News Posts matching "Kaby Lake"

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ASUS Introduces new Prime X299-Deluxe II and ROG Dominus Extreme

Intel's high-end desktop platform raises the stakes with updated Intel Core X-Series processors that boast a lot more of everything, including cores, cache, bandwidth, and more. The additional processing power plows through CPU-intensive tasks, while the extra bandwidth lets you add more GPUs and NVMe SSDs to accelerate a wider range of workloads.

Anchored by the X299 platform, this upper echelon scales up to 18 cores with the new Core i9-9980XE. It's now joined by an even more exclusive chip with 28 cores and an entirely separate platform that redefines extreme desktop PCs. We have new motherboards designed to exploit the strengths of each CPU. The Prime X299-Deluxe II gives professionals and power users a flexible foundation for serious work and it is not alone, ROG engineers are also working on a new Rampage motherboard geared toward hardcore gamers and overclockers, while the ROG Dominus Extreme shows what's possible when our engineers have the freedom to go beyond traditional boundaries

Intel Sneaks in Windows 7-compatible H310 Chipset Revision

Without making too much noise about it, Intel sneaked in a revision of its H310 Express entry-level chipset with support for Windows 7. Microsoft, if you'll recall, restricted support for newer processors (Intel "Kaby Lake" and newer, and AMD "Zen" and newer) on the 9-year old operating system, late-2016. There are ways around this restriction. The revised H310 chipset is pin-compatible with its predecessor, and hence major motherboard manufacturers are putting out revisions of their H310 motherboards with the newer chipset, being referred to as either "H310C" or "H310 R2.0."

To bolster this change, Intel is also releasing Windows 7 drivers for the chipset (INF Update Utility); integrated USB 3.0 controllers, the SATA AHCI controller, and even Management Engine Interface (MEI). What you don't get (yet), however, is Windows 7 versions of Intel UHD 6xx Graphics drivers, so you're restricted to using discrete graphics cards. Windows 7 refuses to die down, not just in enterprises, but also among PUBG gamers from China.

Intel "Crimson Canyon" NUCs with Discrete GPUs Up for Pre-order

One of the first Intel NUC (next unit of computing) mini PCs to feature completely discrete GPUs (and not MCMs of CPUs and GPUs), the "Crimson Canyon" NUC8i3CYSM and NUC8i3CYSN, are up for pre-order. The former is priced at USD $529, while the latter goes for $574. The two combine Intel's 10 nm Core i3-8121U "Cannon Lake" SoC with AMD Radeon 540 discrete GPU. Unlike the "Hades Canyon" NUC, which features an MCM with a powerful AMD Radeon Vega M GPU die and a quad-core "Kaby Lake" CPU die; the "Crimson Canyon" features its processor and GPU on separate packages. The Radeon 540 packs 512 stream processors, 32 TMUs, and 16 ROPs; with 2 GB of GDDR5 memory.

All that's differentiating the NUC8i3CYSM from the NUC8i3CYSN is memory. You get 4 GB of LPDDR4 memory with the former, and 8 GB of it with the latter. Both units come with a 2.5-inch 1 TB HDD pre-installed. You also get an M.2-2280 slot with PCIe 3.0 x4 wiring, and support for Optane caching. Intel Wireless-AC 9560 WLAN card handles wireless networking, while an i219-V handles wired. Connectivity includes four USB 3.0 type-A ports, one of which has high current; an SDXC card reader, CIR, two HDMI 2.0 outputs, and 7.1-channel HD audio. The NUC has certainly grown in size over the years. This one measures 117 mm x 112 mm x 52 mm (WxDxH). An external 90W power-brick adds to the bulk.

QNAP Completes its 9-bay NAS Lineup With the Award-Winning TVS-951X 10GBASE-T Multimedia NAS

Following the releases of the TS-932X (powered by an AnnapurnaLabs CPU) and the TS-963X (powered by an AMD CPU), QNAP Systems, Inc. today completes the high-capacity-compact-size 9-bay NAS lineup with the introduction of the TVS-951X 10GbE multimedia NAS. The new model is powered by a 7th-generation Intel Kaby Lake processor, providing a NAS private cloud solution that combines high capacity and 10GbE high-speed connectivity. The TVS-951X NAS has also won the Red Dot Award (2018) and Computex d&i Award for high-quality product design.

