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Intel Discontinues Omni-Path Enabled Xeon Processors

Intel's Omni-Path technology has been used primarily in high performance computing market, in order to provide high speed interconnect between Intel Xeon CPUs, with speeds reaching around 100 Gbps. Accompanied by different design and system integration that Omni-Path uses, it was a bit difficult to integrate into server system, while not adding much value that other technologies couldn't match or beat.

Because of these reasons, Intel is now discontinuing its last product capable of utilizing Omni-Path - the first generation Xeon Scalable CPUs. Carrying the suffix "F", these CPUs had an extra connector sticking out of CPU's PCB to enable the Omni-Path functionality (see images bellow). There were eight CPUs manufactured in total that had this extra feature, consisting out of two Xeon Platinum and six Xeon Gold CPUs, which have now reached end of life. Intel states that focus from these CPUs has shifted to other technologies like silicon photonics, which provides much greater speed reaching 100s of gigabits per second. Intel already demonstrated transceivers capable of reaching 400 Gb/s speeds with the magic of light, which will become available in 1H 2020.

MSI Confirms Upcoming TRX40 Platform, Lists Creator TRX40 Motherboard

MSI today inadvertently confirmed preparations for the release of TRX40-based motherboards, which will allow for AMD's next-gen, Zen 2-based Threadripper CPUs to slot in quite nicely in a bed of silicon. Via a promo page for new motherboard purchases, where MSI listed the eligible motherboards for a $25 Steam rebate after purchase, the company listed a number of their already-known motherboard quantities... And the new Creator TRX40. This is a new series of motherboards from MSI, first populated by the X299 motherboards, which caters to expandability and storage capabilities so as to accelerate content creation and production.

The reference to the Creator TRX40 has already been silently deleted in MSI's page.

The End of a Collaboration: Intel Announces Discontinuation of Kaby Lake-G with AMD Radeon Vega Graphics

The marriage of Intel and AMD IPs in the form of the Kaby Lake-G processors was met with both surprised grunts from the company and a sense of bewilderment at what could come next. Well, we now know what came next: Intel hiring several high-level AMD employees on the graphics space and putting together its own motley crew of discrete GPU developers, who should be putting out Intel's next-gen high-performance graphics accelerators sometime next year.

The Kaby Lake-G processors, however, showed promise, pairing both Intel's (at the time) IPC dominance and AMD's graphics IP performance and expertise on a single package by placing the two components in the same substrate and connecting them via a PCIe link. A new and succinct Intel notice on the Kaby Lake-G page sets a last order time (January 31, 2020, as the last date for orders, and July 31, 2020, as the date of last shipments), and explains that product market shifts have moved demand from Kaby Lake-G products "to other Intel products". Uptake was always slow on this particular collaboration - most of it, we'd guess, because of the chips' strange footprint arrangement for embedding in systems, which required custom solutions that had to be designed from scratch. And with Intel investing into their own high-performance graphics, it seems clear that there is just no need to flaunt their previous collaborations with other companies in this field. Farewell, Intel-AMD Kaby Lake-G. We barely knew you.

Cooler Master Debuts New CPU Air Cooler MasterAir MA620M

Cooler Master, a global leader in designing and manufacturing innovative computer components introduces the MasterAir MA620M CPU Air Cooler. Continuing the renowned MasterAir Series, the MA620M are dual aluminium towers equipped with a newly designed cross-platform mounting system to provide maximum air cooling.

Peak Performance, Unique Aesthetic
The MA620M features a unique dual tower heatsink with enlarged fins and utilizes 6 copper heat pipes for optimal air flow and cooling performance. Inspired by a stealth-like aesthetic design, the MA620M employs unique lighting effects across the top cover of the cooler, powered by addressable RGB.

BIOSTAR Lists unannounced AMD Ryzen 9 3900 Processor

AMD released their Zen 2-based Ryzen 3000 processors in July this year, and they instantly became a smash hit with gamers, due to their solid performance, and good pricing. The company's flagship processor at this time is the Ryzen 9 3900X, priced at $500, featuring 12-cores/24-threads, with clocks reaching up to 4.6 GHz. Now BIOSTAR has posted an update to their motherboard CPU support list, which mentions a previously unannounced "Ryzen 9 3900", without the "X", running at 3.1 GHz base clock and having a TDP of 65 W (the 3900X has 105 W TDP).

