Other World Computing (OWC), a trusted leader in high-performance storage, memory, connectivity, software, and accessories that empower creative and business professionals to maximize performance, enhance reliability, and streamline workflows, today announced OWC Stack AI, the world's first Thunderbolt 5 AI accelerator and storage hub designed to help businesses, developers, researchers, and power users run larger AI models and workflows locally on select Windows and Linux PCs and laptops with Mac support planned for future release. OWC Stack AI will be demonstrated for the first time at COMPUTEX TAIPEI, in OWC Booth R1002, 4F, Nangang Hall 2.

Businesses today are adding more and more AI models across their operations so quickly that a lot of the hardware assets businesses already own are starting to hit a wall trying to keep up. As a result, many organizations end up stuck choosing between sending sensitive data offsite and paying ongoing cloud AI costs, or trying to run AI locally and discovering their existing hardware simply can't handle it. OWC Stack AI fixes this by expanding the amount of effective AI working memory available to existing PCs and laptops, allowing them to run much larger AI models locally than their onboard GPU memory would normally support. OWC Stack AI helps existing PCs and laptops run larger AI models locally without slowing down, crashing, or running out of GPU memory. Instead of paying ongoing cloud AI fees and sending sensitive data offsite, organizations can keep AI local with better speed, privacy, security, and cost control.

Akasa, a leading provider of computer hardware and PC accessories, has launched a 10 Gigabit PCIe Network Interface Card (NIC), designed to upgrade desktops, workstations, servers and embedded systems to multi-gigabit Ethernet connectivity. Powered by the Realtek RTL8127AT chipset and featuring a PCIe 3.0 x2 interface, the card supports six auto-negotiating speed tiers from 10 Gbps, 5 Gbps, 2.5 Gbps, 1 Gbps, 100 Mbps to 10 Mbps, while fitting PCIe x4, x8 and x16 slots and remaining compatible with x2 slots where present on server and workstation boards.

Compliant with IEEE 802.3bz (2.5GBASE-T/5GBASE-T) and IEEE 802.3an (10GBASE-T), the card incorporates built-in IEEE 802.3az (Energy Efficient Ethernet) support, which reduces power consumption during low-traffic periods without interrupting network availability. Additional features including Wake-on-LAN (WoL) and jumbo frame support up to 16K further extend operational efficiency, enabling remote power management and reducing CPU overhead on large data transfers.

StarTech.com, a global provider of performance connectivity solutions for IT professionals, announced the release of its next-generation Driverless Multi-monitor USB-C Docking Stations for Windows environments utilizing multi-stream transport (MST) with HDMI and DisplayPort compatible models. Built for enterprise Windows environments, the docks support enterprise mixed hardware platforms including Intel, AMD and Snapdragon-based systems while enabling driverless deployment and up to 100 W of power delivery.

Key features include:

• Dual 4K 60 Hz display support or Dual 4K 60 Hz + one 4K 30 Hz with the triple display dock.
• Driverless deployment for faster rollout and less troubleshooting.
• USB ports up to 10 Gbps.
• Mountable design with integrated security lock slots.

The CZ.NIC Association, the Czech national domain administrator, presents Turris Omnia NG Wired - a rack-mountable model offering 10 Gbps connectivity and the Turris OS operating system based on OpenWrt/Linux. It builds on the security principles of the Turris project and features a quiet, passive-cooling design. The device is intended for businesses, institutions, and demanding users seeking a powerful and sustainable network foundation while supporting European technologies, open source, and digital sovereignty.

Designed for rack installation: 10G/2.5G connectivity in a compact package
Turris Omnia NG Wired is built for racks and spaces like server rooms and network cabinets. Wi-Fi can be provided by separate access points, while the router stays in the backroom.