Samsung Launches the Notebook 5 and Notebook 3

Samsung Electronics today announced the Samsung Notebook 5 and Notebook 3, completing the Notebook portfolio. With a seamless, fluid design and embedded with the latest hardware balancing speed, power and usability, these Notebooks are made for the everyday computing experience that fuses comfort, performance and style.

Design
Both Notebooks feature a slim, sleek, zero-screw contemporary finish continuing Samsung's design heritage. The Samsung Notebook 5 and Notebook 3 measure just 19.6mm and 19.9mm wide respectively, making them easy to use, carry, and transport - whatever your lifestyle. Designed to blend into any environment, the Samsung Notebook 3 is available in 15 inches and 14 inches, as well as, four unique colors - Misty Gray, Night Charcoal, Deep Peach, and Pure White, while the Samsung Notebook 5 is available in 15 inches and comes in a timeless and sophisticated Light Titan color, wrapped in a stylish metal body.

Biostar Intros TB250-BTC D+ Motherboard for Mining Builds

Biostar introduced the TB250-BTC D+ motherboard for crypto-mining builds. This board appears to be a re-brand of Colorful C.B250A-BTC PLUS V20. This is probably a case of Colorful piggybacking Biostar to reach markets it cannot (yet). The socket LGA1151 motherboard supports 6th and 7th generation Core "Skylake" and "Kaby Lake" processors, with basic I/O connectivity, and a single DDR4 SO-DIMM slot. The star attraction here are eight PCI-Express x16 slots with 2U spacing between them. One of these slots is electrically x16, the other are x1 (you only need x1 for mining). There are also eight 6-pin PCI-Express I/O ports, so the x16 slots are powered. The board is 195 mm wide, and 485 mm long, designed for mining cases, or something miners put together themselves. It is expected to be priced around $150.

Xiaomi Reveals the 15.6-inch Mi Gaming Laptop

Xiaomi held its Mi Mix 2S launch event at Shanghai, China a few hours ago where the Chinese giant revealed their first-ever gaming laptop. The Mi Gaming Laptop sports a clean, brushed aluminum chassis which measures 20.9mm at its thickest point. Being a gamer-oriented product, Xiaomi has added RGB lighting to four different zones around the laptop's body. The Mi Gaming Laptop features a 15.6-inch Full HD panel with a 72% color gamut and slim 9.9mm bezels. The keyboard also has its own RGB lighting and comes with features like 30-key rollover and five programmable keys. In terms of connectivity options, the Mi Gaming laptop provides users with four high-speed USB 3.0 ports, two USB-C ports, a HDMI port, and a 3.5mm jack with its own high-powered amp. Equipped with stereo 3W speakers, the laptop has also earned the Dolby Atmos and Hi-Res Audio certifications.

For cooling, Xiaomi implemented their own 3+2 design for the heatpipes and four air exhausts. Xiaomi's solution relies on two fans to provide active cooling. The Mi Gaming laptop is powered by Intel's latest Kaby Lake Core i7-7700HQ processor and it's available in two versions. The base version carries a $960 price tag and comes with a NVIDIA GeForce GTX 1050 Ti, 8GB of memory, a 128GB SSD and a 1TB hard drive. The high-end version goes for $1,440 and boasts an NVIDIA GeForce GTX 1060, 16GB of memory, a 256GB NVMe SSD, and a 1TB hard drive. The Mi Gaming Laptop will go on sale in China from April 13.

ViewSonic Launches Its Kaby Lake-Powered NMP660 Chromebox

ViewSonic Corp., a leading global provider of visual solution products, introduces the ViewSonic NMP660 Chromebox. Paired with the company's ViewBoard family of interactive flat panel displays or any ViewSonic display, the ViewSonic NMP660 Chromebox can transform any Google classroom into a collaborative learning hub, or provide content management as a signage player and desktop virtualization solution for conference rooms. The ViewSonic NMP660 Chromebox delivers a complete and secure Chrome OS and Google Play experience.

The ViewSonic NMP660 Chromebox offers a quick out-of-the-box set-up, integrated Google management console and built-in security features, making it an ideal solution for educational and corporate environments. It can drive 4K content, and with the swift set-up, users can quickly access popular applications, websites and even games. Powered by Google Hangouts Meet, Google's video conferencing software, the NMP660 facilitate presentations, brainstorming, and decision-making - even when employees, clients, or students are spread across the globe.

