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Intel Announces NUC 11 Extreme Kit for High-End Gaming Experience

Today, Intel announced the Intel NUC 11 Extreme Kit (code-named "Beast Canyon"), a highly modular desktop PC engineered to provide a phenomenal experience for gaming, streaming and recording. With the latest 11th Gen Intel Core processors, support for full-size discrete graphics cards and a full range of I/O ports, the Intel NUC 11 Extreme Kit delivers high performance gameplay and smooth, immersive visuals.

Compact Intel NUC 11 Extreme Kits are designed to provide powerful, immersive gaming experiences. For performance, connectivity, and modularity, the Intel NUC 11 Extreme kit delivers massive performance with a small footprint.

The highest-performing Intel NUC yet delivers a premium and size-optimized PC package for creating innovative desktops suited to gamers' unique performance needs. Packing the latest hardware components into a tiny 8-liter case, the Intel NUC 11 Extreme Kit is loaded with features typically found in much larger gaming rigs and offers customizable design options.

Intel Announces New Xeon W-3300 Processors

Intel today launched its newest generation Intel Xeon W-3300 processors, available today from its system integrator partners. Built for advanced workstation professionals, Intel Xeon W-3300 processors offer uncompromised performance, expanded platform capabilities, and enterprise-grade security and reliability in a single-socket solution.

Intel Xeon W-3300 processors are intelligently engineered to push the boundaries of performance, with a new processor core architecture that transforms for what expert workstation users can accomplish on a workstation.

The Intel Xeon W-3300 processors are designed for next-gen professional applications with heavily threaded, input/output-intensive workloads. Use cases stretch across artificial intelligence (AI), architecture, engineering, construction (AEC), and media and entertainment (M&E). With a new processor core architecture to transform efficiency and advanced technologies to support data integrity, Intel Xeon W-3300 processors are equipped to deliver uncompromising workstation performance.

TrendForce: Enterprise SSD Contract Prices Likely to Increase by 15% QoQ for 3Q21 Due to High SSD Demand and Short Supply of Upstream IC Components

The ramp-up of the Intel Ice Lake and AMD Milan processors is expected to not only propel growths in server shipment for two consecutive quarters from 2Q21 to 3Q21, but also drive up the share of high-density products in North American hyperscalers' enterprise SSD purchases, according to TrendForce's latest investigations. In China, procurement activities by domestic hyperscalers Alibaba and ByteDance are expected to increase on a quarterly basis as well. With the labor force gradually returning to physical offices, enterprises are now placing an increasing number of IT equipment orders, including servers, compared to 1H21. Hence, global enterprise SSD procurement capacity is expected to increase by 7% QoQ in 3Q21. Ongoing shortages in foundry capacities, however, have led to the supply of SSD components lagging behind demand. At the same time, enterprise SSD suppliers are aggressively raising the share of large-density products in their offerings in an attempt to optimize their product lines' profitability. Taking account of these factors, TrendForce expects contract prices of enterprise SSDs to undergo a staggering 15% QoQ increase for 3Q21.

AMD Zen 4 and RDNA3 Confirmed for 2022, Zen 3 Refresh

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

Intel Rebadges 10nm Enhanced SuperFin Node as "Intel 7," Invents Other Creative Node Names

Intel, in a move comparable to its competitors' Performance Rating system from the 1990s, has invented a new naming scheme for its in-house foundry nodes to claim technological parity with contemporaries such as TSMC and Samsung, that are well into the sub-10 nm class. Back in the i586 era, when Intel's competitors such as AMD and Cyrix, couldn't keep up with its clock-speeds yet found their chips to be somewhat competitive, they invented the PR (processor rating) system, with a logical number attempting to denote parity with an Intel processor's clock-speed. For example, a PR400 processor rating meant that the chip rivaled a Pentium II 400 MHz (which it mostly didn't). The last that the PR system made sense was with the final generation of single-core performance chips, Pentium 4 and Athlon XP, beyond which, the introduction of multi-core obfuscated the PR system. A Phenom X4 9600 processor didn't mean performance on par with a rival Intel chip running at an impossible 9.60 GHz.