Apple today unveiled MacBook Neo, an all-new laptop that delivers the magic of the Mac at a breakthrough price, making it even more accessible to millions of people around the world. MacBook Neo starts with a beautiful Apple design, featuring a durable aluminium enclosure in an array of gorgeous colors—blush, indigo, silver, and a fresh new citrus. Its stunning 13-inch Liquid Retina display brings websites, photos, videos, and apps to life with high resolution and brightness, and support for 1 billion colors. Powered by A18 Pro, MacBook Neo can fly through everyday tasks, from browsing the web and streaming content, to editing photos, exploring creative hobbies, or using AI capabilities across apps. In fact, it's up to 50 percent faster for everyday tasks like web browsing, and up to 3x faster when running on-device AI workloads like applying advanced effects to photos, compared to the bestselling PC with the latest shipping Intel Core Ultra 5. Providing up to 16 hours of battery life, MacBook Neo allows users to go all day on a single charge.

A 1080p FaceTime HD camera and dual mics make it easy to look and sound great, and the dual side-firing speakers with Spatial Audio deliver crisp, immersive sound. MacBook Neo also features Apple's renowned Magic Keyboard for comfortable and precise typing, and a large Multi-Touch trackpad with support for intuitive gestures, enabling smooth and precise control. Completing the MacBook Neo experience is macOS Tahoe, with powerful built-in apps like Messages, Pages, Calendar, and Safari; seamless integration with iPhone; Apple Intelligence; as well as broad compatibility with third-party apps. And starting at just $599 and $499 for education, MacBook Neo is Apple's most affordable laptop ever, providing an unprecedented combination of quality and value. MacBook Neo is available to pre-order starting today, with availability beginning Wednesday, March 11.

VIA Labs, Inc. (VLI), a leading supplier of USB4, DisplayPort, SuperSpeed USB, USB 2.0, and USB Power Delivery Controllers, today announced at Embedded World 2026 the expansion of its industrial portfolio with the debut of the VL819i USB 5 Gbps and VL822i 10 Gbps Hub Controllers. Following the successful release of its industrial-grade VL122i STT and VL123i MTT USB 2.0 hubs earlier this year, this latest launch provides industrial partners with high-reliability, high-bandwidth applications such as machine vision, high-performance peripherals, displays, data acquisition, storage, and general connectivity. Attendees can learn more about VLI's controller silicon products during Embedded World 2026, March 10-12, at Booth 3-396 in Hall 3, Exhibition Centre Nuremberg.

VIA Labs' industrial-grade hub controllers are engineered for stable and reliable operation in extended-temperature environments from -40°C to +85°C and feature enhanced signal integrity and low-power design. They are ideal for embedded systems, servers, industrial PCs, smart retail terminals, and more.

NVIDIA has reportedly lowered its performance requirements for the HBM4 memory used in "Rubin" GPUs, as SK hynix and Samsung are reportedly struggling to meet the ambitious performance targets set by NVIDIA. According to a new note from SemiAnalysis, NVIDIA is reducing its specification requirements for the upcoming GPU generation. Originally, NVIDIA targeted a total bandwidth of 22 TB/s for the Rubin chip, but memory suppliers seem to be having difficulty meeting these requirements. Initial shipments are expected to achieve closer to 20 TB/s, which translates to approximately 10 Gbps per pin for HBM4. This indicates that NVIDIA's aggressive upgrade plan for "Vera Rubin" is facing a setback, and the final performance will differ slightly.

Interestingly, NVIDIA's initial target for the "Vera Rubin" VR200 NVL72 system was 13 TB/s in March 2025, which was later upgraded to 20.5 TB/s by September. At CES 2026, NVIDIA confirmed that the VR200 NVL72 system is now operating at 22 TB/s of bandwidth. Compared to AMD's Instinct MI455X accelerator, which has 19.6 TB/s, NVIDIA initially had lower system bandwidth. They addressed this by using faster DRAM and improving interconnects between CPUs, GPUs, and the entire system. However, as memory makers like SK hynix and Samsung struggle to meet NVIDIA's performance requirements, we will see HBM4 speeds of about 20 TB/s for the entire "Vera Rubin" system.

