ASUS today announced its groundbreaking new server lineup powered by the AMD EPYC 9006 processors, engineered to deliver unmatched performance for the most demanding intensive enterprise workloads. This advanced portfolio introduces two highly optimized series with efficiency-optimized AMD EPYC SP8 server CPU, the flagship dual-socket ASUS RS700A/720A for extreme compute density and the single-socket ASUS RS500A/520A for superior space efficiency and deployment flexibility.

Both series integrate full PCIe 6.0, leading memory support, and high-density E3.S storage, all underpinned by proprietary ASUS innovations for superior thermal management and operational efficiency to meet and exceed the rigorous demands of enterprise AI, virtualization, storage and cloud environments.

Networking is the third pillar of AMD's Advancing AI 2026 rack-scale strategy, and today the company detailed the AMD Pensando silicon and fabric technology that connects the Helios rack. As Helios is AMD's first rack-scale design, the company encountered challenges in interconnecting many GPUs, memories, and data movement speeds within a single system, both for scaling up and scaling out for multi-rack connections inside the data center. Current AI infrastructure must closely follow model development as AI model sizes have grown exponentially, from the original 65-million-parameter Transformer in 2017 to trillion-parameter GPT-4-class systems and now 10-trillion-plus parameter agentic and reasoning models. To run a model with more than 10 trillion parameters, you need to connect dozens of GPUs with high-speed VRAM, as well as a high-speed interconnect to split model weights effectively so latency isn't an issue. The modern interconnect of choice is again the plain-old Ethernet, not proprietary interconnects, which have become the standard for AI networking.

AMD's solution spans three layers: a third-generation Pensando "Salina" DPU on the front end, a first-generation UALink-over-Ethernet (UALoE) scale-up fabric inside the rack, and a second-generation Pensando "Vulcano" AI NIC for scale-out. All of this is managed by AMD's Helios management software and Fabric Manager. AMD outlined challenges that bandwidth needs are doubling in less than two years driven by massive AI models growing at a rapid pace, and that the hardware iteration cycles need to account for intelligence in the data fabric layer, not only compute layer.

ASRock Rack Inc., a leading innovative server company, today announced support for the newly-launched 6th Gen AMD EPYC 9006 Series processors, unveiled this week at AMD Advancing AI 2026 in San Francisco. ASRock Rack will showcase its upcoming server platforms optimized for the new processor generation at the event, demonstrating its commitment to delivering advanced infrastructure for enterprise AI, cloud, and HPC workloads.

Delivering Leadership Performance for the Agentic AI Era
As agentic AI enters enterprise-scale deployment, the 6th Gen AMD EPYC 9006 Series processors deliver the performance, efficiency, and scalability required to support increasingly complex AI services and applications. Featuring up to 256 cores, industry-leading 5 GHz frequencies, and PCIe Gen 6 connectivity, 6th Gen EPYC Server CPUs enable organizations to scale AI agents, maximize AI host-node throughput and GPU utilization, and power the general-purpose workloads essential to modern data centers.

Giga Computing, a subsidiary of GIGABYTE, is a global provider of advanced computing solutions that power the next generation of HPC, AI inference, 5G/edge, and cloud computing, today announced support for 6th Gen AMD EPYC Server CPUs across its server lineup, further expanding its portfolio of systems designed for demanding workloads. Now, at AMD Advancing AI 2026 in San Francisco, Giga Computing is debuting its first server for the new AMD EPYC 9006 platform.

Two Sockets, One Generation
With 6th Gen AMD EPYC Server CPUs, AMD introduces a two-socket strategy to serve the diverse workloads of the modern data center. The larger SP7 socket delivers leadership performance for the agentic AI era, with industry-leading memory bandwidth and PCIe Gen 6 connectivity, and the SP8 socket delivers efficient scale-out performance where density is the goal. Both sockets can be equipped with AMD performant "Zen6" or density "Zen6c" cores to fit the architecture of any deployment.