Intel's new foundry naming system sees its 10 nm Enhanced SuperFin node re-badge as "Intel 7." The company currently builds 11th Gen Core "Tiger Lake" processors on the 10 nm SuperFin node, and is expected to build its upcoming 12th Gen Core "Alder Lake" chips on its refinement, the 10 nm Enhanced SuperFin, which will now be referred to as "Intel 7." The company is careful to avoid using the nanometer unit next to the number, instead signaling the consumer that the node somehow offers transistor density and power characteristics comparable to a 7 nm node. Intel 7 offers a 10-15 percent performance/Watt gain over 10 nm SuperFin, and is already in volume production, with a debut within 2021 with "Alder Lake."

Intel Accelerates Packaging and Process Innovations

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel Now Producing More 10 Nanometer Wafers Than 14 Nanometer Wafers

Intel has recently confirmed during a recent earnings call that it is now manufacturing more 10 nm wafers than 14 nm wafers as part of its IDM 2.0 plan. This news comes four years after Intel first started shipping 10 nm products to customers however the production capacity did not exist to launch any mainstream desktop processors. Intel launched a few low-power mobile Ice Lake processors in 2019 but their 2021 flagship 11th Generation Rocket lake processors remained on 14 nm. This looks set to change as Intel highlights reduced production costs and prepares to launch 10 nm 12th Generation Alder Lake processors in Q4 2021. Intel will offer more details on their future manufacturing plans during their upcoming Intel Accelerated event.
Intel CEOUnder IDM 2.0, our factory network continues to deliver and we are now manufacturing more 10-nanometer wafers than 14-nanometer. As 10-nanometer volumes ramp, economics are improving with 10-nanometer wafer cost 45% lower year-over-year with more to come.

Intel Reports Second-Quarter 2021 Financial Results

Intel Corporation today reported second-quarter 2021 financial results. "There's never been a more exciting time to be in the semiconductor industry. The digitization of everything continues to accelerate, creating a vast growth opportunity for us and our customers across core and emerging business areas. With our scale and renewed focus on both innovation and execution, we are uniquely positioned to capitalize on this opportunity, which I believe is merely the beginning of what will be a decade of sustained growth across the industry," said Pat Gelsinger, Intel CEO. "Our second-quarter results show that our momentum is building, our execution is improving, and customers continue to choose us for leadership products."

Intel Core i9-12900K Allegedly Beats AMD Ryzen 9 5950X at Cinebench R20

With qualification samples of the upcoming Intel Core i9-12900K "Alder Lake-S" processors and companion Socket LGA1700 motherboards hitting the black-market, expect a deluge of benchmarks on social media. One such that stands out makes a fascinating claim that the i9-12900K beats AMD's current flagship Ryzen 9 5950X processor at Cinebench R20, which has been AMD's favorite multi-threaded benchmark. At stock speeds, with liquid cooling, the i9-12900K allegedly scores 810 points in the single-threaded test, and 11600 points in multi-threaded.

To put these numbers into perspective, a retail Ryzen 9 5950X scores 641 points in the single-threaded test, and 10234 points in multi-threaded, in our own testing. The i9-12900K is technically a 16-core processor, just like the 5950X, but half its cores are low-power "Gracemont." The "Alder Lake-S" chip appears to be making up ground on the single-threaded performance of the "Golden Cove" P-core, that's a whopping 25% higher than the "Zen 3" core on the 5950X. This is aided not just by higher IPC, but also the max boost frequency of 5.30 GHz for 1~2 cores, and 5.00 GHz "all-core" boost (for the P-cores).

