Giga Computing, a subsidiary of GIGABYTE Group and a leader in high-performance computing and data center solutions, today announced a strategic partnership with Syrma SGS Technology Limited, a premier Indian electronics manufacturing services provider. This collaboration will establish local manufacturing of GIGABYTE server products in Tamil Nadu, India, supporting the country's "Make in India" initiative and strengthening Giga Computing's supply chain presence in South Asia.

To enhance global advanced manufacturing capabilities and create a more agile supply chain, Syrma SGS will begin assembly of GIGABYTE server motherboards at its Chennai facility to meet India's growing market demand. Initial production will include enterprise-grade boards such as the GIGABYTE MS73-HB0 and MZ33-AR1, delivering critical hardware for data centers and enterprise computing. The partnership will later expand to full box-build system manufacturing with export capabilities, enabling Giga Computing to accelerate global delivery with greater efficiency and flexibility.

AEWIN unveils the BIS-5132-2U, a versatile 2U general-purpose server powered by Intel's latest Xeon 6 processors built on Intel 3 process technology. Featuring a single Intel Xeon 6700/6500-series CPU, the BIS-5132 delivers exceptional compute density with up to 86 P-cores or 144 E-cores for demanding workloads. Designed for scalability, the platform accommodates 12 large form factor (3.5") drive bays and up to 8 PCIe expansion slots address a wide range of deployment scenarios.

2U High-Performance General-Purpose Servers
The BIS-5132-2U features 8x DDR5 RDIMM modules running at speeds up to 6400 MT/s. Leveraging up to 136 PCIe Gen 5 lanes enabled by the Granite Rapids-SP RIS architecture, the system provides up to 8 PCIe expansion slots for flexible configurations including high throughput NICs, storage adapter cards for high-speed NVMe SSDs, and advanced GPU/FPGA accelerators to deliver outstanding I/O performance and scalability.

Dell Technologies (NYSE: DELL) announces financial results for its fiscal 2026 third quarter and provides guidance for its fiscal 2026 fourth quarter and full year. The company also names David Kennedy its chief financial officer on a permanent basis.

Third-Quarter Summary

• Record third-quarter revenue of $27.0 billion, up 11% year over year
• Diluted earnings per share (EPS) of $2.28, up 39% year over year, and record third-quarter non-GAAP diluted EPS of $2.59, up 17%
• Cash flow from operations of $1.2 billion

During Foxconn's annual tech day in Taipei, the company announced that its $1.4 billion supercomputing center, built in partnership with NVIDIA, will be ready in the first half of 2026. The facility will become Taiwan's largest advanced GPU cluster, powered by NVIDIA Blackwell GB300 hardware and operated under Foxconn's new AI and cloud unit, Visonbay.ai. NVIDIA VP Alexis Bjorlin said that with GPU performance rising so quickly, many companies will find it more economical to rent compute capacity instead of building their own facilities. Foxconn plans to invest $2-3 billion per year in AI as Chairman Young Liu says the company can already build around 1,000 AI racks per week, a number set to rise next year.

In a separate announcement, OpenAI confirmed a new partnership with Foxconn to co-develop hardware for data centers. Foxconn will design and manufacture components such as cabling, power systems, and other infrastructure gear. While the agreement doesn't include purchase commitments, OpenAI will get early access to test the hardware. Foxconn's deepening collaboration with OpenAI mirrors the model it already uses with Google, AWS, and Microsoft. The partnership gives Foxconn better feedback on rack design and helps speed up new system development. OpenAI CEO Sam Altman said that demand for advanced AI infrastructure continues to exceed supply, and that new AI models will require new types of server racks, cooling systems, and power hardware.

Counterpoint Research expects memory prices to keep climbing through 2025 and into early 2026. The firm says DRAM prices could rise another 30% in Q4 2025, followed by up to 20% more early next year. This comes on top of roughly 50% price increases already seen this year. The main pressure right now is on older memory. LPDDR4 supply has tightened as manufacturers shift production to newer parts for AI hardware. That shift has created odd price gaps: DDR5 for PCs and servers is trading around $1.50 per gigabit, while DDR4, used in low-end phones and other consumer gear is selling for about $2.10. Even HBM3e is currently cheaper at around $1.70. Counterpoint expects DRAM output to grow by more than 20% in 2026 as Samsung, SK hynix, Micron, and China's CXMT ramp up production. But the bigger problem may be further ahead. NVIDIA's plan to use LPDDR in future AI systems puts it on par with a major smartphone vendor, something the LPDDR supply chain has never had to support. LPDDR also shifts error correction away from DDR5 ECC modules and onto the CPU, a change that could reshape server designs.

