Chinese memory giant CXMT is reportedly facing difficulties with HBM3 production, according to South Korean media. Late last month, it was revealed that CXMT had begun risk production of HBM3E memory, lagging two generations behind Samsung, SK hynix, and Micron, who are already progressing with HBM4E sampling. At that time, it was known that the company was conducting HBM3E risk production in limited runs, but details were scarce. However, today we learn that three out of four HBM3E stacks are defective, indicating that CXMT currently operates at a 25% yield. Stacking DRAM is a complex task, as the technology required is much more intricate than planar DRAM manufacturing, an area where CXMT reportedly excels.

The low yields are reportedly due to the immaturity of the through-silicon via (TSV) technology that CXMT employs. In front-end manufacturing, CXMT achieves around 30% yields, while back-end processing yields about 70% on top of the original 30%. For instance, Samsung uses about 5,000 TSVs per layer on HBM2, and SK hynix uses more than 8,000 TSVs per layer on its HBM3. However, data suggests that CXMT is attempting to achieve HBM3E with only 3,000 TSVs per layer and is trying to pack 8 layers in the regular 8-Hi HBM3E configuration. Given these challenges, the company is unlikely to transition to a higher-capacity 12-Hi HBM in the near term as it addresses engineering challenges.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, is excited to announce the launch of the new Trident Z5 Royal NeoX series DDR5 memory, featuring "AMD EXPO Technology: Featuring Ultra Low Latency", with specifications ranging from DDR5-6000 CL36 to DDR5-6000 CL26. Building on G.SKILL's long-standing dedication to memory overclocking and high-performance memory, the Trident Z5 Royal NeoX series DDR5 is a flagship masterpiece that merges luxury craftsmanship with overclock performance hardware. Supporting the latest AMD EXPO Technology: Featuring Ultra Low Latency, also known as AMD EXPO-ULL, the Trident Z5 Royal NeoX series overclock profile leverages fine-tuned memory sub-timings for advanced performance with supported AMD CPU, motherboard, and BIOS version.

"AMD EXPO Technology: Featuring Ultra Low Latency" is the newly announced memory overclocking technology released by AMD. Compared to existing G.SKILL DDR5 memory kits that include AMD EXPO support, the new Trident Z5 Royal NeoX series come with AMD EXPO-ULL that includes multiple extra-tuned memory sub-timing settings in the overclocking profile, which help deliver better latency performance at the same memory speed. PC enthusiasts can experience the enhanced performance by enabling the AMD EXPO-ULL memory overclock profile on a system with compatible AMD CPU, motherboard, and supported BIOS version.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today announced the new TVS-hx77AX enterprise hybrid ZFS NAS series. Comprising the 16-bay TVS-h1677AX, 12-bay TVS-h1277AX, and 8-bay TVS-h877AX, this lineup is powered by AMD Ryzen 7000 series processors and DDR5 memory. Featuring native NFS over RDMA support, the series is engineered for high-load AI model training, virtualization, and 4K video collaboration, setting a new performance benchmark for desktop NAS form factors.

Compute Core: Zen 4 Architecture and DDR5 Synergy
Powered by AMD Ryzen 7000 series processors based on the cutting-edge Zen 4 architecture, the TVS-hx77AX series delivers a significant boost in Instructions Per Clock (IPC) performance. Paired with up to 192 GB of DDR5 memory (ECC optional), the NAS effortlessly handles concurrent virtual machines (VMs), containerized application development, and high-throughput data decompression workloads.

SK hynix is shifting much of its capacity to the latest 1c DRAM node, according to recent reports. The South Korean giant is transitioning the bulk of its memory production between nodes, and as DRAM technology advances, the company is moving its production to more advanced 10 nm-class nodes. For SK hynix, the sixth-generation 10 nm class 1c DRAM node accounted for 10% of production in Q1 2026, with an increase to about 13% in Q2. In the current third quarter, the company is expected to manufacture 24% of its DRAM on 1c, while Q4 will see more than a third (34%) produced on that node. By Q1 2027, the 1c node will account for around 35%, making the fifth-generation 10 nm-class 1b node at 33%, officially SK hynix's most dominant node.

