ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

Intel and AMD will be releasing new CPUs that support DDR5 DRAM solutions for PCs and servers this year. In response, the DRAM industry led by South Korean suppliers is developing solutions to complement the arrival of the new CPUs. In the midst of the gradual shift to DDR5, DRAM suppliers will also scale back the supply of DDR3 solutions, according to TrendForce's latest investigations. With Korean suppliers accelerating their withdrawal from DDR3 production, Taiwanese suppliers yet to kick off mass production using newly installed capacities, and Chinese suppliers falling short of their expected yield rate, the global supply of DDR3 solutions will undergo an impending decline. With respect to the demand side, however, not only has the supply of networking chips been ramping up, but material shortage issues are also gradually easing. As such, buyers are now procuring DDR3 solutions ahead of time, resulting in a tight supply and demand situation in the DDR3 market. TrendForce therefore expects DDR3 DRAM prices to recover from a bearish first quarter and undergo a 0-5% QoQ increase in 2Q22.

Chinese motherboard maker ONDA released the first Intel Socket LGA1700 motherboard that features both DDR4 and DDR5 memory support—something we learned quite early on that Intel either isn't allowing or is "discouraging" motherboard vendors to do. The ONDA H610M+ is based on the entry-level Intel H610 chipset, and is an otherwise basic-looking motherboard. The memory sub-system is interesting.

While the board supports both DDR5 and DDR4, there's only one of each slots, so you're limited to single-channel, and like every motherboard from the past that supported multiple memory types; you can't use the DDR5 and DDR4 slots at the same time. The board runs DDR4 at a maximum frequency of DDR4-3200, and the DDR5 slot at DDR5-4800 (max). That's not all, the board is quite possibly the only H610 chipset-based motherboard with a Gen 5 PCI-Express x16 slot (every other H610 board we've come across has Gen 4, to keep costs low). PCIe Gen 5 is allowed for the H610 platform. Another interesting bit is the M.2 E-key slot, so you can drop in a WLAN module. It's likely that this board will only be available in the Chinese market.

Silicon Power (SP) releases its newest UDIMM memory module with the latest, groundbreaking DDR5 technology. Read on to learn why it's time to ditch your DDR4 module and make the upgrade. Taking speed, capacity, and reliability even further, the cutting-edge technology of this DDR5 module gives that next-level edge for your system's performance. With aggressive speeds of 4800 MHz, it's 1.5x faster than standard 3200 MHz DDR4 to provide multi-core CPUs with extreme responsiveness and the power to multi-task seamlessly.

Even with all of its extra power, this DDR5 module improves upon its predecessor with on-module voltage regulation. A power management integrated circuit (PMIC) reduces the burden on the motherboard control and results in a lower voltage of 1.1 V versus 1.2 V for DDR4 for even less power consumption.

ASUS today announced the Pro Q670M-C-CSM business motherboard with support for 12th Gen Intel Core processors and DDR5 memory. The Pro Q670M-C-CSM joins the ASUS B660 and H610 models launched in January to deliver a full lineup for customers ranging from small-to-medium businesses to enterprise. These models are designed to deliver enhanced security, reliability, manageability, and serviceability that every company needs to build their IT systems. The board is equipped with anti-sulfur resistors, anti-moisture coating, and a stainless-steel rear I/O port to prevent internal corrosion and adhesion in order to prolong the board's life in humid environments.

Although Intel's upcoming 13th generation of desktop CPUs that goes under the code name of Raptor Lake, are expected to retain support for DDR4 memory, it has come to our attention that Intel will make a big push towards DDR5 when the platform launches later this year. Intel is apparently already asking motherboard makers to avoid using DDR4 in combination with the upcoming 700-series chipsets and the only reason for this would be to speed up the transition to DDR5. According to various leaks and rumors we should expect to see support for DDR5 at 5600 MHz for Raptor Lake, which is at least a step in the right direction.