Club 3D, a Dutch technology innovator specializing in advanced computer connectivity solutions since 1997, announced its newest connectivity solutions for March. These include 2 new adapters, a USB-C to RJ45 10G Ethernet Adapter and a USB-C to HDMI 2.1 Adapter. The Club 3D CAC-2505 is a premium USB-C to HDMI 2.1 adapter that delivers next-generation visual performance in a compact form factor. It is designed to future-proof your setup by enabling stunning 8K60Hz video output from any USB-C device supporting DP Alt Mode.

The Club 3D CAC-2531 is a professional-grade USB-C to RJ45 10G Ethernet Adapter that delivers blazing-fast 10 Gbps speeds to any mobile or desktop setup. It is designed to bridge the gap between ultraportable hardware and high-speed network environments while providing a compact, plug-and-play solution for data-heavy workflows.

pureLiFi, the global leader in light-based communications, is set to challenge expectations at Mobile World Congress (MWC) 2026 by shattering speed barriers and solving the Fixed Wireless Access (FWA) industry's toughest challenge, delivering high quality signal indoors. LiFi is a high-speed, wireless communication technology that transmits data through the light spectrum rather than traditional radio frequencies.

The latest LiFi systems on show leverage technology trusted by international security agencies for classified networks, demonstrating that LiFi's massive capacity and military-grade security are accessible to all. Moving beyond the constraints of radio frequencies, pureLiFi is unveiling its High-Bandwidth Architecture, capable of a staggering 10 Gigabits per second (Gbps). Alongside this breakthrough, the company will showcase a powerhouse lineup of 5G FWA partner demonstrations and the latest Bridge XC Flex system.

Qualcomm Technologies, Inc. today announced its industry-leading Wi-Fi 8 portfolio, a key step toward building the connectivity foundation for the AI era. The comprehensive portfolio features the Qualcomm FastConnect 8800 Mobile Connectivity System and five new Qualcomm Dragonwing Networking Platforms. Each is engineered to deliver the connectivity and compute performance required to anchor a new generation of products, leveraging unparalleled intelligence with breakthrough architecture for today's AI demand realities.

"Today's network traffic profile is fundamentally changing as AI-fueled demand requires a re-thinking of the core architecture. Qualcomm Technologies is redefining that architecture to enable AI everywhere," said Gautam Sheoran, Senior Vice President and General Manager, Connectivity, Broadband and Networking, Qualcomm Technologies, Inc. "Next-gen networks and devices not only need to be AI-native, but they need a new breed of intelligent, high performance connectivity. Qualcomm Technologies' Wi-Fi 8 generation of products is the whole package: faster speeds, higher reliability, longer range, and powerful AI."

Transcend Information, Inc. (Transcend), a global leader in digital storage solutions, announced the launch of the RDE3 microSD Express high-speed card reader, engineered for high-performance applications. Featuring a USB 3.2 Gen 2 (10 Gbps) interface, the RDE3 delivers transfer speeds of up to 900 MB/s while maintaining backward compatibility with UHS-I memory cards. From content creation to gaming, the RDE3 enables fast, stable, and efficient data handling. With a rugged yet refined design that combines performance with reliability, the RDE3—when paired with Transcend's high-capacity microSD Express memory card USD710S—fully unleashes the potential of microSD Express, offering SSD-class performance to meet the demands of gamers and creators seeking smooth, consistent performance.

RDE3 microSD Express Card Reader: Performance Meets Premium Design
Purpose-built for high-speed workflows, the RDE3 microSD Express card reader leverages a USB 3.2 Gen 2 (10 Gbps) interface to achieve transfer speeds of up to 900 MB/s, enabling rapid imports of 8K high-resolution footage and large game files to significantly reduce wait times and boost productivity. Supporting the PCIe-based microSD Express standard while remaining backward compatible with UHS-I cards, the RDE3 balances top-tier performance with broad compatibility. Its USB-C connector supports Windows, macOS, and USB-C tablets for true plug-and-play convenience. The metal alloy housing offers excellent heat dissipation in a lightweight, durable form, while the scratch-resistant exterior delivers a clean, professional aesthetic—ensuring stable and reliable high-speed data transfers.