In a tight supply scenario, Counterpoint warns DDR5 RDIMM prices could double between early 2025 and the end of 2026. For now, the worst impact is hitting budget smartphones that still rely on LPDDR4. But analysts expect the strain to spread to mid-range and high-end devices, raising bill-of-materials costs by as much as 25% for some models. That could squeeze margins or slow shipment growth—or both. The report adds that broader risks like tariffs, geopolitics, and labor costs make the outlook even more volatile.

Q.ANT today announced the availability of its next-generation Native Processing Unit: The Q.ANT NPU 2, with enhanced nonlinear processing capabilities to deliver orders-of-magnitude gains in energy efficiency and performance for AI and high-performance workloads. By performing nonlinear mathematics natively in light, the Q.ANT NPU 2 enables entirely new classes of AI and scientific applications including physical AI and advanced robotics, next-generation computer vision and industrial intelligence, physics-based simulation and scientific discovery. Q.ANT is offering its NPUs directly as a 19" Server Solution including x86 host processor and Linux operating system.

"Q.ANT offers the industry a new class of processors that enable performance gains beyond the incremental improvements of their digital counterparts - opening the door for superior algorithms that digital circuits cannot reach." said Dr. Michael Förtsch, CEO of Q.ANT. "For years, AI has raced ahead of our ability to power it—energy became the new frontier. With our NPUs, we've changed the equation. Our NPU 2 proves that performance and sustainability aren't opposing forces. They're one and the same. This isn't an evolution—it's a new beginning.

MSI, a leading global provider of high-performance server solutions, showcases its next-generation computing and AI innovations at SuperComputing 2025 (SC25), Booth #205. MSI introduces its ORv3 rack solution and a comprehensive portfolio of power-efficient, multi-node, and additional AI-optimized platforms built on NVIDIA MGX and desktop NVIDIA DGX, designed for high-density environments and mission-critical workloads. These modular, scalable and rack-scale solutions are engineered for maximum performance, energy efficiency, and flexibility, enabling modern and next-generation data centers to accelerate deployment and scale with ease.

"Through close collaboration with industry leaders AMD, Intel, and NVIDIA, MSI continues to drive innovation across the data center ecosystem," said Danny Hsu, General Manager of the Enterprise Platform Solutions at MSI. "Our goal is to deliver scalable, energy-efficient infrastructure that empowers customers to accelerate AI development and next-generation computing with performance, reliability, and flexibility at scale."

MiTAC Computing Technology, a global leader in high-performance and energy-efficient server solutions, is proud to announce its participation at the Supercomputing (SC) 2025 (November 18-20, St. Louis, Missouri), booth 3916. Under the theme "AI Cluster Power - Cool Fast. Scale Faster.", MiTAC Computing will showcase its modular, highly scalable rack infrastructure designed for demanding AI and HPC workloads. The exhibition will demonstrate the company's full spectrum of capabilities, ranging from single AI servers to complete cluster-level integration, with a focus on cutting-edge liquid cooling and energy-efficient designs to maximize performance and sustainability.

Collaborating with key industry players such as AMD, Broadcom, CoolIT, Intel, KIOXIA, Micron, NVIDIA, Samsung, and Solidigm, MiTAC Computing is dedicated to accelerating the development of advanced computing and high-efficiency data centers.

Akasa, a leading provider of thermal solutions, has launched the Kepler, a 2U rack-mountable, fanless case for microATX and Mini-ITX motherboards. The Kepler provides passive cooling for Intel Core (12th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP and integrates a 150 W fanless ATX power supply, intended for use in industrial server, control, telecommunications and broadcasting applications where silence and reliability are key.

Kepler Fanless Case
The chassis is compatible with microATX and Mini-ITX motherboards with Intel LGA1851 and LGA1700 sockets, supporting Intel Core (12th/13th/14th Gen) and Core Ultra (15th Gen) processors with a thermal design power (TDP) of up to 35 W.

