It's no secret that Highguard has languished under dwindling player counts and an apparent lack of funding since its launch in late January 2026, with rumors swirling that Tencent pulled funding from Studio Wildlight shortly after the launch of the game, prompting a round of layoffs that saw around 80% of the development team behind the game lose their jobs. Now, barely a month after launch, Wildlight has announced that it will shut down Highguard on March 12. Servers will remain online until March 12, but it's unclear if players will receive refunds for in-game purchases.

Despite the imminent shut-down, it seems like the developer will release the available content that has been completed in an upcoming update that will launch ahead of the shutdown and add a new Warden, a new weapon, account-level progression, and skill trees to the game—all content that may have added enough interest in the game if released earlier, but will likely suffer from being too little, too late. This isn't the first apparent last-ditch effort to save the game, with previous patches addressing complaints by adding new bases and a new game mode, among other new content, all of which again seemed to be positively received but didn't make a dent in the game's plummeting player counts.

AMD is seeing server CPU demand it didn't fully anticipate, with CEO Lisa Su describing it as having "far exceeded" her expectations. Speaking at the Morgan Stanley Technology, Media & Telecom Conference earlier today, Su outlined how the landscape has shifted as agentic AI applications have taken off, pushing CPUs back into the spotlight alongside accelerators. The CPU-to-GPU ratio in AI compute workloads has evolved dramatically over the past few months, and top customers reportedly told Su that CPU demand sitting alongside AI was "under-forecasted." Supply is tightening as a result. The sudden spike in customer commitments left little time for the supply chain to adjust, though AMD says it's working closely with partners to ease existing bottlenecks and expects capacity to expand over the coming year. Su expressed confidence that AMD's product lineup is well positioned to address training, inference, and agentic workloads going forward. We've also seen this play out at the customer level, with hyperscalers like Meta signing CPU agreements with AMD and NVIDIA, a sign that compute is diversifying away from a pure GPU focus.

Back in late January, Intel disclosed it had to reallocate wafer capacity from its PC division to Xeon production after hyperscalers started ordering larger quantities than anticipated, triggering a temporary shortage. Then, in early February, both Intel and AMD warned customers in China about tightening supplies, with Intel Xeon delivery times stretching to as long as six months and prices up more than 10%. AMD's situation is somewhat less difficult, but lead times have still pushed out to eight to ten weeks for some orders. On the consumer side, AMD's next-gen Ryzen 'Olympic Ridge' desktop processors based on Zen 6 are rumored to have slipped to 2027, possibly another sign that AMD is prioritizing Zen 6 chiplets for EPYC server processors.

Minisforum is known for making powerful mini PCs, like the Core Ultra 9 285H-powered M1 Pro we recently reviewed, and the latest entry into the company's line-up is the MS-A2, an upgrade to 2024's MS-A1. The new mini workstation is marketed as a small form factor desktop server for programming, business, and home lab use cases, and it seems to have the specs to back that up. The whole package measures just 196×189×48 mm, or 1.78 L, making it seriously compact. Official US pricing for the MS-A2 with the Ryzen 9 9955HX starts at $799 with no RAM or storage or $1,199 with 32 GB RAM and a 1 TB SSD. The mini PC with 96 GB of RAM and 2 a 2 TB SSD costs $1,919 on the Minisforum store.

The MS-A2 uses AMD's Ryzen 9 9955HX mobile CPU—with a claimed 100 W turbo TDP—paired with up to 96 GB of DDR5-5600 memory and up to three PCIe 4.0 M.2 slots, for up to 12 TB total capacity, as well as support for U.2 NVMe 22110 drives, bringing total storage capacity up to 23 TB. Networking is also impressive, thanks to dual 10 Gb SFP+ ports and dual 2.5 Gb Ethernet ports. The MS-A2 also sports Wi-Fi 6E and Bluetooth 5.2 wireless connectivity, and it has more than enough ports for proper workstation use. The front of the mini PC has dual USB 3.2 Gen 1 Type-A ports, a USB 2.0 port, and a 3.5 mm audio combo jack, while the back has 2× USB Type-C 3.2 Gen 2 ports with DisplayPort 2.0 Alt mode support, 1× HDMI 2.1, 2× 2.5 Gb RJ45 ports, 2× 10 Gb SFP+ ports, 1× USB 3.1 Gen 2, and 1× USB 3.1 Gen 1 port. The Ryzen 9 9955HX has a pretty weak Radeon 610M iGPU, which will get the job done for most productivity tasks, but the MS-A2 also has a built-in full-length PCIe 4.0 ×8 slot for GPU or IO upgrades, and that slot supports can be split into two PCIe ×4 connections.

