News Posts matching "Intel"

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Intel's Skylake and Kaby Lake-based Systems Vulnerable to USB Exploit

At this year's CCC hacker congress, researchers from Positive Technologies have released information, which documents vulnerabilities in Intel's Skylake and Kaby Lake series processors' handling of USB 3.0-based debugging - which could be used to attack, corrupt, and even subvert a user's system.

This vulnerability allows attackers to bypass typical security mechanisms - both at the hardware and at the OS level - by using a new debugging interface, which could allow them to install malware and/or rewrite the system's firmware and BIOS. The exploit is currently undetectable using existing security tools, and according to the researchers, this mechanism can be used on a hacked system regardless of the OS installed.

Intel Adds Hyper-Threading to Its Kaby Lake-based Pentium CPUs

Intel Corporation has made a slight tweak to its product line: the addition of Hyper-Threading to some of its processors which, traditionally, didn't carry it. This includes the Pentium G4620 (3.7 GHz base frequency and integrated graphics HD 630, $93) and G4600 (3.6 GHz base frequency, $82), both at 51 W TDP; G4560 (54W TDP at 3.5 GHz and integrated HD 610 graphics, $64); and the Pentium G4600T (3 GHz, HD 630, $75) and G4560T (2.9 GHz, HD 610, $64) slot in as the low power Pentium offerings with a 35W TDP. All of these processors now carry 2 physical cores, which the system sees exposed as 4 logical cores due to their Hyper-Threading enablement.

ECS Updates and Expands LIVA Mini-PC Family - Z, Z Plus and ZE Models Pictured

At CES 2017, ECS showcased a number of ultra-compact form-factor PCs. basically building upon their previous LIVA family releases, the new LIVA feature either Intel's Apollo Lake SoCs (with Celeron Processors N3350 / N3450 / N4200 and 6 W TDP) on the Z and ZE, or Intel's Kaby Lake-U processors (Intel Core i3-7100U / i5-7200U / i7-7500U and 15W TDP) on the Z Plus.

The Z Plus is obviously the most powerful of the lot, supporting DDR4 memory (the Z and ZE support only DDR3), having better integrated graphics (Intel's HD 620 versus the Intel HD 500/500 on the Z and ZE models), and having an expected extra energy consumption (an external 65 W adapter on the Z Plus versus a 40 W external adapter on the other two models).

Digital Storm Showcases Its "Aventum 3" Update

At CES 2017, Digital Storm made sure to showcase the computer case to devour all others: the Aventum 3 stands tall and deep with 28" height and more than 25" front-to-back, this is a truly massive tower, with room for more fans (it has about 20), cables (more than can be sanely counted), and custom liquid cooling than two or three mid-tower-size typical desktops.

Four GIGABYTE Socket AM4 Motherboards Pictured

GIGABYTE showed off four socket AM4 motherboards, designed for the upcoming AMD Ryzen processors and 7th gen. A-series APUs, at its 2017 CES booth. The lineup begins with the AB350M-D3H, an entry-level micro-ATX board based on the mid-tier B350 chipset; the mid-range AB350-Gaming 3, the mid-high segment AX370-Gaming K5, and the AX370-Gaming 5. The AB350-D3H covers the basics, with a 7-phase VRM, one PCI-Express 3.0 x16 slot wired to the AM4 socket, a second x16 slot that's electrical x4 and wired to the B350 chipset, one legacy PCI slot; one 32 Gb/s M.2 slot and six SATA 6 Gb/s ports (from which two are directly wired to the AM4 socket); and connectivity that includes 6-channel HD audio, gigabit Ethernet, two USB 3.1 (10 Gb/s) ports, DVI, HDMI 2.0, and DisplayPort.

