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All Team Group Industrial Products Pass Military-Grade Certification

Leading memory provider TEAMGROUP today announced that all of its industrial storage products have passed military standards testing for shock and vibration resistance. The company's unique graphene-coated copper heatsink was also awarded a U.S. utility patent and is the world's first heat sink to be used for industrial SSDs. In response to the growing Artificial Intelligence of Things (AIoT) and edge computing trends, TEAMGROUP continues to improve the durability, reliability, and safety of its industrial products, striving to create innovative solutions in the field of industrial control.

TEAMGROUP's industrial product series, including industrial memory modules, SSDs and memory cards, have all been tested and certified to meet military shock (MIL-STD-202G and MIL-STD-883K) and vibration (MIL-STD-810G) standards. Whether focused on edge computing or 5G related applications, these products are guaranteed to handle high-speed data processing and computing for long periods of continuous operation. TEAMGROUP has once again proven the stability and durability of its industrial products, which meet the demanding needs for data security and industrial control in extreme conditions.

Zyxel Communications Unveils New WiFi 6 Mesh Product Line

Zyxel Communications today announced the upcoming launch of a new WiFi 6 series, the DX3300, DX3301, EX3300, EX3301 and WX3100. The series includes a complete portfolio of DSL/Ethernet Gateways/IADs along with an extender. This new offering will be one of Zyxel's most cost-competitive product series for migration to WiFi 6 Mesh and is a great choice for service providers who want to offer these capabilities under an existing copper or fiber infrastructure.

"With the steady growth of IoT applications and connected appliances in households, customer demand for super-fast and reliable WiFi is immense," said James Harris, Senior Product Director for Zyxel Communications in EMEA. "This WiFi 6 Mesh series is giving service providers the opportunity to provide their customers with superior WiFi service on all their devices - anywhere in their home."

HiSilicon Develops RISC-V Processor to Move Away from Arm Restrictions

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics

Think Silicon S.A., the leading provider of ultra-low power GPU IP for embedded systems, and Ambiq, a technology leader recognized in ultra-low power microcontrollers (MCU), System-on-Chips (SoC) and Real-time Clocks (RTC), today announced the companies are working together to bring high-end graphics capabilities to designers of everyday wearable devices.

To provide high-performance, low-power graphics, Ambiq's newest Apollo4 SoC family now incorporates Think Silicon's NEMA |pico GPU and NEMA |dc display controller IP. The Apollo4 SoC family is the fourth-generation processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT ) platform. The Apollo4's complete hardware and software solution enables the battery-powered endpoint devices of tomorrow to achieve a higher level of intelligence without sacrificing battery life. The Apollo4 is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices, including smartwatches, children's watches, fitness bands, animal trackers, far-field voice remotes, predictive health and maintenance devices, smart security devices, and smart home devices.

NVIDIA to Deliver a Keynote on The Transformational Power of Accelerated Computing at COMPUTEX 2021 Hybrid

TAITRA (Taiwan External Trade and Development Council) announced today that NVIDIA will be delivering a keynote, entitled "The Transformational Power of Accelerated Computing, from Gaming to the Enterprise Data Center" at COMPUTEX 2021 Hybrid. Jeff Fisher, Senior Vice President of NVIDIA's GeForce Business Unit, will present on June 1 at 1:00 pm Taiwan time on the massive opportunities that GeForce PC gaming represents for the Taiwan ecosystem.

Manuvir Das, Head of Enterprise Computing at NVIDIA, will then address "The Coming Democratization of AI." He will share three shifts driving this trend and explain how enterprises that embrace them can thrive in the coming years.

ATP Launches PCIe Gen3 x4 NVMe SSDs in M.2 Type 1620 HSBGA Package

ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe Gen3 x4 NVMe solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package. Complying with M.2 specifications, the M.2 Type 1620 HSBGA measures just 16 (L) x 20 (W) x 1.6 (H) mm, supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications. N700 Series SSDs are built with 3D triple-level cell (TLC) configured as pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

AAEON Announces NVIDIA Jetson TX2 NX AI Edge Platform

- AAEON, an industry leader in embedded AI edge computing systems, announces a lineup of platforms currently under development powered by the newly released NVIDIA Jetson TX2 NX system on module (SOM). This range of systems, named the BOXER-823x Series, will augment AAEON's lineup of diverse solutions powered by the NVIDIA Jetson edge AI platform. With these platforms planned for release in mid-2021, early adopters have a chance to demo the systems while in development.

