Synaptics Incorporated (Nasdaq: SYNA) today introduced the xMCU, a new class of microcontrollers that runs multimodal Edge AI, with the launch of the Synaptics Astra SR200 Series. Unlike conventional MCUs constrained by limited on-chip memory and compute, the xMCU combines heterogeneous, AI-native compute and acceleration with integrated high-bandwidth custom DRAM scalable to hundreds of megabytes, enabling larger AI models and richer multimodal workloads to run entirely on-device. The Astra SR200 Series of xMCUs is designed for the next generation of AI wearables, battery-powered sensing devices, connected cameras, streamers, and industrial vision and voice systems.

The SR200 Series is powered by the Synaptics Torq AI engine, which brings a standards-based hardware architecture and unified developer experience featuring the Coral NPU from Google Research. It also comes with the industry's first pairing of the Arm Cortex -M85 and Cortex -M52. Together with integrated vision and audio capabilities and hardware-rooted security, the SR200 Series brings unmatched system design efficiency and cost benefits to Edge and Physical AI designs.

Akasa, a leading provider of thermal solutions, announced the Fermi CM5, a slim 1U fanless aluminium case designed for the Raspberry Pi Compute Module 5 (CM5) with the CM5 IO Board. At 43.6 mm high, it fits within 1U of rack height, measuring 185 x 93 x 43.6 mm (W x D x H) with a compact volume of 0.8L. The case is designed to support up to 10 W TDP, with openings for the main CM5 IO Board interfaces. With its compact form factor and silent operation, the Fermi CM5 is ideal for digital signage, kiosks, edge AI gateways and industrial automation, as well as vision and sensor deployments.

Heat from the CM5 SoC and M.2 NVMe SSD is conducted into the all-aluminium chassis through dedicated custom aluminium thermal modules and high-performance thermal pads. The chassis acts as a heatsink and dissipates heat passively through its external fins. With no fans and no moving parts, the Fermi CM5 removes fan noise, fan wear and fan-driven dust intake, making it suited for applications requiring stable operation under 24/7 continuous use.

Zyxel Networks, a leader in delivering secure and AI-powered cloud networking solutions, today announced the XS1935 series of 10G multi-gigabit lite-L3 smart managed switches. The new series gives small and medium-sized businesses (SMBs) the performance needed to support high-bandwidth devices, while providing room to expand as network requirements scale.

Slow file transfers, stalled backups, lag during multi-user access, and buffering security camera footage can all disrupt day-to-day work. In many cases, the problem is not the latest server, Wi-Fi access point or camera, but an older network switch that cannot keep pace with newer connected devices. The XS1935 series helps SMBs remove that bottleneck while bringing advanced enterprise-class capabilities within their reach.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, is currently presenting its latest innovations at Embedded World North America 2026, running from September 22 to 24 at the Anaheim Convention Center in California, USA. At Hall B, Booth 6512, BIOSTAR is spotlighting its comprehensive industrial motherboards, advanced EdgeComp systems, and a cutting-edge EdgeComp MT-N150 DX-M1 edge AI demonstration, delivering high-performance computing solutions tailored for smart manufacturing, smart cities, and smart retail applications.

BIOSTAR's industrial motherboard lineup features the BIW88-AHS, BIH61-AHA, BIPTL-IHT, BITWL-IHT, BIWCL-IHT, BIWCL-PAT, BIRPL-PAT, and BIAST-PAT, offering a versatile range of computing platforms, form factors, and connectivity options for embedded system development. Highlights include the BIW88-AHS, which combines the Intel W880 platform with support for Intel Core Ultra 200 series processors, DDR5 ECC and non-ECC memory, and four 2.5GbE LAN ports. The BIPTL-IHT features the Intel Panther Lake-H platform, DDR5 memory, and quad-display support, while the Wildcat Lake-based BIWCL-IHT and BIWCL-PAT provide Mini-ITX and 3.5-inch single-board computer options, respectively.

ASRock Industrial proudly presents its latest lineup of industrial edge AI platforms powered by Intel Core Ultra Series 3 processors (Panther Lake-H), designed to accelerate next-generation edge AI, industrial automation, and intelligent computing applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 180 platform TOPS, the new platforms support up to 128 GB DDR5 memory at speeds up to 7200 MHz, high-speed expansion, rich I/O connectivity, and advanced display capabilities. ASRock Industrial's comprehensive lineup spans industrial motherboards, NUC(S) BOX, fanless iBOX systems, and iEP-7050E industrial IoT Controller, providing scalable computing options for demanding AI inference, machine vision, robotics, smart manufacturing, and industrial edge applications.

