Thursday, May 14th 2026
Intel "Razor Lake-AX" to Feature up to 32 Xe3 GPU Cores
Intel's upcoming "Razor Lake-AX" processor is shaping up to be a top-tier gaming chip. Reports suggest that Intel is working on multiple SKUs, with the flagship configuration featuring up to 32 Xe3 cores in its integrated graphics chip. According to the latest leaks from long-time Intel leaker Jaykihn, the "Razor Lake-AX" iGPU will be available in two versions: a 16-core iGPU and a 32-core iGPU, both based on Intel's Xe3 graphics IP currently found in "Panther Lake." This would make "Razor Lake-AX" nearly three times as powerful as the current Arc B390, which powers Intel's PTL lineup. This suggests that "Razor Lake-AX" will be a large package with next-generation CPU core IP and a robust iGPU cluster. Reportedly, this GPU die will measure around 162.84 mm², which is a significant size for integrated graphics.
Earlier this week, we learned that Intel also plans to return to on-package memory with the upcoming "AX" chip. Although the company initially claimed that the Core Ultra 200V "Lunar Lake" was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory to "Razor Lake-AX." Additionally, it's unclear where Intel will manufacture this massive chip, but the large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to what Intel's Xeon CPUs typically use. Do note that the image below is not a real Intel slide.Previously, Intel was considering creating a "Nova Lake-AX" SoC featuring 48 Xe3 cores paired with a 28-core CPU cluster. However, this has been put on hold, and the "AX" generation will not debut with the upcoming "Nova Lake" generation. Intel plans to launch the first batch of chips with the "AX" suffix after "Nova Lake," with "Razor Lake-AX" expected to arrive in 2027.
Sources:
Jaykihn on X, Haze on X, via VideoCardz
Earlier this week, we learned that Intel also plans to return to on-package memory with the upcoming "AX" chip. Although the company initially claimed that the Core Ultra 200V "Lunar Lake" was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory to "Razor Lake-AX." Additionally, it's unclear where Intel will manufacture this massive chip, but the large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to what Intel's Xeon CPUs typically use. Do note that the image below is not a real Intel slide.Previously, Intel was considering creating a "Nova Lake-AX" SoC featuring 48 Xe3 cores paired with a 28-core CPU cluster. However, this has been put on hold, and the "AX" generation will not debut with the upcoming "Nova Lake" generation. Intel plans to launch the first batch of chips with the "AX" suffix after "Nova Lake," with "Razor Lake-AX" expected to arrive in 2027.

9 Comments on Intel "Razor Lake-AX" to Feature up to 32 Xe3 GPU Cores
Strix Halo needs competition, but I expect this to be just as unobtainable when it releases (especially with RAMageddon going on).
32 Xe3 cores would put this in line with an RX 6800 XT or RTX 3080 in theory. Sounds too good to be true. Memory bandwidth will definitely hold it back like with Strix Halo.
Mobile Core Ultra 9 275HX is 243 mm²
So not inordinately big but the 162.84 mm² number in the story is for the iGPU alone.
If that's the case, then no LPCAMM2 or any other sort of modular RAM.