AMD today talked a little more about the Ryzen Threadripper, its upcoming line of HEDT (high-end desktop) processors, which will compete with Intel's recently launched Core i7 and Core i9 X-series processors. The chips will still be launched "later this Summer," and AMD hasn't mentioned models, yet. We know of at least two features which will spell trouble for Intel, and it's not the CPU core performance.

The first of two killer Threadripper features is that it has 64 PCI-Express gen 3.0 lanes across all its models - 12-core and 16-core. This is unlike Intel, where you get 44 (not 64) PCIe lanes to begin with, and those start with the $999 Core i9-7900X ten-core processor. Models below this are relegated to 28 lanes, removing the biggest advantage of the HEDT platform - to be able to run more than one graphics card at full x16 PCIe bandwidth. The second killer Threadripper feature is its memory controller. AMD announced that Quad-channel DDR4 memory will be available across the lineup. This again is unlike Intel, where the Core i5-7640X and Core i7-7740X quad-core LGA2066 chips feature just dual-channel memory. All Threadripper chips further feature 32 MB of shared L3 cache. ASUS, ASRock, GIGABYTE, and MSI are said to be developing Ryzen Threadripper motherboards based on the X399 chipset as we speak.

If you had your eyes on those new Intel HEDT processors, which were posted just today with some... Interesting... price-points, you'll be a little miffed to know that Intel has gone on and done it again. The few cents per unit that soldering the CPU would add to the manufacturing costs of Intel's HEDT processors (starting at $999, tray-friendly prices) could definitely bring the blue giant to the red. As such, the company has decided to do away with solder even on its HEDT line of high-performance, eye-wateringly-expensive CPUs in favor of their dreaded TIM.

The news have been confirmed by der8auer, a renowned overclocker. And as you have probably seen in our own VSG's review (and if you haven't shame on you and click that link right away), delidding Intel's CPU's and ridding them of their TIM can improve temperatures by up to a staggering 21 ºC (case in point, an i7-7700K). And that's a quad-core CPU; imagine an Intel Core i9-7980XE 18-core processor sitting under that TIM, and overclocking it to boot. Those are more than four times the cores under an equally bad thermal interface; add to that the likely presence of a thermally-insulating air-gap, and you can imagine where this is going. If you are planning on going for Intel's HEDT platform, you better take those delidding tools off your shelf.

Update: Check this video here for some more information. Turns out both Skylake-X and Kaby Lake-X will make use of the referred TIM, but Skylake-X dies, which make use of a stacked PCB, won't be deliddable with current tools. A new tool is going to be developed by der8auer alongside ASUS for these chips.

Here are some of the first pictures of Alphacool Eisbaer 420, a closed-loop AIO liquid CPU cooler by one of the few manufacturers that doesn't sell re-branded Asetek wares. The cooler is designed for extreme overclocked setups using HEDT processors, and supports upcoming HEDT sockets. The cooler consists of a copper-base pump-block plumbed to a 420 mm x 140 mm full-copper radiator, with three 140 mm fans. One of the coolant tubes has a quick-disconnect fitting.

Videocardz is advancing an exclusive in that Intel seems to be about to introduce even more cores in a single package than previously thought. Intel's X299 platform, which we've just started officially started seeing some motherboards for (just scroll down on our news feed), looks to be the awakening of a slumbering giant. But you don't have to believe me on this: before we ever knew of AMD's Ryzen line of processors (much less about their Threadripper line), leaks on Intel's Skylake-X and Kaby Lake-X processors only showed core counts up to 10-cores - in line with previous Intel HEDT platforms (see below image.) Cue more recent leaks, and it would seem that Intel is increasing the core-counts on its upcoming platform on a daily basis - especially if the most recent leak referencing 14, 16 and 18-core parts pans out. (I am reminded of a "moar cores" meme that used to float around the web. Maybe one of you in the comments can find it for me?)

A new, leaked slide on Intel's X-series processors shows 18, 16, 14, and 12-core configurations as being available on the upcoming X299 platform, leveraging Intel's turbo Boost Max Technology 3.0 (which is apparently only available on Intel's Core i9-7820X, 7900X, 7920X (which we know to be a 12-core part), 7940X (probably the 14-core), 7960X (16-core) and the punchline 7980XE 18-core processor, which should see a price as eye-watering as that name tumbles around on the tip of the tongue. There is also mention of a "Rebalanced Intel Smart Cache hierarchy". But you don't want me to be rambling on about this. You want to comment about this story. Feel free to partake in a joyous conversation over these news (I'll also leave you with a bonus picture of some purported, upcoming Intel X-series packaging efforts. They're certainly colorful.)

At its follow-up conference call for its Analysts Day presentation, AMD clarified that Threadripper is a brand, and not a codename to its upcoming line of HEDT processors. This effectively implies that the chips will be called either Threadripper (followed by a model number), or Ryzen Threadripper, but not "Ryzen 9." Responding to questions by TechPowerUp, AMD also mentioned that it will put out more details about Threadripper in its May 29th pre-Computex event in Taipei.