NVIDIA plans to reshape the industry's approach to building high-performance AI servers with its "Vera Rubin" product stack, which will enter volume production as the VR200 line in late 2026. Rather than supplying CPUs and GPUs to OEMs, NVIDIA plans to ship fully finished L10 compute trays that come pre-populated with "Vera" CPUs, "Rubin" accelerators, memory, 800G NICs, 110kW power delivery, and liquid-cooling infrastructure, all of which are validated before they leave the factory. This, however, will leave many system vendors and OEMs shifting away from designing core server electronics and toward tasks such as rack-level assembly, power configuration, installation of rack cooling sidecars, and final certification.

Rubin silicon is rumored to have a TDP of up to 2.3 kW for highest-end models, leading to rack-level power consumption exceeding 250 kW and making custom cooling designs economically unviable. NVIDIA's strategy reportedly involves standardizing cooling and power across two performance tiers while increasing network I/O density. These choices decrease the feasibility and cost-effectiveness of third-party replication. By centralizing production with select partners, development cycles can be shortened and manufacturing yields improved. However, this approach also limits the options OEMs and hyperscalers have traditionally used to differentiate their hardware.

With the exponential rise in AI infrastructure costs and vendor lock-in designs, enterprises are increasingly limited in their ability to scale demanding applications. EnGenius Technologies, a global innovator in intelligent networking and enterprise solutions, is excited to unveil its portfolio of modular data center servers and dedicated AI accelerators at Supercomputing 2025 (Booth #6451), taking place November 16-21 at the America's Center Convention Complex in St. Louis, Missouri.

"Supercomputing 2025 marks a milestone for EnGenius as we expand beyond networking into AI and high-performance computing," said Roger Liu, Executive Vice President at EnGenius Technologies. "Our modular data center total solution delivers the openness, efficiency, and scalability that enterprises need to power next-generation workloads."

Intel released a new CPU microcode yesterday, accompanied by 30 new security advisories. The new microcode update—version 20251111—covers processors from 12th to 14th Generation Core and Core Ultra mobile lines, as well as multiple Xeon Scalable families (fourth through sixth generation), and focuses on functional fixes. However, the most interesting announcement is the new cohort of security advisories, where the count goes up to 30. For example, things like The Intel PROSet/Wireless WiFi Software Advisory (INTEL-SA-01398) closes a high-severity flaw that could disrupt wireless connectivity, so update WiFi drivers to version 23.160 or later. The Intel Graphics Advisory (INTEL-SA-01356) patches privilege escalation and stability issues in Arc B-series and Iris Xe drivers, where installing driver version 32.0.101.6913 or newer is recommended.

The Intel Rapid Storage Technology Advisory (INTEL-SA-01362) addresses a medium-severity escalation vulnerability affecting RAID and NVMe caching, and users should move to RST version 20.0.1021 or later. The Intel Killer Software Advisory (INTEL-SA-01377) covers security fixes for networking utilities often bundled with gaming systems, so check for updates if your PC uses Killer networking software. Finally, the Intel Server Configuration Utility Advisory (INTEL-SA-01400) is primarily targeted at server and home lab administrators, but it is worth applying if you manage such systems. Keeping these drivers and utilities up to date reduces both stability problems and exposure to potential exploits.

ADATA INDUSTRIAL, a global leader in industrial-grade embedded memory, will make its first appearance at Embedded World North America 2025 (Booth #7060), showcasing the theme "Driving the Infinity of AI." This strategic expansion into the U.S. market underscores ADATA INDUSTRIAL's commitment to empowering intelligent transformation across vertical markets with high-performance PCIe Gen 5 SSDs, DDR5 DRAM modules, intelligent software, and enterprise-grade storage solutions under ADATA's enterprise brand, TRUSTA. Together, these innovations form a complete edge-to-cloud storage ecosystem for AI, automation, and other high-demand industrial applications.

Cutting-Edge Hardware & Intelligent Management Platform
To meet the extreme demands for data processing speed and system stability in next-generation AI applications, ADATA INDUSTRIAL will showcase a range of advanced products:

• Industrial-grade SSDs: Supporting the latest PCIe Gen 5 interface in U.2 form factors and leveraging advanced eTLC and BiCS8 3D NAND flash, these SSDs deliver outstanding bandwidth and endurance—ideal for high-speed data logging and real-time analytics.
• Industrial-grade DDR5 Memory Modules: Featuring robust technologies such as Clock Drivers (CKD), Power Management ICs (PMIC), and On-Die ECC, these modules ensure signal integrity and data accuracy even in complex electromagnetic environments and prolonged operation, providing a stable computing backbone for edge servers and AI accelerators.