Flexible Industrial Motherboards for Intelligent Edge Applications
ASRock Industrial expands its industrial motherboard portfolio with the IMB-1251-WV Series, SBC-377 Series, and COMHA-300, delivering flexible, high-performance platforms powered by Intel Core Ultra Series 3 processors for next-generation edge AI and industrial applications. The IMB-1251-WV Series combines Mini-ITX flexibility with up to 128 GB DDR5 7200/6400 memory with In-Band ECC, extensive I/O, dual LAN, quad-display support, flexible storage, and optional out-of-band (OOB) functionality, making it ideal for machine vision, robotics, and industrial automation.

Intel is reportedly planning another 10% price increase on PC CPUs in October, according to DIGITIMES. This would be the latest in a string of price hikes made in stages over the past year. The report doesn't specify whether this price increase will affect only desktop CPUs or whether mobile CPUs will also be included. Industry sources cited by the outlet say the goal is to improve gross margin rather than growing market share. That would be especially important, since global PC shipments are expected to dip slightly from 260 million to about 250 million units in 2027, even as prices continue to climb. If Intel can push CPU shipments back up toward 200 million units, DIGITIMES estimates its market share could recover to roughly 78%.

The report also claims Intel is considering ending its low-margin Small Core product line entirely, which could open the door for Qualcomm and MediaTek to expand further into the industrial PC and IoT chip markets that Intel currently leads. On staffing, sources suggest another 5% to 10% of the workforce could be cut, following Intel's trim of its Data Center and AI group in July. Headcount reportedly sits around 75,000 now, though the same sources say Intel plans to keep hiring alongside any cuts, and that its current size is already reasonable.

Ugreen, a leading global consumer technology company, hosted the Ugreen Smart Living Launch Event on Sept. 1 at Gillette Stadium in Foxborough, Massachusetts. At the event, Ugreen unveiled HomeAgent and the new MagFlow Series and named New England Patriots cornerback Christian Gonzalez its Global Brand Ambassador.

This launch marks Ugreen's AIoT debut and a broader vision for what intelligence in the home should do. Home cameras have traditionally focused on recording risks, while meaningful everyday moments can be overwritten before families recognize their value. Ugreen HomeAgent is a groundbreaking agentic AI local hub unifying local storage, computing, and control into one device. It is designed to activate household data, provide proactive assistance, and keep users in control through a trusted local-first architecture.

Ahead of IFA, Qualcomm Technologies, Inc. today announced the Qualcomm Dragonwing Q-2390 and IQ-2390 processors, expanding the Dragonwing portfolio with highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. As demand grows for devices that can perceive, analyze and act on data locally, the Dragonwing Q-2390 and IQ-2390 processors are designed to bring AI, vision, connectivity and security to a broader range of connected devices, helping power the next wave of intelligence across homes, businesses, cities and factories.

"AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the GMB150, a next-generation Mini-ITX gaming motherboard powered by the latest AMD Ryzen Embedded P100 Series processors. As one of the first Mini-ITX gaming motherboards built on this new platform, the GMB150 combines advanced AMD "Zen 5" architecture, RDNA 3.5 graphics, and the AMD XDNA 2 AI engine into a single SoC, delivering up to 80 TOPS of heterogeneous AI computing performance.

Designed to meet the evolving needs of AI-powered electronic gaming machines, the GMB150 combines AI computing, gaming-specific peripheral integration, and hardware-level security in a compact Mini-ITX platform while maintaining the flexibility to support a wide range of intelligent edge applications. Leveraging the latest AMD Ryzen Embedded P100 Series platform, the GMB150 enables gaming OEMs to build more intelligent, secure, and future-ready electronic gaming machines through AI acceleration, advanced graphics, and trusted security.

Arduino S.r.l., a subsidiary of Qualcomm Technologies, Inc., today opened pre-orders for Arduino VENTUNO Q, its most advanced edge AI platform to date, powered by the Qualcomm Dragonwing IQ8 Series. Now available worldwide, VENTUNO Q was built for developers, prioritizing familiarity and ease of use with the right software, accessories and extensions.

One Board to Sense, Decide, and Act
The VENTUNO Q has a dual-brain architecture, pairing a Dragonwing IQ-8275 processor, delivering up to 40 dense TOPS of AI performance, with 16 GB LPDDR5 memory, 64 GB eMMC and expandable M.2 NVMe storage, alongside a dedicated STM32H5 real-time microcontroller, enabling systems that don't just interpret sensor data but respond to it physically, immediately and offline.

