Transcend, has announced its new-generation DDR5 DRAM modules targeting business and personal computers. In compliance with the JEDEC standards, Transcend's DDR5 memory modules take speed, capacity, and reliability even further, bringing ground-breaking performance to metaverse, high performance computing (HPC), and virtual economy.

The DDR5 module starts its speed at 4800 MT/s, a 50% increase compared to its predecessor, while the DDR4 is at 3200 MT/s. Its strengths lie not only in its high bandwidth, but low power consumption, because the operating voltage has dropped from 1.2 V to 1.1 V, which effectively enhances the overall power efficiency. The DDR5 is also equipped with the on-module Power Management IC, which allows for better control of system power and a higher signal integrity. Meanwhile, the on-die ECC mechanism pushes the system reliability to a new level for computing-intensive applications.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new kits of its acclaimed DOMINATOR PLATINUM RGB DDR5 high-performance memory, now boasting speeds up to a screaming-fast 6,600MT/s. At time of writing, these are the fastest DDR5 kits available to buy in the world, achieving remarkably tight timings of 32-39-39-76. Available in kits of 2x16 GB, DOMINATOR PLATINUM RGB continues to break frequency barriers with unprecedented speeds, and stay on the cutting-edge of performance.

The frequency ceiling for DDR5 performance has risen again on CORSAIR's flagship DRAM, joining high-frequency DOMINATOR PLATINUM RGB offerings of DDR5-6000, DDR5-6200, and DDR5-6400. With 6,600 MHz, DOMINATOR PLATINUM RGB memory now clocks phenomenal speeds on systems leveraging 12th Generation Intel Core processors and Intel Z690 motherboard chipsets, such as the ASUS ROG STRIX Z690-F and ROG MAXIMUS Z690 HERO. With a speedy 32 CAS timing and tight 32-39-39-76 overall timings on these new modules, DOMINATOR PLATINUM RGB pushes the envelope of enthusiast DRAM performance.

Biostar is seemingly trying to become more competitive in the consumer motherboard market and although the company has some catching up to do with the tier one motherboard brands, the company has put out some more interesting products in the past couple of years. Its VX670E Valkyrie motherboard seems to sit near the middle of the X670E models that have been announced so far, although it's a little bit hard to tell, as the company only provided partial specs. As this is an AMD X670E based board, the PCIe x16 slot is using PCIe 5.0, although it's multiplexed with the second x16 slot, which means if both slots are used, the bandwidth drops down to eight lanes per slot. The board layout doesn't suggest any PCIe 5.0 M.2 slots, but as this is mandatory on X670E board, we have to presume that the M.2 slot right below the x16 PCIe slot, is the PCIe 5.0 one. The board has a further three M.2 slots, as well as what appears to be an empty M.2 E-keyed slot for a WiFi/Bluetooth module.

Other features listed by Biostar includes 2.5 Gbps Ethernet via a Realtek chip, HDMI and DisplayPort outputs, six SATA 3 ports, one rear and one front header for USB Type-C Gen 3.2 2x2 (20 Gbps) ports, as well as Realtek based audio and a pair of ARGB headers. The board also has a debug LED and a few buttons and switches for resetting the CMOS, and powering the board on. Interestingly, Biostar also provided figures for the memory clock speed, as the company listed support for up to four sticks of DDR5 memory at 5600 MHz plus. AMD has already demoed higher memory clocks of 6000 and even 6400 MHz during its keynote, as supported by the footnotes that went alongside it, suggesting that this might just be a placeholder. Intel officially only supports 4800 MHz DDR5 memory, but speeds in excess of 6000 MHz doesn't appear to be an issue with the right motherboard and CPU combination. We'll have to wait and see what the official figures will be from AMD.

To usher in the new era of DDR5 and satisfy the demands for precise, high-performance, real-time computing, and computer multi-tasking in servers, data centers, and industrial computers, the world-leading memory brand TEAMGROUP is officially announcing today that TEAMGROUP's DDR5 Industrial Server Memory is now in mass production. The DDR5 Industrial Server Memory targets applications in high-end servers and large databases and is integrated with TEAMGROUP's patented technology, welcoming a total upgrade for next-generational servers such as Intel Eagle Stream and AMD Zen 4 Genoa.

