News Posts matching "Kaby Lake"

Return to Keyword Browsing

ViewSonic Launches Its Kaby Lake-Powered NMP660 Chromebox

ViewSonic Corp., a leading global provider of visual solution products, introduces the ViewSonic NMP660 Chromebox. Paired with the company's ViewBoard family of interactive flat panel displays or any ViewSonic display, the ViewSonic NMP660 Chromebox can transform any Google classroom into a collaborative learning hub, or provide content management as a signage player and desktop virtualization solution for conference rooms. The ViewSonic NMP660 Chromebox delivers a complete and secure Chrome OS and Google Play experience.

The ViewSonic NMP660 Chromebox offers a quick out-of-the-box set-up, integrated Google management console and built-in security features, making it an ideal solution for educational and corporate environments. It can drive 4K content, and with the swift set-up, users can quickly access popular applications, websites and even games. Powered by Google Hangouts Meet, Google's video conferencing software, the NMP660 facilitate presentations, brainstorming, and decision-making - even when employees, clients, or students are spread across the globe.

Intel Intros Core i3-8130U Dual-core Low-power Processor

Intel today introduced the Core i3-8130U dual-core (2-core/4-thread) ultra low-power processor for thin and light notebooks, and 2-in-1 convertibles. Based on the 14 nm "Kaby Lake-U" silicon, the chip features a TDP of just 15W, making it ideal for all-day power devices. It is clocked at 2.40 GHz, with 3.40 GHz Turbo Boost frequency, and packs 4 MB of L3 cache. In its TDP-down mode, the CPU idles at 800 MHz, lowering the TDP to 10W. Its dual-channel DDR4 memory controller supports up to 32 GB of DDR4-2400 or LPDDR3-2133 memory. On the display side of things are the UHD Graphics 620 iGPU with clock speed ranging between 300 MHz and 1.00 GHz, 24 execution units, and hardware-acceleration for H.265/HEVC with 10bpc color.

BIOSTAR Introduces H110MDE Motherboard

BIOSTAR presents another entry-level micro-ATX form factor motherboard - the BIOSTAR H110MDE. This motherboard sports the entry-level Intel H110 chipset that supports the Socket LGA 1151 7th and 6th generation Intel Core processors. The BIOSTAR H110MDE is the perfect solution for desktop users on a tight budget by opting for Kaby Lake and Skylake processors. The compact micro-ATX form factor ensures high compatibility with most desktop cases in the market today. It also comes bundled with a free BullGuard Antivirus Software, another instant saving for builders.

The BIOSTAR H110MDE features the entry-level Intel H110 chipset for the 7th and 6th generation Intel Core processors offering builders instant savings by opting for the previous generation Intel processors. Still, the H110MDE offers the essential features and performance you need for daily computing with its dual DIMM slots supporting up to 32GB of 2400MHz DDR4 memory and a single PCI-E 3.0 x16 slot that supports high-end graphics card and NVMe solid-state drives if desired. As for connectivity, the H110MDE packs a Realtek RTL8111G offering up to 100 MB/s Ethernet connectivity along with two USB 3.1 Gen1 ports and a USB 3.1 Gen1 header offering high-speed data transfers for portable storage drives.

Intel Core i7-8705G with Vega M Obliterates 8th Gen Core + GeForce MX 150

It looks like Intel has achieved the design goals of its new Core i7-8705G multi-chip module, built in collaboration with AMD. Combining a 4-core/8-thread "Kaby Lake" CPU die with an AMD "Vega" GPU die that has its own 4 GB HBM2 memory stack, the ruthless duo put similarly-priced discrete GPU setups to rest, such as the combination of an 8th generation Core processor + NVIDIA GeForce MX 150. More importantly, entry-level discrete GPU combinations with high-end mobile CPUs have a similar power/thermal envelope as the i7-8705G MCM, but at significantly higher PCB footprint.

Dell implemented the Core i7-8705G on one of its latest XPS 15 2-in-1 models. The device was compared to an Acer Swift 3 (SF314-51), which combines a Core i5-8250U processor with GeForce MX 150 discrete graphics; and a Dell XPS 13 9370, which implements an 8th generation Core processor that has Intel's workhorse graphics core, the HD 620. The three devices squared off against each other at "Rise of the Tomb Raider" game benchmark. The i7-8705G averaged 35 frames per second (fps), while the MX 150 barely managed 24 fps. The HD 620 ran a bored intern's PowerPoint slideshow at 9 fps.