MSI is expanding its server portfolio with platforms advanced by 6th Gen AMD EPYC Server CPUs across SP7 and SP8 designs to modernize data centers for AI, cloud, HPC, virtualization, and business-critical workloads. SP7 platforms deliver maximum density and performance with up to 256 cores and 512 threads per processor for performance-driven deployments, while SP8 platforms offer up to 128 cores and 256 threads per processor for balanced mainstream deployments. MSI's latest portfolio spans liquid-cooled GPU servers, 19" and 21" DC-MHS multi-node platforms, and enterprise servers. At AMD Advancing AI 2026, MSI will showcase the CD270-S4091-X2 multi-node server as part of its latest 6th Gen AMD EPYC server lineup.

"Data center architecture is becoming more workload-specific, and customers need systems that can be selected with purpose," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "MSI's latest server portfolio powered by 6th Gen AMD EPYC Server CPUs gives organizations the platform range to build around performance, density, efficiency, and serviceability as their infrastructure evolves."

Super Micro Computer, Inc., an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions (DCBBS), today announced its next-generation H15 server portfolio powered by 6th Gen AMD EPYC 9006 Series CPUs, optimized for next generation GPUs including AMD Instinct, and connected by AMD Pensando networking. With up to 256 cores and 512 threads, H15 systems meet the growing compute demands of cloud, enterprise, storage, high-performance computing (HPC), and agentic AI workloads. With breakthrough 1.7x generational CPU performance improvement1, expanded memory and I/O bandwidth, and industry-leading compute density, customers are now able to run more concurrent AI agents, accelerate enterprise applications, and maximize host-node performance while operating within existing power envelopes.

"The latest AMD powered additions to our DCBBS family deliver the next generation of AI infrastructure, optimized for high performance, rapid scalability, and peak efficiency," said Vik Malyala, Chief Business Officer at Supermicro. "Backed by our global services team, resilient U.S. supply chain, and consistent investment in US AI innovation, we continue to help customers deploy and scale AI with confidence."

Lenovo has released its annual sustainability report for the fiscal year 2025/26, marking the 20th edition and concluding the company's first five-year set of ESG targets. Companies typically set ESG targets to guide their sustainable corporate development, but only a few achieve these goals. Lenovo, the world's largest PC vendor, reports that it has met most of its objectives. It now sources approximately 90% of its operational electricity from renewable sources, incorporates recycled plastic into every PC it ships, and remains on track for net-zero emissions by 2050.

The 125-page document contains the usual corporate responsibility content, but a few numbers stand out for hardware enthusiasts. Over the five-year period, Lenovo claims to have recycled or reused about 800 million pounds (approximately 363 million kg) of end-of-life equipment, including old PCs, keyboards, mice, servers, and other products. Around 300 million pounds of post-consumer recycled plastic are now used across Lenovo's product range. The company also noted that data centers, the largest consumers of energy, are now utilizing its Neptune liquid cooling technology to reduce energy use compared to air cooling. These figures are self-reported, but Lenovo supports its key climate data with third-party verification and Science Based Targets initiative (SBTi) validation.

In the sea of negative news surrounding the entire semiconductor industry, NAND Flash might be one of the few major components that will become abundant again. According to the latest report by TrendForce, the storage supply chain is expected to achieve balance by 2027, making it the only area of computing projected to stabilize. Although the demand for NAND Flash and all SSD storage solutions that rely on it is expected to remain in short supply for the rest of 2026, TrendForce forecasts that supply and demand will return to normal in 2027. This year, there will be about a 4-6% supply deficit compared to demand for the remainder of the year. However, the second half of 2027 is anticipated to finally bring balance to the supply chain, with no deficit in NAND Flash supply a year from now.

This supply balance is driven by several factors. First, increased production capacity from NAND Flash suppliers like SK hynix, Micron, Samsung, YMTC, and others is crucial. The increase in the number of wafers produced each month, along with process node upgrades, will significantly boost supply, bringing this commodity to balance after a long period of uncertainty. The second factor is the persistently weak demand from consumers, as consumer electronics prices have risen so much due to DRAM and NAND Flash shortages that many consumers are opting not to purchase new hardware, avoiding the high premiums compared to a year ago. On the enterprise side, server demand will continue to rise, consuming most of the NAND Flash supply. Server demand accounts for about 40% of output consumption, while smartphones and notebooks together account for more than 40%.