TEAMGROUP's DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules can reach speeds of up to 6400MT/s and storage capacities of up to 128 GB, with total energy consumption reduced to 1.1 V. TEAMGROUP has also introduced Row Hammer Protection Technology to support the DFE (Decision Feedback Equalization) function to offer robust support for data storage. The memory is equipped with TEAMGROUP's patented "TRUST technology", which stands for Temperature, Robust, Unique, S.M.A.R.T. technology, and Trusty. With the TRUST technology, the industrial server memory can ensure reliable performance under harsh environments of high temperatures, high humidity, sulfurization, vibration, and shock as well as improving the overall reliability and durability of the product to guarantee that the memory can satisfy the diversified demands of next-gen servers. In addition, the DDR5 Industrial Server Memory has adopted a brand new framework. The greatest difference between the DDR5 and DDR4 server memories is that the power management is now transferred onto the DIMM, in other words, TEAMGROUP has optimized redundant circuit designs on the server, providing its DDR5 products a greater system stability, lower power consumption, better performances, larger capacities, and more stable signals.

addlink Technology Co., Ltd, a global storage and memory solution provider, is proud to host its virtual expo from May 25th to June 30th and addlink is also launching the brand new DDR5 RGB gaming memory, AddGame SPIDER X5, DDR5-4800, 5600, and DDR5-6000. addlink Online Virtual Showcase 2022 has three major themes: AddGame SPIDER X5/S5 DDR5 Gaming Memory, AddGame A-Series M.2 PCIe Gen4x4 SSD for Sony PS5, and Micro SDXC U3 A2 card for Nintendo Switch. Addlink is excited to bring these products to the forefront for attendees to experience virtually.

The brand new AddGame Spider X5 delivers with speeds at 4800 MHz, 5600 MHz, and 6000 MHz. They are not only equipped with the Highest-Quality DDR5 components but also tested under the most stringent conditions. Spider X5 features a large lighting strip with dynamic multi-zone RGB lighting that is gorgeous and smooth. The RGB lighting can be configured and synced perfectly by motherboards from ASUS, GIGABYTE, MSI, and ASRock. The exclusive black Spider totem with a high-quality aluminium heatsink enables a more efficient heat dissipation.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the release of Kingston FURY Beast DDR5 RGB memory. The Kingston FURY Beast family boasts the first DDR5 module used to break 10,000MT/s, this latest addition to the portfolio features enhanced RGB lighting effects with a new heatspreader design that provides bright and smooth illumination.

Kingston FURY Beast DDR5 RGB is the perfect solution to customise the style of next-generation DDR5 systems. Intel XMP 3.0-Ready and Certified, and qualified by the world's leading motherboard manufacturers, Kingston FURY Beast DDR5 RGB lets users build with confidence. With Kingston FURY CTRL2 software, users can choose from a library of preset patterns and effects. Alternatively, users can customise the smooth and vibrant RGB effects to make their system completely unique. All Kingston FURY Beast DDR5 RGB modules feature the patented Kingston FURY Infrared Sync Technology, which keeps the lighting effects in perfect lockstep.

Thanks to the excellent R&D capabilities of T-FORCE LAB, global memory leader TEAMGROUP is proud to announce the release of two new specification upgrades of T-FORCE DELTA RGB DDR5 Gaming Memory. The overclocking RAM comes in a high-speed variant clocking in at 6,600 MHz and a low-latency variant rated at 6,000 MHz CL30. Samples have been sent to major motherboard manufacturers for verification testing. Through continuous improvements in product design and R&D capabilities, TEAMGROUP is able to deliver the ultimate high-performance experience to gamers and overclocking enthusiasts around the world pursuing the best of the best.

With the maturation of DDR5 platform development, the T-FORCE DELTA RGB DDR5 Gaming Memory has undergone a revolutionary upgrade. DELTA RGB DDR5 offers two additional spec options: a DDR5-6600 CL34 2X16GB kit and a DDR5-6000 CL30 2X16GB kit. Each module is equipped with a power management chip and carefully selected high-quality ICs to provide superior system performance and stable computing. It'll fully satisfy any gamer seeking top-notch overclocking performance and buttery-smooth gaming experiences. The DELTA RGB DDR5 features the iconic 120°wide-angle RGB heatspreader with smart RGB control support. The DDR5's exclusive thermal module is combined with dazzling aluminium alloy heat sinks and a special cooling silicone, giving gamers and overclockers unparalleled thermal performance and stability as well as a visually-pleasing environment while gaming.