Dell Technologies (NYSE: DELL) announces financial results for its fiscal 2026 fourth quarter and full year ended January 30, 2026. The company also provides guidance for its fiscal 2027 first quarter and full year.

Full-Year Summary

• Record full-year revenue of $113.5 billion, up 19% year-over-year
• Record full-year diluted earnings per share (EPS) of $8.68, up 36% year over year, and record full-year non-GAAP diluted EPS of $10.30, up 27%
• Record full-year cash flow from operations of $11.2 billion
• Announcing a cash dividend increase of 20% and $10 billion increase in share repurchase authorization
• FY27 guidance: Full-year revenue growth of 23% at the midpoint, diluted EPS growth of 33% at the midpoint, and non-GAAP diluted EPS growth of 25% at the midpoint

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing the launch of the industry's first and highest-density blade server platform powered by the latest AMD EPYC 4005 series processors. Designed with a flexible, density-optimized blade architecture, Supermicro's new MicroBlade platform is designed for longevity and versatility. By including the latest AMD EPYC 4005 series processors, along with previous versions, the system provides seamless scalability and long-term investment protection, allowing organizations to expand and upgrade as compute requirements evolve.

"Our flexible blade architecture enables customers to mix different node types with different CPUs within a single enclosure and can incorporate up to 320 server nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "Supermicro continues to lead the industry in delivering advanced, energy-efficient platforms to market that maximize scalability, lower total cost of ownership, and protecting data center investments for the long term."

Team Group Inc. today announced its strong return to Embedded World 2026, one of the world's premier events for embedded technologies, following its Embedded Award-winning presence at last year's exhibition. Building on this momentum, Team Group will focus on two core themes, "Edge to Action" and "Military", highlighting AI-driven intelligent applications alongside mission-critical data security solutions for highly sensitive environments.

The showcase will feature a comprehensive portfolio spanning high-performance embedded storage and military-grade physical destruction technologies, demonstrating Team Group's continued commitment to advancing efficiency, stability, and security across industrial and defense-related sectors while delivering end-to-end solutions that seamlessly connect edge computing with real-world deployment. Embedded World 2026 will take place from March 10-12 at the NürnbergMesse Convention Center in Nuremberg, Germany. Team Group cordially invites visitors to Hall 3 / Booth 3-349 to explore its latest embedded breakthroughs designed to enable more precise, trusted, and secure intelligent applications.

Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XR9700 server, a first of its kind closed-loop liquid-cooled, fully-enclosed, ruggedized server engineered to run Cloud RAN and edge AI workloads in unprotected outdoor environments. Designed to mount on utility poles, rooftops and building exteriors, the PowerEdge XR9700 brings high performance computing into dense urban areas, remote locations and space-constrained facilities where traditional data center infrastructure cannot reach.

Why it matters
Telecommunications operators and those working at the edge often struggle to deploy compute due to lack of power and space. The PowerEdge XR9700 solves this, delivering high performance compute directly at the point of need in an ultra-compact, zero-footprint IP66-rated enclosure that's sealed from the elements. For telecommunications operators, it provides a flexible, software-defined alternative to traditional RAN solutions, supporting Cloud RAN and Open RAN processing at the cell site. At the same time, the platform can run edge and AI applications directly where data is created and consumed.