The NVIDIA Jetson TX2 NX is the latest addition to NVIDIA's Jetson lineup, slotting in between the NVIDIA Jetson Nano and NVIDIA Xavier NX. Jetson TX2 NX is powered by a NVIDIA Pascal GPU, quad-core Arm Cortex -A57 MPCore processor complex, offering 256 CUDA Cores, 4 GB of onboard LPDD4 memory, and 51.2 GB/s of memory bandwidth compatible with extensions of various standard bus interfaces. In total, this offers AI processing speeds up to 1.33 TFLOPS.

Kingston Digital Partners With NXP Semiconductors on i.MX 8M Plus Processors

Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it is partnering with NXP Semiconductors on their new i.MX 8M Plus applications processors. NXP is a leading applications processor developer for creating infrastructure solutions involving smart technology, and Kingston is proud that its eMMC embedded memory solution is part of the reference board for its latest application processor.

Smart device makers requesting NXP's engineering verification kits featuring the i.MX 8M Plus chipset will see Kingston's eMMC onboard. This creates a terrific opportunity to expand the relationship with NXP and also further showcase Kingston embedded memory solutions to other IoT manufacturers. Kingston's discrete memory and storage solutions were also embedded on NXP's previous-generation i.MX 6 and i.MX 7 series processor boards.

Xilinx Announces Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

Xilinx, Inc., the leader in adaptive computing, today announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world's only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

Revenue of Top 10 Foundries Expected to Increase by 20% YoY in 1Q21 in Light of Fully Loaded Capacities, Says TrendForce

Demand in the global foundry market remains strong in 1Q21, according to TrendForce's latest investigations. As various end-products continue to generate high demand for chips, clients of foundries in turn stepped up their procurement activities, which subsequently led to a persistent shortage of production capacities across the foundry industry. TrendForce therefore expects foundries to continue posting strong financial performances in 1Q21, with a 20% YoY growth in the combined revenues of the top 10 foundries, while TSMC, Samsung, and UMC rank as the top three in terms of market share. However, the future reallocation of foundry capacities still remains to be seen, since the industry-wide effort to accelerate the production of automotive chips may indirectly impair the production and lead times of chips for consumer electronics and industrial applications.

TSMC has been maintaining a steady volume of wafer inputs at its 5 nm node, and these wafer inputs are projected to account for 20% of the company's revenue. On the other hand, owing to chip orders from AMD, Nvidia, Qualcomm, and MediaTek, demand for TSMC's 7 nm node is likewise strong and likely to account for 30% of TSMC's revenue, a slight increase from the previous quarter. On the whole, TSMC's revenue is expected to undergo a 25% increase YoY in 1Q21 and set a new high on the back of surging demand for 5G, HPC, and automotive applications.

AAEON Announces the SRG-3352C Compact Edge IoT Gateway System

AAEON, an industry leader in Edge Computing solutions, announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments.
The SRG-3352C builds upon the features, durability and reliability of the SRG-3352 Edge IoT Gateway System with expanded support for more connections and wireless communications. All of this is packed into a compact form factor that makes deploying the SRG-3352C even easier, powering more flexible edge network deployments.

The SRG-3352C is powered by the Arm Cortex-A8 800 MHz RISC processor. This innovative processor reduces the energy requirements of the system, allowing for a more efficient system to help save electricity costs. While powerful enough to connect edge networks together, the low energy usage can help cities with achieving green energy goals, and even allow the system to operate on solar power or batteries. It also eliminates the need for dedicated heatsinks, allowing the system to operate in wider temperatures, from 0°C up to 60°C without loss in performance.

Qualcomm Announces World's First 10 Gigabit 5G Modem-RF System

Qualcomm Technologies, Inc. today announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is the world's first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial device launches in 2021. Snapdragon X65 is the Company's biggest leap in 5G solutions since the commercialization of its first modem-RF system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.

DigiTimes: DDR3 Prices to Soar 40-50% in 2021

Yes, you are reading that title correctly. Today we got ahold of information that DDR3 prices are going to skyrocket by as much as 40-50% this year! Despite DDR4 being present for seven years (since 2014), which is a lot in the world of tech, DDR3 is still thriving. Used in a wide range of devices like IoT, older servers, and long time running machines that need maintenance for decades. The DDR3 has been manufactured by SK Hynix, Samsung, and Micron, however, as technology moved on, these companies began the migration to the newer DDR4 standard. Even DDR5 exists today and it is currently manufactured.

So why is DDR3 soaring in value? It is because of the increased scarcity of this memory. SK Hynix has stopped the production of 2 Gb modules, leaving only the 4 Gb modules in production. Samsung has cut down the capacity from 60,000 wafers of DDR3 memory modules per month to just 20,000. This has caused the price of 2 Gb and 4 Gb modules to rise already as much as 30%. Despite the age of 14 years, DDR3 is still widely used in many systems. And because of that, the scarcity is making the price of the current memory increase. The price is expected to rise through the whole year and it could reach a 50% increase.

