Friday, March 10th 2017

You Really Shouldn't Delid AMD's Ryzen 7 CPUs

Power users sometimes really go the extra mile towards achieving the best performance on their hardware. And sometimes, this process includes delidding, as in, removing the processor's Integrated Heatspreader (IHS). This would allow for users to sometimes replace less than perfect TIM (Thermal Interface Material) companies use, achieving lower operating temperatures, and possibly even higher overclocks.

Well, you really shouldn't try to do so with AMD's Ryzen 7. The reason: attempting to delid said processors cost overclocking genius der8auer a grand total of 3 (three!) Ryzen 7 samples before he managed to do it without damaging the processor. This happens because contrary to other CPUs, AMD's Ryzen 7 IHS comes soldered to the chip, which obviously increases difficulty and risk of such a delidding process. Apparently, AMD did a pretty good job with the thermal interfaces of Ryzen 7 anyway - der8auer achieved only a 2ºC decrease in operating temperatures on the delidded Ryzen sample. Long story short: maybe it's not worth it. Especially if your cooling solution of choice isn't able to achieve proper contact with the CPU after the process. You can see a video of the direct cooling test, after the break.



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56 Comments on You Really Shouldn't Delid AMD's Ryzen 7 CPUs

#1
RejZoR
This isn't cheapo Intel garbage, AMD does stuff properly and they soldered IHS on top of it. Like every CPU should be.
Posted on Reply
#2
chinmi
Thank god. Nice move amd. If this delidd ing trend goes on, doing delidd ing gonna be standard soon enough.
Posted on Reply
#3
Mats
Maybe I'm late to the party, but that really looks like an MCM, right?
Posted on Reply
#4
erixx
Nobody told derBauer? Oh oh oh...
Posted on Reply
#5
Raevenlord
News Editor
Mats said:
Maybe I'm late to the party, but that really looks like an MCM, right?
Right. Two CCX's connected by AMD's Data Fabric =)

Posted on Reply
#6
Imsochobo
Mats said:
Maybe I'm late to the party, but that really looks like an MCM, right?
NO, One DIE. it's TWO solder pads, ONE chip.
Posted on Reply
#7
Imsochobo
Raevenlord said:
Right. Two CCX's connected by AMD's Data Fabric =)
No, Multiquote messed up everything, sorry for double post.
It's one Chip, one DIE and two solder pads.

The ccx's is faster than MCM design still as it's ondie.
Posted on Reply
#8
OneCool
I wonder if lapping would help any. I'm guessing no.
Posted on Reply
#9
madness777
The only thing that would (theoretically) lower your operating temperature would be polishing/lapping the surface area of the IHS. And we're talking =<1°C difference.
Posted on Reply
#10
jaggerwild
erixx said:
Nobody told derBauer? Oh oh oh...
He gets his stuff for free, probably from AMD
Posted on Reply
#11
lanlagger
deliding to clean up the cheapest grey paste garbage is for intel chips only.
Posted on Reply
#13
newtekie1
Semi-Retired Folder
lanlagger said:
deliding to clean up the cheapest grey paste garbage is for intel chips only.
And AMD's APUs.
Posted on Reply
#14
xorbe
This is a good PSA, surely it crossed r/amd already.
Posted on Reply
#15
newtekie1
Semi-Retired Folder
mcraygsx said:
Intel go extra mile only with their $1000 CPUs. I am glad AMD decided to stick to proper soldering.
They soldered their $350 processors.

Also, AMD uses TIM on their cheaper processors, and have for years now.
Posted on Reply
#16
mcraygsx
RejZoR said:
This isn't cheapo Intel garbage, AMD does stuff properly and they soldered IHS on top of it. Like every CPU should be.
Intel go extra mile only with their overpriced Broadwell-E series. I am glad AMD decided to stick to proper soldering method.

While 7700K is an excellent chip it suffers from same fate of cheap TMP as usual with INTEL cpu's.
Posted on Reply
#17
Hood
I predicted before Ryzen's release that these unlocked CPUs would be clocked near their limit from the factory, and that overclocking would hit a wall at 4.2-4.3 GHz. I was wrong - the absolute limit on air/water seems to be 4.1, with some chips only hitting 3.9 stable. While that's not bad for 8 cores/16 threads, I hope their 4 and 6 core offerings will hit 4.5 GHz or above, so they'll be in the same ballpark as Intel's mainstream CPUs. That would have much more impact on the overall market than these HEDT parts.
Posted on Reply
#18
Imsochobo
OneCool said:
I wonder if lapping would help any. I'm guessing no.
madness777 said:
The only thing that would (theoretically) lower your operating temperature would be polishing/lapping the surface area of the IHS. And we're talking =<1°C difference.
Lapping on New Intel and AMD cpu's doesn't matter, they're flat.
However your cooler probably is not, Stock AMD Coolers with Ryzen is flat as it gets, Noctua and Scythe (3 year old ones) is not flat at all and I had on my scythe a temp drop of 9 C.


mcraygsx said:
Intel go extra mile only with their overpriced Broadwell-E series. I am glad AMD decided to stick to proper soldering method.
While 7700K is an excellent chip it suffers from same fate of cheap TMP as usual with INTEL cpu's.
the 7700K at 91W tdp really should have proper tim....
AMD seems to have done it for a 65W part (1700) and I'm really happy about that!
Posted on Reply
#19
EntropyZ
Where's that person who call these people dumbf***s? Well at least maybe nobody else will try delidding their Ryzen CPU's.
Posted on Reply
#20
mcraygsx
Imsochobo said:
Lapping on New Intel and AMD cpu's doesn't matter, they're flat.
However your cooler probably is not, Stock AMD Coolers with Ryzen is flat as it gets, Noctua and Scythe (3 year old ones) is not flat at all and I had on my scythe a temp drop of 9 C.



the 7700K at 91W tdp really should have proper tim....
AMD seems to have done it for a 65W part (1700) and I'm really happy about that!
It is perfectly okay if Intel were to use cheap TIM on Pentium/Celerons but 7700K had no excuse. Intel seems to enjoy intentional crippling their own OC abilities. Really looking forward to a highly clocked Kaylake-E variant with proper temperatures.

I can play Rainbow Six on this G4560 all day long without a heatsink on it. After this article I have this urge to practice delidding this G4560. Let me grab a cutter and a rubber mallet :roll:
Posted on Reply
#21
_JP_
So we're back to mirror-finish lapping? Good. :)
Posted on Reply
#22
m0nt3
OneCool said:
I wonder if lapping would help any. I'm guessing no.
Kyle Bennett from HardOCP made a video showing the heatspreader and heatsink were both very flat, unlike the convex heatspredre on piledriver. So probably no point to lap.
Posted on Reply
#23
Mats
Imsochobo said:
NO, One DIE. it's TWO solder pads, ONE chip.
Jeez, sorry for asking.
Posted on Reply
#24
Imsochobo
Mats said:
Jeez, sorry for asking.
You better BE!

:)
as it was an early reply, stating clearly for others: One chip and not specifically for you :)
Posted on Reply
#25
peche
Thermaltake fanboy
Raevenlord said:
The reason: attempting to delid said processors cost overclocking genius der8auer a grand total of 3 (three!) Ryzen 7 samples before he managed to do it without damaging the processor.
yeah, wise... took 3 samples to find out that was soldered and delid wont help that much... sorry but...
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