As a reminder, DRAM nodes are not the same as conventional logic nodes. DRAM manufacturers use variations of 10 nm and scale them with more EUV layers or advanced features. For SK hynix, the currently dominant 1b node is around 12-13 nm in actual design and involves about 4 layers of EUV patterning, while the most advanced 1c node shrinks to 11-12 nm with 5-6 layers of EUV. SK hynix will use the 1c node to manufacture HBM4E, LPDDR6, and DDR5 memory. For the older 1b node, SK hynix produces DDR5, LPDDR5X, HBM3E, and HBM4.

TrendForce's latest findings on the memory industry reveal that sharp rises in traditional DRAM contract prices have led to a 59.5% QoQ increase in total DRAM industry revenue, reaching nearly US$154.73 billion in 2Q26.

Growing demand for AI servers, fueled by expanding LLM training and AI inference, has driven higher shipments of HBM3e, LPDDR5X, and high-capacity RDIMMS. The surge in agentic AI applications is further boosting RDIMM demand across various capacities.

At IFA 2026 in Berlin, we visited the ADATA booth to see what the company has in store. To many, the surprising factor is the introduction of the relatively new "TRUSTA" brand by ADATA, which focuses on enterprise and industrial product offerings, a departure from what traditional PC enthusiasts know about ADATA. First, we explored the TRUSTA brand to see what the company offers. This includes the T7P5 SSDs, which boast read speeds of 13.5 GB/s and write speeds of 10.3 GB/s, and come in capacities ranging from 1.6 TB to 7.68 TB. All of this is powered by 3D NAND Flash using eTLC architecture, with the SSD form factors including U.2, E1.S, and E3.S versions, all carrying the same PCIe Gen 5 x4 interface, just with different twists depending on server or workstation needs.

The opening keynote at IFA 2026 was held by AMD and our team on the ground was there to see it. During the event, AMD announced the Threadripper Halo Station, a liquid-cooled workstation built around the 96-core Threadripper PRO 9995WX CPU codenamed "Shimada Peak" and up to four AMD Instinct MI350P accelerators. The system is designed around one specific use case: run AI models with more than one trillion parameters locally, without a cloud connection. Jack Huynh, AMD's SVP and GM of Computing and Graphics, described it as a new class of workstation bringing supercomputer-class compute to individual users and developers. The Threadripper PRO 9995WX Zen 5 CPU has 96 cores and 192 threads, 5,4 GHz boost frequency and supports up to 2 TB of DDR5 system memory.

Going further down the specifications, each MI350P card features 144 GB of HBM3E running at 4 TB/s, offering a bandwidth 14 times higher than any LPDDR5X variant. At IFA 2026, AMD presented a configuration based on two MI350P PCIe cards for a total of 288 GB of HBM3E memory. Users can upgrade the system to four cards and 576 GB of HBM3E. This amount of accelerator memory is enough, says AMD, to hold a trillion-parameter model entirely on-device. Each Instinct MI350P card has a TBP of up to 600 W and is liquid-cooled independently, as is the CPU. Complete system specifications, availability and pricing have not been announced.

Advantech, a leading provider of industrial edge AI and high-performance computing solutions, announces the ASMB-808, a next-generation workstation motherboard designed to bring high-performance Intel Xeon 600 processors and scalable multi-GPU acceleration to professional AI and compute-intensive workloads. Supporting a single Intel Xeon 600 processor with up to 350 W TDP and seven PCIe Gen 5 x16 slots, ASMB-808 provides the high-bandwidth expansion needed for advanced GPU and accelerator configurations. Combined with Advantech's HPC-7485 4U chassis and 2,000 W power supply, the platform can support up to four Intel Arc Pro B70 workstation GPUs, delivering a scalable foundation for AI inference, generative AI, engineering simulation, 3D visualization, and professional content creation.