Intel Core i9-12900K Qualification Samples Black-marketed for Roughly $1100

Qualification samples (QS) of Intel's upcoming Core i9-12900K "Alder Lake-S" desktop processors just hit the black market for the equivalent of roughly USD $1,064 to $1,157 (6,500 to 7,500 RMB), in China. The processor maxes out the 10 nm silicon, offering 8 "Golden Cove" P-cores, and 8 "Gracemont" E-cores, along with 30 MB of L3 cache, a dual-channel DDR5 memory interface, in a hybrid processor setup. You can bag yourself this QS, but you'll need to find a compatible motherboard. "Alder Lake-S" debuts the new LGA1700 socket, Intel's first major change in the physical dimensions of its mainstream-desktop CPU socket since 2009, mandating a cooler update.

Intel In Talks To Purchase GlobalFoundries for $30 Billion

Intel is exploring a deal to purchase GlobalFoundries for roughly $30 billion according to people familiar with the matter, which would serve as Intel's largest acquisition to date. GlobalFoundries is owned by Mubadala Investment Co and it was widely reported that the company was planning an initial public offering later this year. This latest report comes as Intel continues talks with RISC-V chip designer SiFive for a $2 billion purchase as part of a major restructuring effort led by new CEO Pat Gelsinger. Intel is planning to boost its manufacturing capacity with the IDM 2.0 initiative where they have already committed to building two new fabs in Arizona and will offer manufacturing services to other countries. GlobalFoundries currently holds about 7% of the global foundry market by revenue and has several large customers including AMD, Qualcomm, and NVIDIA.

XMG Reports Higher Availability of Ryzen 5000 Mobile Processors

Laptop manufacturer XMG Has recently reported that the supply of AMD Ryzen 5000 mobile processors has increased considerably in the past weeks with this availability expected to continue through the coming months. These supply improvements come after an ongoing period of global chip shortages which has resulted in price increases for various electronics devices. XMG also reports that the supply of components from Intel and NVIDIA is expected to remain stable but ICs from Realtek and Cypress continue to fluctuate in availability and pricing.
XMGThe availability of AMD's current mobile processors from the Ryzen 5000 series has improved significantly over the past few weeks. The coming months continue to promise a reliable CPU supply.

Intel First Graphics Vendor to Release non-Beta GPU Driver for Windows 11

Intel today released version 30.0.100.9684 of the Intel Graphics Drivers suite, which is the first non-beta driver to support Windows 11. With this, Intel beats NVIDIA and AMD to Windows 11 drivers, who don't even list out Windows 11-compatible drivers on their websites. To achieve Windows 11 support, these drivers comply with WDDM 3.0, supporting DirectX 12 Shader Model 6.6 compiler.

WDDM 3.0 lays the foundation of Microsoft's future attempts to standardize dynamic refresh rate and supersampling in games (making DLSS and FSR obsolete). The drivers also enable the Microsoft Auto HDR feature of Windows 11 on 10th Gen Core processors with Iris Plus Graphics (or later). This would mean you'll need at least a Core "Ice Lake," Core "Tiger Lake," or Core "Rocket Lake" processor. "Comet Lake" chips with Gen 9.5 UHD 630 Graphics (or older), don't support Auto HDR. Grab the latest Intel Graphics Drivers from the link below.

DOWNLOAD: Intel Graphics Drivers 30.0.100.9684

NAND Flash Contract Prices Likely to Increase by 5-10% QoQ in 3Q21 as Quotes Continue to Rise, Says TrendForce

The recent wave of COVID-19 outbreaks in India has weakened sales of retail storage products such as memory cards and USB drives, according to TrendForce's latest investigations. However, demand remains fairly strong in the main application segments due to the arrival of the traditional peak season and the growth in the procurement related to data centers. Hence, the sufficiency ratio of the entire market has declined further. NAND Flash suppliers have kept their inventories at a healthy level thanks to clients' stock-up activities during the past several quarters. Moreover, the ongoing shortage of NAND Flash controller ICs continues to affect the production of finished storage products. Taking account of these demand-side and supply-side factors, TrendForce forecasts that contract prices of NAND Flash products will rise marginally for 3Q21, with QoQ increases in the range of 5-10%.