Amazon's AWS division has been making Graviton processors for a few years now, and the company recently announced its Graviton3 design will soon to available in the cloud. Today, we are witnessing a full launch of the Graviton3 CPUs with the first instances available in the AWS Cloud. In theC7g instances, AWS customers can now scale their workloads across 1-64 vCPU instance variants. Graviton3's 64 cores run at 2.6 GHz clock speed, 300 GB/sec maximum memory bandwidth, DDR5 memory controller, 64 cores, seven silicon die chiplet-based design, 256-bit SVE (Scalable Vector Extension), all across 55 billion transistors. Paired with up to 128 GiB of DDR5 memory, these processors are compute-intensive solutions. AWS noted that the company used a monolithic computing and memory controller logic design to reduce latency and improve performance.

One interesting thing to note is the motherboard that AWS hosts Graviton3 processors in. Usually, server motherboards can be single, dual, or quad-socket solutions. However, AWS decided to implement a unique solution with three sockets. This tri-socket setup is designed to see each CPU as an independent processor, managed by a Nitro Card, which can handle exactly three CPUs. The company notes that the CPU is now in general availability with C7g instances and you can see it below.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

As Computex 2022 is largely an online event, MSI announced its upcoming AMD X670 and X670E boards shortly after AMD's keynote earlier today. Although the official press release didn't go into too many details, VideoCardz got their hands on more detailed information from MSI, which also brings some additional clarity to the platform as a whole. The most interesting slide is the one that lists the AM5 CPU's as having 28 PCIe 5.0 lanes, rather than the 24 PCIe lanes AMD mentioned in its presentation. This makes sense based on the fact that some X670/E boards have multiple PCIe 5.0 M.2 slots for NVMe drives. MSI's X670E Godlike and X670E Ace even feature three PCIe 5.0 x16 slots, although it's likely that this is in a x8/x8/x4 configuration, as these boards only have a single PCIe 5.0 M.2 slot. The same slide also mentions that all Raphael based CPUs will have support for HDMI 2.1 as well as DisplayPort 2.0, which will also work over USB Type-C Alt Mode. Interestingly it seems like not all AM5 CPUs will support DisplayPort 2.0, based on a footnote from MSI.

Other interesting titbits include a minimum CMOS chip size of 32 MB, which hopefully means we won't be seeing a repeat of the issue that the AM4 platform had, where AMD ran out of space for the AGESA, which led to multiple UEFI versions depending on the CPU used with the board. As far as MSI specific features goes, at least the high-end models will be getting eight to 10 layer PCBs and MSI will offer up to 24+2 power phases with improved heatsinks. MSI is also promising 60 W USB PD support for the front USB-C header. Just like ASUS, MSI will also offer an add-in card for more M.2 NVMe drives and MSI calls it the Xpander-Z Gen5 Dual. A common feature among all four boards is that they'll feature AMD's RZ616 WiFi 6E module, which is technically a MediaTek solution.

GeIL, is excited to announce the market launch of its EVO V DDR5 RGB Hardcore Gaming Memory kits providing high-frequency modules ranging from 4800 MHz to 6600 MHz and available in large kit capacities of 32 GB to 64 GB. The unique heatspreader design features active cooling and fascinating RGB lighting effects and is available in titanium gray or glacier white color themes.

GeIL EVO V DDR5 RGB Hardcore Gaming Memory offers unparalleled memory performance and stability to meet the intensive demand of hardcore gamers and overclockers across Intel's latest platforms. GeIL has crafted a break-through cooling solution for EVO V modules that integrates a stunning RGB light bar and two micro cooling fans into a single molded aluminium heatshield. Most importantly, the physical height of the heatspreader allows it to be compatible with most CPU coolers on the market without any mechanical interference.

Acer today announced new models in its professional line of ConceptD creator PCs. The ConceptD 5 laptop, ConceptD 500 mini workstation and ConceptD 100 small form factor desktop now include the latest 12th Gen Intel Core processors and NVIDIA GPUs, while the ConceptD 5 laptop now offers a 16-inch OLED display option. ConceptD PCs are designed and optimized for graphic designers, filmmakers, engineers, architects, developers and other creators. They feature top-of-the-line technology housed in a timeless design aesthetic.