According to Mercury Research, Intel's x86 CPU market share has dropped below 70% for the first time since 1995, hitting 69.3% in Q2 2026, a 6.5-point drop year over year. AMD was there to pick up the difference, reaching 30.7%, a new record for the company. Mercury Research president Dean McCarron confirmed the 31-year low to CRN following the release of his second-quarter CPU market share report. Those figures cover PC and server CPU shipments only. When semi-custom, embedded, and IoT products are included, the Intel market share falls to 65.9% vs. AMD's 34.1%, with the latter getting a boost from a stronger than expected gaming console SoC shipments, a segment Intel doesn't compete in, if we skip the Arc G3 CPU family dedicated to handhelds.

Breaking it down by segment, AMD's desktop share reached 34.9%, up 2.7 points year over year against Intel's 65.1%, despite Intel CPUs returning to Amazon's CPU Top 10 sales ranking yesterday. In the server CPU market, AMD managed to grow by 7.3 points year over year, reaching 34.5% against Intel's 65.5%. The competition is fierce in this segment, AMD has launched the 6th Gen EPYC "Venice" server processors powered by the "Zen 6" CPU microarchitecture, while Intel just announced its upcoming Xeon 7 "Diamond Rapids" CPUs and the "Crescent Island" graphics card for data centers and workstations. The laptop market is where AMD moved the most, climbing to 28.9%, up 8.4 points year over year, while Intel stays at 71.1%. Overall PC market share for AMD hit a record 30.3%, up 6.4 points year over year.

D-Link Corporation (TWSE: 2332), a global leader in networking and connectivity solutions, today announced the DAP-E3620 Series, a new family of BE3600 Wi-Fi 7 Enterprise Access Points designed to deliver secure, reliable, and high-performance wireless connectivity for modern business environments. Paired with D-Link's DMS-1250 Series 2.5 Gbps Multi-Gigabit Ethernet PoE Switches and the DAP-E3620 Series access points provides a complete end-to-end networking solution that maximizes Wi-Fi 7 performance. Together, they eliminate network bottlenecks, simplify power and connectivity through PoE, and deliver the bandwidth needed for latency-sensitive applications, high-density deployments, and next-generation enterprise networks.

The portfolio includes the ceiling-mount DAP-E3620, wall-plate DAP-E3620W, and outdoor DAP-E3620OU, offering flexible deployment across a wide range of business environments. Paired with D-Link's 2.5 Gbps Multi-Gigabit Ethernet PoE Switches, the DAP-E3620 series delivers a scalable, secure, and centrally managed enterprise networking solution.

ASRock Industrial today announced a strategic collaboration with Axelera AI to deliver high-performance, power-efficient, and cost-effective AI inference solutions for edge computing. The collaboration integrates Axelera Metis AIPU cards into ASRock Industrial's edge AI platforms, delivering a compact, scalable AI inference solution optimized for real-world edge environments. The solution enables parallel AI processing by extending the system's native AI computing capabilities with up to 214 TOPS of additional inference through the Metis M.2 or PCIe AI acceleration cards. Powered by Metis AIPU, it delivers superior performance while significantly lowering power consumption and total cost of ownership (TCO) compared with conventional GPU-based architectures. Designed for edge AI applications including LLM, machine vision inspection, robotics, smart retail and city environments, the solution enables organizations to deploy advanced AI workloads where data is generated while minimizing the system footprint, power requirements, and infrastructure costs.

Validated Edge AI Platforms Accelerate Deployment
These validated configurations provide customers with a scalable path to deploying advanced AI capabilities on compact edge systems. On ASRock Industrial's expandable Edge AIoT platforms, including the iEPF-11000S, iEPF-10000S, iEPF-9500S, iEPF-9040S, and iEPF-9040VS series, the Axelera Metis PCIe card enables scalable, industrial-grade AI processing for demanding edge applications. For compact edge systems such as the AI BOX-A395, NUC BOX-358H, NUC BOX-255H, and NUC BOX-155H, the Axelera Metis M.2 card delivers high-performance AI inference in a compact, power-efficient form factor. Supporting multiple AI workloads running in parallel, these solutions enable real-time analysis for machine vision, robotics, retail and hospitality, warehouse automation, smart surveillance, and intelligent transportation.

AMD began shipping the first production units of the AMD Versal Prime Series Gen 2 2VM3858 device in late 2025. Since then, the Versal 2VM3558 device has also entered full production, and the Versal 2VM3358 device is now sampling and on track to reach production later this year. With the majority of previously-announced Versal Prime Gen 2 adaptive SoCs now in customers' hands, today AMD is announcing the expansion of this portfolio with three new devices: the Versal 2VM3454, 2VM3254, and 2VM3104. These new adaptive SoCs deliver up to 100k DMIPs of scalar compute in packaging as small as 23 mm x 23 mm for embedded applications in Pro AV, broadcast, industrial IoT, and beyond.