Specs of Top Intel 12th Gen Core "Alder Lake-S" Processors Surface

Intel will debut its 12th Gen Core "Alder Lake-S" desktop processors either toward the end of 2021, or early 2022, introducing the LGA1700 socket, 600-series chipset, and more importantly, hybrid CPU core architecture to the desktop space. The 10 nm "Alder Lake-S" silicon features up to eight "Golden Cove" performance cores (P-cores), and up to eight "Gracemont" efficiency cores (E-cores), in a heterogenous CPU core setup rivaling Arm big.LITTLE. Specifications of the top Core i9, fairly-top Core i7, and mid-tier Core i5 parts were leaked to the web on Chinese social media.

The 12th Gen Core lineup will be led, predictably, by the Core i9-12900K, which succeeds the i9-11900K with a maxed out 8+8 (P+E) configuration, unlocked multipliers, the most cache, and the highest clock speeds. The P-cores ("Golden Cove" cores) are clocked up to 5.30 GHz (1-2 cores boost), and up to 5.00 GHz all-core / 8 cores; while the E-cores ("Gracemont" cores), are clocked up to 3.90 GHz (1-4 cores boost), with 3.70 GHz all-core / 8 cores boost. The total L3 cache on the silicon is 30 MB. The i9-12900K has a TDP of 125 W (PL1), with 228 W PL2. Intel will introduce several new overclocking features, including multiple memory gear ratios.

Lenovo Introduces New Family of ThinkStation P350 Desktop Workstations for the Entry-Level Space

Lenovo today announced the next generation of its family of entry-level desktop workstations - the ThinkStation P350 Tower, Small Form Factor (SFF) and Tiny. This trio of workstations hosts a technology upgrade - each one is equipped with support for PCIe Gen 4 for faster access to cutting-edge storage technologies, as well as enhanced professional graphics support. This latest generation of desktop workstations becomes Lenovo's most powerful entry-level offering and delivers a complete package of size options that can scale across a variety of industries and their respective workflows. From engineering and architecture, to finance, STEM/higher education and medical, these new desktop workstations offer versatile, flexible and ISV-certified performance at whatever size is best suited for users' needs and working environment.

Built with the latest high-performance Intel Core or Xeon processors with support up to 11th Gen Intel Core or Intel Xeon W processors, the ThinkStation P350 Tower and SFF are tailored for mission-critical tasks that require superior reliability and powerful performance. Both the Tower and SFF also offer NVIDIA RTX professional graphics, with the Tower now able to support up to the NVIDIA RTX A5000 graphics card. In addition to the 500 W power supply, the tower chassis now boasts a new 750 W PSU option - enabling high-end GPU users with the power needed to tackle sophisticated workflows. The ThinkStation P350 Tiny is the industry's smallest workstation at less than 1L and offers uncompromising performance within a form factor 96% smaller than a traditional desktop. Powered by 11th Gen Intel Core processors, it is uniquely qualified for enabling OEM solutions, and can be used as a host for like-local remote workstation power.

Intel Announces Accelerated Webcast with Process & Packaging Updates

Intel has recently announced that CEO Pat Gelsinger and Dr. Ann Kelleher (senior vice president and general manager of Technology Development) will be hosting a webcast on July 26th to provide a deeper look at Intel's process and packaging roadmaps. These updates will focus on the companies IDM 2.0 Strategy which seeks to increase the companies manufacturing capabilities through the creation of new fabs and the development of more advanced processes. Intel will also offer manufacturing capabilities to external companies using these foundries which it hopes will allow it to better compete with the likes of TSMC, Globalfoundries, and Samsung. You can watch the webcast on July 26th at 2 PM PDT, Intel will publish a link to it on their Newsroom website.

Intel Prospects Europe for a Massive €20 Billion New Fab

Intel is exploring a massive €20 billion ($23.7 billion) manufacturing investment in the European Union that aims to produce "20% of the world's logic chips" by 2030, reports the Financial Times. This is likely to be separate from the company's ongoing investments in Ireland. Intel CEO Pat Gelsinger recently met with the leaders of France and Italy in a bid to "rebalance the semiconductor manufacturing landscape to make supply chains more resilient." Reading between the lines it becomes clear that they are referring to the world's overdependence on Asia, particularly Taiwan, for cutting-edge semiconductor manufacturing.