What this doesn't mean, is that Intel has removed support for DDR4 in the CPUs, as it's still very much present and is expected to work fine in 600-series chipset motherboards. As such, there shouldn't be any issues upgrading to a new CPU, at least not after a quick UEFI update. From our understanding, it's partially related to the fact that DDR4 and DDR5 motherboards have quite different UEFI code when it comes to the memory support and in turn it means that the board makers are going to end up spending a lot more time getting their boards working, as is already the case with the 600-series chipsets. We can sort of understand Intel's sentiment here, but we're also expecting to see some motherboards based on the 700-series chipsets with DDR4 support, least not from the likes of ASRock that has always liked to create non-conforming motherboards. However, this also looks like it's the end for DDR4 support from Intel, which wasn't entirely unexpected.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announces the release of Kingston FURY Impact DDR5 SODIMMs. Perfect for the gamer or PC enthusiast who want the latest cutting-edge performance from their laptop or small form factor machine.

Kingston FURY Impact DDR5 is fifty percent faster than DDR4 to provide a boost in gaming, rendering, and multitasking, while its low power consumption and increased efficiency keeps your system cool at 1.1 V. Available in Intel XMP 3.0 Certified SODIMM kit capacities up to 64 GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. With innovative Plug N Play overclocking technology and on-die ECC, it automatically supports DDR5-4800 at lower latencies than standard DDR5-4800. Thus, improving system performance without having to enable a profile and maintains data integrity while hitting extreme speeds.

Having been developing its brand in the consumer market and creating high-quality gaming products for many years, TEAMGROUP continues to heavily invest in R&D and design, and is now utilizing its strong product development capabilities and foresight to invest in the NFT (non-fungible token) market. With the expansion of NFT applications, TEAMGROUP is launching innovative limited edition digital card content, providing consumers around the world the joy of card collecting, and bringing an all-new type of value to its digital content. TEAMGROUP invites everyone to join together for creative, next-gen thinking in the Metaverse, leading gamers to a new era of collectibles in consumer electronics.

According to statistics provided by blockchain analysis company, Chainalysis, up until December 15th, 2021, US$40.9 billion has been invested in the smart contracts of developing global NFT. TEAMGROUP announced today that it is entering the NFT market through the world's largest NFT trading platform, OpenSea, with the release of its first limited edition TEAMGROUP NFT card. The design team has meticulously crafted its digital content to be highly collectible and to give players an exciting collecting experience. The product is not only unique in the virtual world but also an important asset in the future Metaverse. From digital art creation to venturing into the creative blockchain market, TEAMGROUP forges brand new paths, showing its determination and strength in technological innovation.

Acer today updated its popular Swift line of notebooks with new models of the Swift 5 and Swift 3. To push the limits of what's possible with a thin and light device, these new laptops come with 12th Gen Intel Core processors, gorgeous touchscreen displays, and all-day battery life: everything a mobile professional needs.

"Designed for executives and mobile professionals, the latest Acer Swift 5 offers a perfect balance of performance and portability," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The Intel Evo-verified laptop not only provides a great experience, it is housed in a stylish thin-and-light CNC-machined unibody chassis featuring a gorgeous touchscreen display." "Intel and Acer have a long history of co-engineering to deliver amazing laptops," said Josh Newman, VP and GM of Client Computing Group Mobile Innovation. "Now, more than ever, our engineers are focused on the experiences that matter most with the Intel Evo platform, powered by 12th Gen Intel Core processors."

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

Intel Xeon Scalable "Sapphire Rapids" is an upcoming enterprise processor with a CPU core count of up to 60. This core-count is achieved using four dies inter-connected using EMIB. Locuza, who leads social media with logic die annotation, posted one for "Sapphire Rapids," based on a high-resolution die-shot revealed by Intel in its ISSCC 2022 presentation.