Phanteks introduces the Enthoo Pro 2 Server V2, engineered for extreme performance and versatility. Its fully meshed all-metal exterior delivers exceptional airflow and durability, while the flexible interior is built for demanding server and workstation configurations. With broad hardware compatibility, adaptable cooling support, and versatile storage options, it is designed for scalable, high-performance systems.

Also joining the lineup is the Phanteks Enthoo Elite Server, a flagship chassis engineered for AI development, professional workstations, and enterprise computing. Expanding on the Enthoo platform, it delivers exceptional expansion, cooling, and storage capabilities with support for E-ATX and SSI-EEB motherboards, dual PSU configurations, and multi-GPU deployments. With 12 PCIe slots, support for up to 29 fan positions, and flexible high-capacity storage options, the Enthoo Elite Server is purpose-built for today's most demanding workloads.

IBM (NYSE: IBM) today announced IBM Power Autonomous Operations, an AI agent that can help continuously monitor Power systems and autonomously resolve issues to keep operations running smoothly. It complements the recently launched IBM Bob Premium Package for i, which brings agentic-driven software designed to accelerate application development on IBM i. These capabilities can accelerate building modern applications so enterprises can innovate at the pace required by their business. Additionally, the entry-level Power S1112 server provides a new compact, efficient option powerful enough to run AI inference locally.

IBM Power has long been IBM's platform for mission-critical enterprise workloads. As AI becomes part of that critical infrastructure, Power is built to support it. IBM introduced Power11 last year as autonomous IT for the AI era, built for availability, resiliency, and scale across on-premises and IBM Cloud environments. IBM Power Virtual Server is a fully managed cloud service on which enterprises can run AIX, IBM i and Linux workloads while offloading much of the routine management for system operations. Now, IBM is embedding autonomous IT across the Power platform, from code to runtime, with new capabilities and systems.

Minisforum showed off a range of new hardware at Computex 2026 earlier this year, and one of the new products it announced there was the MS-03 workstation mini PC, a new small form factor workstation PC designed for productivity, NAS, and local AI workloads. The MS-03 is based on the Intel Panther Lake Core Ultra 9 386H, a 25 W (80 W max Turbo) mobile CPU with four P-Cores, eight E-Cores, and four LP E-Cores, and four Arc Xe3 cores, meaning it's not going to be an outstanding gaming, content creation, or rendering workstation.

One of the big draws for NAS and server use cases is undoubtedly going to be the ample storage options and networking. Not only does the MS-03 have three M.2 slots that support up to 8 TB per slot, it also includes an adaptor to support U.2 SSDs, for up to 15 TB of enterprise storage, and the full-size PCIe ×8 slot can be used for additional storage expansion. The MS-03's chassis is made of aluminium and features a slide-out motherboard tray for easy upgrades. Although the CPU is soldered, it uses DDR5-7200 SODIMMs. Minisforum says that it offers up to 128 GB of memory, but it's unclear if it will only sell as a barebones kit or as a pre-built PC as well.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced its complete DDR5 9600 Client Memory Module Chipset for high-performance CUDIMM, CQDIMM and CSODIMM modules in future generation AI PCs. The chipset includes the new Gen 2 Client Clock Driver (CKD02), delivering breakthrough performance with support for PC memory module operation of up to 9600 MT/s, Power Management IC (PMIC5120) and Serial Presence Detect Hub (SPD Hub).

With the rise of agentic AI, PCs now plan, execute, and adapt workflows in real time. These workloads require persistent context, concurrent processing, and continuous data movement between the processor and system memory requiring significant increases in both bandwidth and capacity. At the same time, scaling DDR5 memory beyond 6400 MT/s introduces new technical challenges, including signal degradation, clock jitter, and timing instability. To address these challenges, the industry is transitioning to clocked memory modules, including CUDIMM and CQDIMM for desktops and CSODIMM for laptops, which incorporate an on-module client clock driver (CKD) to condition and redistribute the clock signal.