Intel Could Ditch AMD dGPU Die on Future Core G-series MCMs with "Arctic Sound"

Intel did the impossible in 2017, by collaborating with rival AMD after decades, on a product. The new Core i7-8000G series processors are multi-chip modules that combine quad-core "Kaby Lake" CPU dies with discrete AMD Radeon Vega GPU dies that have their own dedicated HBM2 stacks. With performance-segment notebooks and sleek AIO desktops building momentum for such products, Intel sees a future in building its own discrete GPUs, at least dies that can replace the AMD Radeon IP from its Core G-series processors.

With former AMD Graphics head Raja Koduri switching to Intel amidst rumors of the company investing in discrete GPUs of its own, details emerge of the company's future "Arctic Sound" and "Jupiter Sound" graphics IP, which point to the possibility of them being discrete GPU dies based on the Gen 12 and Gen 13 graphics architectures, respectively. According to Ashraf Eassa, a technology stock commentator with "The Motley Fool," both "Arctic Sound" and "Jupiter Sound" are discrete GPU dies that connect with Intel processor dies over EMIB, the company's proprietary high-density interconnect for multi-chip modules. It could be a long wait leading up to the two, since the company is still monetizing its Gen 9.5 architecture on 8th generation Core processors.

Intel Released "Coffee Lake" Knowing it Was Vulnerable to Spectre and Meltdown

By the time Intel launched its 8th generation Core "Coffee Lake" desktop processor family (September 25, 2017, with October 5 availability), the company was fully aware that the product it is releasing was vulnerable to the three vulnerabilities plaguing its processors today, the two more publicized of which, are "Spectre" and "Meltdown." Google Project Zero teams published their findings on three key vulnerabilities, Spectre (CVE-2017-5753 and CVE-2017-5715); and Meltdown (CVE-2017-5754) in mid-2017, shared with hardware manufacturers under embargo; well before Intel launched "Coffee Lake." Their findings were made public on January 3, 2018.

Intel's engineers would have had sufficient time to understand the severity of the vulnerability, as "Coffee Lake" is essentially the same micro-architecture as "Kaby Lake" and "Skylake." As one security researcher puts it, this could affect Intel's liability when 8th generation Core processor customers decide on a class-action lawsuit. As if that wasn't worse, "Skylake" and later micro-architectures could require micro-code updates in addition to OS kernel patches to work around the vulnerabilities. The three micro-architectures are expected to face a performance-hit, despite Intel extracting colorful statements from its main cloud-computing customers that performance isn't affected "in the real-world." The company was also well aware of Spectre and Meltdown before its CEO dumped $22 million in company stock and options (while investors and the SEC were unaware of the vulnerabilities).

Intel Core i7-8809G "Kaby Lake + Vega" MCM Specs Leaked Again, Indicate Dual IGP

Intel revealed specifications of its upcoming "Kaby Lake + AMD Vega" multi-chip module, the Core i7-8809G, on its website. A number of these specs were already sniffed out by Futuremark SystemInfo, but the website sheds light on a key feature - dual integrated graphics. The specs sheet confirms that the chip combines a 4-core/8-thread "Kaby Lake" CPU die with an AMD Radeon RX Vega M GH graphics die. The CPU is clocked at 3.10 GHz, and SystemInfo (from the older story) confirmed that its Turbo Boost frequency is up to 3.90 GHz. The L3 cache amount is maxed out a 8 MB. The reference memory clock is set at dual-channel DDR4-2400. What's more, the CPU component features an unlocked base-clock multiplier.

Things get interesting with the way Intel describes its integrated graphics solution. It mentions both the star-attraction, the AMD Radeon RX Vega M GH, and the Intel HD Graphics 630 located on the "Kaby Lake" CPU die. This indicates that Intel could deploy a mixed multi-GPU solution that's transparent to software, balancing graphics loads between the HD 630 and RX Vega M GH, depending on the load and thermal conditions. Speaking of which, Intel has rated the TDP of the MCM at 100W, with a rider stating "target package TDP," since there's no scientifically-correct way of measuring TDP on a multi-chip module. Intel could build performance-segment NUCs with this chip, in addition to selling them to mini-PC manufacturers.