The powerful ConceptD 5 and ConceptD 5 Pro creator laptops for mobile professionals are ideal for those who need the ability to create or edit work on the go. Less than an inch in height, their sophisticated and durable metal design makes them easy to take on the road. Designed to handle large, complex CAD modeling and advanced digital content creation, they smoothly render up to 6K-resolution videos, effortlessly process 3D animations, and deliver the best encoding and image quality for livestreaming.

Lexar, is excited to announce the launch of the new Lexar ARES DDR5 OC Desktop Memory and ARES DDR4 RGB Desktop Memory. ARES DDR5 OC Memory is designed for PC enthusiasts, gamers, overclockers and creatives while optimized on the latest Intel Core processor. ARES DDR4 RGB Memory enhances your PC with vibrant RGB lighting and blazing-fast DDR4 overclocked performance for an elevated gaming experience.

The Lexar ARES DDR5 OC Desktop Memory leverages next-gen DDR5 technology designed for the latest Intel Core processors platform and supports Intel XMP 3.02. With speeds of 5200, it provides more than 1.6x the bandwidth than that of DDR4. So whether you're operating speed-demanding video games, video editing software, or processing intensive workloads, the Lexar ARES DDR5 OC Memory enables you to experience superior DDR5 performance.

Tachyum today launched the world's first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.

After the company undertook its mission to conquer the processor performance plateau in nanometer-class chips and the systems they power, Tachyum has succeeded by launching its first commercial product. The Prodigy Cloud/AI/HPC supercomputer processor chip offers 4x the performance of the fastest Xeon, has 3x more raw performance than NVIDIA's H100 on HPC and has 6x more raw performance on AI training and inference workloads, and up to 10x performance at the same power. Prodigy is poised to overcome the challenges of increasing data center power consumption, low server utilization and stalled performance scaling.

Lenovo announced today its latest generation of stylish and savage gaming laptops: the Lenovo Legion 7i and 7 (16", 7) portable powerhouses, and the thin and light Lenovo Legion Slim 7 and 7i (16", 7) laptops. Sitting at the apex of gaming performance, the new Lenovo Legion 7i and 7 are now the world's most powerful 16-inch gaming laptops. And joining the 16-inch QHD gaming category are Lenovo Legion's thinnest and lightest gaming laptops yet - the new Lenovo Legion Slim 7i and 7 - now available in a taller 16:10 display for when productivity meets play. The new Lenovo Legion 7 series laptops exceed expectations with a number of innovation firsts that adapt to and balance the multi-dimensional needs of modern gamers and professional players. These new devices not only have the world's largest battery capacity on a 16-inch gaming laptop, they also reign as the world's first 16-inch gaming laptops with FHD webcams for better streaming, and as the first 16-inch WQXGA (2560×1600) gaming laptops. The Windows 11 laptops' minimalist design, long battery life, and whisper-quiet artificial intelligence (A.I.) tuned thermals are purpose-built for those who want performance and mobility.

"Lenovo Legion has always occupied a place at the pinnacle of gaming performance, complementing gamers' personal and professional lives to adapt to wherever they go, whether it's a tournament stadium, classroom, or boardroom," said Ouyang Jun, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "More stylish and savage than ever before, Lenovo's new Legion 7 series laptops are leveling up to push the limits of smarter, high-performance gaming."

AMD is planning a massive integrated graphics performance uplift for its next-generation Ryzen 7000U mobile processors. Codenamed "Phoenix," this SoC will feature a CPU based on the "Zen 4" microarchitecture with a higher CPU core count than the Intel alternative of the time; and an iGPU based on the RDNA3 graphics architecture. AMD is planning to endow this with the right combination of a CU count and engine clocks, to result in performance that roughly matches the NVIDIA GeForce RTX 3060 Laptop GPU, a popular performance-segment discrete GPU for notebooks, according to greymon55. Other highlights of "Phoenix" include a DDR5 + LPDDR5 memory interface, and PCI-Express Gen 5. The SoC is expected to be built on the TSMC N5 (5 nm) process, and debut in 2023.

Samsung Electronics, the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems. Since introducing the industry's first CXL DRAM prototype with a field-programmable gate array (FPGA) controller in May 2021, Samsung has been working closely with data center, enterprise server and chipset companies to develop an improved, customizable CXL device.