TrendForce's latest memory pricing survey reveals that the DRAM market will remain extremely tight in the third quarter of 2026. However, weaker demand from consumer applications and the impact of a higher comparison base are expected to moderate contract price increases to 13-18% QoQ.

Demand for NAND Flash will continue to be driven primarily by AI inference and large-scale data center deployments. Yet, with contract prices already at record highs and consumer demand slowing, price tolerance among consumer customers has reached its limit. As a result, NAND Flash contract prices are projected to increase by 10-15% QoQ—a noticeably slower pace than in previous quarters.

The ARCTIC Freezer 4U-Altra is a powerful air cooler for server and workstation processors. It is designed for efficient heat dissipation under high-performance demands and supports the Ampere Altra LGA4926 socket. With its compact design, it fits into standard 4U racks and 4U cases.

Efficient Airflow, Reliable Performance
Two high-performance fans in a push-pull configuration ensure high airflow while maintaining moderate noise levels. The durable bearings enable reliable continuous operation, making them ideal for 24/7 use in server environments. They provide efficient cooling - particularly well-suited for compact 4U server or workstation builds with powerful processors.

Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XE8812 server, a new addition to the Dell AI Factory with NVIDIA, purpose-built for the world's most demanding HPC and AI workloads, featuring NVIDIA Vera Rubin NVL4 architecture and delivering up to 144 GPUs per rack. The announcement comes as Dell AI Factory deployments accelerate worldwide, advancing sovereign AI initiatives, engineering and design workflows, and genomic science.

Why it matters
As AI and HPC simulation workloads converge, the scale and pace of these workloads are outgrowing what incremental infrastructure upgrades can keep up with. At the same time, organizations are pushing the boundaries of science and industry, resulting in a need for platforms that deliver a generational leap.

Montage Technology today announced the sampling of its Gen 6 DDR5 Registering Clock Driver chip (RCD06) with key customers. Designed for next-generation DDR5 Registered Dual In-line Memory Modules (RDIMMs), the chip is set to accelerate performance and reliability for upcoming server platforms.

The RCD06 supports data transfer rates of up to 9200 MT/s, a 15% increase over the previous generation, addressing the stringent high-bandwidth demands of next-generation server platforms. The chip features a dual-channel independent architecture in which both sub-channels share clock logic while operating independently, enabling separate parity checking without cross-channel interference. The device also integrates Continuous Time Linear Equalization (CTLE) and a low-jitter Phase-Locked Loop (PLL), improving signal integrity while ensuring precise and stable clock distribution.

MiTAC showcased an extended portfolio of HPC, servers and enterprise components at Computex 2026, among them being AMD Instinct MI350X air-cooled servers, MI355X liquid-cooled systems and enterprise MI350P PCIe accelerator cards. On display was an impressive 52U liquid-cooled AI rack built around 12x G4826Z5 servers and 96 AMD Instinct MI355X GPUs. In the server area MiTAC presented a 4U liquid-cooled G4826Z5 server powered by AMD Instinct MI355X accelerators and the 8U air-cooled G8825Z5 featuring Instinct MI350X GPUs.

NVIDIA MGX architecture AI servers powered by 6th Gen AMD EPYC processors and NVIDIA Blackwell B200 GPUs were also presented.

SilverStone's Computex 2026 cooling showcase leaned heavily into server, workstation and industrial applications. The HailStone 420 is a 420 mm AIO targeting workstation platforms including AMD Threadripper PRO. With an 84 × 73 × 65 mm copper base waterblock and 140 mm fans spinning between 800 and 2500 RPM it reaches up to 123.8 CFM. The XE420 extends the well-received XE360 server AIO lineup to a larger 420 mm format (140 × 28 × 456 mm), built for server and industrial environments with a radiator-integrated pump, industrial 140 mm LCP blade fans, and a vibration-reducing design. The fan speed and airflow specs are the same as the HailStone 420.

