.0 lanes and 64 CXL 2.0 lanes. Memory speed targets push toward DDR5-8000.

Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion," the "Company," "we" or similar terms) today announced its financial results for the fourth quarter and year ended December 31, 2025. For the fourth quarter of 2025, net sales (GAAP) increased sequentially to $278.5 million from $242.0 million in the third quarter of 2025. Net income (GAAP) also increased sequentially to $47.7 million, or $1.41 per diluted American depositary share ("ADS") (GAAP), from net income (GAAP) of $39.1 million, or $1.16 per diluted ADS (GAAP), in the third quarter of 2025.

For the fourth quarter of 2025, net income (non-GAAP) increased sequentially to $42.7 million, or $1.26 per diluted ADS (non-GAAP), from net income (non-GAAP) of $33.8 million, or $1.00 per diluted ADS (non-GAAP), in the third quarter of 2025. All financial numbers are in U.S. dollars unless otherwise noted.

NVIDIA's long-awaited N1 and N1X laptop chips are set to arrive in the first quarter of this year, according to sources close to DigiTimes. The new roadmap indicates that NVIDIA's latest Windows-on-Arm platform will debut with the N1X chips this quarter, while the regular N1 chips are expected in the second quarter of 2026. After years of speculation, this release could finally position NVIDIA to compete with other Windows-on-Arm platforms like Qualcomm's Snapdragon X2 Elite and X2 Plus. The N1X and N1 processors were initially expected to debut around CES 2026.

NVIDIA reportedly used its GB10 Superchip—the design powering the DGX Spark—as the blueprint for the N1/N1X. The CPU features 20 Arm v9.2 cores, divided into two clusters of ten, each supported by 16 MB of shared L3 cache (32 MB total), with each core having private L2 storage. The memory subsystem uses a unified LPDDR5X-9400 fabric on a 256-bit bus, supporting up to 128 GB and delivering approximately 301 GB/s of raw bandwidth, although it's unclear if such capacity will be available in consumer laptops. The package is rated at around 140 W TDP and includes PCIe 5.0 for high-speed NVMe SSD connections. For the GPU, N1X variant is rumored to include 6,144 CUDA cores.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, today introduces the all-new Rock Series lineup, engineered to provide comprehensive solutions for PC DIY builders, including models such as the B850 Rock WiFi 7 and B860 Rock WiFi 7 in ATX, as well as the B850M Rock WiFi and B860M Rock WiFi in microATX, offering dependable performance and a clean, satisfying aesthetic—all while maintaining an accessible price point.

Functionality and practicality is the key aspects of Rock series. Every Rock series motherboard comes standard with built-in Wi-Fi, 2.5GbE networking, PCIe 5.0 support, and a DIY-friendly pre-installed I/O shield—delivering a well-balanced, sweet-spot solution for daily PC builds. For ATX models, the B850 Rock WiFi 7 and B860 Rock WiFi 7 further enhance connectivity with Wi-Fi 7 support.

be quiet!, the German manufacturer for premium PC components and peripherals, is proud to announce two new high-wattage power supplies: Power Zone 2 1200 W and Pure Power 13 M 1200 W. These additions to the company's award-winning PSU lineup deliver exceptional performance for high-end gaming and workstation builds, combining cutting-edge efficiency, silent operation, and full compatibility with next-generation hardware. Both models feature a sturdy steel enclosure and reflect be quiet!'s high standards in design and manufacturing and are backed by a 10-year manufacturer's warranty.

"With these new 1200 W models, we're delivering the power and reliability that enthusiasts demand for their most ambitious builds," says Aaron Licht, CEO of be quiet! "Whether builders prioritize the Platinum efficiency and advanced cooling of Power Zone 2 or the Gold-rated mainstream value of Pure Power 13 M, both models represent our commitment to exceptional quality and whisper-quiet operation."

Acemagic unveiled its latest Mini PC lineup at CES 2026, highlighting significant advancements in local AI computing, content creation and gaming performance. Among the key exhibits was Acemagic's flagship Mini PC powered by the AMD Ryzen AI 9 HX 470 processor. Featuring Radeon 890M graphics and an XDNA 2 NPU, the system delivers up to 55 TOPS of AI performance, meeting Copilot+ PC requirements and enabling a wide range of local AI applications. The device also supports OCuLink expansion, PCIe 5.0 storage, dual 2.5 Gb Ethernet and Wi-Fi 7 connectivity, offering flexible performance and high-speed networking options.