IBASE Announces ET975 COM Express CPU Module for Factory Automation

IBASE Technology Inc., a world leader in the manufacture of industrial motherboard and embedded systems, today launches a new ET975 COM Express Computer-on-Module based on the ultra-low voltage 7th Generation Intel Core i7/i5/i3 processor (Kaby Lake-U) produced using a 14 nanometer manufacturing process technology. Characterized with product longevity, performance computing and low power consumption, the ET975 is suitable for applications found in factory automation, kiosk, communications, medical imaging and digital signage environments.

The ET975 comes with features that provide high performance and reliable operation across a wide range of industrial and embedded applications. The ET975 COM Express Type 6 compact module is equipped with two DDR4-2133 SO-DIMM sockets with a 32GB memory capacity, operating temperature range from 0°C to +60°C, and Intel Gen 9 HD low-power integrated graphics on the SoC providing 4K resolution via popular display interfaces such as DVI, HDMI, DisplayPort and LVDS. A rich set of standard I/Os available are one gigabit Ethernet, four USB 3.0 and eight USB 2.0 ports, two serial ports and two SATA III ports.

Akasa Releases Pascal MD Waterproof Case for Intel "Dawson Canyon" NUC

Akasa today introduced the Pascal MD (A-NUC40-M1) fan-less case for Intel 7th generation "Dawson Canyon" NUC boards, namely NUC7i3DNBE, NUC7i3DNKE, and NUC7i3DNHE. The case boasts of IP65-compliant waterproofing, including modular waterproof connectors at the back of the case, which connect internally with the various ports of the NUC board. Its body doubles up as a chunky, ridged aluminium heatsink, to cool the "Kaby Lake" SoC. The case measures 234.6 mm x 238 mm x 76.3 mm (WxDxH), and comes with 2 m long modular cables with connectors for power, USB 3.0, network, and HDMI. The case is recommended for outdoor builds such as digital signage, automobile, marine vessels (navigation computers), etc.

Intel Core i7-8709G with Vega M Graphics Parsed by Futuremark SystemInfo

Ahead of its Q1-2018 launch after a CES reveal, Intel's Core i7-8709G multi-chip module (MCM) was picked up by Thai PC enthusiast and tech vlogger "TUM APISAK," revealing some of its first specifications as read by Futuremark SystemInfo, a hardware-detection component common to various Futuremark benchmark suites. The "Kaby Lake-G" MCM combines a quad-core "Kaby Lake" CPU die with an AMD Radeon "Vega M" graphics die that has a dedicated HBM2 memory stack on-package.

Futuremark SystemInfo puts out quite a few specs of the i7-8709G, beginning with its 4-core/8-thread CPU based on the "Kaby Lake" micro-architecture, which is clocked at 3.10 GHz with 3.90 GHz Turbo Boost; Radeon RX Vega M (694C:C0) graphics core with 4 GB of HBM2 memory across a 1024-bit memory bus; with its GPU engine running at 1.19 GHz, and memory at 800 MHz (204.8 GB/s memory bandwidth); although the core-config of the iGPU remains a mystery. We recommend you maximize the video below for legible details.

Shuttle's SZ270R9 Gaming and VR Cube Comes with Overclocking on Demand Function

Shuttle Computer Group, Inc., one of the world's leading designers of small form computers, announces a new and powerful cube-sized computer, its SZ270R9, designed for advanced home and portable gaming, along with virtual reality applications. Unlike other PCs, once set, users can overclock with the Turbo button for the quickest, most realistic action. In spite of its small size, it has an impressive expansion capability and storage capacity. With lots of interior space, the SZ270R9 supports large-format dual-slot graphics cards; users can install up to four 2.5" or 3.5" hard drives and two m.2 bays. It also supports Intel's new Optane Memory to improve data processing and system speed.

"This is the ultimate gaming PC, power packed with an external design that looks like you're ready for battle," said Robert Garcia, channel manager, Shuttle Computer Group. "And when you press the overclock button, watch out! You'll be the winner for sure."

Latest Intel Roadmap Slide Leaked, Next Core X is "Cascade Lake-X"

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

8th and 9th Gen Intel Core Processor Model Names Revealed

Intel 9th generation Core processors could hit the shelves some time in 2018, after Intel has ironed out supply issues of its current 8th generation Core "Coffee Lake" lineup, and figured out what to do with the unsold 7th generation Core "Kaby Lake" inventory. It has been rumored that the company could increase core-counts across the board again, with the introduction of an eight-core part in the mainstream-desktop lineup, probably to better segment the Core i7 series from the Core i5 series. It's not implausible to expect the next-generation Core i7 MSDT parts to be 8-core/16-thread, and Core i5 MSDT 6-core/12-thread, with 4-core/4-thread or 8-thread Core i3 parts making up the entry-level, which would bring Intel's MSDT lineup on core/thread-count parity with AMD.