Next-Level Performance, Optimized for Area
Versal Prime Series Gen 2 adaptive SoCs combine high-performance embedded CPUs for scalar processing, world-class programmable logic, cutting-edge video encode/decode IP, and support for DDR5 & LPDDR5X memory to enable next-generation embedded systems. The earliest Versal Prime Gen 2 devices, the 2VM3858, 2VM3558, and 2VM3358, feature 8 Arm Cortex -A78AE application cores and 10 Cortex-R52 real-time cores, delivering up to 10X scalar compute vs. previous AMD Versal or Zynq UltraScale+ adaptive SoCs. While this level of compute is compelling for applications such as avionics and robotics that involve complex algorithms, decision-making, and control, it comes with footprint and resource trade-offs that aren't ideal for every use case.

Swissbit introduces the N7000, a highly versatile PCIe Gen 4 SSD platform designed to balance performance, power efficiency, and cost across a wide spectrum of embedded applications. Offering more than 30 variants across a broad range of capacities, features, and temperature grades, the platform enables precise configuration for system-level power and performance requirements. Powered by 3D TLC BiCS8 NAND and a power-optimized industrial architecture, the series targets fanless, thermally constrained, and enclosed systems, while providing comprehensive data-security capabilities for mission-critical applications. The platform is further expanded by high-endurance pSLC variants and mission-critical models with enhanced protection features.

As Swissbit's first PCIe solution built entirely on in-house NAND packaging combined with Swissbit-developed controller and firmware, the N7000 strengthens supply-chain independence while delivering a reliable, energy-efficient foundation for next-generation boot and data storage drives with mixed workloads.

TetraMem Inc., a Silicon Valley-based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22 nm multi-level RRAM-based analog IMC system-on-chip (SoC).

The achievement marks a significant step toward the commercialization of analog computing architectures based on emerging non-volatile memory technologies, addressing the growing challenges of data movement, power consumption, and thermal constraints in modern AI systems.

SiFive, Inc., the gold standard for RISC-V computing, today announced the launch of the SiFive Performance P570 Gen 3, the most powerful and efficient out-of-order processor core in its class. Purpose-built for demanding edge AI, high-end consumer, and commercial IoT applications, the P570 Gen 3 delivers a large leap in performance compared to the popular P550 Gen 1, and also provides the most modern RVA23 ISA profile support.

This versatile IP can be used as the control processor in embedded IoT devices, running a full networking stack, or can be used as the main applications processor in consumer devices, running rich OSs, such as Android or enterprise-grade Linux. The high-performance vector unit supports running AI models and inference on edge devices.

The industrial world is transforming fast. As AI moves from the cloud to the edge, demand is rising for high-performance, low-latency computing that can operate reliably in real environments—powering everything from real-time defect detection in smart factories to advanced patient monitoring in healthcare. Edge AI needs hardware that's both intelligent and resilient. To meet this shift, GIGAIPC introduces a versatile lineup of motherboards based on Intel Core Ultra desktop processors (Series 2), enabling flexible system designs across diverse industrial scenarios and helping businesses deploy AI-ready solutions at scale.

Accelerating Industrial AI with Intel Core Ultra Series
Built around the Intel Core Ultra desktop processor (Series 2), this platform brings higher efficiency, stronger performance, and expanded connectivity to industrial and edge applications. This new architecture reduces package power by up to 58% in typical workloads, enabling IPC and embedded system developers to build more energy-efficient, thermally optimized, and reliable products for space-constrained and demanding environments. At the same time, performance improves over the previous generation, with up to 6% faster single-thread and up to 14% faster multi-thread performance to support real-time control, edge analytics, and multitasking workloads. Furthermore, the Intel 800 Series chipset extends platform compatibility with up to 24 PCIe 4.0 lanes, 8 SATA 3.0 ports, and 10 USB 3.2 ports, empowering industrial systems with superior scalability for I/O expansion, storage, and diverse connectivity.

Zyxel Networks, a leader in delivering secure and AI-powered cloud networking solutions, today announced the launch of the WBE665S BE22000 12-stream Wi-Fi 7 Triple-Radio NebulaFlex Pro ruggedized access point. The new solution presents MSPs and installers with an opportunity to address the rising demand for fast, reliable wireless connectivity within industrialized and challenging environments. Combining a durable IP67-rated weatherproof design and AI-powered cloud management, the WBE665S is designed for professional installers deploying networks in demanding locations.