"AI is penetrating into industrial and professional work environments, where high-performance computing is needed with the flexibility to run demanding workloads locally. ASMB-808 combines the latest Intel Xeon 600 processor technology with a highly scalable PCIe architecture, enabling system developers to build powerful multi-GPU workstations tailored to AI and professional applications," said Barry Chang, Director of Advantech's industrial servers. "By pairing ASMB-808 with up to four Intel Arc Pro B70 GPUs, we provide a flexible platform for AI inference and professional workloads that demand high compute performance and GPU acceleration."

We're on the ground at IFA in Berlin this week, and one of the more interesting machines we walked past on the show floor was the Acer Swift Blade 14. It's a new sub-brand under Acer's Swift lineup, and the first thing you notice picking it up is just how little of it there is to hold. Acer built the Swift Blade 14 to weigh just 799 grams (1.76 pounds), making it one of the lightest 14-inch Windows laptops we've come across. The chassis pairs carbon fiber on the top and bottom covers with a magnesium-aluminum alloy keyboard deck, keeping the weight down without the machine feeling flimsy in hand. It measures 12.9mm thin on the base configuration and 13.5mm on OLED models. That's not quite as thin as a 13-inch MacBook Air, but it is significantly lighter.

Inside, the laptop runs on Intel's Wildcat Lake platform, scaling up to a Core 7 350 CPU alongside 12GB of onboard LPDDR5-6400 memory and up to 1TB of PCIe Gen 4 NVMe storage. The display comes in three tiers, topping out at a 3K OLED WQXGA+ panel running at 90Hz with 400 nits and full DCI-P3 coverage, packed into a 90% screen-to-body ratio with 4.3mm bezels. A 50Wh battery, three USB Type-C ports, Wi-Fi 6, and Bluetooth 5.3 round out the spec sheet. Of course, thermal performance will be a concern in a chassis this thin, so we'll have to wait for independent testing to comment on that. Acer confirmed the Swift Blade 14 launches across EMEA in December, though pricing hasn't been announced yet.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, announces the launch of the new Flare X5X series DDR5 memory, with initial launch specification of DDR5-6000 CL36-36-36-76 32 GB (2x 16 GB). Continuing G.SKILL's long-standing commitment to memory overclocking technology and high-speed memory, the Flare X5X series DDR5 is designed for users seeking high performance and a clean minimalist hardware aesthetic. Supporting the latest AMD EXPO Technology: Featuring Ultra Low Latency, also known as AMD EXPO ULL, the Flare X5X series overclocking profile leverages fine-tuned memory sub-timings for performance with supported AMD CPU, motherboard, and BIOS.

"AMD EXPO Technology: Featuring Ultra Low Latency" is the newly announced memory overclocking technology released by AMD. Compared to existing G.SKILL DDR5 memory kits that includes AMD EXPO support, the new Flare X5X series come with AMD EXPO ULL that includes multiple extra-tuned memory sub-timing settings in the overclocking profile, which help deliver better latency performance at the same memory speed. PC enthusiasts can experience the enhanced performance by enabling the AMD EXPO ULL memory overclock profile on a system with compatible AMD CPU, motherboard, and supported BIOS version.

In early August, the Piston V appeared online, shrouded in mystery, but ran the gauntlet in a video by ETA Prime. Now, the Piston V has officially launched on Kickstarter at a surprisingly early bird price. The Kickstarter campaign also fully reveals the mini PC's specs and bundled accessories. The Piston V launched on Kickstarter with a super early bird price of $559, and, at the time of writing, is available starting at $590. However, the post-Kickstarter MSRP is expected to be around $799. The creators of the mini PC and its crowdfunding campaign tout the device as a hybrid mini PC and game console "in a gadget form factor," with the Bazzite/Windows dual-boot and a 4-inch touchscreen on the front adding to the HTPC experience.