Each of the four dies in "Sapphire Rapids" is a fully-fledged multi-core processor in its own right, complete with CPU cores, integrated northbridge, memory and PCIe interfaces, and other platform I/O. What brings four of these together is the use of five EMIB bridges per die. This allows CPU cores of a die to transparantly access the I/O and memory controlled any of the other dies transparently. Logically, "Sapphire Rapids" isn't unlike AMD "Naples," which uses IFOP (Infinity Fabric over package) to inter-connect four 8-core "Zeppelin" dies, but the effort here appears to be to minimize the latency arising from an on-package interconnect, toward a high-bandwidth, low-latency one that uses silicon bridges with high-density microscopic wiring between them (akin to an interposer).

AMD on Thursday unveiled its Ryzen 6000 series "Rembrandt" mobile processors. The company claims these chips offer generational increases in CPU performance, along with big leaps in energy-efficiency and integrated graphics performance. At the heart of these processors is the new 6 nm "Rembrandt" silicon that the company is building on the TSMC N6 silicon fabrication node that leverages EUV lithography.

The "Rembrandt" silicon broadly combines an 8-core/16-thread CPU based on the new Zen 3+ microarchitecture, a large new iGPU based on the RDNA2 graphics architecture, complete with real-time ray tracing support; a DDR5 + LPDDR5 memory controller, and a full PCI-Express Gen4 root-complex. The iGPU, memory interface, and PCIe interface are generational updates over the previous-gen "Cezanne," and it may seem like the CPU is largely unchanged, but AMD claims there are several optimizations that have gone into the CPU to earn the "+" tag.

Introducing the EVGA Z690 DARK K|NGP|N - The Motherboard Designed by and Used by Professional Overclockers. EVGA DARK motherboards blaze the trail for other boards to follow, and the Z690 DARK K|NGP|N is no exception. The ability to destroy world records is insignificant next to the power of a 21-phase VRM and a 10-layer PCB - capable of driving the most powerful 12th Gen Intel Core processors. With support for 64 GB of DDR5 memory at up to 6600 MHz+(OC), PCIe Gen5, and PCIe Gen4 M.2 NVMe SSDs, a new DARK age of overclocking will rise as quickly as new hardware becomes available. The Z690 DARK K|NGP|N is today's choice for the future of overclocking and gaming.

Out of nowhere, Micron has announced that it will end production of its Ballistix RAM products that are the high-performance and gamer focused RAM products from its Crucial brand. The details available so far doesn't state a reason for the discontinuation of these products. That said, Crucial has launched a wide range of DDR5 products, but so far none under the Ballistix brand and that is obviously a permanent move now. The company said it would focus on "the development of Micron's DDR5 client and server product roadmap, along with the expansion of the Crucial memory and storage product portfolio."

Furthermore the press release mentioned that "the company will continue to support the performance compute and gaming communities with its award-winning SSD products, such as the Crucial P5 Plus Gen 4 PCIe NVMe SSD, Crucial P2 Gen 3 NVMe SSD, and the popular Crucial X6 and Crucial X8 portable SSDs." It seems like Micron has decided to change the focus of it's consumer focused Crucial brand yet again, as the company has done several times in the past, but it's going to remove a major player in the consumer DRAM market, which isn't a good thing, especially as Micron was one of few DRAM manufacturers to offer high-end RAM modules, since neither Samsung or SK-Hynix is in this market. That said, it looks like Crucial will at least continue to offer its standard RAM modules, but they tend to follow JEDEC spec and aren't particularly exciting.

SMART Modular Technologies, Inc., a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new DDR5 32 GB Very Low Profile Registered Dual In-Line Memory Module (VLP RDIMM). SMART's new DuraMemory DDR5 32 GB VLP RDIMM is the industry's first DDR5 VLP RDIMM form factor.