In warehousing and distribution, manufacturing, cold storage, large-scale retail and other sectors, Wi-Fi is now being extended into zones that were once considered too harsh for wireless connectivity. Forklift trucks run connected tablets, while IoT sensors track the movement of consignments and goods, and handheld barcode scanners are used to drive greater efficiency and accuracy. In these environments, hazards such as extreme temperatures, humidity and dust are common and dropped connections, downtime and hardware failures can disrupt operations.

Espressif Systems (688018.SH) proudly announces the upcoming release of ESP32-S31, a high-performance dual-core Wi-Fi 6 + Bluetooth 5.4 + IEEE 802.15.4 + Ethernet System-on-Chip (SoC). Building on Espressif's proven track record, this versatile SoC addresses the growing demand for advanced IoT applications including consumer and industrial appliances, smart speakers, voice-controlled devices, and automation systems requiring comprehensive wireless connectivity, edge AI capabilities, rich HMI, and robust security features.

ESP32-S31 delivers comprehensive wireless connectivity by combining Wi-Fi 6 (802.11ax) in 2.4 GHz band, Bluetooth 5.4 with both Bluetooth LE (Low Energy) and Classic (BR/EDR) support, plus an IEEE 802.15.4 radio enabling Thread and Zigbee protocols for diverse IoT applications. ESP32-S31 will provide a seamless support for Matter protocol over Wi-Fi as well as Thread radio.

ASUS, a global leader in AIoT solutions, today announced full compatibility across its product portfolio with the newly launched Intel Core 200S Series processors. This integration spans a comprehensive range of industrial motherboards, configurable turnkey-to-order (CTOS) embedded systems, and rugged edge AI computers, further empowering sophisticated edge AI applications with enhanced performance, scalability, and reliability.

Purpose-built for embedded and industrial markets, the Intel Core 200S Series leverages the mature LGA 1700 socket and advanced performance hybrid architecture. Customers can easily upgrade existing Intel 600 series-based systems with a simple BIOS update, delivering up to 24 cores and 32 threads with PCIe 5.0 connectivity and DDR5-5600 memory support. This unlocks significant multi-tasking and AI inferencing power—especially for demanding use cases like machine vision, autonomous vehicles, and intelligent video analytics (IVA).

At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT products and applications: MediaTek Genio Pro, Genio 420 and Genio 360. The Genio Pro series is MediaTek's premium offering for high-performance IoT and embedded offerings, while Genio 420 and Genio 360 bring efficient system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.

With its impressive AI, multimedia, and display capabilities, along with rich OS support, Genio Pro enables OEMs to develop the next generation of autonomous mobile robotics, commercial drones, edge AI devices, machine vision systems, and transportation and logistics platforms.

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that provide real-time AI processing, deterministic performance, and long-term reliability in always-on environments.

To meet these needs, AMD is expanding its AMD Ryzen AI Embedded P100 Series processor portfolio. New processors feature up to 2x higher CPU core counts, up to 8x higher graphics processing unit (GPU) compute, and an estimated 36% higher system tera operations.

Ahead of Embedded World, Arduino announced the upcoming launch of its newest platform to democratize edge AI, Arduino VENTUNO Q. Named after the Italian word for twenty-one, VENTUNO Q builds on the iconic legacy of the popular Arduino UNO family and embodies the company's coming of age as it prepares to celebrate its foundation's 21st anniversary, later this month.

At the Edge of Intelligence: Where AI Takes Action
VENTUNO Q unites high-performance AI compute with deterministic real-time control, enabling systems that don't just interpret the world—they interact with it.
The board builds upon a dual-brain architecture similar to Arduino UNO Q, yet significantly upgrades capabilities leveraging the Qualcomm Dragonwing IQ8 Series for both traditional and generative AI workloads, supported by NPU acceleration delivering up to 40 dense TOPS, as well as a dedicated STM32H5 microcontroller for low-latency actuation and motor control. In addition, VENTUNO Q comes with 16 GB RAM—able to handle concurrent inference and complex multitasking—and an expandable 64 GB of storage.

Global high-performance computing and industrial embedded platform leader MSI will showcase a complete Edge AI ecosystem at Embedded World 2026, integrating edge computing platforms and vertical industry solutions to demonstrate industrial-grade Edge AI computing and on-site deployment capabilities.

As artificial intelligence applications increasingly extend from the cloud to field environments, MSI leverages industrial-grade reliability and platform integration expertise to help enterprises build intelligent systems with long-term operational stability, accelerating digital transformation across transportation, manufacturing, retail, agriculture, and UAV applications.