As was shown in the pre-launch hands-video, the mini PC will feature the AMD Ryzen AI 9 365 APU with its built-in AMD Radeon 880M iGPU, which should deliver reasonable performance for most non-AAA games. All models available in the Kickstarter come with 16 GB of DDR5-5600 memory and a 500 GB PCIe Gen 4×4 M.2 SSD, but the specs are upgradeable 24, 32, 48, or 64 GB of memory and up to 4 TB of SSD storage. One thing that wasn't mentioned in the original hands-on was the presence of an OCuLink port for eGPU support.

In a time when DDR5 memory prices keep soaring to unprecedented levels, we have seen consumers resort to older DDR4 memory, but not like this. X user @watagjt shared an unusual experience with a DDR5 memory stick that contained no DDR5 memory chips inside. The memory stick, seemingly from Kingston, reportedly had DDR4 memory chips soldered onto the PCB instead, making it clear that it wasn't a regular purchase. According to the buyer, the Kingston FURY Beast DDR5 module was bought unopened, with no visible damage, and its heatsink and label looked normal at first glance.

The teardown, however, revealed a messy soldering job with flux residue and unused PCB pads, leading the buyer to suspect the swap. Interestingly, the DDR4 chips themselves showed valid DDR5 identifiers, which made the swap even more convincing. Of course, what makes this scam deeply concerning is that it is impossible to spot without disassembling the stick, and even then, a trained eye is needed to make the conclusion. The advice for buyers is to stick with brand-new or trusted used components, and never purchase anything from a suspicious third-party vendor.

XCENA, a semiconductor company developing memory-centric computing solutions for AI infrastructure, today presented the architecture and measured performance of MX1, its computational CXL memory architecture, during the Hot Chips 2026 Memory session. Presented by Harry Kim, Chief Product Officer of XCENA, the session examined how MX1 combines large-scale memory expansion, SSD-backed capacity and programmable near-memory computing in a single CXL Type 3 device to address the growing memory constraints of AI infrastructure. The MX1 presentation was selected through the Hot Chips program committee's technical review process.

As AI models continue to grow, system performance is increasingly constrained by memory capacity, data movement and the economics of high-bandwidth memory scaling rather than compute alone. MX1 is designed to complement CPUs, GPUs and AI accelerators by expanding memory capacity and offloading selected memory-bound operations—including vector search, KV-cache retrieval and data preprocessing—so host processors can focus on compute-intensive inference.

Minisforum is apparently continuing its ongoing attempt to flood the mini PC market with as many models as possible, with the M2 Pro being the latest entry into its Intel Panther Lake-powered mini PC line-up. The Minisforum M2 Pro packs Intel's latest Core Ultra X7 358H, with its powerful Arc B390 iGPU in tow, into an aluminium chassis measuring just 195 × 195 × 47.5 mm, or 1.8 L. Minisforum claims that the Intel Core X7 Ultra CPU inside the M2 Pro can sustain TDP of up to 65 W thanks to a dual heat pipe cooling solution and a flow-through cooling design.

Minisforum seems to also be positioning the M2 Pro as something of a do-it-all machine, since it features built-in HDMI CEC, making it a solid, if somewhat expensive HTPC and living room console. The Minisforum M2 Pro also packs a 134.9 W PSU into the tiny chassis, meaning there is no need to hide a power brick behind a TV console or on a desk. The M2 Pro only comes in one variant, with the Intel Core Ultra X7 358H, 32 GB of LPDDR5X-7467 memory, and a 1 TB NVMe SSD, all for an MSRP of $1,799, with a launch discount bringing that down to $1,439. At that price, it's certainly not cheap, but it also has an impressive specs and features list to back up that price, including upgradeable and expandable storage and triple USB4 ports.