AMD has announced its EPYC 8005 series server processors, codenamed "Sorano". These new CPUs are filling the gap between the EPYC 9005 high-end Zen 5 lineup and the lower-tier EPYC 4005 parts. The new 8005 series succeeds the EPYC 8004 "Siena" family and targets single-socket (1P) platforms with an emphasis on telecom, edge, and vRAN (Virtual Radio Access Network) workloads. Built on the Zen 5 architecture, EPYC 8005 is designed around performance-per-watt and performance-per-dollar rather than peak multi-socket scalability. With these new server CPUs, AMD is targeting the telco sector where power and space-constrained environments are key factors in cell sites and distributed edge locations. AMD has not yet published a full SKU list or detailed specifications about the EPYC 8004 CPUs. However, the company says the lineup will scale up to 84 cores in a single-socket configuration, with SKUs operating in power envelopes up to 225 W.

AMD is also highlighting wide thermal operating ranges and support for NEBS (Network Equipment-Building System) compliant platforms. For vRAN specifically, EPYC 8005 adds targeted LDPC (Low-Density Parity Check) decoding optimizations to improve Layer 1 acceleration for 5G workloads. AMD claims improved uplink throughput and more efficient forward-error-correction processing, while maintaining the deterministic behavior required in RAN environments, thanks to the updated Zen 5 execution pipeline and vector capabilities. The EPYC 8005 "Sorano" CPUs should become available in the following months, with more details about the platform and performance likely closer to launch.

The Korea Economic Daily had an exclusive mid-month sit-down with Jensen Huang, just after his attendance of a casual NVIDIA and SK hynix engineering team meetup. As disclosed in an exclusive report, the South Korean publication managed to extract some intriguing tidbits during an "unscheduled interview," that took place in Santa Clara, California (not far from Team Green's HQ). A headline generating quote was pulled from part of the conversation concerning next month's GPU Technology Conference. The NVIDIA did not hold back, after granting plentiful access: "ask as much as you want." When asked about plans for the company's forthcoming (March 16 to 19) conference, Huang confidently let slip that: "a chip that will surprise the world will be unveiled at GTC next month."

With an annual cadence, the Team Green boss—is once more—expected to present the latest and greatest items in a keynote presentation. Since 2026 is the launch year of "Vera Rubin," industry observers have already predicted a very VR200 NVL72-heavy on-stage showcase. Later on in the exclusive Q&A, Huang teased multiple unnamed new properties, due for introduction at GTC 2026: "we've prepared several new chips the world has never seen before." Potentially, very early "Feynman" AI accelerator prototypes could make it onto the main stage. Alternatively, "Vera GPU" offshoots are also likelihoods. In the interview, Green Team leader hinted about the slog of getting cutting-edge IPs into fruition: "nothing is easy because all technologies are at their limits." The Korea Economic Daily reporter noted Huang's just concluded meal with "NVIDIA and SK Hynix memory engineers"—elaborating on this potent HBM4-focused partnership, Huang remarked boastfully: "with a team like this, nothing is impossible."

It is official: AMD is now capturing 40% of the entire server CPU market revenue share, according to data from Mercury Research. In the final quarter of 2025, AMD EPYC server CPUs managed to capture 41.3% of the revenue in the server/data center market that hyperscalers are spending on. This is a 1.8% increase from Q3 2025 and an impressive 4.9% year-over-year growth in a multi-billion USD data center market. For unit share shipment, AMD now stands at 28.8%, meaning the company is actually selling more SKUs at a higher average selling price. Intel, on the other hand, now holds 71.2% of the unit share while capturing 58.7% of the revenue share, indicating that Intel Xeon processors are now selling for a lower ASP with more units needed to reach this revenue.

The situation in the desktop segment looks interesting as well, with AMD's revenue share in the desktop CPU market now at 42.6%, while the unit share is at 36.4%. Again, this means that AMD's Ryzen processors sell at a higher ASP, nearly capturing half of the desktop CPU revenue with a bit more than a third of the unit sales. This sector also grew 1.6% sequentially, while Ryzen CPUs won the hearts of 14.6% more gamers for a yearly revenue share increase.