Amazon Web Services (AWS) and OpenAI have signed a $38 billion deal spanning several years, seven to be more precise, to boost OpenAI's AI operations using AWS's high-end cloud setup. This agreement lets OpenAI use clusters with hundreds of thousands of NVIDIA GB200 and GB300 GPUs, the complete planned capacity is expected to be deployed for use by the end of 2026. These GPUs are set up across Amazon EC2 UltraServers linked by a fast, high-capacity network built to handle both inference and large-scale model training. AWS's previous experience managing clusters exceeding 500,000 chips has been a key factor in OpenAI's decision.

The new infrastructure is expected to serve a range of OpenAI applications, from ChatGPT inference workloads to training next-generation foundation models. OpenAI's move to AWS comes after a series of recent partnerships with NVIDIA, AMD, Microsoft, Broadcom, and Oracle making sure they can tap into a mix of high-end chips and cloud systems. OpenAI CEO Sam Altman stated that the company plans to invest $1.4 trillion to build 30 gigawatts of computing capacity, equivalent to the power consumption of roughly 25 million U.S. households. So far, OpenAI has partnered with NVIDIA for 10 GW, AMD for 6 GW, and Oracle for 4.5 GW of compute capacity, moving steadily toward its stated goal of building a 30 GW AI infrastructure network.

NVIDIA today announced that it is working with SK Group to build an AI factory to advance semiconductor research, development and production, as well as cloud infrastructure to support digital twin and AI agent development. SK Group is building an AI factory featuring more than 50,000 NVIDIA GPUs, with the first phase planned for completion by late 2027. Once complete, the system is expected to be one of Korea's largest AI factories.

The new factory will serve SK subsidiaries - including SK hynix and SK Telecom (SKT) - as well as external organizations through a GPU-as-a-service model, accelerating digital transformation and industrial innovation for Korea's industries. Further expanding the NVIDIA and SK Group partnership, the companies are collaborating on the development of SK hynix high-bandwidth memory (HBM) and next-generation advanced memory solutions for NVIDIA GPUs, semiconductor manufacturing and telecommunications infrastructure.

NVIDIA today announced plans with Samsung Electronics to build a new AI factory, representing a new era where intelligent computing and chip manufacturing converge. The state-of-the-art AI factory will combine Samsung's semiconductor technologies with NVIDIA platforms to establish the foundation of next-generation, AI-driven production. Powered by more than 50,000 NVIDIA GPUs, Samsung's semiconductor AI factory will be a centerpiece of the company's digital transformation, integrating accelerated computing directly into full-fledged advanced chip manufacturing.

Through this collaboration, Samsung and NVIDIA are setting a global benchmark for AI-driven semiconductor manufacturing at scale, integrating data from physical equipment and production workflows to achieve predictive maintenance, process improvements and increased operational efficiency in autonomous fab environments.

Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing its advanced AI infrastructure solutions at NVIDIA GTC in Washington, D.C. this week, highlighting systems tailored to meet the stringent requirements of federal customers. Supermicro announced its plans to deliver next-generation NVIDIA AI platforms, including the NVIDIA Vera Rubin NVL144 and NVIDIA Vera Rubin NVL144 CPX in 2026. Additionally, Supermicro introduces U.S.-manufactured, TAA (Trade Agreements Act)-compliant systems, including the high-density 2OU NVIDIA HGX B300 8-GPU system with up to 144 GPUs per rack and an expanded portfolio featuring a Super AI Station based on NVIDIA GB300 and the new rack-scale NVIDIA GB200 NVL4 HPC solutions.

"Our expanded collaboration with NVIDIA and our focus on U.S.-based manufacturing position Supermicro as a trusted partner for federal AI deployments. With our corporate headquarters, manufacturing, and R&D all based in San Jose, California, in the heart of Silicon Valley, we have an unparalleled ability and capacity to deliver first-to-market solutions are developed, constructed, validated (and manufactured) for American federal customers," said Charles Liang, president and CEO, Supermicro. "The result of many years of working hand-in-hand with our close partner NVIDIA—also based in Silicon Valley—Supermicro has cemented its position as a pioneer of American AI infrastructure development."