It looks like the Ryzen 9 3900 non-X is a more power-efficient version of the 3900X with lower clocks. It's possible that it is made from chips that failed the clock-frequency certification for the 4.6 GHz boost clock of the 3900X, but that work fine otherwise. By dialing down the TDP of their chip, AMD could also build an interesting SKU for OEMs, that want to market the high core counts, but aren't willing to drive up the cost of their power and cooling setup.

Intel's 14nm Chip Shortage Continues

Intel is constantly having troubles with its silicon manufacturing business lately. Firstly the late delivery of 10 nm, then the shortage of 14 nm chips that started all the way back in 2018. Despite the making of $1 Billion investment into extending its 14 nm production capacity, there seems to be no end of troubles in sight.

According to sources close to DigiTimes, 14 nm production has fallen short of demand again and will likely cause many notebook manufacturers to delay their products to 2020. Most likely victim of this delay is the newly announced 10th generation mobile CPUs codenamed Comet Lake. Those CPUs were supposed to be built using Intel's "14nm++" revision of 14 nm technology which targets higher CPU frequencies and improved efficiency, but most likely due to continued shortage of 14nm, there will be only a few notebooks powered by these chips. As the source suggests, many manufacturers are likely to delay the launch of their products to 2020, when this situation is supposed to be resolved.

AMD Could Release Next Generation EPYC CPUs with Four-Way SMT

AMD has completed design phase of its "Zen 3" architecture and rumors are already appearing about its details. This time, Hardwareluxx has reported that AMD could bake a four-way simultaneous multithreading technology in its Zen 3 core to enable more performance and boost parallel processing power of its data center CPUs. Expected to arrive sometime in 2020, Zen 3 server CPUs, codenamed "MILAN", are expected to bring many architectural improvements and make use of TSMC's 7nm+ Extreme Ultra Violet lithography that brings as much as 20% increase in transistor density.

Perhaps the biggest change we could see is the addition of four-way SMT that should allow a CPU to have four virtual threads per core that will improve parallel processing power and enable data center users to run more virtual machines than ever before. Four-way SMT will theoretically boost performance by dividing micro-ops into four smaller groups so that each thread could execute part of the operation, thus making the execution time much shorter. This being only one application of four-way SMT, we can expect AMD to leverage this feature in a way that is most practical and brings the best performance possible.

Intel Cascade Lake-X Core i9-10980XE Put Through Its Paces in GeekBench

Intel's upcoming Extreme Edition Core i9-10980XE from the Cascade Lake-X family. Cascade Lake-X (CSL-X) will be Intel's next take on the High End Desktop (HEDT) systems. The Core i9-10980XE is pegged as the flagship on that lineup, sporting an 18-core, 36-thread design, and are still based on Intel's 14 nm process node. These processors will be pin-compatible with Intel's LGA 2066 platform. Caches are expected to be set at 1.125 MB, 18 MB and 24.75 MB of L1, L2 and L3.

Base clocks set in the Geekbench 4 entry are set at 4.1 GHz, with a maximum boost of 4.7 GHz. That's a lot of frequency on a 14 nm CPU with 18 cores; if previous entries on the Intel HEDT family (such as the i9-9980XE) sported a 165 W TDP with clocks of 3.0 GHz and 4.4 GHz respectively, it seems highly unlikely that Intel will keep the same TDP for the i9-10980XE - and even if they do, power consumption will certainly be higher. Those reported clocks for the i9-10980XE may not be right, however - we don't know the conditions of the test run.

AMD Confirms: Ryzen 9 3950X and Threadripper 3rd Generation Coming in November

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.
AMD's full statement is quoted below.

TSMC Trembles Under 7 nm Product Orders, Increases Delivery Lead Times Threefold - Could Hit AMD Product Availability

TSMC is on the vanguard of chipset fabrication technology at this exact point in time - its 7 nm technology is the leading-edge of all large volume processes, and is being tapped by a number of companies for 7 nm silicon. One of its most relevant clients for our purposes, of course, is AMD - the company now enjoys a fabrication process lead over arch-rival Intel much due to its strategy of fabrication spin-off and becoming a fabless designer of chips. AMD's current product stack has made waves in the market by taking advantage of 7 nm's benefits, but it seems this may actually become a slight problem in the not so distant future.