SilverStone has quietly expanded its comprehensive range of CPU cooling solutions with a myriad of brand-new designs, across both air and liquid cooling lines. A pair of 2U small form factor server/workstation CPU cooling solutions have gained the most media attention. As expected, the Taiwanese manufacturer has not issued any press material for this pair of freshly introduced AMD-oriented products. The SST-XE02-AM5B cooler's naming scheme clearly states that it is intended for deployment on Team Red's AM5 socket, although SilverStone's specification sheet mentions compatibility with the older AM4 platform. The SST-XE02-TR5B SKU's credentials list support of AMD's sTR5, SP6, TR4, and SP3 socket types.

The newest AM5B and TR5B models share similar traits; mainly a provision of five 6 mm heat-pipes combined with aluminium fins—marketed as offering "excellent heat conducting efficiency"—and a centrally-positioned 60 mm PWM dual ball bearing fan. This fan model's specification sheet lists an RPM range of 2000 to 14,000, a 72.8 CFM maximum airflow rating, and max. air pressure of 47.18 mmH2O. Mean Time To Failure (MTTF) is estimated at 70,000 operational hours. Despite featuring the same fan, the two low-profile SST-XE02 models deviate in terms of CPU TDP ratings—the AM5/AM4 compatible cooler is rated up to 170 W, while the ever so slightly larger/heavier sibling (sTR5/SP6/TR4/SP3) is capable of tempering up to 350 W. Naturally, the more capable unit is tasked with handling (for example) EPYC 8004 and Ryzen Threadripper 7000 processors.

Intel and AMD have reportedly warned customers in China about tightening server CPU supplies, with delivery times stretching significantly and prices already moving higher. According to Reuters, average prices for Intel server processors in China have increased by more than 10%, depending on contract terms, while delivery times for some Xeon models have extended to as much as six months. The situation appears most severe for Intel's fourth and fifth-generation Xeon processors, where backlogs are reportedly building fast. AMD is facing similar, though less extreme constraints, with some server CPU orders now quoted at eight to ten weeks for delivery. China remains a major market for both companies, accounting for over 20% of Intel's total revenue, and includes customers such as large server OEMs and cloud operators like Alibaba and Tencent. The supply crunch is being driven by a mix of factors, including surging demand tied to AI infrastructure and so-called "agentic AI" systems, which significantly increase CPU requirements alongside GPUs.

Manufacturing limits are also having a negative effect with Intel admitting supply issues linked to manufacturing and yield problems, while AMD relies on TSMC, which now gives priority to high-profit AI chips. Rising memory costs in China have put more pressure on the market, with buyers rushing to buy CPUs to avoid paying more for complete systems later. Both companies say they are working to improve supply. Intel told Reuters its inventory hit a low point in Q1 but expects gradual improvement through 2026, while AMD stated it remains confident in its ability to meet demand based on supplier agreements and its partnership with TSMC. For now, however, customers may still be facing higher prices and longer waits for server CPUs.

Giga Computing, a subsidiary of GIGABYTE and a leader in high-performance computing and data center solutions, today announced two new enterprise-grade workstation motherboards for demanding workloads in engineering, AI development, data science, and media creation. For Intel Xeon 600 processors for workstations, the first wave of products from Giga Computing includes the GIGABYTE MW94-RP0 and MW54-HP0. Designed for a traditional computer chassis, these new motherboards are feature rich and offer a significant boost in AI bound workloads.

Intel Xeon 600 Processors for Workstations
Modern workstation workloads are evolving rapidly, driven by AI, higher core density, and the need for faster data movement across the system. Intel Xeon 600 processors for workstations are built on the new Redwood Cove+ P-core architecture and the Intel 3 process, delivering a significant leap in compute capability, AI acceleration, and platform bandwidth. With expanded PCIe 5.0 connectivity, faster DDR5 memory, and the new W890 workstation chipset, this platform provides a future-ready foundation for professionals tackling demanding workloads in engineering, AI development, data science, and media creation.