The FHL120 and FHL140 are high-airflow fans. The 140 mm version runs at 800 to 2500 RPM at 123.8 CFM and 38.8 dB(A), while the 120 mm reaches 95.1 CFM at 39.6 dB(A). Both run on dual ball bearings while measuring 27 mm (FHL120) and 34 mm (FHL140) thick.

Renowned PC case maker, Lian Li, has officially unveiled its next-gen case line-up at Computex 2026, with updates to both its full- and mid-tower cases, including popular series, like the O11 and Lancool cases. The new Lancool cases consist of the Lancool 207XL, which takes a pragmatic approach and aims for maximum performance and compatibility, and the Lancool 4, which prioritizes aesthetics without compromising too much on thermal performance. The Lancool 207XL is an ATX mid-tower case launching sometime in Q4 2026 for $109.99, and it will feature support for up to ATX motherboards, 360 mm liquid cooling radiators, and ATX PSUs. The most notable feature of the Lancool 207XL is the dual cross-flow fans installed in the bottom of the case, which increase GPU airflow with minimal impact on the case's dimensions. The Lancool 207XL will ship with two pre-installed 170 × 30 mm fans in the front intake, which is covered by a front plastic front panel with vertical slats that should allow for decent airflow.

SilverStone booth at Computex 2026 was full of products ranging from retro-inspired consumer chassis to enterprise servers, storage solutions, and high-capacity power supplies. Among the consumer products, the FLP03 got to the final production specifications as the microATX successor to the FLP02. The retro-themed chassis retains its classic cream finish, Turbo button and switches with a numeric display. Internally it adds support for triple 5.25-inch bays, 360 mm radiators, and graphics cards up to 413 mm long. A large hidden 180 mm fan is included on the removable front panel paired with a classic 120 mm at the rear.

Also on display was the Ultra Fort 5110 super-tower workstation chassis, offering support for up to three ATX power supplies, multiple GPUs and up to two 420 mm plus one 360 mm radiator.

We've already covered the latest cases and PSUs that DeepCool has on show at Computex, but the cooling hardware maker is also debuting a bunch of new CPU air coolers and AIO liquid coolers that cover everything from SFF builds to maximalist E-ATX use cases. The most premium new product at DeepCool's Computex booth is the Silentnox 360 Pro, the company's latest 360 mm AIO liquid cooler. The Silentnox 360 Pro uses DeepCool's in-house pump design, which the company says has been optimized for low-noise performance, and has a 6.67-inch, 2K flexible AMOLED display on the pump block, which ties into DeepCool's DeepCreative software and can be used to display system status, like CPU temperature, power draw, and utilization, as well as pump or fan speed. The pump cover and its display can be rotated 360 degrees, so that the waterfall edge can be placed at any 90° interval. DeepCool also has a new LT360 Vision ARGB AIO, which features a 360 mm radiator as well as a 4.5-inch LCD mounted on a 90-degree swivel on the CPU pump block. The display once again ties into DeepCool's software and is able to display system information. The new D-Cast functionality in the DeepCreative software also allows owners to use those mini AIO displays as secondary screens in order to display more complex images, videos, or animations.

There's a lot more going on in the air cooler front, however, with the brand launching an update to the famed Assassin cooler line-up alongside a number of vapor chamber air coolers. The Assassin V Vision is a new CPU tower air cooler designed for 140 mm fans, and it features eight heat pipes and a 38 mm thick hybrid hydraulic bearing fan. The Assassin V Vision also has a built-in 4.5-inch LCD on the top for system information and customization. The consumer tower coolers are rounded out by the single-tower 120 mm AK700 VC, which uses the same VC 2.0 (vapor chamber 2.0) cooling tech as the Assassin, but in a more affordable package with seven heat pipes and a single fin stack. The AN600 VC brings that same vapor chamber cooling design to a low profile cooler that DeepCool claims operates at as low as 27.2 dBA. DeepCool hasn't been very forthcoming about the TDPs of the new consumer-grade CPU coolers, but most of them are updates to older designs, so they should feature similar, if not slightly improved, performance.