The change-log of the latest FinalWire AIDA64 version spells out several 9th generation Core processor model numbers, at least the Core i5 and Core i3 SKUs. The Core i5 lineup includes the i5-9600K, followed by the i5-9600, i5-9500, i5-9400, i5-9400T, i3-9300, i3-9300T, i3-9100, i3-9100T, i3-9000, and i3-9000T, with the "T" extension denoting lower TDP, probably at 35W, while the rest of the lineup has its TDP rated at 65W. The change-log also speaks about Intel's second-wave of Core "Coffee Lake" parts, which launch early-2018, alongside its other 300-series chipset for the platform, such as the H370, B360, and H310.

Researchers Find Glaring Intel ME Security Flaws, Company Outs Detection Tool

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

ECS Intros LIVA Z Plus ZE Mini-PC with Legacy Connectivity

ECS today rolled out the LIVA Z Plus ZE mini-PC featuring legacy connectivity, combined with otherwise modern hardware, which puts its applications halfway between retail/POS (point of sale) and educational/robotics. The mini-PC features four RS232 serial COM ports, so you can directly plug in POS peripherals such as barcode/RFID scanners, receipt printers, credit card POS machines, electronic weighing scales, etc. It comes with rather powerful 7th generation "Kaby Lake" SoC options, including Celeron 3965U, Core i3-7100U, Core i5-7200U, and i5-7500U, bolstered by Intel vPro.

Besides factory-fitted SoCs, the LIVA Z Plus ZE comes with two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel memory, and one M.2-2242 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring. Besides the four RS232 ports, it features four USB 3.0 ports (three type-A, one type-C), two 1 GbE wired network interfaces, 802.11ac + Bluetooth 4.0 WLAN, stereo HD audio, and display outputs that include one each of HDMI 1.4 and miniDisplayPort. Measuring 117 mm x 128 mm x 51 mm (WxDxH), it supports VESA mounting, which lets you tuck it away behind your monitor. It draws power from an external 65W power brick.

Intel NUC Based on Intel+Vega MCM Leaked

The first product based on Intel's ambitious "Kaby Lake-G" multi-chip module, which combines a quad-core "Kaby Lake-H" die with a graphics die based on AMD "Vega" architecture, will be a NUC (next unit of computing), and likely the spiritual successor to Intel's "Skull Canyon" NUC. The first picture of the motherboard of this NUC was leaked to the web, revealing a board that's only slightly smaller than the mini-ITX form-factor.

The board draws power from an external power brick, and appears to feature two distinct VRM areas for the CPU and GPU components of the "Kaby Lake-G" MCM SoC. The board feature two DDR4 SO-DIMM slots which are populated with dual-channel memory, and an M.2 NVMe slot, holding an SSD. There are two additional SATA 6 Gb/s ports, besides a plethora of other connectivity options.

Intel Hires Raja Koduri, to Develop Discrete GPUs, This Time for Real

Intel hired Raja Koduri, who resigned as head of AMD's Radeon Technologies Group (RTG), earlier this week. Koduri has been made Senior Vice President and Chief Architect of Intel's future discrete GPUs. That's right, Intel has renewed its dreams to power high-end graphics cards that compete with AMD and NVIDIA. Intel's last attempt at a discrete GPU was "Larrabee," which evolved into a super-scalar multi-core processor for HPC applications under the Xeon Phi line.

This development heralds two major theories. One, that Intel's collaboration with AMD RTG on graphics IP could only go further from here, and what is a multi-chip module of Intel and AMD IP now, could in the future become a true heterogeneous die of Intel's and AMD's IP. Two, that the consolidation of AMD's graphics assets and IP into a monolithic entity as RTG, could make it easier to sell it lock, stock, and barrel, possibly to Intel.