ASUS has used CES as a launch platform for many of its new Wi-Fi router products over the years, although this year it brought what it calls a demo system, rather than something that is ready for launch later this year. The ROG NeoCore Wi-Fi 8 router looks like something out of a Sci-Fi movie, and it really stands out compared to every other router we've ever seen. Due to the fact that Wi-Fi 8 isn't expected to be ratified until 2028, we might have to wait a while before we know if the NeoCore will become a retail product or not. The ROG NeoCore router is based on the shape of an icosahedron, which people that play role playing games might recognise as a 20-sided dice. As it is still early days, ASUS didn't share any specs, but three network ports are visible and based on the Wi-Fi 8 demo ASUS was running, we might be able to expect it to feature eight antennas split between the three Wi-Fi bands.

ASUS was also showing a pair of new ProArt branded networking products, the PRT-BE5000 router and the PQG-U1080 Ethernet switch. The PRT-BE5000 is as the name suggests a BE5000 Wi-Fi 7 router, which means a 3x3 antenna configuration for the 5 GHz which delivers a throughput of up to 4320 Mbps and a 2x2 setup for the 2.4 GHz band which delivers up to 688 Mbps. Other features include a pair of 2.5 Gbps Ethernet ports for WAN/LAN, three Gigabit ports, but oddly enough no USB ports. The PQG-U1080 is an unmanaged switch with eight 2.5 Gbps ports and two 10 Gbps SFP+ ports. Pricing of either device is currently unknown.

Razer has announced the Razer Forge AI Dev Workstation, a new addition to its growing line of high-performance hardware for AI developers. Built on over 20 years of high-performance engineering, this definitive local compute platform is designed to handle the most demanding training, inference, and simulation workloads for AI developers, researchers, and enterprises.

The Forge AI Dev Workstation fulfills Razer's vision for powerful, purpose-built AI hardware, delivering end-to-end local performance with secure on-device compute, zero subscription costs, and maximum responsiveness.

Satechi introduced at CES 2026 the CubeDock with SSD enclosure, its first Thunderbolt 5 docking station. The device is offering 80/120 Gbps bandwidth and integrated M.2 NVMe storage supporting 2230/2242/2260/2280 NVMe SSDs up to 8 TB with speeds up to 6,000 MB/s. The aluminium dock measures 127 x 127 x 52 mm and features one upstream Thunderbolt 5 port with support for up to 140 W of host charging. Connectivity includes three downstream Thunderbolt 5 ports (80 Gbps, 15 W each), two USB-C ports (10 Gbps), two USB-A ports (10 Gbps), UHS-II SD and microSD card readers (up to 312 MB/s), 2.5G Ethernet, and a 3.5 mm audio jack. Display support includes single 8K@144 Hz (Windows) or 6K@60 Hz (macOS), dual 8K@120 Hz (Windows) or 6K@60 Hz (macOS), and triple 8K@60 Hz on Windows only.

Satechi also launched the Thunderbolt 5 Pro Cable (1 meter, braided) supporting up to 120 Gbps uni-directional or 80 Gbps bidirectional transfers, 240 W power delivery, and dual 8K@60 Hz or triple 4K@144 Hz displays. Both products are available on the Satechi website. The CubeDock is priced at $399.99 (currently on pre-order, starts shipping at the end of March), and the Thunderbolt 5 Pro Cable at $39.99.

To say that TP-Link has a limited range of routers would be a lie and the company has at least two dozen Wi-Fi 7 routers in its lineup. At CES, the company showed yet a new addition, the Archer BE670/BE12000 is set to launch officially next week. It sports a 2x2 6 GHz radio, a 4x4 5 GHz radio and a 2x2 2.4 GHz radio for its combined speed of BE12000 or 5765 Mbps for the 6 and 5 GHz band and 688 Mbps for the 2.4 Gbps band. 320 MHz wide channels are supported on the 6 GHz band. The BE 670 has six external antennas which TP-Link claims forms a signal-boosting array for better coverage and the BE670 should cover 3000 square feet or around 278 square meters. All the standard Wi-Fi 7 features you'd expect, such as MU-MIMO, OFDMA and MLO are part of the package.