TSMC has announced a threefold increase in its delivery lead times for 7 nm orders, from two months to nearly six months, which means that orders will now have to wait three times longer to be fulfilled than they once did. This means that current channel supplies and orders made after the decision from TSMC will take longer to materialize in actual silicon, which may lead to availability slumps should demand increase or maintain. AMD has its entire modern product stack built under the 7 nm process, so this could potentially affect both CPUs and GPUs from the company - and let's not forget AMD's Zen 3 and next-gen RDNA GPUs which are all being designed for the 7 nm+ process node. TSMC is expected to set aside further budget to expand capacity of its most advanced nodes, whilst accelerating investment on their N7+, N6, N5, and N3 nodes.

Intel Adds More L3 Cache to Its Tiger Lake CPUs

InstLatX64 has posted a CPU dump of Intel's next-generation 10 nm CPUs codenamed Tiger Lake. With the CPUID of 806C0, this Tiger Lake chip runs at 1000 MHz base and 3400 MHz boost clocks which is lower than the current Ice Lake models, but that is to be expected given that this might be just an engineering sample, meaning that production/consumer revision will have better frequency.

Perhaps one of the most interesting findings this dump shows is the new L3 cache configuration. Up until now Intel usually put 2 MB of L3 cache per each core, however with Tiger Lake, it seems like the plan is to boost the amount of available cache. Now we are going to get 50% more L3 cache resulting in 3 MB per core or 12 MB in total for this four-core chip. Improved cache capacity can result in additional latency because of additional distance data needs to travel to get in and out of cache, but Intel's engineers surely solved this problem. Additionally, full AVX512 support is present except avx512_bf which supports bfloat16 floating-point variation found in Cooper Lake Xeons.

Intel Says Its Upcoming Gen12 GPUs Will Feature Biggest Architecture Change In A Decade

Intel is slowly realizing plans to "one up" its GPU game starting from first 10 nm Ice Lake CPUs that feature Gen11 graphics, equipping users of integrated GPUs with much more performance than they previously got. Fortunately, Intel doesn't plan to stop there. Thanks to the recent pull request found on GitLab Mesa repository, we can now expect to receive biggest GPU performance bump in over a decade with the arrival of Gen12 based GPUs, found on next generation Tiger Lake processors.

In this merge request, Francisco Jerez, member of Intel's open source Linux graphics team, stated the following: "Gen12 is planned to include one of the most in-depth reworks of the Intel EU ISA since the original i965. The encoding of almost every instruction field, hardware opcode and register type needs to be updated in this merge request. But probably the most invasive change is the removal of the register scoreboard logic from the hardware, which means that the EU will no longer guarantee data coherency between register reads and writes, and will require the compiler to synchronize dependent instructions anytime there is a potential data hazard..."

Bitspower Introduces New Mono Block for ASUS Crosshair VIII Hero

Bitspower informed us earlier today that they have a new mono block out for the ASUS Crosshair VIII Hero motherboard based on AMD's X570 chipset. Titled the BP-MBASX570CVIIIH, it features an acrylic top to allow the end user to see through into the cooling engine and the coolant flow in use and a nickel-plated copper coldplate. The latter, as with any mono block, is massive relative to just a CPU water block since it covers the CPU in addition to the critical power delivery section of the motherboard to ensure no thermal throttling, be it direct or indirect.

The direct injection of the coolant over the microfins via the split central-inlet flow design allows for the CPU to be cooled first, before a parallel split through the VRM section and also a flow indicator wheel as seen in the images below. The mono block also has integrated lighting support via Bitspower's digital RGB LEDs, which in turn are compatible with ASUS Aura Sync and onboard LED headers in addition to Bitspower's TouchAqua dRGB controller. Bitspower also teased more mono blocks on the way, with owners of the ASRock X570 Taichi and Gigabyte X570 Auros Master going to see support coming up shortly.