The 32 GB VLP RDIMM addresses applications with space constraints, such as embedded 1U blade compute and storage, enterprise networking, telecom, and industrial single-board computers (SBCs). The space savings also equates to improved heat dissipation and energy savings, reducing business costs. The DDR5 32 GB VLP RDIMM is the newest addition to SMART's broad portfolio of VLP and ULP (Ultra Low Profile) modules that are suitable for all types of dense computing, storage, networking and telecom applications. For ruggedized and harsh operating conditions, SMART also offers retention clips to secure the socket latches in place, and industrial grade temperature operation of -40°C to +85°C.

Leading memory provider TEAMGROUP has released a variety of DDR5 memory and applied its advanced R&D capabilities to conduct Intel XMP3.0 certification testing for its next-gen memory modules. After rigorous testing of ASRock, ASUS, Biostar, GIGABYTE and MSI motherboards with Intel processors, TEAMGROUP announced today that all of its T-FORCE DDR5 gaming memory have received Intel XMP3.0 certification, ensuring that gamers can enhance the performance of their processors using T-FORCE's overclockable DDR5 memory. With just an easy single click, users will be able to fully experience the incredible performance of T-FORCE gaming memory with XMP's easy-to-use overclocking profiles.

TEAMGROUP's DDR5 product series strictly uses high-quality, specially selected ICs to provide gamers with stable and compatible memory. Its T-FORCE overclocking memory modules have all passed XMP3.0 certification tests, including frequencies of 4,800 MHz, 5,200 MHz, 6,000 MHz, 6,200 MHz and 6,400 MHz, making T-FORCE the DDR5 memory brand with the most specification variety under Intel's XMP 3.0 certifications. To meet the demand for high-frequency, low-latency overclocking, TEAMGROUP created a proprietary DDR5 thermal module that enables T-FORCE DDR5 memory to operate smoothly and stably when overclocked to its very limits.

Thermaltake, officially announces the worldwide availability of TOUGHRAM RC DDR5 Memory. This series is the first DDR5 memory of Thermaltake's RAM collection, which comes in frequencies of 4800 MHz, 5200 MHz and 5600 MHz and with capacities of 32 GB (16 GB x2), offering enhanced performance. Thermaltake TOUGHRAM RC DDR5 4800 MHz is available now, followed by the 5200 MHz and 5600 MHz on March 3rd.

Being compatible with mainstream hardware and the latest AMD and Intel motherboards, the new DDR5 series comes with higher capacities, faster speeds and better performance than the previous generation. The TOUGHRAM RC DDR5 Memory has been through rigorous tests to select tightly-screened ICs, and features a built-in Power Management IC (PMIC) to enhance power supply stability; Additionally, the on-die error correction code (ECC) allows memory modules to correct errors automatically, further improving overall stability and reliability. With its doubled bank group architecture, the new TOUGHRAM RC DDR5 enhances access availability and brings you higher capacities without lag, leading the way to next-gen memory. What's more, the latest TOUGHRAM RC DDR5 Memory is compatible with Thermaltake's CPU and memory AIO cooler series, such as Floe RC and Floe RC Ultra Series, providing users more flexibility when it comes to matching PC builds.

Intel's next-generation Xeon processors code-named Sapphire Rapids are on track to hit the market this year. These new processors are supposed to bring a wide array of new and improved features and a chance for Intel to show off its 10 nm SuperFin manufacturing process in the server market. Thanks to the Twitter user YuuKi_AnS, we have some of the first tests run in AIDA64 and Cinebench R15 benchmark suites. Yuuki managed to get ahold of DDR5-enabled Sapphire Rapids Xeon with 48 cores and 96 threads, equipped with a base frequency of 2.3 GHz and boost speeds of 3.3 GHz. The processor tested was an engineering sample with a Q-SPEC designation of "QYFQ" and made for Intel Socket E (LGA-4677). This CPU sample was locked at 270 Watt TDP.

Below, you can see the performance results of this processor, tested in the AIDA64 cache and memory benchmark and Cinebench R15 bench test. There is a comparison between AMD's Milan-X and Xeon Platinum 8380, so the numbers are more in check of what you can expect from the final product.