Moving up the ladder, the AB350-Gaming 3 is a gaming-grade board in the ATX form-factor, featuring a red+black color scheme. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors; conditioning it for the CPU with a 7-phase VRM. The APU is wired to four DDR4 DIMM slots, and one PCI-Express 3.0 x16 slot. Other expansion slots include two x16 slots that are electrical x4, and two x1 slots. Storage connectivity includes one 32 Gb/s M.2 and six SATA 6 Gb/s ports (from which two are low-latency ports). Display outputs include DVI, DisplayPort, and HDMI. USB connectivity includes two USB 3.1 (10 Gb/s) ports, and six USB 3.0 ports. GIGABYTE deployed its gaming-grade AMPUp! onboard audio solution with a 115 dBA SNR CODEC, ground-layer isolation, audio-grade capacitors, a headphones amp, and gold-plated audio jacks. Network is care of an Intel-made gigabit Ethernet controller.

Intel Unveils Compute Card, a Credit Card-Sized Compute Platform

Today, Intel is announcing a new modular compute platform called the Intel Compute Card along with a range of partners who will be working with Intel to help accelerate the ecosystem of solutions based on the Intel Compute Card. Intel has been a leader in delivering technology to help realize the benefits of the Internet of Things and enable more smart and connected devices. The Intel Compute Card is being developed with that in mind, to transform the way compute and connectivity can be integrated and used in future devices.

Colorful Unveils its iGame Z270 Gamer Customization Motherboard

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, is proud to announce its latest motherboard for enthusiasts and gamers featuring the latest Intel Z270 chipset to support LGA1151 processors including the newly announced 7th generation Core processors from Intel with their new iGame Z270 Gamer. Customization motherboard. This latest products joins the family of iGame enthusiast and performance series of motherboards and graphics cards which focuses on not just the needs of gamers for a faster and robust system but serves as a canvas to promote their creativity and idea with great customization options.

G.SKILL Announces New DDR4 Specifications for Trident Z Series and Z270

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, announces new high-speed DDR4 memory specifications designed for the latest 7th Gen Intel Core processors and Z270 motherboards under the extreme performance Trident Z series.

With 16GB (8GBx2) and 32GB (8GBx4) kits becoming the mainstream memory capacities in PC systems, 8GB-based kits are in greater demand for higher performance than ever. Upon the launch of Intel's latest Kaby Lake platform, G.SKILL bumps up the maximum frequency speeds to a blistering DDR4-4266MHz at CL19-19-19-39 for 16GB (8GBx2) kits and DDR4-4133MHz CL19-21-21-41 for 32GB (8GBx4) kits.

Intel to Acquire 15 Percent Ownership of HERE

Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE's current indirect shareholders: AUDI AG, BMW AG and Daimler AG. In conjunction with Intel's acquisition of a stake in HERE, the two companies also signed an agreement to collaborate on the research and development of a highly scalable proof-of-concept architecture that supports real-time updates of high definition (HD) maps for highly and fully automated driving. Additionally, the two companies plan to jointly explore strategic opportunities that result from enriching edge-computing devices with location data.

"Cars are rapidly becoming some of the world's most intelligent, connected devices," said Brian Krzanich, Intel CEO. "We look forward to working with HERE and its automotive partners to deliver an important technology foundation for smart and connected cars of the future." "A real-time, self-healing and high-definition representation of the physical world is critical for autonomous driving, and achieving this will require significantly more powerful and capable in-vehicle compute platforms," said Edzard Overbeek, HERE CEO. "As a premier silicon provider, Intel can help accelerate HERE's ambitions in this area by supporting the creation of a universal, always up-to-date digital location platform that spans the vehicle, the cloud and everything else connected."

Intel Announces the 7th Generation Core "Kaby Lake" Desktop Processors

Intel today announced availability of its first 7th generation Core "Kaby Lake" desktop processors. All the processor SKUs being launched today are quad-core, across the company's Core i7 and Core i5 brand extensions. Leading the pack is the Core i7-7700K, priced at US $339, with a clock speed of 4.20 GHz, and 4.50 GHz Turbo Boost. This chip offers 8 MB of L3 cache, HyperThreading, and an unlocked base-clock multiplier, which enables easy overclocking. Next up, is the Core i7-7700 (non-K). This chip lacks an unlocked base-clock multiplier, and has lower clocks of 3.60 GHz, with 4.20 GHz Turbo, but offers 8 MB cache and HyperThreading. It is priced at $303.