ADATA Unveils Industrial-grade IEM5141A eMMC

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions, today announces the ADATA IEM5141A embedded multi media cards. Ideally suited for industrial and IoT applications, the ADATA IEM5141A meets JEDEC eMMC 5.1 HS400 standard that delivers high read/write speeds of up to 300/170 MB/s,and low-power consumption of optimized performance.

The IEM5141A is a fully integrated device with built-in controllerand NAND Flash for higher capacities, durability, and perfectly suited for space-constrained IPCs and server boot-up applications. Furthermore, the IEM5141A offers Auto sleep on/off mode for low power consumption, Partitioning Management, and Thermal Throttling. It also features wide-temperature operability (-40°C - +85°C) and a 3,000 P/E cycle for excellent stability and reliability.

Qualcomm Announces Cristiano Amon Appointed Chief Executive Officer-Elect

Qualcomm Incorporated today announced that its Board of Directors has unanimously selected Cristiano Amon to succeed Steve Mollenkopf as CEO, effective June 30, 2021. Mollenkopf informed the Board of his decision to retire as CEO following 26 years with the Company. Amon, who has worked at Qualcomm since 1995, is currently President of the Company. Mollenkopf will continue his employment with the Company as a strategic advisor for a period of time.

Mollenkopf, 52, became CEO in March of 2014. He began his career as an engineer and, for nearly three decades, has helped define and lead Qualcomm's strategy and technology roadmap. His work helped propel smartphones into the mainstream and made Qualcomm a leader in 3G, 4G and now 5G, and he also oversaw the expansion into new industry segments such as the Internet of Things (IoT), RF Front End and Automotive. He was also instrumental in the Company's rise as a smartphone technology supplier. In addition, Mollenkopf successfully guided the Company through a number of extraordinary circumstances and challenges and begins the CEO transition process with the Company stabilized and well-positioned to continue to grow and drive value.

Tachyum Prodigy Software Emulation Systems Now Available for Pre-Order

Tachyum Inc. today announced that it is signing early adopter customers for the software emulation system for its Prodigy Universal Processor, customers may begin the process of native software development (i.e. using Prodigy Instruction Set Architecture) and porting applications to run on Prodigy. Prodigy software emulation systems will be available at the end of January 2021.

Customers and partners can use Prodigy's software emulation for evaluation, development and debug, and with it, they can begin to transition existing applications that demand high performance and low power to run optimally on Prodigy processors. Pre-built systems include a Prodigy emulator, native Linux, toolchains, compilers, user mode applications, x86, ARM and RISC-V emulators. Software updates will be issued as needed.

Dialog Semiconductor Licenses its Non-Volatile ReRAM Technology to GLOBALFOUNDRIES for 22FDX Platform

DIALOG SEMICONDUCTOR, a leading provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog's CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog's proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.

Imagination Launches IMG B-Series: Doing More with Multi-Core, up to 6 TeraFLOPs of Compute

Imagination Technologies announces IMG B-Series, a new expanded range of GPU IP. With its advanced multi-core architecture, B-Series enables Imagination customers to reduce power while reaching higher levels of performance than any other GPU IP on the market. It delivers up to 6 TFLOPS of compute, with an up to 30% reduction in power and 25% area reduction over previous generations and up to 2.5x higher fill rate than competing IP cores.

With IMG A-Series Imagination made an exceptional leap over previous generations, resulting in an industry-leading position for performance and power characteristics. B-Series is a further evolution delivering the highest performance per mm² for GPU IP and offering new configurations for lower power and up to 35% lower bandwidth for a given performance target, making it a compelling solution for top-tier designs.

New Arm Technologies Enable Safety-capable Computing Solutions for an Autonomous Future

Today, Arm unveiled new computing solutions to accelerate autonomous decision-making with safety capability across automotive and industrial applications. The new suite of IP includes the Arm Cortex -A78AE CPU, Arm Mali -G78AE GPU, and Arm Mali-C71AE ISP, engineered to work together in combination with supporting software, tools and system IP to enable silicon providers and OEMs to design for autonomous workloads. These products will be deployed in a range of applications, from enabling more intelligence and configurability in smart manufacturing to enhancing ADAS and digital cockpit applications in automotive.

"Autonomy has the potential to improve every aspect of our lives, but only if built on a safe and secure computing foundation," said Chet Babla, vice president, Automotive and IoT Line of Business at Arm. "As autonomous decision-making becomes more pervasive, Arm has designed a unique suite of technology that prioritizes safety while delivering highly scalable, power efficient compute to enable autonomous decision-making across new automotive and industrial opportunities."