The location of Intel's new mega-fab remains undecided, as the company is still sitting down with the various EU member states to work out a favorable deal. Regardless of where it lands, the investment would align with the EU's grand-strategy to localize semiconductor manufacturing on a large scale, with the goal of making the EU a net-exporter of semiconductors.

Intel "Alder Lake" Mobile Processor SKU Stack Leaked

Armed with up to 8 "Golden Cove" high-performance CPU cores and up to 8 "Gracemont" low-power cores in a hybrid x86 processor setup, the "Alder Lake" silicon enables Intel to carve out some interesting SKUs in the mobile space, by creating numerous combinations of the big and small CPU core counts, and more importantly, by adjusting the ratio of big cores to small ones. The two core types operate at significantly different performance/Watt bands, which allows Intel to target the various TDP-defined mobile processor SKU categories with just the right big:small core ratios, as revealed by a leaked "Alder Lake" mobile SKU roadmap, leaked to the web by HXL.

Intel is looking to spread the silicon across six mobile segments defined by TDP—the 5 W tablet/handheld; the 9 W ultra-thin, the 15 W mainstream tablet/laptop, the 28 W performance tablet/laptop, the 35-45 W thin enthusiast laptop, and the 45-55 W "muscle" laptop. With Intel recently announcing the discontinuation of its 1+4 (big+small) core "Lakefield" hybrid processor, its mantle in the 5 W segment will be picked up by "Alder Lake-M5," with 1 "Golden Cove" and 4 "Gracemont" cores. There will be two product tiers segmented by iGPU execution units (EUs), one with 48 EU, and the other with 64.

Intel Retires "Lakefield," "Comet Lake-U," and "Ice Lake-U" Processors

Intel on Tuesday issued product-change notifications (PCNs) to announce the discontinuation of its first Hybrid processors, codenamed "Lakefield," besides 15-Watt U-segment variants of its "Ice Lake" and "Comet Lake" mobile processors. With the product discontinuation notice put out, it sets the ball rolling toward a year-long process where Intel solicits its final orders for these chips from OEMs and distributors, fulfills these orders last by 2022, and marks these parts "End of Life" (EOL).

Intel's mobile processor segment is dominated by the "Tiger Lake" microarchitecture on the 10 nm SuperFin node. Quad-core variants of the architecture cover the 15 W Y- and U-segments, while 8-core variants span the 35 W to 55 W H-segments for mainstream notebooks. Intel's next hybrid mobile processor, the "Alder Lake-P," is expected arrive in Q4-2021.

Intel Regains CPU Market Share that it lost to AMD, Latest Steam Hardware Survey

Valve has released its Steam Hardware Survey results for the month of June, and as always, it is a pretty good indication of the gaming market and market trends, showing us just how well the companies providing hardware are doing. On the CPU front, there are two companies constantly fighting for market domination: Intel and AMD. A bit over a month ago, we reported that AMD made serious progress in taking the market share away from Intel, using its latest Ryzen 5000 series of processors. However, this time, the effect seems to be reversed by its competitor, Intel.

All the gains AMD has made in the past few months have been sort of "erased" by Intel, as team blue managed to get back to a point where AMD now holds 28.41% of the CPU market, while Intel is back to over 70% share, more specifically 71.58%. What this means is that there are some fluctuations happening right now, and we are eager to see more reports to analyze in what direction is the market moving and how the two competing companies are performing. AMD seems to be held back by their ability to produce enough CPUs, while Intel is happily filling that void, fueled by a more aggressive pricing strategy.