Intel Intros Core i3-8130U Dual-core Low-power Processor

Intel today introduced the Core i3-8130U dual-core (2-core/4-thread) ultra low-power processor for thin and light notebooks, and 2-in-1 convertibles. Based on the 14 nm "Kaby Lake-U" silicon, the chip features a TDP of just 15W, making it ideal for all-day power devices. It is clocked at 2.40 GHz, with 3.40 GHz Turbo Boost frequency, and packs 4 MB of L3 cache. In its TDP-down mode, the CPU idles at 800 MHz, lowering the TDP to 10W. Its dual-channel DDR4 memory controller supports up to 32 GB of DDR4-2400 or LPDDR3-2133 memory. On the display side of things are the UHD Graphics 620 iGPU with clock speed ranging between 300 MHz and 1.00 GHz, 24 execution units, and hardware-acceleration for H.265/HEVC with 10bpc color.

BIOSTAR Introduces H110MDE Motherboard

BIOSTAR presents another entry-level micro-ATX form factor motherboard - the BIOSTAR H110MDE. This motherboard sports the entry-level Intel H110 chipset that supports the Socket LGA 1151 7th and 6th generation Intel Core processors. The BIOSTAR H110MDE is the perfect solution for desktop users on a tight budget by opting for Kaby Lake and Skylake processors. The compact micro-ATX form factor ensures high compatibility with most desktop cases in the market today. It also comes bundled with a free BullGuard Antivirus Software, another instant saving for builders.

The BIOSTAR H110MDE features the entry-level Intel H110 chipset for the 7th and 6th generation Intel Core processors offering builders instant savings by opting for the previous generation Intel processors. Still, the H110MDE offers the essential features and performance you need for daily computing with its dual DIMM slots supporting up to 32GB of 2400MHz DDR4 memory and a single PCI-E 3.0 x16 slot that supports high-end graphics card and NVMe solid-state drives if desired. As for connectivity, the H110MDE packs a Realtek RTL8111G offering up to 100 MB/s Ethernet connectivity along with two USB 3.1 Gen1 ports and a USB 3.1 Gen1 header offering high-speed data transfers for portable storage drives.

Intel Core i7-8705G with Vega M Obliterates 8th Gen Core + GeForce MX 150

It looks like Intel has achieved the design goals of its new Core i7-8705G multi-chip module, built in collaboration with AMD. Combining a 4-core/8-thread "Kaby Lake" CPU die with an AMD "Vega" GPU die that has its own 4 GB HBM2 memory stack, the ruthless duo put similarly-priced discrete GPU setups to rest, such as the combination of an 8th generation Core processor + NVIDIA GeForce MX 150. More importantly, entry-level discrete GPU combinations with high-end mobile CPUs have a similar power/thermal envelope as the i7-8705G MCM, but at significantly higher PCB footprint.

Dell implemented the Core i7-8705G on one of its latest XPS 15 2-in-1 models. The device was compared to an Acer Swift 3 (SF314-51), which combines a Core i5-8250U processor with GeForce MX 150 discrete graphics; and a Dell XPS 13 9370, which implements an 8th generation Core processor that has Intel's workhorse graphics core, the HD 620. The three devices squared off against each other at "Rise of the Tomb Raider" game benchmark. The i7-8705G averaged 35 frames per second (fps), while the MX 150 barely managed 24 fps. The HD 620 ran a bored intern's PowerPoint slideshow at 9 fps.

Intel Could Ditch AMD dGPU Die on Future Core G-series MCMs with "Arctic Sound"

Intel did the impossible in 2017, by collaborating with rival AMD after decades, on a product. The new Core i7-8000G series processors are multi-chip modules that combine quad-core "Kaby Lake" CPU dies with discrete AMD Radeon Vega GPU dies that have their own dedicated HBM2 stacks. With performance-segment notebooks and sleek AIO desktops building momentum for such products, Intel sees a future in building its own discrete GPUs, at least dies that can replace the AMD Radeon IP from its Core G-series processors.

With former AMD Graphics head Raja Koduri switching to Intel amidst rumors of the company investing in discrete GPUs of its own, details emerge of the company's future "Arctic Sound" and "Jupiter Sound" graphics IP, which point to the possibility of them being discrete GPU dies based on the Gen 12 and Gen 13 graphics architectures, respectively. According to Ashraf Eassa, a technology stock commentator with "The Motley Fool," both "Arctic Sound" and "Jupiter Sound" are discrete GPU dies that connect with Intel processor dies over EMIB, the company's proprietary high-density interconnect for multi-chip modules. It could be a long wait leading up to the two, since the company is still monetizing its Gen 9.5 architecture on 8th generation Core processors.