DFI's Miniaturized IPCs Empower Edge AI Applications

In the era of Artificial Intelligence of Things (AIoT), Industrial PC (IPC) is expected more than just a computer for general data processing. Faced with the increasing workload at the edge, end devices are required to be smart, automated and interconnected, which reflects on the demands of AI computing and M2M (Machine-to-Machine) communication in small-sized PCs.

The demand for AI computing emerged on the account of the decentralization trends in recent years to reduce cloud computing workloads and costs, and to reinforce AI performance at the edge, high-end embedded solutions is a must. But to downsize them and meanwhile support the conditions required by edge environments, like tight spaces and abrupt temperature changes, it's definitely a challenge for IPC manufactures.

GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF's industry-leading 22FDX (22 nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF's new 22FDX+ builds on the company's 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.

Intel Introduces IoT-Enhanced Processors to Increase Performance, AI, Security

Today at the Intel Industrial Summit 2020, Intel announced new enhanced internet of things (IoT) capabilities. The 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series bring new artificial intelligence (AI), security, functional safety and real-time capabilities to edge customers. With a robust hardware and software portfolio, an unparalleled ecosystem and 15,000 customer deployments globally, Intel is providing robust solutions for the $65 billion edge silicon market opportunity by 2024.

"By 2023, up to 70% of all enterprises will process data at the edge. 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series processors represent our most significant step forward yet in enhancements for IoT, bringing features that address our customers' current needs, while setting the foundation for capabilities with advancements in AI and 5G," said John Healy, Intel vice president of the Internet of Things Group and general manager of Platform Management and Customer Engineering.

NVIDIA to Acquire Arm for $40 Billion, Creating World's Premier Computing Company for the Age of AI

NVIDIA and SoftBank Group Corp. (SBG) today announced a definitive agreement under which NVIDIA will acquire Arm Limited from SBG and the SoftBank Vision Fund (together, "SoftBank") in a transaction valued at $40 billion. The transaction is expected to be immediately accretive to NVIDIA's non-GAAP gross margin and non-GAAP earnings per share.

The combination brings together NVIDIA's leading AI computing platform with Arm's vast ecosystem to create the premier computing company for the age of artificial intelligence, accelerating innovation while expanding into large, high-growth markets. SoftBank will remain committed to Arm's long-term success through its ownership stake in NVIDIA, expected to be under 10 percent.

Arm Announces Cortex-R82: The First 64-bit Real Time Processor to Power the Future of Computational Storage

There is expected to be more than 79 zettabytes of IoT data in 2025, but the real value of this data is found in the insights it generates. The closer to the data source we can produce these insights the better, because of the improved security, latency and energy efficiency enabled. Computational storage is emerging as a critical piece of the data storage puzzle because it puts processing power directly on the storage device, giving companies secure, quick and easy access to vital information.

Our expertise and legacy in storage puts Arm in a strong position to address the changing needs of this market - with around 85% of hard disk drive controllers and solid-state drive controllers based on Arm, we are already a trusted partner for billions of storage devices. Today, we're announcing Arm Cortex-R82, our first 64-bit, Linux-capable Cortex-R processor designed to accelerate the development and deployment of next-generation enterprise and computational storage solutions.

TSMC Details 3nm N3, 5nm N5, and 3DFabric Technology

TSMC on Monday kicked off a virtual tech symposium, where it announced its new 12 nm N12e node for IoT edge devices, announced the new 3DFabric Technology, and detailed progress on its upcoming 5 nm N5 and 3 nm N3 silicon fabrication nodes. The company maintains that the N5 (5 nm) node offers the benefits of a full node uplift over its current-gen N7 (7 nm), which recently clocked over 1 billion chips shipped. The N5 node incorporates EUV lithography more extensively than N6/N7+, and in comparison to N7 offers 30% better power at the same performance, 15% more performance at the same power, and an 80% increase in logic density. The company has commenced high-volume manufacturing on this node.

2021 will see the introduction and ramp-up of the N5P node, an enhancement of the 5 nm N5 node, offering a 10% improvement in power at the same performance, or 5% increase in performance at the same power. A nodelet of the N5 family of nodes, called N4, could see risk production in Q4 2021. The N4 node is advertised as "4 nm," although the company didn't get into its iso-power/iso-performance specifics over the N5 node. The next major node for TSMC will be the 3 nm N3 node, with massive 25%-30% improvement in power at the same performance, or 10%-15% improvement in performance at same power, compared to N5. It also offers a 70% logic density gain over N5. 3DFabric technology is a new umbrella term for TSMC's CoWoS (chip on wafer on substrate), CoW (chip on wafer), and WoW (wafer on wafer) 3-D packaging innovations, with which it plans to offer packaging innovations that compete with Intel's various new 3D chip packaging technologies on the anvil.
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