The next chip which could interest PC enthusiasts is the Core i5-7600K. This chip features 3.80 GHz core, and 4.20 GHz Turbo Boost, 6 MB of L3 cache, and an unlocked base-clock multiplier, but like other Core i5 branded quad-core chips, lacks HyperThreading. It's priced at $242. The Core i5-7600 (non-K) lacks unlocked multiplier, and comes with lower clocks of 3.50 GHz core with 4.10 GHz Turbo Boost. It goes for $213. Priced below the $200 mark at $192, is the Core i5-7500, with its 3.40 GHz clock speed, and 3.80 GHz Turbo Boost. The i7-7700K and i5-7600K come with TDP rating of 95W. The non-K SKUs are rated at 65W. Intel also launched energy-efficient "T" Core i7 and Core i5 processors, with their TDP rated at just 35W.

ASUS ROG Maximus IX Apex Leads the Pack

Here are some of the first pictures of ASUS Republic of Gamers (ROG) Maximus IX Apex, the company's flagship motherboard based on the Intel Z270 Express chipset. The board has many first-in-segment features. To begin with, it features a non-rectangular PCB, which probably lets you quickly pull the board out of bench-tables. Designed for extreme overclocking, the Maximus IX Apex draws power from a 24-pin ATX, two 8-pin EPS, and one 4-pin Molex. The CPU is wired to three memory slots, two of these are DDR4, and make up the dual-channel DDR4 interface. The third slot is DDR3, and can be enabled at the flick of a switch, for troubleshooting the DDR4 memory OC.

The Maximus IX Apex features four PCI-Express 3.0 x16 slots, from which two are wired to the CPU (topmost slot and third slot), and run at x8/x8 when both are populated. The second and fourth x16 slots are electrical x4 and wired to the Z270 PCH. Although not visible, it's likely that this board features one or two M.2 slots, at the reverse side of the PCB. 8-channel HD audio, Intel gigabit Ethernet, four USB 3.1 ports (including type-C), and display outputs that include DisplayPort and HDMI, make for the rest of the connectivity. The board appears to feature a great deal of onboard OC buttons and switches. ASUS will reveal these features when it launches the motherboard a little later this month.
Source: VideoCardz

ASUS Prime B250 Pro Motherboard Detailed

ASUS is introducing the new Prime family of motherboards positioned between its Pro Gaming series and its mainline series. These are motherboards that share their feature-set from the company's mainline series, but feature black PCBs, and black+red product styling reminiscent of some of its premium ROG motherboards. Here are some of the first pictures of the Prime B250 Pro, an ATX form-factor motherboard priced around the $100 mark. The board could share its PCB design with the Prime Z270 Pro. Based on the Intel B250 Express chipset, the board lacks NVIDIA SLI support, or the kind of CPU overclocking features the Z270 chipset does.

The Prime Z270 Pro draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the CPU with a 7-phase VRM. Expansion slots include one PCI-Express 3.0 x16 wired to the CPU, a second x16 (electrical x4) slot wired to the PCH, and two each of PCI-Express 3.0 x1 and legacy PCI slots. Storage connectivity includes two M.2 slots, from which one is 32 Gb/s (bottom), and the other 16 Gb/s (top); and six SATA 6 Gb/s ports. The board offers two USB 3.1 (10 Gb/s) ports, one USB 3.0 type-C port, two USB 3.0 type-A ports on the rear panel, and four USB 3.0 ports by headers. Display connectivity includes HDMI, DVI, and D-Sub. ASUS also has a stripped-down variant of this board, called the Prime B250 Plus. It lacks USB 3.1 ports, and the heatsink over the CPU VRM.

Source: VideoCardz

Intel's Core i3-7350K to Reportedly be Absent From Initial Kaby Lake Launch

Intel's Core i3-7350K, the little dual-core that could, is going to be absent from the company's launch line-up, multiple sources have reported. Considering Intel's other expected, already pretty well-known parts and respective pricing which will be making up its Kaby Lake market launch, the absence of Intel's only "innovative" product (if you can really call an unlocked multiplier an innovation) surely presents itself as sad news for the extreme value-conscious consumer - at least if non-K overclocking of Intel's processors is, this time around, properly shut-down by the company as intended.