Giga Computing, a subsidiary of GIGABYTE and a leader in high-performance computing and data center solutions, today announced the launch of its next-generation AI and HPC server, GIGABYTE XN24-VC0-LA61, powered by the NVIDIA GB200 NVL4 platform. Purpose-built for its heterogeneous architecture of CPU and GPU, the system will make its debut at SCA/HPC Asia 2026 in Osaka, Japan, showcasing Giga Computing's latest innovation in accelerated computing with liquid cooling technologies.

The XN24 server has been selected for the RIKEN Center for Computational Science (R-CCS) next-generation HPC-Quantum hybrid platform. The new platform integrates GIGABYTE servers into the development of FugakuNEXT, the eventual successor to Japan's flagship supercomputer, Fugaku. This integration will use the NVIDIA CUDA-Q platform to support the development of hybrid quantum-GPU supercomputing systems and research into advanced scientific applications that bridge quantum and traditional high-performance computing.

Around mid-September of last year, Intel and NVIDIA announced a somewhat surprising joint venture. At the time, the two partners teased an eventual deployment of unspecified GeForce RTX iGPU designs within futuristic Intel x86 System-on-Chips (SoCs). We have not heard much about this mainstream project since autumn time—in the meantime, Team Blue has gone all in on hyping up next-gen "Panther Lake-H" mobile processors, that utilize in-house Arc Xe3 graphics architecture. Lately, Lip-Bu Tan—CEO of Intel—has mentioned the existence another co-development with the Green Team. In a recent earnings call, regarding Q4 2025 results, the boss slipped in a brief teaser about an in-progress enterprise-grade processor design.

When discussing his company's ongoing simplification of server product roadmaps, Tan disclosed that: "we also continue to work closely with NVIDIA to build a custom Xeon fully integrated with their NVLink technology, to bring best-in-class x86 performance to AI host nodes." He swiftly moved onto talking about the Xeon division being laser-focused on getting 16-channel "Diamond Rapids" out into the wild. Naturally, it is too early to tell whether the latest Intel + NVIDIA collab will leverage sixth or seventh generation Xeon technologies. The further out "Coral Rapids" family is expected to resurrect Hyper-Threading for datacenter workflows. Tan stated that another main goal is the acceleration of Xeon "Coral Rapids" series' introduction to market. Prior to publication of Intel's Q4 '25 financial results, the semiconductor industry rumor mill proposed a second half of 2027 release window.

North American CSPs' continued investments in AI infrastructure are expected to increase global AI server shipments by more than 28% YoY in 2026, according to the latest market research from TrendForce. The rapid growth of AI inference services is boosting demand for general-purpose servers, supporting both replacement and expansion efforts. Consequently, TrendForce predicts that total global server shipments, including AI servers, will accelerate from 2025, with a 12.8% YoY growth in 2026.

The server market from 2024 to 2025 primarily centered on training advanced large language models (LLMs), utilizing AI servers with GPUs and HBM for parallel computing. However, starting in the second half of 2025, the growth of AI agents, LLaMA-based applications, and Copilot upgrades shifted CSP's focus toward inference services as a monetization strategy. AI inference workloads are now deployed not only on dedicated AI server racks but also on general-purpose servers that handle pre- and post-inference computing and storage.

At CES 2026, InWin presented a mix of showcase chassis, mainstream PC cases and enterprise platforms, covering everything from enthusiast builds to AI and HPC deployments. Leading the lineup is AEON, InWin 12th signature chassis. This full-tower case uses aluminium, tempered glass, stainless steel, and mirrored mosaic panels. It supports motherboards up to 305 × 330 mm (E-ATX), offers eight PCIe slots, fits GPUs up to 360 mm, and includes space for two 270 mm PSUs. Cooling support includes up to six 120/140 mm fans and dual 360/420 mm radiators. The front I/O panel features dual USB 3.2 Gen 2 Type-C ports, and we should add that the case features RFID-based access.

For professional workloads, COVALENT targets AI and HPC users with a modular workstation design. It supports EEB motherboards, eight PCIe slots, up to eight 3.5-inch or nine 2.5-inch drives, and extensive cooling options with up to 13 fans or multiple large radiators.