Intel, in a detailed presentation, detailed the package design of its next-generation Xeon 7 "Diamond Rapids" server processor. The processor is designed to be a versatile serial processing powerhouse for enterprise-scale agentic AI. Intel's design goal with the processor is to offer up to 256 P-cores, cushioned by up to 1.28 GB of last-level cache, per socket. The chip also features contemporary I/O, including PCI-Express Gen 6. Intel is leveraging its latest in-house foundry node, the Intel 18A-P, to design the core complex chiplets.

Xeon 7 "Diamond Rapids" is built on essentially the same disaggregation philosophy as AMD EPYC—that of CPU cores being spun out in small groups of CPU core complexes (CCXs) contained in CPU core dies (CCDs), groups of which interface with a centralized server I/O die (sIOD), which serves as a system agent and I/O hub. The "Diamond Rapids" MCM consists of two Fabric Hub Tiles (FHTs), four CPU core Base Tiles, and a total of 16 core chiplets, each containing 16 "Panther Cove" P-cores. The core-count per compute base tile is 64, and four of these add up to 256 cores.

Intel made a surprising comeback in Amazon's CPU sales rankings today, with two of its processors breaking into the retailer's top 10 CPUs sold in the United States. This marks the first time in months that Intel has been among the top 10 choices for gamers across the country, as AMD continues to dominate the chart and holds most of the leading positions. However, the appearance of Intel's Core Ultra 7 270K Plus and Core i7-14700K signifies a notable shift from the situation over the past year. Intel was effectively absent from the top 10 during AMD's strongest periods, making the latest rankings an especially interesting development for the DIY market, particularly driven by value.

The Core Ultra 7 270K Plus has made the biggest jump, reaching sixth place after previously being much lower on the list. Intel's latest "Arrow Lake Refresh" processor combines 24 cores with strong single- and multithreaded performance, and aggressive pricing has made it significantly more attractive to buyers. The Core i7-14700K has also climbed into the top 10, with its appeal likely tied to its compatibility with both DDR4 and DDR5 memory during a particularly challenging time for PC DIY enthusiasts. That flexibility is becoming increasingly valuable as high DDR5 prices continue to influence system-building decisions. The older "Raptor Lake Refresh" chip remains a particularly capable option for users who want to reuse existing LGA 1700 hardware and DDR4 memory, which is also currently more affordable than any DDR5 platform.

GPD's Win Max 3 gaming handheld was shown off in June 2026 running AMD's Strix Halo Ryzen AI Max+ 395, a 165 Hz AMOLED display, and a modular battery. GPD has now officially announced the upcoming launch date for the Indiegogo campaign to get the new Strix Halo handheld off the ground, alongside the price at which the device will launch on the crowdfunding platform.

At launch, there will be three variants of the GPD Win Max 3, with the entry-level model with an AMD Ryzen AI Max+ 388 CPU, 32 GB of RAM, and a 1 TB SSD launching at $1,750, while stepping up to 64 GB of RAM and 2 TB of storage on the same APU will bring the price up to $2,246. The most expensive version of the Win Max 3 will have the full-fat AMD Ryzen AI Max+ 395 APU with 128 GB of RAM and 2 TB of storage for a whopping $3,499 MSRP.

Transcend Information, Inc. (Transcend), a global leader in memory and storage solutions, has introduced a comprehensive lineup of DDR5-7200 embedded DRAM modules designed to meet the growing performance and data-processing demands of next-generation computing platforms. The portfolio includes CUDIMM, CSODIMM, ECC CUDIMM, ECC CSODIMM, and RDIMM modules, supporting a wide range of applications—from AI PCs, desktop computers, and industrial embedded systems to workstations, servers, and data centers. With transfer speeds of up to 7200 MT/s, the modules significantly enhance memory bandwidth, data-processing efficiency, and multitasking performance while maintaining low power consumption, stable operation, and high system reliability. This enables customers to accelerate the deployment of AI computing, edge computing, and other data-intensive applications.