The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512 GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering. "CXL DRAM will become a critical turning point for future computing structures by substantially advancing artificial intelligence (AI) and big data services, as we aggressively expand its usage in next-generation memory architectures including software-defined memory (SDM)," said Cheolmin Park, Vice President of Memory Global Sales & Marketing at Samsung Electronics, and Director of the CXL Consortium. "Samsung will continue to collaborate across the industry to develop and standardize CXL memory solutions, while fostering an increasingly solid ecosystem."

Montage Technology, a leading data processing and interconnect IC design company, today announced it is now producing its 5600 MT/s 2nd-generation DDR5 RCD (RCD02) chip to support memory module vendors to enable the DDR5-5600 ecosystem. The new device is targeted for demanding applications such as next-generation servers, edge computing, and AI. The RCD02 is compliant with the latest JEDEC DDR5RCD02 specification. Compared with the 1st-generation RCD (RCD01), the RCD02 boosts DDR5 data rate by 16.67%. The RCD02 chip adopts dual-channel memory architecture, supports 1.1 V VDD and 1.0 V VDDIO voltages and several power saving modes, thus enabling a great reduction in power consumption.

In addition to providing industry-leading performance, power efficiency and reliability at the device level, Montage's DDR5 RCD02 solution supports CA, CS and DFE training modes, dual frequency, as well as other advanced features to facilitate the higher speed for the next generation DDR5 platform.
"An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, is fueling the development of the next-generation memory," said Montage Technology's President, Stephen Tai. "Montage is delighted to be the first in the industry to successfully produce the DDR5 RCD02 chip to help meet the ever-increasing demand for memory bandwidth."

PNY released the top-spec model of the XLR8 MAKO RGB series, with the XLR8 DDR5-6000 MAKO RGB. Designed for enthusiast PC builds, the memory modules are characterized by an aluminium heatspreader crowned by a frost-white lighting diffuser with addressable-RGB LEDs underneath, dubbed EPIC-X RGB lighting. Available in 16 GB single-module and 32 GB two-module kits, these sticks pack an Intel XMP 3.0 profile that runs them at DDR5-6000 (PC5-48000) with CL38 latency, and 1.3 V module voltage. The company didn't reveal pricing.

On Tuesday and Wednesday next week, Intel will host its Intel Vision event which will take a look at what the company will bring in the near future. Although not specified in the program, VideoCardz have managed to secure a slide listing no less than seven new Alder Lake-HX mobile CPUs that Intel are expected to reveal during the event. The new chips will be fully loaded out with eight performance and eight efficient cores and with a total of 24 threads at the top-end, i.e. the same as Intel's current desktop parts. In fact, according to VideoCardz, these CPUs are the same physical size as the desktop CPUs, just in a different packaging that reduces the Z-height.

Alder Lake-HX comes with a base power TDP of 55 W and is said to be a new enthusiast CPU range from Intel in the mobile space. As such, overclocking is said to be allowed, which can push the turbo TDP to at least 157 W and this applies to all the CPUs in the Alder Lake-HX family. The platform is also said to feature a full set of PCIe lanes, which means 16 PCIe 5.0 lanes, 20 PCIe 4.0 lanes and 12 PCIe 3.0 lanes. DDR5 memory with XMP 3.0 profiles is also supported, alongside something called Dynamic Memory Boost. Oddly enough, Intel has even made several vPro SKU's that support overclocking, albeit with some kind of limit compared to the non vPro SKUs. It'll be interesting to see what kind of notebooks these CPUs will be going into and what kind of cooling systems will be required, but it's pretty obvious we're talking desktop replacement machines.

Montage Technology, a leading data processing and interconnect IC design company, today announced that it has delivered the world's first Compute Express Link (CXL ) Memory eXpander Controller (MXC). The device is designed to be used in Add-in Cards (AIC), Backplanes or EDSFF memory modules to enable significant scaling of memory capacity and bandwidth for data-intensive applications such as high-performance computing (HPC) and artificial intelligence (AI). The MXC is a Type 3 CXL DRAM memory controller. The MXC supports and is compliant with both DDR4 & DDR5 JEDEC standards. It is also designed to the CXL 2.0 specification and supports PCIe 5.0 specification speeds. The MXC provides high-bandwidth and low-latency interconnect between the CPU and the CXL-based devices, allowing them to share memory for higher performance, reduced software stack complexity, and lower data center TCO.