Interesting details regarding Intel's upcoming "Diamond Rapids" Xeon 7 processor family have turned up in mid-to-late December patch notes. At the time, Team Blue's Linux team discussed the nature of the chipmaker's next-gen server-grade CPU series. When comparing the "Diamond Rapids" (DMR) design to a predecessor—"Sapphire Rapids" (SPR)—the engineers outlined several key differences and new additions. On a basic level, the two generations depend on discovery tables for uncore enumeration, but the plucky newcomer could feature: "two Integrated I/O and Memory Hub (IMH) dies, which are separate from the compute tile (CBB) dies. Each 'Core Building Block' (CBB) die and each IMH die has its own dedicated discovery table." Elaborating further, Intel's second bullet point notes that: "unlike prior CPUs that retrieve the global discovery table portal exclusively through either PCI or MSR, 'Diamond Rapids' uses PCI for IMH PMON discovery and MSR for CBB PMON discovery."

InstLatX64 has weighed in on last month's "insightful" Linux kernel patch updates. They propose that "Diamond Rapids" goes even further than "Clearwater Forest" (a next-gen efficiency-focused Xeon 6+ product line), due to its IMC being placed on the base tile. Within a lengthy list of new PMON (Performance Monitor) types, internal correspondence discloses support for PCIe 6.0—a very new standard, that was supposed to launch at some point last year. Last we heard, Intel's "Diamond Rapids" Xeon 7 lineup is expected to launch later this year, but with a reduced product lineup. At the time, 8-channel variants were cut, with 16-channel SKUs becoming the basis of the family's entire stack.

TrendForce's latest investigations indicate that DRAM suppliers in 1Q26 will continue to reallocate advanced process nodes and new capacity toward server and HBM products to support rising AI server demand. This shift has significantly limited supply in other markets, causing conventional DRAM contract prices to increase by about 55-60% QoQ. Meanwhile, disciplined capacity management by NAND Flash suppliers, along with robust server demand that is displacing other applications, is likely to increase contract prices across all NAND Flash product categories by 33-38%.

Despite weaker notebook shipments and slower growth in memory demand due to potential specification downgrades, PC DRAM prices are still set to rise sharply in the first quarter. DRAM suppliers have simultaneously tightened supply to PC OEMs and module makers, forcing some OEMs to procure memory at higher prices through modules makers. This is expected to raise DRAM suppliers' module pricing and significantly drive up PC DRAM prices.

Eurocom is proud to announce the launch of the EUROCOM Raptor X18 - a mobile server platform that brings enterprise-grade, rack-class performance into a single, portable chassis. Built to deliver full server functionality without the constraints of traditional data center infrastructure, the EUROCOM Raptor X18 gives organizations the freedom to deploy high-performance computing, private cloud hosting, edge-computing nodes or temporary network infrastructures - anywhere, anytime.

EUROCOM Raptor X18 is powered by Intel Core Ultra 9 Processor 275HX with 24C/24T 36M cache and NVIDIA GeForce RTX 5090 24 GB DDR7 with Blackwell 328 Tensor AI cores architecture. It supports up to 256 GB of DDR5 memory, up to 32 TB of NVMe SSD storage in RAID 0/1/5, two LAN ports and two additional LAN ports via TB5 ports.

Akasa, a leading provider of thermal solutions, continues to strengthen its presence in the enterprise and datacenter market with an expanded range of server CPU coolers designed for the growing demands of workstation, AI and edge compute, dense rackmount systems and industrial applications. The latest additions include models supporting AMD SP6 / sTR5, Intel LGA1851 / LGA1700 sockets or Intel LGA3647 sockets, ranging from high capacity 4U tower solutions, compact 2U active coolers to low-profile 1U passive coolers.

New Models for AMD Platforms
Collectively, the AK-CC340X series expands Akasa's current server cooler range of Intel LGA4677 socket coolers to include three new models supporting AMD SP6 sockets (for AMD EPYC processors) and sTR5 sockets (for AMD Ryzen Threadripper (Pro) 9000 / 7000 series CPUs). All three coolers are equipped with secure spring-loaded screw mounting and pre-applied thermal compound for quick and easy installation.