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly announces the launch of its IMB701, a high-performance server-grade ATX motherboard designed to meet the demands of AI, high-performance computing, and advanced image analysis. Powered by the latest 5th/4th Gen Intel Xeon Scalable Processors (up to 350 W TDP), the IMB701 delivers unparalleled computing performance with enterprise-level reliability.

High-Performance Architecture
The IMB701 supports the Intel Xeon Scalable platform with an LGA4677 socket, handling processors with up to 350 W TDP. It offers eight DDR5-5200 R-DIMM ECC slots, enabling up to 512 GB of high-density memory for demanding workloads. Its advanced architecture includes five PCIe x16 Gen 5 slots, enabling the integration of multiple GPUs and acceleration cards, making it highly scalable for AI workloads and video analytics, AOI, and LLM applications.

Just two days after Windows 10 reached its end of life, issues with Microsoft's latest Windows 11 October update have begun to surface. Users on Microsoft Support Forums, Stack Overflow, and Server Fault have reported that the localhost functionality in Windows 11 is now broken. This problem is affecting millions of web developers who are unable to run their applications on their own PCs. The update, KB5066835, focuses on security and enhances the September-issued KB5065789 package with additional quality improvements. However, it disrupts the localhost function, a virtual hostname that allows a PC to serve as its own server. This feature is commonly used by local developers to test websites or fully developed web apps. The disruption has significantly impacted developers, including those using Windows 11 on their local servers or workstations for production purposes.

The community has managed to solve the issue by simply deleting the October KB5066835 package, alongside its September KB5065789 sibling, if the first package uninstall doesn't work. Software engineers have reported connection failures and HTTP/2 protocol issues impacting various development tools, including ASP.NET compilation processes and Visual Studio debugging functionality. Investigation has revealed that the problem originated in build version 26100.6899, with the root cause identified in HTTP.sys—a kernel-level Windows component responsible for managing HTTP traffic on local systems.

Update October 17, 15:30 UTC: Microsoft confirmed the issue and stated: "We are working on releasing a resolution for this issue in a future Windows update. We will provide an update when more information is available."

According to TrendForce, citing a Nikkei report, Microsoft is accelerating efforts to relocate laptop and server production out of China. The company has asked suppliers to prepare for the manufacture of Surface laptops and data center servers outside the country, with the goal of moving up to 80% of server components and final assembly elsewhere by 2026. The transition extends beyond final assembly to components and materials, including cables, connectors, and printed circuit boards marking the first time major U.S. firms have diversified supply chains down to this level.

Meanwhile, Micron reportedly plans to exit China's server chip business after failing to recover from a 2023 government ban that restricted its products from critical infrastructure. The U.S. memory maker was the first American semiconductor company targeted by Beijing in what was widely viewed as retaliation for Washington's tech export controls. The move has cost Micron access to China's fast-growing data center market in favor of rivals Samsung Electronics, SK hynix, and domestic players YMTC and CXMT. However, Micron will continue supplying customers such as Lenovo and other firms with operations outside China, as well as maintain business in the automotive and mobile sectors. Despite workforce reductions in its Chinese NAND division earlier this year, Micron continues to operate and expand its Xi'an packaging facility, one of its key manufacturing sites in Asia, Reuters reports.

ASUS today announced its participation in the 2025 OCP Global Summit, being held from October 13-16 at the San Jose Convention Center, booth #C15. At the event, ASUS unveiled its XA NB3I-E12 series AI servers, based on NVIDIA HGX B300 system integrated with NVIDIA ConnectX-8 InfiniBand SuperNICs, 5 PCIe expansion slots, 32 DIMM and 10 NVMe. Designed for enterprises and cloud service providers (CSPs) managing intensive AI workloads, these servers deliver outstanding performance and stability, unlocking the full potential of AI.

Starting this September, ASUS AI POD built on NVIDIA GB300 NVL72 and XA NB3I-E12 servers based on NVIDIA HGX B300 have begun shipping, giving enterprises and cloud service providers early access to cutting-edge AI performance and reliability.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise hardware and advanced cooling solutions, today announced its participation in the OCP Global Summit and the launch of its new GIGABYTE TO86-SD1 based on the NVIDIA HGX B200 platform. Built on the OCP ORv3 standard, the system combines breakthrough performance with an energy-efficient design to meet the demands of large-scale AI training, inference, and HPC workloads. With support for the powerful NVIDIA Blackwell GPU, this next-generation platform empowers enterprises and research organizations to accelerate innovation, scale seamlessly, and unlock new possibilities in AI.