In terms of wired connectivity, there's a single 10 Gbps WAN/LAN port, one 2.5 Gbps WAN/LAN port and three Gigabit Ethernet ports. There's also a single Type-A USB 3.0 port that supports external storage devices and the BE670 supports Samba for easy file sharing on the network. The BE670 has a US$299.99 MSPR, but despite only launching next week according to TP-Link, it's already on sale on Amazon in the US and it's already offered with a US$50 discount, making it as cheap as its slightly less performant sibling, the BE600.

Belkin, a leading consumer electronics brand for over 40 years, today announced a bold new lineup of accessories designed to power, protect, and enhance the way people work, play, and connect. The new collection, debuting at CES 2026, includes advanced power banks, Qi2 25 W wireless chargers, a wireless HDMI dongle for seamless content sharing, and a next gen charging case for the Nintendo Switch 2.

Gaming
Charging Case Pro for Nintendo Switch 2 (Model ENA003)
Engineered for the ultimate on-the-go gaming experience, the Pro case delivers power, protection, and portability in one premium package. A removable 10,000mAh power bank delivers up to 30 W fast charging and features an LCD screen to display remaining battery life. The Pro version builds on the standard model's safe in-case charging with a sleeker, integrated power bank design that adds even more convenience. Gamers can now recharge the power bank externally without opening the case, check battery levels at a glance, and enjoy uninterrupted play with the hinged power bank design that doubles as a tabletop stand. Additional features include a dedicated flap for organized game card storage, a hidden compartment for smart trackers such as AirTag and Tile, and rugged materials and heavy-duty zippers for long-term durability. Compact, stylish, and performance-driven, the Pro case delivers upgraded convenience and charging flexibility for players who demand more from their gear.

ASUS introduced the Pro WS B850M-ACE SE, an AMD Socket AM5 motherboard in the microATX form-factor that's laid out like a server motherboard, but targets a range of consumers spanning from home and small-business servers, to workstations with storage-heavy loadouts. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It supports the entire range of consumer Ryzen and commercial Ryzen PRO desktop processors from the Ryzen 7000 and Ryzen 9000 series. It also supports EPYC 4005 series server processors in the AM5 package. The board also supports ECC DDR5 unbuffered memory, with support for up to 256 GB of dual-channel (4 sub-channel) DDR5-5600 memory.

Among its use case-specific features are IPMI, U.2, and PCIe Gen 4 MCIO NVMe interfaces. The IPMI is driven by an ASPEED AST2600 chip that includes ASUS Control Center Express IT management software. Storage options include two M.2-2280 slots each with PCI-Express 5.0 x4 wiring, a PCIe Gen 4 MCIO, a U.2 Gen 3, and four SATA 6 Gbps ports. There's also an internal microSD slot for software key storage. There are three wired LAN interfaces—a 10 GbE driven by a Realtek RTL8127 PHY, a 2.5 GbE driven by Intel i225 series controller, and a third 1 GbE interface for the IPMI controller. USB interfaces include two 10 Gbps USB-C ports on the rear panel, a 20 Gbps USB-C header, three 10 Gbps USB type-A, an internal type-A, and additional 5 Gbps ports via headers. Display outputs include HDMI and DisplayPort from the iGPU, and a D-Sub from the IPMI chip. The board is expected to be priced around the $400 mark.

Last week, Beelink revealed a teaser for its ME Pro NAS devices and now the company has unveiled the pricing for its first two 2-bay models, which come in a total of five different SKUs. All five SKUs are based on Intel Twin Lake SoCs, with the three base SKUs being built around the Intel Processor N95 and the two remaining SKUs sporting the Intel Processor N150. The base model pairs the N95 with 12 GB of 4800 MT/s LPDDR5 and a 128 GB SSD for US$369, whereas an upgraded SKUl with a 512 GB SSD comes in at US$449 and finally the top tier SKU comes with a 1 TB SSD for US$479. The N150 SKUs include 16 GB of LPDDR5 and start at US$529 with a 512 GB SSD and tops out at US$559 with a 1 TB SSD.