SK hynix Inc. announced today that it has become the first in the industry to complete the Intel Data Center Certified process to apply 256 GB DDR5 RDIMM - a high capacity server module based on 32 Gb fifth-generation 10 nm-class (1b) DRAM - to Intel Xeon 6 platform. As an Intel Data Center Certified system/platform, 256 GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel's Advanced Data Center Development Laboratory, and is now the industry's first server module verified to provide reliable performance, compatibility and quality when combined with Intel Xeon processors. SK hynix has previously obtained similar validation in January this year for its 16 Gb fourth-generation 10 nm-class (1a) die-based 256 GB product.

By becoming the first in the industry to validate compatibility with Intel's latest server platform, SK hynix is demonstrating technological leadership in high-capacity DDR5 modules. Based on this, the company will expand cooperation with major global data center operators and continue to lead the next-generation memory market in response to rapidly increasing demand from server customers. In this new AI-driven infrastructure environment, memory has emerged as a critical determinant of performance. As AI inference models evolve beyond generating simple response to performing complex logical processes, the volume of data that must be processed in real time is growing exponentially. To manage these massive data sets swiftly and reliably, high-capacity and high-performance memory has become indispensable - driving a sharp increase in market demand.

Microsoft has introduced native NVMe SSD support in its Windows Server 2025 build, now available as an opt-in feature for users. After 12 years of NVMe's existence and years of support in the Linux kernel and Linux-based operating systems, native support has been added to the Windows Server stack. Previously, Microsoft converted NVMe drive commands into SCSI commands, which resulted in processing latency and overhead, slowing down read/write speeds in typically high-performing storage configurations. With native NVMe support, the entire stack and I/O processing have been redesigned to achieve optimal SSD performance.

System administrators don't need data to recognize the significant performance improvements that native NVMe support will bring. Windows Server 2025's native NVMe support fundamentally transforms storage performance by enabling direct multi-queue access to modern hardware. It delivers up to 3.3 million IOPS on PCIe Gen 5 SSDs and exceeds 10 million IOPS on HBAs, while reducing latency through streamlined, lock-free I/O paths. This leap in efficiency is essential because traditional SCSI-based processing, originally designed for rotational disks with a single-queue model limited to 32 commands, cannot fully utilize flash storage.

EK by LM TEK is proud to introduce the EK-Pro GPU Zotac RTX 5090, a high-performance single-slot water block engineered for high-density AI server deployment and professional workstation applications. Designed exclusively for the ZOTAC Gaming GeForce RTX 5090 Solid, this full-cover EK-Pro block actively cools the GPU core, VRAM, and VRM to deliver ultra-low temperatures and maximum performance.

Its single-slot design ensures maximum compute density, with quick-disconnect fittings for hassle-free maintenance and minimal downtime. The EK-Pro GPU Zotac RTX 5090 is now available to order at EK Shop.

AEWIN is excited to unveil the BIS-5231 Series, a high-performance 2U general purpose server built on Intel's latest Xeon 6 processors manufactured with Intel 3 process technology. Powered by dual Intel Xeon 6700/6500-series processors with P-cores or E-cores, the BIS-5231 delivers exceptional compute density and scalability. It offers up to eight PCIe Gen 5 expansion slots and twelve storage drive bays with SAS/SATA or NVMe options to meet diverse deployment requirements.

The BIS-5231 Series is equipped with 16 DDR5 RDIMM slots supporting speeds up to 6400 MT/s, two M.2 PCIe Gen 5 slots, two USB 3.1 ports, four RJ45 10GbE ports, and one RJ45 GbE IPMI port without requiring additional PCH needed. The BIS-5231A model provides twelve 3.5-inch LFF drive bays and eight PCIe Gen 5 slots plus an OCP 3.0 slot while the BIS-5231B offers twelve U.2 NVMe drive bays and seven PCIe Gen 5 slots plus an OCP 3.0 slot. The expansion slots are suitable for high-throughput NICs and GPU cards for data-intensive and AI-driven workloads.