BIOSTAR Launches the New X470MH Motherboard

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce a new addition to its AMD socket AM4 motherboards with the BIOSTAR X470MH. Built for office workers looking to smoothly cruise through their daily tasks without setbacks and for home users looking for a strong and stable platform to run their HTPC, the X470MH is equipped with the latest features the PC industry has to offer while maintaining an affordable price point. And for those looking to push the limit, the X470MH offers overclocking possibilities giving the user the added performance benefit for faster gaming and task management without risking to damage their investment.

The BIOSTAR X470MH, equipped with AMD's X470 chipset and AMD AM4 CPU socket, brings support for AMD's latest 3rd Gen Ryzen 7 nm processors. Built to make your daily computer needs a breeze, the X470MH is a Micro ATX motherboard featuring USB 3.1 Gen1 support (5 Gb/s) providing fast transfer speeds and support to a wide array of peripherals, PCI-e M.2 at 32 Gb/s for increased system responsiveness, as well as HDMI 4K resolution to sooth the eye while watching Netflix or Youtube, and a VGA port for a wider range of monitor compatibility. In addition, the Internet and network connectivity will not be a drag with the onboard Realtek GbE LAN. Overclockers are not left out either with enough room for 2x DDR4 RAM slots which support up to 32 GB and overclocks at 3200 MHz, making multitasking a pleasant experience.

Primate Labs Introduces GeekBench 5, Drops 32-bit Support

Primate Labs, developers of the ubiquitous benchmarking application GeekBench, have announced the release of version 5 of the software. The new version brings numerous changes, and one of the most important (since if affects compatibility) is that it will only be distributed in a 64-bit version. Some under the hood changes include additions to the CPU benchmark tests (including machine learning, augmented reality, and computational photography) as well as increases in the memory footprint for tests so as to better gauge impacts of your memory subsystem on your system's performance. Also introduced are different threading models for CPU benchmarking, allowing for changes in workload attribution and the corresponding impact on CPU performance.

On the Compute side of things, GeekBench 5 now supports the Vulkan API, which joins CUDA, Metal, and OpenCL. GPU-accelerated compute for computer vision tasks such as Stereo Matching, and augmented reality tasks such as Feature Matching are also available. For iOS users, there is now a Dark Mode for the results interface. GeekBench 5 is available now, 50% off, on Primate Labs' store.

LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs

TE Connectivity, the maker of various kinds of connectivity solutions for computer systems, has released its latest iteration of the LGA socket for the next generation of Xeon Scalable CPUs. Being validated by Intel, the LGA 4189-4 and LGA 4189-5 are going to power the next generation of 10 nm Xeon CPUs, based on the Ice Lake architecture, and up to 56-core 2nd generation Xeon Scalable CPUs. While there are two models of the socket, TE Connectivity didn't reveal what the differences are between them. Socket P4 (LGA 4189-4) and P5 (LGA 4189-5) also feature exactly the same pin count, 0.9906 mm hex pitch and 2.7 mm SP height, so we can only speculate that the "4" or "5" in the revision is supposed to indicate details like higher power delivery capability or support for Ice Lake CPUs.

In addition to providing a new socket for Ice Lake, these sockets have support for PCI-Express Gen 4.0 and eight-channel memory (supported memory configurations are vendor dependent), meaning that we are getting two more memory channels than previous Xeon CPUs with a faster and newer PCIe standard.

Der8auer: Only Small Percentage of 3rd Gen Ryzen CPUs Hit Their Advertised Speeds

World famous overclocker Der8auer published his survey of boost clocks found on 3rd generation Ryzen CPUs. Collecting data from almost 3,000 entries from people around the world, he has found out that a majority of the 3000 series Ryzen CPUs are not hitting their advertised boost speeds. Perhaps one of the worst results from the entire survey are for the 12-core Ryzen 9 3900X, for which only 5.6% of entries reported have managed to reach the boost speeds AMD advertises. However, the situation is better for lower-end SKUs, with about half of the Ryzen 5 3600 results showing that their CPU is boosting correctly and within advertised numbers.

Der8auer carefully selected the results that went into the survey, where he discarded any numbers that used either specialized cooling like water chillers, Precision Boost Overdrive - PBO or the results which were submitted by "fanboys" who wanted to game the result. Testing was purely scientific using Cinebench R15 and clock speeds were recorded using HWinfo (which got recommendation from AMD), so he could get as precise data as possible.