The ME Pro with the Twin Lake SoCs offers three M.2 NVMe slots, one with a PCIe 3.0 x2 interface and two with a PCIe 3.0 x1 interface. There's space for a pair of 2.5- or 3.5-inch hard drives and up to 30 TB drives are supported. Around the back you'll find a 19 V DC input, a 2.5 Gbps (Intel i226-V) and a 5 Gbps (Realtek RTL8126) Ethernet jack, an HDMI 2.1 port capable of 4K60p output, two USB 2.0 ports, one USB 3.2 Gen 2 (10 Gbps) Type-C port and a 3.5 mm audio jack. Around the front is a further USB 3.2 Gen 2 (10 Gbps) Type-A port, the power switch and a reset and clear CMOS pin-hole. A neat addition is a small tool that is attached to the base of the housing. Beelink has also included Wi-Fi 6 and Bluetooth 5.4 and it seems like the ME Pro ships with Windows 11 Home. Pre-orders are up now, with shipping said to start at some point in January.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today unveils the A620MT-E 2.0 motherboard, a reliable and adaptable AM5 platform designed for modern office environments, home entertainment setups, and SI integration projects.

Built on AMD's A620A single chip architecture with full support for Ryzen 9000, 8000, and 7000 series processors, the A620MT-E 2.0 delivers efficient performance and dependable stability for a wide range of everyday applications. It is an ideal choice for office users who need a smooth experience running essential tasks such as web browsing, emails, and productivity software. Home users will enjoy its capability as an HTPC platform for streaming TV shows and movies, listening to music, and engaging in light gaming. SI builders will appreciate its ability to support integrated systems handling customer data, transaction records, communications, and various business processes with consistent and secure performance.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today announced new models of the acclaimed TBS-h574TX all-flash NASbook, which come pre-installed with enterprise-grade E1.S SSDs. Available with two raw capacities, 9.6 TB or 19.2 TB, the new models are purpose-built for high-throughput post-production workflows including video editing, visual effects (VFX), and animation. With support for hot-swappable E1.S SSDs, the TBS-h574TX enables uninterrupted ingest-to-delivery operations—empowering on-location shoots, small-scale video production teams, SOHO users, and mobile media professionals to collaborate seamlessly and maintain peak productivity.

"Speed and reliability are critical in media production. By integrating QNAP-validated E1.S SSDs into the TBS-h574TX, users no longer need to worry about drive compatibility. They can power on, configure, and get straight to editing." said Andy Chuang, Product Manager of QNAP, adding "This NASbook combines portable design, all-flash performance, and hot-swappable SSDs to offer a uniquely compact, powerful, and zero-downtime experience—so teams can focus on creativity anytime, anywhere with peace of mind."

SilverStone has launched the TS434U, a compact external hard drive enclosure designed for users who need high-capacity storage with modern connectivity. Measuring 158 mm × 173 mm × 210 mm, it holds up to four 3.5-inch HDDs or 2.5-inch SSDs using regular SATA I/II/III connections with full hot-swap functionality support. The enclosure has a USB 3.2 Gen 2 connection with a USB Type-C plug, delivering transfer speeds up to 10 Gbps. Inside, it has an ASMedia ASM2074 controller working with four ASMedia ASM235CM bridge chips to manage the drives. It runs on 100-240 V AC power and puts out 12 V/7.5 A DC, which is enough to run multiple drives. To keep things cool, it has a 120 mm fan at the bottom. It also has built-in protection to prevent the drives from overheating. The magnetic front door design allows removal and side attachment while concealing LED indicators when closed. Status monitoring includes power, fan, and individual HDD activity indicators using color-coded LEDs.