Phanteks at the 2026 Computex showcased the stunning the EX series of PC cases that feature an extruded, compartmentalized, and modular-looking layout. The foundational feature of the EX-Series is its ability to deliver fresh, non-recirculated air directly to major heat-generating components, including the CPU, GPU, and PSU. A strategically positioned side-mounted cooling system specifically targets the motherboard, VRMs, and M.2 storage, which ensures maximum thermal efficiency without the need for numerous traditional case fans. The EX6 serves as the flagship lineup.

Expected in a Stone Gray finish by September, the standard EX6 is priced at $159.99. The top-tier EX6 MAX variant, priced at $329.99, heavily upgrades the hardware experience with premium X30 fans, a custom 90-degree AIO liquid cooler, and an integrated 10-inch (1600 x 720) LCD. It also features an integrated Nexlinq controller for advanced smart lighting and system monitoring. The EX5 models bring the EX6's core thermal architecture to a more accessible price point by utilizing a steel frame construction. Expected in August as a Black variant, the base EX5 starts at $109.99. The lineup offers two expanded tiers: the EX5 PLUS ($159.99), which adds an integrated custom AIO with 90-degree tubing management, and the top-tier EX5 MAX ($229.99), which includes all PLUS features alongside an integrated 6-inch LCD.

Super Micro Computer, Inc (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge total solution provider featuring Data Center Building Block Solutions (DCBBS), today announced the launch of 12 new server platforms optimized for new Intel Xeon 6+ processors. Featuring up to 288 efficiency cores per socket and delivering improved performance-per-watt, the new systems are designed for high-density cloud, virtualization, 5G analytics, and other throughput-intensive workloads.

"By working closely with Intel, we have optimized our DCBBS with the new Xeon 6+ processors to deliver breakthrough core density and efficiency," said Charles Liang, president and CEO of Supermicro. "These new X14 platforms, with up to 576 E-cores per server, dramatically improve performance-per-watt and help customers shorten time-to-deployment while lowering TCO and energy consumption in large-scale cloud and enterprise data centers."

HPE (NYSE: HPE) today announced the expansion of its industry-leading server portfolio with the introduction of the HPE ProLiant Compute DL394 Gen12, powered by NVIDIA Vera CPU. This next-generation server is engineered specifically to address the compute demands of emerging high-performance AI and data processing workloads delivering industry leading agentic AI CPU performance, memory bandwidth and low latency. Built on a foundation of advanced architecture, the platform also features HPE's enterprise-grade Integrated Lights-Out (iLO) as security, while HPE Compute Ops Management provides a unified dashboard to manage and automate server environments.

The HPE ProLiant Compute DL394 Gen12, based on NVIDIA Vera CPU, was launched at COMPUTEX 2026 as part of a new collaboration with NVIDIA and Redpanda, that is being explored by the New York Stock Exchange (NYSE). The new server features technology optimized for the specific demands of agentic AI, across data storage and processing, monitoring, management and security capabilities, ensuring smooth and secure operation for agentic AI.

ZOTAC Technology, leader in innovation and high-performance hardware solutions, is joining COMPUTEX 2026, one of the largest, most anticipated technology exhibitions of the year. This year, ZOTAC celebrates its 20th Anniversary at the event by showcasing products both classic and new, as a nod to the Company's past and its outlook toward the future. As a member of the NVIDIA Partner Network (NPN) Program, the Company plans to illustrate its future product strategy: a full-range of computational offerings for every application, from Gaming, Local AI deployment, to Industrial and Enterprise-level high performance computing applications.

ZOTAC, as a brand historically focused on gaming, has come a long way since first starting to offer NVIDIA GeForce graphics cards, and was one of the first pioneers of the now ubiquitous Mini PC product category, known for novel designs that pushed compact computing to new levels. During the exhibition, ZOTAC will be looking back at the last 20 years, and present the Company's significant products that shaped the Company, while looking forward to new heights.