Researchers Build a CPU Without Silicon Using Carbon Nanotubes

It is no secret that silicon manufacturing is an expensive and difficult process which requires big investment and a lot of effort to get right. Take Intel's 10 nm for example. It was originally planned to launch in 2015, but because of technical difficulties, it got delayed for 2019. That shows how silicon scaling is getting more difficult than ever, while costs are rising exponentially. Development of newer nodes is expected to cost billions of Dollars more, just for the research alone and that is not even including the costs for the setting up a manufacturing facility. In order to prepare for the moment when the development of ever-decreasing size nodes becomes financially and physically unfeasible, researchers are exploring new technologies that could replace and possibly possess even better electrical properties than silicon. One such material (actually a structure made from it) is Carbon Nanotube or CNT in short.

Researchers from MIT, in collaboration with scientists from Analog Devices, have successfully built a CPU based on RISC-V architecture entirely using CNTs. Called RV16X Nano, this CPU is currently only capable of executing a classic "Hello World" program. CNT is a natural semiconductor, however, when manufactured, it is being made as a metallic nanotube. That is due to the fact that metallic nanotubes are easier to integrate into the manufacturing ecosystem. Its has numerous challenges in production because CNTs tend to position themselves randomly in XYZ axes. Researchers from MIT and Analog Devices solved this problem by making large enough surfaces so that enough random tubes are positioned well.

AORUS Announces the All-New AORUS 17 Flagship Laptop

Top-of-the-line gaming brand AORUS, reveals itself at the 2019 GAMESCOM trade show in Germany Cologne, in which the spotlight shines at the all-new 17 inch flagship gaming laptop, the AORUS 17. AORUS takes the lead yet again through the co-op with world renowned switch manufacture OMRON to innovate and develop a set of unique mechanical switches that is tailored for the AORUS 17, not only does the keys offer exceptional durability, it also offers one of the best feeling keys that gamers can find on a laptop. The AORUS greatness continues through the combination of the brand new Intel 8-core CPU, NVIDIA RTX graphics chip with Ray Tracing technology and an exclusive WINDFORCE INFINITY cooling system, the AORUS 17 steadily sits on the high-end gaming thrown with these specs.

AORUS leads the industry again by working with world renowned mechanical switch manufacture, OMRON in order to create a unique set of mechanical keys for the AORUS laptop, with gamer oriented design details, including an optimal 2.5 mm key travel and an actuation point of 1.6 mm, giving gamers both the sensational touch and sound of a crisp blue switch, which gamers can now enjoy the qualities of a full mechanical keyboard right on their AORUS laptop. AORUS pursues further by redesigning the key caps to produce stunning backlit keys with unique "concentric" keycaps, letting the LED underneath the keycap shine though evenly, increasing the overall lighting intensity by 27%, in addition to the AORUS exclusive FUSION 2.0 keyboard customization software, gamers can truly create a unique personal style.

Intel Says AMD Did a Great Job (with Ryzen 3000), But Intel CPUs are Still Better

It is no secret that AMD has made a huge success with its long awaited "Zen" CPUs and returned to PC market stronger than ever. Intel however has neglected AMD's presence and only recently admitted what an impact AMD made. At this year's Gamescon, Intel started a new campaign against AMD with a point that Intel's CPUs are still better performers with "real world benchmarks" backing that claim.

"A year ago when we introduced the i9 9900K," says Intel's Troy Severson, "it was dubbed the fastest gaming CPU in the world. And I can honestly say nothing's changed. It's still the fastest gaming CPU in the world. I think you've heard a lot of press from the competition recently, but when we go out and actually do the real-world testing, not the synthetic benchmarks, but doing real-world testing of how these games perform on our platform, we stack the 9900K against the Ryzen 9 3900X. They're running a 12-core part and we're running an eight-core," he adds. "I'll be very honest, very blunt, say, hey, they've done a great job closing the gap, but we still have the highest performing CPUs in the industry for gaming, and we're going to maintain that edge."