It's worth mentioning that the device operates as a non-RAID unit, requiring software RAID configuration through OS utilities for array functionality. You can get the SilverStone TS434U in black or white, and it comes with a 120 cm USB cable and a 1500 mm power cord. Price and exact store availability have yet to be announced.

The ROG XG Station 3 (Thunderbolt 5) external graphics dock is a plug-and-play solution that merges the power of an external GPU with the expandability of a Thunderbolt dock, instantly transforming any Thunderbolt 5-enabled laptop into a gaming or rendering powerhouse. The incredible 80 Gbps bandwidth of Thunderbolt 5 allows users to upgrade to external GPU computing power, including NVIDIA GeForce RTX 50 Series, enabling high-speed gaming, video editing, 3D rendering, or AI application development on their laptop.

Along with the Thunderbolt 5 port, the ROG XG Station 3 offers three USB Type-C ports with up to 10 Gbps data-transfer speeds. It also features ASUS Aura Sync lighting and the BTF hidden-connector design that provides a clean look while improving cable management.

EnGenius Technologies Inc., a leader in enterprise networking solutions, has announced the launch of the ECS2530FP, a powerful L2+ Multi-Gigabit switch designed to meet the demands of modern enterprises. The ECS2530FP delivers advanced performance and flexibility, offering multiple management options—locally, via EnGenius Private Cloud, or through the EnGenius Cloud platform—empowering IT teams with complete control across any deployment scenario.

The ECS2530FP delivers unmatched flexibility and power with 24 multi-gigabit 2.5GbE PoE+ & PoE++ ports and 6 dual-speed 10G SFP+ uplinks, offering the bandwidth, speed, and fiber connectivity enterprises need to support high-throughput applications such as Wi-Fi 7 access points, AI surveillance systems, and advanced VoIP deployments.

ASUS today introduced its first ROG Strix-H branded AMD platform motherboard. ASUS differentiates its ROG Strix line of motherboards with brand extensions resembling their main ROG brands, with E denoting "extreme," F denoting "formula," G denoting "gene" (microATX), I denoting "impact" (Mini-ITX), A denoting "apex," and H denoting "hero." The H extension is positioned below F, just like Hero is positioned below Formula; however ROG Strix-H motherboard SKUs tend to be rare as that price-point tends to be occupied by TUF Gaming Plus SKUs. The new ROG Strix X870-H Gaming WiFi7 S is exclusive to China, and comes co-branded. The board pulls power from a combination of 24-pin ATX and dual 8-pin EPS connectors, using a 16+2+1 phase VRM, which uses 80 A DrMOS on all phases. The board uses an 8-layer PCB.

The board is based on the AMD X870 chipset, which ensures USB4 connectivity, besides some premium networking features such as Wi-Fi 7. The AMD Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and two M.2 Gen 5 NVMe slots—the second slot shares its Gen 5 x4 lanes with the PEG slot. There are two additional Gen 4 NVMe slots, one of these is wired to the X870 FCH, while the other shares its lanes with the CPU-attached discrete USB4 host controller. The topmost Gen 5 NVMe slot comes with a tall heatsink, while the other three slots come with a flatter common heatsink-shroud.

GL.iNet, a leader in secure network solutions, is proud to announce the launch of Flint 3 (GL-BE9300), its first tri-band Wi-Fi 7 home router. Engineered for home users, remote workers, gamers, and small offices, Flint 3 delivers next-generation wireless performance with unmatched flexibility, speed, and control.

Next-Generation Wi-Fi 7 Performance
Flint 3 is powered by the latest Wi-Fi 7 technology, supporting Multi-Link Operation (MLO) across 2.4 GHz, 5 GHz, and 6 GHz bands. This dramatically reduces interference and latency by combining multiple wireless channels into a single stable connection. With max speeds of 688 Mbps (2.4 GHz), 2882 Mbps (5 GHz), and 5765 Mbps (6 GHz), Flint 3 ensures responsive, and constant connectivity, even in congested device environments.