Expected to be priced at $175, the Core i3-7350K is expected to carry a base clock of 4 GHz, with 5 GHz on air being the expected OC potential of the chips. Apparently, Intel is delaying the launch of this part (as well as its entry-level Celeron and Pentium families of processors) by several weeks. This could be a way for Intel to prevent early cannibalization of its i5 7400 processors by a small chip that could, in the right scenario, provide much higher performance due to its 1 GHz extra base core clock speed (also being the only Core i3 desktop SKU to feature Turbo Boost, with a frequency of up to 4.2 GHz).

Source: Hermitage Akihabara, Computerbase

Experience 10 Years of ZOTAC Design and Engineering Excellence at CES 2017

ZOTAC International, a global manufacturer of innovation, is pleased to bring 10 years of design excellence to CES 2017 and showcase innovative VR and
commercial solutions. A strong lineup including ZOTAC's first Thunderbolt 3 Mini PC, External VGA box, and what's being touted as "the world's smallest GeForce GTX 1080" will be on show at One-Story Sky Villa, Palms Casino Resort.

"We believe the future of computing should be flexible," says Tony Wong, CEO, ZOTAC International. "Our next generation of computing products enables users to get the best of mobile and stationary experience."

Soon: Kaby Lake-based Systems Carrying Intel Optane Solutions

Lenovo has recently released the specifications for their 2017 Thinkpad series line-up, with several models (T470p, L470, L570, T470, T570, X270 and Yoga 370) featuring the usual, evolutionary hardware improvements, such as being equipped with Intel's latest generation Kaby Lake processors and increased screen resolutions. However, one of the hardware announcements for the new Thinkpad series goes a little further than your usual, run-of-the-mill updates: these solutions will feature what is expected to be the first consumer-level adaptations of Intel's Optane technology.

Intel Core i7-7700K Cracks 7 GHz Bench-Stable Overclock

It may have practically no IPC gains over its predecessor, but Intel's 7th generation Core "Kaby Lake" unlocked processors are shaping up to be an overclocker's delight. A Core i7-7700K sample tested by professional overclocker Allen "Splave" Golibersuch was able to breach the 7 GHz barrier. To achieve this feat however, HyperThreading was disabled, and two of the four CPU cores were also disabled.

Paired with an ASRock Z170 OC Formula motherboard, the i7-7700K was bench-stable at 7022.96 MHz, at the chip's maximum base clock multiplier of 69x, and a base-clock of 101.78 MHz. The Vcore voltage was set at a scorching 2.00V. The chip crunched PiFast in 9.02 seconds, SuperPi 32M in 4 minutes 20.25 seconds, wPrime 32M in 2.953 seconds, and wPrime 1024M in 1 minute 33.171 seconds. Paired with an ASUS GeForce GTX 1080 STRIX OC graphics card, it scored 643,316 points in Aquamark, and 86,798 points in 3DMark 05.

Source: OCLab.ru

AMD Ryzen Performance Review Leaked: Promising

French tech print magazine "Canard PC" is ready with early benchmarks of an AMD Ryzen 8-core processor. The scan of a page from its Ryzen performance review article got leaked to the web, revealing three key performance takeaways. In the first selection of tests, Canard PC put Ryzen through synthetic CPU-intensive tests that take advantage of as many CPU cores/threads as you can throw at them. These include the likes of H.264 and H.265 video encoding, WPrime, Blender, 3DSMax 2015, and Corona. Ryzen was found to be faster than the quad-core Core i7-6700K, and the six-core i7-6800K, but somewhere between the i7-6800K and the eight-core i7-6900K.