Montage Technology's President, Stephen Tai said, "CXL is a key technology that enables innovative ways to do memory expansion and pooling which will play an important role in next-generation server platforms. I'm very excited that Montage is the first company in the industry to successfully deliver the MXC chip, which signals we are making a critical step towards advancing the CXL interconnect technology to the memory market." CXL Consortium's President, Siamak Tavallaei said, "The CXL Consortium is excited to see continued CXL specification adoption to enable technologies and solutions such as the CXL DRAM Memory eXpander Controller." Montage Technology is working closely with industry-leading memory manufacturers to deliver advanced memory products based on the CXL MXC and help develop a robust memory ecosystem around CXL.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today Z690 AORUS TACHYON motherboard with the latest 12th generation Intel Core i9 12900K processor and LN2 liquid nitrogen heat dissipation set the world-leading overclocking records of DDR5 -10022, which verified by HWBOT. GIGABYTE Z690 AORUS TACHYON motherboard designed by world-famous overclocker equips with plenty functions exclusively for extreme overclockers, which promise overclockers higher scores with easier operation, establishing GIGABYTE's leading role in overclocking on the Z690 motherboards.

This DDR5 world record set by GIGABYTE Z690 AORUS TACHYON has been validated by HWBOT—the world famous overclocking records verification website, which indicates that overclocker HiCookie has set the leading record at 5011 MHz (DDR5-10022) using single DDR5 AORUS RGB memory stick with core i9 12900K on his self-designed Z690 AORUS TACHYON motherboard in the DDR5 memory overclocking competition.

AMD has confirmed its revamped APU strategy will be delivered throughout three different APU line-ups come 2023. While Raphael will take care of AMD's hopes in the desktop space, the company is readying a new, "Dragon Range" lineup of "pinnacle gaming"-oriented APUs, leveraging the company's upcoming Zen 4 architecture, DDR5, and PCIe 5. Dragon Range APUs will feature the "highest core, thread, and cache ever for a mobile gaming CPU" - although AMD stopped just short of confirming exactly what "highest" translates to. To aid in its extreme gaming aspirations, TDP for Dragon Range is set at 55 W - they thus "largely exist in the space where gaming laptops are plugged in the majority of the time," according to AMD director of technical marketing Robert Hallock.

Another APU family, Phoenix, will be aimed at thin and lights with a penchant for gaming. Phoenix too will leverage AMD's Zen 4 core, DDR5 memory subsystem, and PCIe 5 interfaces. Being aimed at thin and lights, Phoenix APUs are set for a 35 W - 45 W operating range. Interestingly, AMD didn't share any other details - more crucially, the graphics architecture that's to be employed in these high-performance APUs.

Razer, the world's leading lifestyle brand for gamers, announces a brand-new model of the Razer Blade 15 featuring an OLED QHD 240 Hz display will soon be available for purchase. This never-before-seen panel brings brighter, more vivid colors to life at e-sports-level speeds like no other laptop today. Paired with a 12th gen Intel ️ Core i9-12900H processor and an NVIDIA ️ RTX 3070 Ti laptop graphics card, the new Blade 15 stakes ground as an easy choice for both gamers and creators alike.

Both games and video content move swiftly thanks to the panel's ultrafast 1 ms response time, freeing users from the decision of color-accuracy or speed. The unique new OLED display will reach a typical 400 nits brightness and include up to 100% DCI-P3 colors for a crisp, clean picture perfect for a variety of functions, including photo and video editing, watching movies or playing AAA gaming titles.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the launch of Ripjaws DDR5 SO-DIMM memory kits for laptops and small form factor PC systems, with available memory speeds up to DDR5-5200 or kit capacity up to 64 GB (32 GB x2).

Built with specially screened IC chips and hand-tested with G.SKILL's rigorous and highly selective binning process, each Ripjaws DDR5 SO-DIMM memory kit is constructed for high performance and reliability. Shaping the industry standard for memory performance, G.SKILL is launching low-latency specifications with the Ripjaws DDR5 SO-DIMM memory series, including DDR5-4800 CL34-34-34-76 and DDR5-5200 CL38-38-38-83. For a list of specifications at launch, please see the chart below.