Linux Foundation to Form New Open 3D Foundation

The Linux Foundation, the nonprofit organization enabling mass innovation through open source, today announced an intent to form the Open 3D Foundation to accelerate developer collaboration on 3D game and simulation technology. The Open 3D Foundation will support open source projects that advance capabilities related to 3D graphics, rendering, authoring, and development. As the first project governed by the new foundation, Amazon Web Services, Inc. (AWS) is contributing an updated version of the Amazon Lumberyard game engine as the Open 3D Engine (O3DE), under the permissive Apache 2.0 license. The Open 3D Engine enables developers and content creators to build 3D experiences unencumbered by commercial terms and will provide the support and infrastructure of an open source community through forums, code repositories, and developer events. A developer preview of O3DE is available on GitHub today. For more information and/or to contribute, please visit: https://o3de.org

3D engines are used to create a range of virtual experiences, including games and simulations, by providing capabilities such as 3D rendering, content authoring tools, animation, physics systems, and asset processing. Many developers are seeking ways to build their intellectual property on top of an open source engine where the roadmap is highly visible, openly governed, and collaborative to the community as a whole. More developers look to be able to create or augment their current technological foundations with highly collaborative solutions that can be used in any development environment. O3DE introduces a new ecosystem for developers and content creators to innovate, build, share, and distribute immersive 3D worlds that will inspire their users with rich experiences that bring the imaginations of their creators to life.

Intel Xeon "Sapphire Rapids" Processor With 20 Cores Tested

Intel is slowly preparing to launch its 4th generation of Xeon Scalable processors, with it being the first arrival of the 10 nm designs to the server market. Codenamed Sapphire Rapids, these processors are expected to bring much-needed IPC and platform improvements so Intel can keep up with AMD's EPYC processors. Today, we are getting some first performance results as well as some information about a specific 20 core, 40 threaded Intel Xeon Sapphire Rapids SKU. In a leaked Geekbench 4 submission, the latest Xeon processor was tested and we get to see even more details about the processor.

Featuring 20 cores and 40 threads, the CPU has a base clock speed of 1.5 GHz. It features as much as 40 MB of L2 cache and 75 MB of L3 cache spread across the die. The system was tested on an Intel reference platform called VulcanCity, with this configuration carrying 32 GB of DDR5 memory. The reported results of the benchmarks that this processor went through are not very impressive. These numbers are easily beaten by AMD Ryzen 9 5950X, however, this is only an engineering sample with low clock speed and it could be possible that Geekbench is not optimized to run on this processor. You can check out some of the performance numbers below, and see the submitted results here.

Intel Sapphire Rapids HEDT Processors & W790 Chipset Appear in Leaked Roadmap

We haven't seen any new prosumer HEDT processors since AMD launched their Ryzen Threadripper 3000 lineup in early 2020. Intel has had a very weak HEDT offering over the past few years with their 14 nm Cascade Lake processors and X299 chipset where the flagship Core i9-10980XE offered just 18 cores. Intel appears to be preparing to launch an updated HEDT offering in Q2 2022 with 10 nm Sapphire Rapids processors and a new W790 chipset. The new W790 chipset may launch alongside Raptor Lake which is expected to support the Z790 chipset. We still have a while until these products launch with Intel not yet having released their Alder Lake predecessors while AMD is expected to announce Threadripper 5000 in the coming months.

Intel Books Two 3 nm Processor Orders at TSMC Manufacturing Facilities

Intel's struggles with semiconductor manufacturing have been known for a very long time. Starting from its 10 nm design IP to the latest 7 nm delays, we have seen the company struggle to deliver its semiconductor nodes on time. On the other hand, Intel's competing companies are using 3rd party foundries to manufacture their designs and not worry about the yields of semiconductor nodes. Most of the time, that 3rd party company is Taiwan Semiconductor Manufacturing Company (TSMC). Today, thanks to some reporting from Nikkei Asia, we are learning that Intel is tapping TSMC's capacities to manufacture some of the company's future processors.

Citing sources familiar with the matter, Nikkei notes that: "Intel, America's biggest chipmaker, is working with TSMC on at least two 3-nm projects to design central processing units for notebooks and data center servers in an attempt to regain market share it has lost to Advanced Micro Devices and Nvidia over the past few years. Mass production of these chips is expected to begin by the end of 2022 at the earliest." This means that we could expect to see some of the TSMC manufactured Intel processors by the year 2023/2024.
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