The next selection of tests focused on PC gaming, with a list of contemporary AAA titles, including "Far Cry 4," "Battlefield 4," "The Witcher 3: Wild Hunt," "Anno 2070," "GRID: Autosport," and "ARMA III." Here, the Ryzen sample was found to be underwhelming - it was slower than the Core i5-6600 quad-core chip clocked at 3.30-3.90 GHz; but faster than the i5-6500, clocked at 3.20-3.60 GHz. The fastest chip in the table is the i7-6700K (4.00-4.20 GHz). The reviewer still notes that Ryzen has a decent IPC gain unseen from the AMD stable in a while.

Intel 7th Gen Core "Kaby Lake" Boxes Pictured

Intel's 7th generation Core "Kaby Lake" processors are slated for a January 2017 launch, beginning with the flagship Core i7-7700K processor. Ahead of their launch, here are pictures of the retail boxes of Core i7, Core i5, and Core i3 "Kaby Lake" processors. As you can see, they're nearly identical to those of the 6th generation Core "Skylake" boxes, except for the "7th Generation" marking on the box, Intel HD Graphics 630 markings, and an interesting-looking "For a Great VR Experience" marking on the box. The processor model number sticker will be pasted right where you'd expect it. Intel Core "Kaby Lake" processors will run on motherboards with Intel 200-series chipset out of the box, and on 100-series chipset motherboards with BIOS updates.

Source: VideoCardz

Intel Could License AMD Radeon iGPU Tech for Future Processors

Intel and AMD's cross-licensing arrangements could get more equitable in the future, with reports hinting at the possibility of Intel licensing AMD Radeon intellectual property to be used as Intel processors' integrated GPUs. Rumors of such a deal were first reported by HardOCP this Spring, where it stated that the two companies were negotiating a licensing agreement. Earlier this week, HardOCP editor Kyle Bennett commented on the site's forums that a licensing agreement has been reached between the two, even though Intel does not want this to be public.

Such an agreement could see AMD sharing designs of its Radeon integrated graphics processors with Intel, which will integrate it into its processor designs, and manufacture them. Whether the amalgamated graphics solution will continue to be branded "AMD Radeon" or whether it will be marketed under the Intel graphics brands, remains to be seen.

Sources: OC3D, HardOCP

MSI's Z270 SLI Plus and Z270 SLI Motherboards Teased

On their Facebook page, MSI have given a little tease regarding their upcoming next generation Intel Z270 boards. Details are scarce at the moment, but these motherboards are to be marketed under MSI's PRO series, with the Z270 SLI Plus featuring a clean, high-contrast black and white color scheme, while the Z270 SLI opts for an almost totally black design.

The Z270 SLI Plus is the higher-end product of the two. It sports a 10-Phase PWM circuitry, cooled with the aid of two heatsinks in the ATX form-factor. As usual, it has four DIMM slots which leverage MSI's DDR4 Boost feature, and support for XMP profiles. All of these four DIMM slots are protected by metal shielding, and expansion slots include three PCIe 3.0 x16 (x16/x8/x8 electrical), three PCIe 3.0 x1 and two Turbo M.2 NVMe slots. Storage options include 6 SATA III ports and a dual USB 3.0 front panel header. It also features MSI's latest Audio Boost panel for premium audio quality, with what they call a "Mystic Light" RGB solution, and the I/O panel is covered by a black and white shroud.

NVIDIA Rumored to Launch the GTX 1050 M at CES 2017

New reports have surfaced that indicate NVIDIA is all set to launch a new mid range mobile graphics solution, the GTX 1050 M at CES 2017 in Las Vegas. While NVIDIA has already released mobile variants of the GTX 1080, GTX 1070 and GTX 1060, people not willing to spend big on higher tier products from the green camp are limited to "Maxwell" based GTX 960 M or GTX 950 M offerings. Reports also indicate there has been somewhat of a surge in demand for GTX 1060 M equipped laptops, where the new GTX 1050 M could be nicely positioned to further augment consumer appetite.

As we reported in November, we can expect that in line with the existing "Pascal" based mobile solutions, the new GTX 1050 M to sport the same (or better) core-configuration as its desktop counterpart, but with significantly higher clock speeds. This should make the GTX 1050 M an attractive option as it would endow the laptop with graphical horsepower exceeding the very capable GTX 970 M. All in all with new Intel "Kaby Lake" processors set to take the stage at CES 2017 too, we could see quite an array of new or reconfigured laptops scattered throughout the show.