For professional users, Acemagic introduced the TANK CENTER M1A PRO+, designed for intensive AI inference and creative workloads. Powered by the AMD Ryzen AI Max+ 395 processor, the system delivers up to 126 TOPS of total AI computing performance. It supports up to 128 GB of LPDDR5x unified memory and features three PCIe 4.0 M.2 slots, providing strong support for large AI models and storage-intensive applications.

ASRock at the 2026 International CES showed off its latest PSUs. Starting things off is the new ASRock 12V-2x6 L-type modular PSU cable. This cable comes with 16 AWG wires for its main power lines, and is 70 cm in length. It is capable of 12V-2x6 with 600 W continuous output and meets ATX 3.1 and PCIe 5.1 CEM specs. Besides its 12 power pins and 4 sensor pins, there are two additional detachable pins, which connect a compatible PSU to a thermal diode located in the VGA-end of the cable. When it senses that temperature within the connector has crossed a certain safety threshold, the PSU's over-temperature protection (OTP) kicks in and turns off your machine. You will lose work, but might end up saving your high-end graphics card. The cable's temperature pins work with ASRock's Taichi, Phantom Gaming, and Steel Legend Platinum series PSUs).

ASRock PRO series PSUs are the company's mainstream non-modular (fixed cable) PSU lineup, these come in 850 W (600 W 12V-2x6), 750 W (450 W 12V-2x6), and 650 W (450 W 12V-2x6) models, and meet ATX 3.1 and PCIe 5.1 specs, offering 80 Plus Gold switching efficiency. The Steel Legend Platinum series are a premium line of PSUs positioned above, with full modular cabling. These can be had in 850 W, 1000 W, and 1200 W models, each of which have 600 W-capable 12V-2x6. The 1200 W model in fact comes with two 600 W 12V-2x6). You get 80 Plus Platinum switching efficiency, along with Cybenetics Platinum switching and Cybenetics A acoustics. The Phantom Gaming (SFX) series comes in 850 W and 1000 W, featuring not just 600 W 12V-2x6, but also connector OTP, 92 mm cooling fans, and 5 V rail power boost.

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it has entered into a definitive agreement to acquire XConn Technologies ("XConn"), a provider of advanced PCIe and CXL switching silicon. The acquisition expands Marvell's switching portfolio by adding XConn's PCIe and CXL products and augments Marvell's Ultra Accelerator Link ("UALink") scale-up switch team, adding highly experienced engineering talent with deep domain expertise in high-performance switching.

As AI workloads scale, data center system design is evolving from single-rack deployments to larger, multi-rack configurations. These next-generation platforms increasingly require a high-bandwidth, ultra-low latency scale-up fabric such as UALink to efficiently connect large numbers of XPUs and enable more flexible resource sharing across the system.

At the start of the CES 2026, Sandisk shocked everyone with the rebranding of the WD_Black SSD family into a new brand called Sandisk Optimus. The new Sandisk Optimus drive family brings the old trusted WD_BLACK SSD family under a single name. The regular Optimus drives replace WD_BLUE, while the Optimus GX replaces WD_BLACK SN7100 NVMe SSD. For the Optimus GX PRO, Sandisk rebranded WD_BLACK SN8100 NVMe SSD, now offering PCIe 5.0 NVM M.2 SSDs with 14.9 GB/s read and 14 GB/s write speeds in 2 TB and 4 TB capacities. These name tags are reminiscent of the older WD SSDs, and carry the same part numbers to better resonate with the gaming community who has grown found of the WD SSDs for great value with WD_BLUE and performance with WD_BLACK. Pictured below are the newly rebranded SSDs, which feature a black and red color theme across the lineup.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, is set to impress tech enthusiasts worldwide at CES 2026 with its latest product lineup innovations. This year, ASRock will unveil an expanded lineup featuring cutting-edge motherboards, graphics cards, gaming monitors, compact systems, power supply series, and the debut of its all-in-one (AIO) liquid cooler solution.

This comprehensive product showcase highlights ASRock's continuous commitment to high performance and precision engineering. By combining innovative technology, reliable quality, and industry-leading design aesthetics, ASRock continues to shape the future of PC hardware, driving the industry forward with innovation that leads the flow.