Intel to Rebrand Pentium "Kaby Lake" Processors as Pentium Gold

Intel this Tuesday, issued a curious-looking product-change notification (PCN) directed at retail-channel distributors, which points to the re-branding of 7th generation Pentium "Kaby Lake" desktop processors under the new Pentium Gold brand (PCN #115827-00). The re-brand affects retail SKUs of the Pentium G4560, G4620, and G4600. Intel is borrowing the precious-metal nomenclature from its Xeon product-line over to the Pentium brand, which will help consumers tell the MSDT (mainstream-desktop) Pentium processors from the ULP (ultra low-power) chips branded Pentium.

When this product-change comes into effect from the 2nd of November, 2017, MSDT Pentium dual-core chips will be branded Pentium Gold, while low-power "Gemini Lake" SoCs will bear the Pentium Silver brand, besides Celeron. Re-branded names apart, the Pentium Gold SKUs will be identical to the parts they are replacing. The Pentium G4560, for example, will be re-branded Pentium Gold G4560 (or simply "4560") and will carry an identical feature-set. You probably won't even need to update your motherboard BIOS (of your 100-series and 200-series chipset motherboards) to use these chips. It's not likely that these chips will work on 300-series chipset motherboards since they feature a different pin-map, and the retail box design will reflect that with clear markings. The name change also comes with a refreshed case-badge and a slightly modified box design.

Intel Core i7-8700K "Coffee Lake" De-lidded, Reveals Larger Die

A member of the HKEPC tech community, with access to an upcoming Core i7-8700K six-core mainstream-desktop processor, wasted no time in de-lidding it (removing its integrated heatspreader or IHS). It was revealed that Intel is still using thermal-paste between the IHS and the CPU die. The "Coffee Lake" die itself is as wide as the "Kaby Lake," but is visibly longer. It has a die area of approximately 151 mm², compared to the 126 mm² of "Kaby Lake." This is due to its increased CPU core count to 6, and a proportionate increase in last-level cache (L3 cache) to 12 MB. The die is marginally northwest of center, so you can get away placing your TIM blob dead-center of the IHS.

Intel Coffee Lake CPUs Have Different Pin Configuration than Previous Generation

Intel is set to release its newest generation of processors, known as code name Coffee Lake in just a few days. Recent controversy has focused around the inability of newer processors to be used with motherboards supporting the previous generation CPUs. Intel has released data sheets for Coffee Lake CPUs, and images of the socket's layout support Intel's statement that Coffee Lake will indeed need a new socket design. Specifically, there are more pins responsible for delivering the main power for the CPU cores, known as VCC pins, with Coffee Lake motherboards sporting 146 VCC pins illustrated in the first image below, compared to Kaby Lake and Skylake's 128 illustrated in the second image.

With these pins responsible for delivering power to the CPU cores, this may suggest that previous generation motherboards allowed for lower power operation than is possible with the higher core count of Coffee Lake processors. Whatever the reason, it definitely confirms that Coffee Lake CPUs are hardware-incompatible with previous generation motherboards, and not simply a software or BIOS-level lock.

7th Gen Core "Kaby Lake" Won't Work on 300-series Chipset Motherboards

The upcoming Intel 300-series chipset, and LGA1151 socket continues to be a source of chaos for PC builders. While the 100-series and 200-series chipset based motherboards support both 6th generation Core "Skylake," and 7th generation Core "Kaby Lake" processors, they will not support the upcoming 8th generation Core "Coffee Lake" chips. What's more, the upcoming 300-series chipset motherboards, which were earlier believed to feature backwards-compatibility for "Skylake" and "Kaby Lake" chips, will not support them, according to a report.

The LGA1151 socket between the two platforms remains unchanged, down to the package notches, which are designed to prevent you from installing a processor on an incompatible motherboard (eg: LGA1150 processors on LGA1151 motherboards). This isn't even a case like the incompatibility between LGA2011 and LGA2011v3, where the latter features DDR4 memory I/O, compared to the former's DDR3. Platform segmentation, and synthetically keeping up with a product development cycle, by forcing people to upgrade motherboards every two generations, appears to be Intel's primary motivation. The report, however, doesn't rule out the possibility of 300-series chipset motherboards getting support for older LGA1151 processors in the future, through BIOS updates.

ZOTAC Announces ZBOX MAGNUS EK and ER Series Compact Gaming Desktops

ZOTAC International, a Hong Kong based and a global manufacturer of innovation which created the first-ever Mini Gaming PC, continues to push the MAGNUS Series to a previously impossible level. With the all-new MAGNUS EK and ER Series powered by high-performance Intel or AMD Ryzen processors with a ZOTAC GeForce GTX 1070/1060 Series graphics card, ZOTAC is showcasing the first Mini PC series ever built with desktop sized graphics cards. Packing the punch that rivals full-size desktop rigs twice their weight, they are solid choices even for demanding pro gamers.

