AMD in its HotChips 22 presentation released a block-diagram of its biggest AI-HPC processor, the Instinct MI250X. Based on the CDNA2 compute architecture, at the heart of the MI250X is the "Aldebaran" MCM (multi-chip module). This MCM contains two logic dies (GPU dies), and eight HBM2E stacks, four per GPU die. The two GPU dies are connected by a 400 GB/s Infinity Fabric link. They each have up to 500 GB/s of external Infinity Fabric bandwidth for inter-socket communications; and PCI-Express 4.0 x16 as the host system bus for AIC form-factors. The two GPU dies together make up 58 billion transistors, and are fabricated on the TSMC N6 (6 nm) node.

The component hierarchy of each GPU die sees eight Shader Engines share a last-level L2 cache. The eight Shader Engines total 112 Compute Units, or 14 CU per engine. The CDNA2 compute unit contains 64 stream processors making up the Shader Core, and four Matrix Core Units. These are specialized hardware for matrix/tensor math operations. There are hence 7,168 stream processors per GPU die, and 14,336 per package. AMD claims a 100% increase in double-precision compute performance over CDNA (MI100). AMD attributes this to increases in frequencies, efficient data paths, extensive operand reuse and forwarding; and power-optimization enabling those higher clocks. The MI200 is already powering the Frontier supercomputer, and is working for more design wins in the HPC space. The company also dropped a major hint that the MI300, based on CDNA3, will be an APU. It will incorporate GPU dies, core-logic, and CPU CCDs onto a single package, in what is a rival solution to NVIDIA Grace Hopper Superchip.