As Intel launched the 12th Gen Core processors and immediately gained lots of attention, MSI also released many motherboards for various usages. However, the best has yet to come until now. Today, the last member of the Z690 platform is here. The one board to rule them all - MEG Z690 GODLIKE. GODLIKE's number one goal for the end-users is evident, designed for the best performance and experience enabled by truly remarkable systems. Whether it's record-breaking overclocking, ultra-customization of ARGB lighting with touch control LCD dashboard, or simply the desire to build the most powerful system imaginable, the MEG Z690 GODLIKE stands unrivaled at the pinnacle of all the Z690 motherboard capabilities.

It is covered in dark, deep, and full aluminium heatsink fashioned with a triangular grid pattern. The illuminating dragon nebula with tempered glass reveals the power with a column of faith and meteor RGB effect. The MEG Z690 GODLIKE symbolizes the endless power of the one universe, ready for every challenge.

We recently reported on the DDR5-8888 CL88 Overclocking world record set by G.Skill, ASUS, and overclocker "lupin_no_musume" using G.Skill Trident Z5 DDR5 memory on an ASUS ROG Maximus Z690 APEX motherboard. This same overclocker has now set a new record using the same memory and motherboard combination achieving a speed of 4779.7 MHz (9560 MT/s) at 120-120-120-120-127-2 timings using liquid nitrogen cooling. The record was set with a single 16 GB Trident Z5 DDR5 memory module paired with an Intel Core i9-12900K processor.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce the launch of an extremely low-latency, high-speed DDR5-6400 CL32 32 GB (2x16 GB) memory kit under the Trident Z5 family memory series, designed for the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards.

Dedicated to developing ever-faster memory modules, G.SKILL is launching an ultra-low latency DDR5-6400 CL32-39-39-102 memory kit at 1.40 V with 32 GB (2x16 GB) kit capacity. Equipped with exceptionally tight timings, this extreme memory specification represents the next step of the Trident Z5 family flagship performance. The screenshot below shows this memory kit validated on the Intel Core i7-12700K processor and ASUS ROG Maximus Z690 Hero motherboard. The DDR5-6400 CL32 32 GB (2x16 GB) memory kits under the Trident Z5 and Trident Z5 RGB series is available now via G.SKILL worldwide distribution partners.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the achievement of a new overclocking world record for fastest memory frequency at DDR5-8888 CL88-88-88-88, in cooperation with ASUS. This amazing frequency speed was achieved by the extreme overclocker "lupin_no_musume" with G.SKILL Trident Z5 DDR5 memory, ASUS ROG Maximus Z690 APEX motherboard, and Intel Core i9-12900K processor. To see the moment this amazing overclocking world record was set, please click the following video link: https://youtu.be/OgQFbUOs6i8

DDR5-8888 CL88-88-88-88 - Pushing the Speed to the Limit
At the dawn of the DDR5 era, G.SKILL and ASUS have been constantly exploring the memory speed limitations of the latest Intel Z690 platform. Surpassing the previous DDR5-8704 world record in November 2021, a new memory frequency world record is achieved at DDR5-8888 under liquid nitrogen extreme cooling. The memory speed has been validated by CPU-Z. Please refer to the screenshot and validation link below: https://valid.x86.fr/qgvylc

Introducing the EVGA Z690 CLASSIFIED - The latest addition to EVGA's most-respected line of motherboards. This motherboard fully supports the latest 12th Gen Intel Core Series Processors and takes full advantage of PCIe Gen5 and PCIe Gen4 M.2 NVMe SSDs. The EVGA Z690 CLASSIFIED provides unbeatable power, performance and stability via a 19-phase VRM and 10-layer PCB. Moreover, this board supports up to 128 GB of DDR5 memory, 2x 2.5 Gbps NIC + Wi-Fi 6E / BT 5.2, 7.1 HD audio, and multiple USB options. The EVGA Z690 CLASSIFIED is designed for nothing less than the ultimate gaming experience.