Alleged Leaked Details on Intel Comet Lake-S Platform Require... You Guessed It... A New Platform

Intel's development of their Core architecture in the post-Ryzen world has been slow, with solutions slowly creeping up in core counts with every new CPU release - but much slowly than rival AMD's efforts. Before Intel can capitalize on a new, more scalable and power-efficient architecture, though, it has to deliver performance and core count increases across its product line to stay as relevant as possible against a much revitalized rival. Enter Comet Lake-S: the desktop parts of Intel's new round of consumer CPUs, which will reportedly see an increase in the maximum core count to a 10-core design. This 10-core design, however, comes with an increase in power consumption (up to 135 W), and the need, once again, for beefier power delivery systems in a new, LGA 1200 package (with 9 more pins that the current LGA 1151).

The move to a new socket and the more stringent power requirements give Intel the opportunity to refresh its chipset offerings once again. If everything stays the same (and there's no reason it should change), new Z470 and Z490 chipsets should be some of the higher tier offerings for builders to pair with their motherboards. The new Comet Lake-S CPUs will still be built in the now extremely refined 14 nm process, and allegedly keep the same 16 PCIe 3.0 lanes as current Coffee Lake Refresh offerings. The new CPU offerings from Intel are expected to roll out in Q1 2020.

Caseking Adds Binned Ryzen 3000 CPUs to Its Offerings

Users that don't want to play the silicon lottery game have been using services that offer pre-binned and pre-overclocked chips for a while now. Silicon Lottery is one of the most well known players in this game, but German retailer Caseking is now offering the same for AMD's latest Ryzen 3000 processors. AMD's work on automatic overclocking and boost clocks for their Ryzen chips has rendered manual overclocking almost (read: almost) obsolete, and in some cases it may even be detrimental to the CPU's performance to set a manual overclock that overrides AMD's boost clock algorithm. This is because AMD's boost increases speed on a single core, with subsequent cores being clocked slightly lower according to their capabilities. In effect, this means that manually overclocking all cores to, say, 4.0 GHz can sometimes render lower performance in particular tasks, since the all-core overclock is, by necessity, handicapped by the least-overclockable core.

Caseking's offerings have been pre-overclocked, and are guaranteed to hit stable overclocks at the claimed frequency, thus saving users from getting a "bad" overclocker CPU from AMD. Caseking's offerings have been tested by their own King Mod team and overclocking superstar Roman "der8auer" Hartung, with Prime95 26.6 software being used to test the overclocked chips' stability with a FFT length of 1344 for at least one hour. This practice is backed by a two-year limited warranty on the CPU. Sadly, most CPUs are out of stock at the moment, so keep on checking availability, unless one of the offerings is exactly up your alley.

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with up to 56 Processor Cores

Intel today announced its future Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in a standard, socketed CPU as part of its mainline Intel Xeon Scalable platforms, with availability in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series, which today is gaining momentum among the world's most demanding HPC customers, including HLRN, Advania, 4Paradigm, and others.

"The Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family generated a lot of excitement among our customers who are deploying the technology to run their high-performance computing (HPC), advanced analytics, artificial intelligence and high-density infrastructure. Extended 56-core processor offerings into our mainline Intel Xeon Scalable platforms enables us to serve a much broader range of customers who hunger for more processor performance and memory bandwidth."
-Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

Intel Launches First 10th Gen Core Processors: Redefining the Next Era of Laptop Experiences

Today, Intel officially launched 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics for stunning entertainment and enable the best connectivity with Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season.

"These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 - all integrated onto the SoC, thanks to Intel's 10nm process technology and architecture design - we're opening the door to an entirely new range of experiences and innovations for the laptop."
-Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

ASUS Confirms Existence of X590 Boards for AMD Ryzen CPUs

According to VideoCardz'es sources at ASUS, they have received confirmation that ASUS is working on new motherboards for AMD's unannounced chipset offerings, X590 and possibly even X599. In ASUS'es internal documentation two motherboards are appearing with X590 name, PRIME X590-PRO and ROG STRIX X590-E.

These motherboards are named similarly as the current offering from ASUS, the PRIME X570-PRO and ROG STRIX X570-E Gaming, so even though that we don't know if these models will ever hit the market, there is great possibility. Additionally, there is another chipset refresh coming, but now for the HEDT space. ASUS is working on ZENITH II EXTREME, an update to first ZENITH EXTREME motherboard (based on X399 chipset), which is expected to feature updated X599 chipset and should support new ThreadRipper 3000 series of CPUs. For now, we don't have any details of either two chipsets nor the improvements they will bring.
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