7200 MT/s High-Speed Data Transfer for Next-Generation Computing
Transcend's DDR5-7200 modules accelerate large-scale data access and multitasking, making them ideal for applications such as AI inference, industrial automation, smart healthcare, in-vehicle systems, and high-performance computing. Featuring a dual-channel architecture, an integrated power management IC (PMIC), a low operating voltage of 1.1 V, and on-die ECC, the DDR5 DIMM modules enhance data access efficiency while optimizing power management and ensuring stable data transmission.

G.SKILL has begun distributing payments between $20 and $25 to various customers after settling a $2.4 million class-action lawsuit. The lawsuit alleged that G.SKILL misled buyers of DDR4 and DDR5 memory kits about the actual speed of their DRAM kits. Filed in 2022, the lawsuit claimed that G.SKILL did not properly label its advertising materials and misled users into believing that the maximum speeds advertised for their memory modules were achievable only through XMP or EXPO memory overclocking profiles. Additionally, the lawsuit asserted that there were no warnings for consumers about the potential risks of memory overclocking, such as system instability or memory damage.

The DDR4 and DDR5 memory kits in the Trident Z and Ripjaws series were the focus of the class-action lawsuit. G.SKILL initially argued that it had properly labeled these products but eventually reached a settlement earlier this year, agreeing to pay $2.4 million in damages to the buyers of the original kits. Anyone who purchased G.SKILL DDR4 and DDR5 memory kits with speeds rated over 2,133 MT/s or 4,800 MT/s, respectively, from January 31, 2018, to January 7, 2026, is eligible to receive a settlement.

The Framework Laptop 12 was an almost instant hit when it launched, thanks to its whimsical, compact design and durable chassis, but there was always a bit of a perception amongst hardware enthusiasts that the small laptop wasn't a serious computer, thanks to its outdated 13th-Gen Intel CPUs. Now, Framework has just announced that the convertible laptop has received an update to Intel's latest Core Series 3 CPUs.

Following the update, the Framework 12 is available for pre-order with the Intel Core 3 304, Core 5 320, and Core 7 350 CPUs, delivering Intel's latest six-core (2× P-Cores, 4× E-Cores) CPUs. Unfortunately, there are still no versions with the Intel Core Ultra X7 358H or any with a proper Intel Arc B390 iGPU. That said, the Framework Laptop 12 also now ships with two Thunderbolt 4-capable USB Type-C ports in the two rear-most expansion bays, theoretically allowing for eGPU expansion or other Thunderbolt peripherals.

Memory pricing is a hot topic these days as consumers struggle to purchase any, with little hope of prices dropping. Memory costs are reaching new all-time highs, with various trackers reporting that prices in August this year are up to five times more expensive than the same month last year for DRAM kits. According to data from PCPartPicker, DDR5 memory prices have increased anywhere from 372% for 2 x 16 GB 4,800 MT/s kits to 485% for 2 x 32 GB kits running at 5,600 MT/s. A 6,000 MT/s 64 GB kit, which used to cost $222, is now considered a luxury investment at an astounding $1,272. At the TechPowerUp editorial team, we remember when that was the entire budget for building a very decent high-end gaming PC.

PCPartPicker also shows that DDR4 kits have increased by 120% to 177%, which is still significant but mainly affects those using the older DDR4 technology. For those on a newer DDR5 platform, the change is much more pronounced. Note that PCPartPicker only tracks pricing in the United States, while German websites like ComputerBase have reported a 345% year-over-year increase for August in the Eurozone, which is much higher than anything seen before. With no signs of slowing down, we might see even higher year-over-year changes.

Chinese memory giant CXMT has finally surpassed 9,000 MT/s on the AMD platform, rivaling DRAM kits from Micron, SK hynix, and Samsung. On the Colorful iGame X870E VULCAN W OC motherboard, an iGame Shadow II 24G×2 kit with 48 GB of memory achieved speeds of 9,000 MT/s. In the provided screenshot, the kit runs at 4,507 MHz, which translates to over 9,014 MT/s, thanks to double data rate technology. Late last year, CXMT announced that its DDR5 could reach 8,000 MT/s, but now we see that overclocked memory can exceed these speeds on the AMD platform.