AMD also confirmed that Threadripper is very much a client platform product and not enterprise; although its target audience is "a bit of both" power-users looking for a huge amount of CPU power, and high-end gamers. The Epyc line of processors are firmly in the enterprise domain. Finally, AMD confirmed that motherboard manufacturers will show off Threadripper motherboards at Computex 2017. AMD hopes to launch Threadripper within Summer 2017 (that's before September end). Wake me up when September ends.

It seems that Intel's accelerated released schedule for its upcoming HEDT platform is starting to slowly bear fruits, with many details leaking through the cracks almost non-stop during the last few days (and before you ask, yes, I did have more links to show you.)

These should be two of the top performing processors in Intel's line-up, and the i9 7900X (10-core) and 7920X (12-core) have been tested on integer and floating point calculations. The 10-core i9-7900X (3.1 GHz base frequency, no Turbo listed)) scores 107 points in single-core benchmarks, and 1467 points in the multi-core test. The 12-core, 2.9 GHz base frequency 7920X, however, scores a head-scratchingly-higher 130 points in the same single-threaded benchmark, despite carrying the same architecture at... hmm... lower clocks. Maybe this processor's Turbo is working as expected, up to 3.25 GHz (average), and that's the factor for the higher single-core performance?

AMD Ryzen 9 "Threadripper" series 12-core, 14-core, and 16-core client desktop processors, which will form the company's next-generation high-end desktop (HEDT) lineup, which goes against Intel Core i9 "Skylake-X" series, could come in a brand new socket. This shouldn't come as a surprise because the chips have higher electrical requirements, besides double the I/O of socket AM4 Ryzen processors, such as a 44-lane PCIe gen 3.0 root complex, quad-channel DDR4 memory interface, and more. This socket, according to a "HotHardware" report, is an LGA (land-grid array) with 4,094 pins.

The new LGA-4094 socket, so-called SP3r2, will be slightly scaled up from the SP3 socket AMD has been selling enterprise Opteron-brand multi-socket CPUs on (pictured below). The consumer version of this socket could feature a more user-friendly retention mechanism that shouldn't require a screwdriver to fasten. Motherboards based on this distinctively rectangular socket will feature up to eight DDR4 DIMM slots to hold quad-channel DDR4 memory, and over four PCI-Express 3.0 x16 slots, with support for 3-way and 4-way multi-GPU solutions. The motherboards will also feature copious amounts of onboard devices, M.2 slots, and other storage connectivity. Since "Threadripper" is rumored to be a multi-chip module of two 14 nm "Summit Ridge" dies linked together on-package with with an Infinity Fabric interconnect, only one of the two dies links to the motherboard chipset (AMD X399 chipset), while all the PCIe lanes of the second die (including those which would make up the chipset bus) are freed up.

Today is an eventful day in the tech world, with two high-impact leaks already offering themselves up to our scrutiny. We had previously covered AMD's upcoming HEDT platform, based on the company's new X399 chipset, as having a quite distinctive lineup of processors, with not only 16 and 12-core offerings hot on foundries presses', but also some 14-core, 28-thread chips as well. Now, a leak has apparently revealed the entire Ryzen HEDT platform, whose processor marketing name, Ryzen 9, sounds really close to Intel's Core i9.

AMD's offerings look to offer an edge at least on core-count, with the Red team's top offerings, the Ryzen 9 1998X and Ryzen 9 1998, bringing in a game-changer 16 cores and 32 threads to the table. Perhaps even more importantly, we have to mention that the 1998X (these names, if true, are quite a mouthful, though) achieves a 3.5 GHz base, 3.9 GHz boost clock, which owes nothing to AMD's Ryzen 7 1800X consumer flagship CPUs. Rumors of AMD's frequency demise on higher core-count Ryzen CPUs have been greatly exaggerated, it would seem. And did I mention that these chips are coming with a TDP of 155 W - 5 W lower than Intel's purported 12-core, i9-7920X offering? Consider that for a moment.

The folks at MSI seem to be particularly fond of puzzles at this point in time, for no discernible reason. I say so because they've been giving us snippets of an upcoming high-end motherboard, which we have previously covered. At the time, we posited it would fall somewhere along the X299-end of the spectrum, considering the huge amount of PCIe x16 ports on-board.

It would seem those suspicions were founded, since MSI's other GODLIKE branded motherboards (which means they have all the bells & whistles available on time of their release) were X99-based, so it would follow that the new GODLIKE would usher in their footsteps as well. From the new piece of the puzzle, we can glean that this motherboard will offer, in addition to its 4x PCIe x16 ports and 3x M.2 slots over the X299's 44 PCIe lanes, 3x Ethernet connectors, 6x USB 3.1, and 2x Wi-Fi antennas. Expect this motherboard to be one of the most feature-packed offerings for Intel's expected ninth coming (of their Core i9-branded HEDT processors, that is.)