AMD's Ryzen 9 9955HX3D launched earlier this year as a 16-core mobile gaming CPU based on AMD's Zen 5 architecture. Now, it appears to be coming to an microATX motherboard designed for use in DIY PC builds, courtesy of Aoostar. The company, known for its mini PCs, has announced two versions of the microATX motherboard via a Bilibili post: one with an AMD Ryzen 9 9955HX and another with the AMD Ryzen 9 9955HX3D. Both motherboards feature a full-size PCIe 5.0×16 expansion slots for dGPU compatibility, two DDR5 RAM slots for dual-channel capability, and dual 2280 M.2 PCIe 5.0×4 slots for storage expansion.

The motherboard also looks to use a standard 24-pin ATX power connector. The 9955HX3D's biggest claim to fame is the sizeable cache that's split between 64 MB of 3D V-Cache and 64 MB of regular cache, but this specific offering might be a decent option for those looking for a lot of power in a smaller form factor without the very limited expansion options that come from traditional mini PCs. The Ryzen 9 9955HX motherboard will launch at $530 (converted from ¥3799), a while the 3D V-Cache-equipped 9955HX3D will launch at $669.53 (converted from ¥4799), although it is unclear if these motherboards will be available for purchase outside of China.

Update Dec 30th: Aoostar has officially launched the TA95X3D microATX motherboards on its international store at a launch price of $749 (after a 25% discount).

Kioxia Corporation, today announced that its 2.5-inch KIOXIA CM7 Series Enterprise PCIe 5.0 NVMe 2.0, KIOXIA CD8P Series Data Center PCIe 5.0 NVMe 2.0 and KIOXIA CD8 Series Data Center PCIe 4.0 NVMe 1.4 SSDs have been successfully tested for compatibility and interoperability with the Adaptec SmartRAID 4300 Series RAID storage accelerator card from Microchip Technology Inc.

The Adaptec SmartRAID 4300 accelerator supports up to 32 NVMe SSDs, with each drive directly connected to the CPU through its own dedicated channel. This design eliminates the PCIe bottleneck typically associated with a traditional single x16 host interface, enabling each SSD to operate at peak performance. This innovative architecture delivers exceptional throughput and IOPS, making it an ideal solution for data-intensive enterprise applications. The success of next-generation data center infrastructures relies on ecosystem collaboration and interoperability to ensure seamless integration of current and future technologies.

ENERMAX, an industry-leading force dedicated designing high-performance computer hardware and cooling solutions, proudly announces the launch of the REVOLUTION III S 1000 W, a premium fully modular power supply designed to meet the latest standards in performance, reliability, and aesthetics. Available in both black and white, the REVOLUTION III S 1000 W offers enthusiasts and professionals the flexibility to build powerful systems without compromise. The REVOLUTION III S comes with a 13-year warranty that highlights ENERMAX's confidence in the product's reliability and long-term durability.

The newest addition to the REVOLUTION line is 80 Plus, Cybenetics, and PPLP Platinum certified, ensuring outstanding efficiency and reduced power consumption. Fully compliant with the Intel ATX 3.1 standard, the REVOLUTION III S guarantees stable and reliable power delivery for not only the latest generation of high-performance graphics cards and CPUs, but also the upcoming generations too. Equipped with one 12V-2x6 interface, the REVOLUTION III S 1000 W can deliver up to 600 W of dedicated power to the latest GPU, making it future-ready for enthusiast builds.

The ToughArmor MB699V5P-B packs next-generation performance and rugged durability into a compact mobile rack solution, integrating up to four enterprise U.2/U.3 NVMe SSDs (7-15 mm height) into a single external 5.25" optical drive bay. With PCIe 5.0 support delivering transfer speeds of up to 128 Gbps per drive through dual MCIO 8i (SFF-TA-1016) connectors, a redesigned airflow-optimized enclosure, and a lightweight aluminium housing, the MB699V5P-B is built for mission-critical applications in servers, workstations, and compact systems where maximum speed, security, and reliability are essential.

The MB699V5P-B is designed for workflows that demand extreme I/O performance and hot-swappable NVMe SSD access. It is particularly well-suited for edge computing nodes, HPC clusters, and AI/ML training systems that rely on fast dataset streaming. Industrial imaging and medical diagnostic platforms also benefit from its removable design, enabling quick SSD replacement during maintenance. In addition, the MB699V5P-B is an excellent fit for system integrators, labs, and R&D environments, where frequent SSD swaps are necessary for validation, testing, or rapid dataset changes. This makes it a versatile solution that bridges enterprise-grade performance with flexible deployment scenarios.