Additionally, CXMT is working on improving latency. Some Colorful iGame Shadow II 24Gx2 48 GB kits are being tested on ASUS motherboards to achieve ultra-low latency, matching the performance of the top three memory manufacturers. On the latest AMD and Intel platforms, Colorful has tested DDR5 kits running at 6,000 MT with CL30 latency and even some preliminary tests with CL28 latency. This is a promising sign that CXMT memory is finally meeting the standards of competing DRAM from the leading memory makers in both transfer rate and latency.

Chinese memory giant CXMT has reportedly achieved a significant milestone in DDR5 production, with manufacturing yields now comfortably above 90%. This is comparable to what major manufacturers like Samsung, SK hynix, and Micron are achieving. According to reports, CXMT uses a 17 nm node for DDR5 chip production and has reached a 90% yield for these chips. This is only 2-3% lower than Samsung's yield on its 10 nm class node for DDR5 production, indicating that CXMT's production quality is matching that of the world's largest memory maker. This is a remarkable achievement for a company that excels in cleanroom construction time, taking only 12 months to build its fab's cleanroom compared to the two years others require. As the company plans to end the year with 350,000 DRAM wafers per month, high yields mean there is little waste or leftover.

Chinese MyDrivers also notes that PC OEMs have mixed reactions to adopting CXMT DRAM in their products. For instance, Dell has completely banned the use of CXMT in its machines, while HP only allows CXMT DRAM in its Chinese PCs. Major Taiwanese brands such as ASUS and Acer have increased adoption in some models, as they have more flexibility in supply chain procurement. However, both companies use CXMT memory for PCs sold in mainland China and some emerging markets, meaning the West is still far from receiving PCs with CXMT memory modules. PC OEMs are also cautious about procuring CXMT memory due to concerns about disrupting their relationships with the big three memory makers.

It seems as though mini PCs have never been more popular, with brands like Minisforum and Geekom releasing new models at an almost alarming rate. A new video by ETA Prime on YouTube, however, has shown off something different: an unbranded, mystery Mini-PC that only goes by the Piston V and dual-boots Bazzite and Windows right out of the box. Given that it runs Bazzite, it can boot right into a SteamOS-like view, revealing its intentions as a HTPC or living-room gaming PC.

The Piston V features a 10-core, 20-thread AMD Ryzen AI 9 365 CPU with an RDNA 3.5 AMD Radeon 880M iGPU (not the claimed RDNA 3 890M), 32 GB of DDR5-5600 memory, and a 1 TB M.2 SSD. While solid, the internals are the least interesting part of the new Mini-PC—in keeping with its apparent living-room gaming PC vibe, the Piston V also packs a circular built-in display on the front, which can be used to display static images, system stats, media UIs, and basically anything else you may need immediate access to while you're gaming or using your PC. On Linux, the mini PC already has a built-in performance monitor, which is a nice level of polish for what appears to be a niche OEM.

Lenovo has officially unveiled the ThinkCentre Neo50q Gen 7, a desktop that it calls a "Tiny PC." The ThinkCentre 50q is being marketed as a versatile SFF desktop PC based on the Intel Core Ultra Series 3 CPUs, for use in anything from personal AI to business and home use, with multitasking productivity in mind. The ThinkCentre Neo 50q is not available just yet, but it is listed as "available soon" on Lenovo's online store.

The ThinkCentre Neo 50q fits an Intel Core Ultra 7 350 CPU into an aluminium chassis that measures just 36.5 × 179 × 182.9 mm, or 1.2 L in volume. It comes with up to 32 GB of upgradeable DDR5-5600 SODIMM memory, and up to a 2 TB PCIe Gen 4 SSD. The ThinkCentre 50q Gen 7 comes with built-in Wi-Fi 7 and Bluetooth 5.4 for connectivity, but it's also no slouch when it comes to physical ports, especially given its diminutive size.