AMD's ZEN-Supporting X370 Motherboards to be Shown at "New Horizon" Event

AMD's December 13th "New Horizon" event is supposedly (and expectedly) a pivotal moment for the company - a celebration of sorts for the impending launch of their ZEN-based microprocessors. The event, which will be presented mainly by Gametrailers TV-based journalist Geoff Keighley, is now turning up to be a Summit Ridge celebration of sorts as well.

According to recent reports, a small number of motherboard manufacturers should also be in attendance at the event, showing-off their AM4-compatible motherboards based on the top-of-the-line X370 chipset. The X370 is the most advanced version of the Zen-compatible chipsets and is expected to provide extensive overclocking features and up to two third-generation PCIe x16 lanes for multi-GPU systems. Below the X370, the B350 and A320 take over the role of the mid-range and entry-level chipsets respectively. The new chipsets are expected to bring native M.2 NVMe & SATA Express connectivity, PCIe gen 3, DDR4 memory compatibility and USB 3.1 Gen2 to the company's high-end desktop platform for the very first time.

ASRock's Beebox-S SFF PCs Upgraded With Kaby Lake CPUs

Remember ASRock's Beebox? The original Mini PC was originally reviewed here on TechPowerUp to a glowing score and wholehearted recommendation, and now, the company has announced an upgrade to its innards that is sure to give a new lease of life to the device's appeal. The upgraded systems are powered by either Intel's Core i5-7100U (2C/4T, 2.5 GHz base and 3.1 GHz Boost clocks) or i3-7200U (2C/4T, 2.4 GHz base clock) CPUs, featuring the Kaby Lake micro-architecture, but are, apart from that, identical to their predecessors. The system can also be equipped with up to 32 GB of DDR4-2133 memory (two SO-DIMM slots), an M.2-2280 NVMe SSD and a 2.5" SSD/HDD depending on your particular demands. Meanwhile, Intel's 802.11ac Wi-Fi + BT 4.0 wireless module is pre-installed.

ASUS PRIME Z270-A Motherboard Also Detailed

Finally putting the lid on all of ASUS' leaked and detailed motherboards, comes, the PRIME Z270-A, which doesn't belong to a special, bang-and-whistle-filled product line, and is just concerned with getting the job done. It clads itself in a simple and appealing white and gray color-scheme, and is expected to keep most of the important features in ASUS' more expensive product lines.

The PRIME Z270-A comes with ASUS' 8+2+2 Phase Digital power design, fed by an 8-pin connector, that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustment, courtesy of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking. It features four DDR4 DIMM slots that can support up to 64 GB of memory with speeds of up to 3866 MHZ (O.C+), and expansion slots on the motherboard include three PCIe 3.0 x16 (x16/x8/x4 electrical), four PCIe 3.0 x1 and dual M.2 slots that deliver up to 32 GB/s transfer speeds, with the PCIe slots being armored for higher resistance.

ASUS TUF Z270 MARK 1 Motherboard Detailed - Armored and Tough

Moving on from the Strix series, ASUS' TUF Z270 Mark 1 has also been detailed. Designed around so-called military standards purported to ensure longer stability and extreme durability, the new TUF Z270 motherboards incorporates features such as Tough Inside, Thermal Armor, TUF Networking, TUF Audio, Ultimate Cooling, 24/7 Durability and high speed transfer. This motherboard is one of ASUS' most premium and feature-packed products, so you should expect to pay a pretty, pretty penny for it, if history - and pricing history in particular - is anything to go by (and it usually is).

The LGA 1151 socket supports the latest 6th and 7th generation Intel Core processors, with the MARK 1 sporting an aggressive heatsink design that features ASUS' AURA RGB technology and a full cover TUF Thermal Armor and Fortifier shield. The chassis of the board houses a 40mm fan that offers significant cooling performance to the VRMs.
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