What to Expect at GIGABYTE Booth #A57
The 2025 OCP Global Summit (Oct. 13-16) is the first opportunity to display and introduce this new OCP-based GPU server. The new GIGABYTE TO86 Series is designed to support 8-GPU OAM baseboards that are ideal for their performance and scalability and are used by hyperscalers, sovereign data centers, and specialized AI cloud providers. Also featured at the GIGABYTE booth is the NVIDIA GB300 NVL72 platform, a liquid-cooled, rack-scale design with dense performance in a platform optimized for test-time scaling inference. Alongside this platform for AI factories is the GIGABYTE XL44-SX2, an NVIDIA RTX PRO Server featuring NVIDIA ConnectX-8 SuperNICs. These products are a testament to the breadth of accelerated computing solutions using standardized designs, including ones inspired by OCP.

Giga Computing, a subsidiary of GIGABYTE and a global leader in AI servers and advanced cooling technologies, announced its participation in GITEX Global 2025, featuring nVent and Iceotope at GIGABYTE booth H10-18. As a trusted partner in the AIDC Infra ecosystem, Giga Computing designs and delivers high-performance AI servers. nVent is a leader in high density liquid cooling, rear-door heat exchangers (RDHx), IT server racks and cabinets, manifolds and iPDUs. Iceotope liquid cooling solutions offer enterprises and cloud service providers a unique combination of peak thermal efficiency and deployment flexibility. Working together, they underscore a collaborative ecosystem supported by a joint commitment to energy-efficient and sustainable AI infrastructure.

Driving Growth and Innovation in the Middle East
Participation in GITEX reflects Giga Computing's commitment to building a strong presence in the Middle East market, a region experiencing a rapid digital transformation and AI adoption. As one of the world's top-tier AI server suppliers, Giga Computing is bringing its complete AI data center solutions to the Middle East, providing enterprises, hyperscalers, and emerging AI innovators with scalable infrastructure designed for cutting-edge workloads.

AWS has collaborated with AMD as the first major cloud provider to launch instances powered by AMD EPYC CPUs. Since 2018, AWS has launched all generations of EPYC CPUs spanning general purpose, memory-optimized, compute-optimized, burstable, and HPC instance families. Today we're excited to announce the availability of the latest Amazon EC2 general-purpose instance, M8a, powered by 5th Gen AMD EPYC processors. AMD EPYC CPU-powered M8a is a strong fit for general-purpose applications that need balanced compute, memory, and networking. It is ideal for web and application hosting, microservices architectures, and databases where predictable performance and efficient scaling are important.

"AWS has trusted AMD EPYC processors for every generation of their cloud instances," said Dan McNamara, senior vice president and general manager, Server Business, AMD. "With 5th Gen EPYC, we're continuing to increase the performance, efficiency, and scalability customers need to power everything from modern applications to the most demanding workloads—helping them innovate faster in the cloud."

For most of us, when we think of Taiwanese company Sparkle, graphics cards come to mind first. So it came as quite a surprise when Sparkle just announced the C741-6U-Dual 16P servers packing no less than 16 Arc Pro B60 graphics cards—both in the single-GPU variant with 24 GB and the Arc Pro B60 Dual version with 48 GB. In this extreme Battlemage BMG-G21 GPU implementation, the server configuration delivers 81,920 GPU cores and 768 GB of VRAM. Sparkle uses a dedicated circuit that extends PCIe connectivity to 16 slots, giving each GPU its own PCIe 5.0 x8 interface. Both models use Intel Xeon Scalable processors from either 4th or 5th generation.

Such a setup needs an equally massive power delivery system. The 768 GB model uses five 2,700 W 80 Plus Titanium power supplies (4 + 1 redundancy) for a total of 10,800 W. The 384 GB VRAM variant uses four 2,400 W PSUs (3+1 redundancy) for 7,200 W total. For cooling, Sparkle went with classic air cooling using 15x 80 mm fans (or 12x 60 mm fans for the 384 GB variant). Both server models fit in a 6U chassis. Sparkle says they're targeting applications like Knowledge Management System and Retrieval, Multimodal RAG, or Intelligent Video Analysis.