ZOTAC takes the unprecedented step of packing the best-performing desktop graphics card into the small footprint of the Gaming Mini PC paired with a next-generation processor. MAGNUS EK Series features a 7th Gen Intel Core quad-core processor based on the Kaby Lake architecture to deliver higher frequencies in speeds for a powerful gaming experience. Plus it adds the revolutionary new Intel Optane Memory that enables quick access times while allowing for larger storage capacities.

Intel Core i7-8700K Put Through Cinebench R15

Intel's upcoming Core i7-8700K six-core mainstream desktop processor was put through Cinebench R15, where it was seen trading blows with much higher high-end desktop (HEDT) processors, thanks to its core-count and relatively high clock speeds. Unlike HEDT processors, the i7-8700K doesn't carry a bulky uncore, keeping its TDP low at 95W, enabling high clock speeds. This reflects in its single-threaded performance, where it was significantly faster than older chips, some of which are even HEDT, but since the "Coffee Lake" architecture is essentially a refresh of the "Kaby Lake" architecture, the chip could lose out on single-threaded performance to the Core i7-7700K on account of slightly lower clock speeds.

The multi-threaded test is where the action is. Bolstered by two more cores, four more threads, and 4 MB more L3 cache, the i7-8700K is proportionately faster than the quad-core chips it succeeds, and is even faster than older 6-core HEDT chips thanks to higher clock speeds, and a newer micro-architecture. The i7-8700K features 6 cores, 12 threads enabled by HyperThreading, Intel's newest Turbo Boost Max 3.0 technology introduced with its Core X family, and 12 MB of L3 cache. It launches on the 5th of October, at an expected price of around USD $380, if not more.
A video presentation by YouTuber Karl - MrTechQc, who tested the chip, follows

ZOTAC Announces its ZBOX M-series and P-series Mini PCs

ZOTAC International, a Hong Kong based and a global manufacturer of innovation, today announced two groundbreaking releases from the acclaimed ZBOX M series and P series Mini PCs. More customized to contemporary users' needs, yet equipped with future fast technologies. The ZBOX MI553 has a refreshing all-new minimal and elegant design with future fast technologies permeating all of the Mini PC, while the ZBOX PI225 tops world rankings in being the smallest and thinnest Mini PC ever.

"Both ZBOX MI553 and PI225 inherit the defining features of their predecessors, and perhaps employ the most ambitious designs and features yet in a Mini PC. We want to make sure users can enjoy a simple and fast computing experience," said Chinny Chuang, ZOTAC Global Director of Marketing. Future Fast - The all-new ZBOX MI553 introduces the largest surface-area of ventilation ever that with future fast technologies that brings speeding performance to the forefront. It features a 7th Gen Intel Core processor based on the Kaby Lake architecture, a revolutionary Optane Memory technology, Thunderbolt 3, USB 3.1 Gen2, and the fast lanes to support a NVMe M.2 SSD. Professionally dressed for the office and casually comfortable for the home, the all new ZBOX MI553 is the multi-functional do it all Mini PC.

Lists of Motherboards Based on Intel Z370 Express Chipset Surface

Intel is rushing in its 8th generation Core mainstream-desktop (MSDT) processor lineup, codenamed "Coffee Lake," later within Q3-2017. The first four of these will be six-core SKUs, which while built in the "LGA1151" package, the same ones as the 7th generation "Kaby Lake" and 6th generation "Skylake," will not be compatible with motherboards based on the older 100-series and 200-series chipsets, for reasons unknown. Upcoming motherboards based on the 300-series chipset, could support not just 8th generation "Coffee Lake" processors, but also older LGA1151 processors. The chipset lineup consists of the Z370 Express, which features support for CPU overclocking and 2-way multi-GPU; and the mid-range B360 Express chipset, which could launch either in late-2017 or early-2018, alongside the first Core i3 "Coffee Lake" chips. The first wave of motherboards to go with "Coffee Lake" processors will hence be Z370-based. VideoCardz compiled a partial, but growing list of motherboards which could make up the first wave.
Return to Keyword Browsing