Recent reports mentioned Intel's moves to bring forward the launch of their Basin Falls HEDT platform, which succeeds their X99 platform. Intel is doing this in hopes to hold the blue flag against AMD's upcoming X399 Ryzen-based HEDT platform (there's seemingly a war in numbers here), pitting 4, 6, 8, 10, and 12-core CPUs against AMD's expected 12-core and 16-core processors.

As such, it's only natural motherboard makers would also have to expedite their work on X299-based motherboards, and it would seem that MSI has done just that, simultaneously advancing their marketing campaign. A teaser image from the company showcases an as-of-yet unreleased motherboard (not just any motherboard, but the "Best. Motherboard. Ever") which boasts of a trio of M.2 slots (with MSI's M.2 Shield thermal solution), and four PCIe x16 slots. Are you still counting the number of PCI lanes needed to drive all these slots? Well, it just so happens Intel's Basin Falls is expected to deliver up to 44 PCIe 3.0 lanes, so those should be enough to at least make this ridiculous amount of slots worthwhile... For some use cases. There's also an additional power-supply connector on top of the first PCIe slot, which should increase power delivery for these. It's almost open season on these HEDT platforms, kind sirs.

Noctua today announced that it will continue its tradition of supplying customers with its premium-class SecuFirm2 mounting kits for novel platforms free of charge. While most current Noctua heatsinks support the new LGA2066 socket of Intel's 'Basin Falls' X299 platform for 'Skylake-X' and 'Kaby Lake-X' CPUs out of the box, older models can be upgraded with the NM-I2011 or NM-i20xx kits at no additional cost.

"We're determined to provide the best possible support to our customers and, over the years, we've sent many thousands of mounting kits free of charge to users who wanted to upgrade to new platforms", says Roland Mossig (Noctua CEO). "With Skylake-X just around the corner, we're pleased to announce that we'll extend this offer for LGA2066. Owners of older Noctua retail heatsinks that don't support LGA2011/LGA2066 out of the box will be able to upgrade to the new socket free of charge!"

Two days, two leaks on an upcoming Intel platform (the accelerated release dates gods are working hard with the blue giant, it would seem.) Now, it's Intel's own i7-7740K, a Kaby Lake-X HEDT processor that packs 4 cores and 8 threads, which is interesting when one considers that AMD's latest mainstream processors, Ryzen, already pack double the cores and threads in a non-HEDT platform. Interesting things about the Kaby Lake-X processors is that they are rumored to carry 16x PCIe 3.0 lane from the CPU (which can be configured as a singularly populated 16x or as a triple-populated 1x @ 8x and 2x @ 4x PCIe ports. Since these parts are reported as being based of on consumer, LGA-1151 Kaby Lake processors, it would seem these eschew Intel's integrated graphics, thus saving die space. And these do seem to deliver a quad-channel memory controller as well, though we've seen with Ryzen R7 reviews how much of a difference that makes for some of the use cases.

Intel's X299 HEDT platform, whose launch we recently covered as having been pushed forward by the company so as to better compete against AMD's upcoming X399 HEDT platform, has some new, juicy rumors floating about it. Namely, Bench.Life has reported that Intel's upcoming Kaby Lake-X and Skylake-X lines of high performance CPUs will also feature 12-core offerings on its Skylake-X materialization, instead of just the previously reported 6, 8, and 10-core designs.

This really looks like an Intel that's stretching its manufacturing and chip design prowess so as to prevent itself from being buried in higher-performing, higher core and thread count offerings from its rival AMD, which has turned Intel's line-up in the mainstream consumer market head-over-heels already. Latest reports peg the new series as being presented on Computex 2017 (specifically, on may 30th), with availability being expected on June 26th. Which platform are most interested in, and what do you think of this move from Intel?

In an interesting report that would give some credence to reports of AMD's take on the HEDT market, it would seem that some Ryzen chips with 12 Cores and 24 Threads are making the rounds. Having an entire platform built for a single processor would have always beenludicrous; now, AMD seems to be readying a true competitor to Intel's X99 and its supposed successor, X299 (though AMD does have an advantage in naming, if its upcoming X399 platform really does ship with that naming scheme.)

Some rumors and whispers have been making the rounds lately, regarding a HEDT platform incoming from AMD. This platform (built upon a new X399 chipset planned exclusively for it) would use a cut-down version of the Naples-based server SP3 socket called SP3r2. SP3r2 and the new chip will reportedly offer quad channel memory support, pitting them directly in competition with Intel's HEDT lineup in terms of memory bandwidth.

Reportedly, engineering samples of the 180W 16-core Ryzen currently run at 3.1 GHz Base, 3.6 GHz Boost clocks, which leads towards performance in the level of two Ryzen 7 1700 chips. If the rumors are true and such a platform is in development, then we will surely hear of some more chips designed for it. Going through the trouble of creating a new chipset and platform for a single CPU model doesn't seem likely. Perhaps some 12-core and 20-core chips are lurking just below the surface?