Intel Released "Coffee Lake" Knowing it Was Vulnerable to Spectre and Meltdown

By the time Intel launched its 8th generation Core "Coffee Lake" desktop processor family (September 25, 2017, with October 5 availability), the company was fully aware that the product it is releasing was vulnerable to the three vulnerabilities plaguing its processors today, the two more publicized of which, are "Spectre" and "Meltdown." Google Project Zero teams published their findings on three key vulnerabilities, Spectre (CVE-2017-5753 and CVE-2017-5715); and Meltdown (CVE-2017-5754) in mid-2017, shared with hardware manufacturers under embargo; well before Intel launched "Coffee Lake." Their findings were made public on January 3, 2018.

Intel's engineers would have had sufficient time to understand the severity of the vulnerability, as "Coffee Lake" is essentially the same micro-architecture as "Kaby Lake" and "Skylake." As one security researcher puts it, this could affect Intel's liability when 8th generation Core processor customers decide on a class-action lawsuit. As if that wasn't worse, "Skylake" and later micro-architectures could require micro-code updates in addition to OS kernel patches to work around the vulnerabilities. The three micro-architectures are expected to face a performance-hit, despite Intel extracting colorful statements from its main cloud-computing customers that performance isn't affected "in the real-world." The company was also well aware of Spectre and Meltdown before its CEO dumped $22 million in company stock and options (while investors and the SEC were unaware of the vulnerabilities).

Intel Core i7-8809G "Kaby Lake + Vega" MCM Specs Leaked Again, Indicate Dual IGP

Intel revealed specifications of its upcoming "Kaby Lake + AMD Vega" multi-chip module, the Core i7-8809G, on its website. A number of these specs were already sniffed out by Futuremark SystemInfo, but the website sheds light on a key feature - dual integrated graphics. The specs sheet confirms that the chip combines a 4-core/8-thread "Kaby Lake" CPU die with an AMD Radeon RX Vega M GH graphics die. The CPU is clocked at 3.10 GHz, and SystemInfo (from the older story) confirmed that its Turbo Boost frequency is up to 3.90 GHz. The L3 cache amount is maxed out a 8 MB. The reference memory clock is set at dual-channel DDR4-2400. What's more, the CPU component features an unlocked base-clock multiplier.

Things get interesting with the way Intel describes its integrated graphics solution. It mentions both the star-attraction, the AMD Radeon RX Vega M GH, and the Intel HD Graphics 630 located on the "Kaby Lake" CPU die. This indicates that Intel could deploy a mixed multi-GPU solution that's transparent to software, balancing graphics loads between the HD 630 and RX Vega M GH, depending on the load and thermal conditions. Speaking of which, Intel has rated the TDP of the MCM at 100W, with a rider stating "target package TDP," since there's no scientifically-correct way of measuring TDP on a multi-chip module. Intel could build performance-segment NUCs with this chip, in addition to selling them to mini-PC manufacturers.

IBASE Announces ET975 COM Express CPU Module for Factory Automation

IBASE Technology Inc., a world leader in the manufacture of industrial motherboard and embedded systems, today launches a new ET975 COM Express Computer-on-Module based on the ultra-low voltage 7th Generation Intel Core i7/i5/i3 processor (Kaby Lake-U) produced using a 14 nanometer manufacturing process technology. Characterized with product longevity, performance computing and low power consumption, the ET975 is suitable for applications found in factory automation, kiosk, communications, medical imaging and digital signage environments.

The ET975 comes with features that provide high performance and reliable operation across a wide range of industrial and embedded applications. The ET975 COM Express Type 6 compact module is equipped with two DDR4-2133 SO-DIMM sockets with a 32GB memory capacity, operating temperature range from 0°C to +60°C, and Intel Gen 9 HD low-power integrated graphics on the SoC providing 4K resolution via popular display interfaces such as DVI, HDMI, DisplayPort and LVDS. A rich set of standard I/Os available are one gigabit Ethernet, four USB 3.0 and eight USB 2.0 ports, two serial ports and two SATA III ports.

Akasa Releases Pascal MD Waterproof Case for Intel "Dawson Canyon" NUC

Akasa today introduced the Pascal MD (A-NUC40-M1) fan-less case for Intel 7th generation "Dawson Canyon" NUC boards, namely NUC7i3DNBE, NUC7i3DNKE, and NUC7i3DNHE. The case boasts of IP65-compliant waterproofing, including modular waterproof connectors at the back of the case, which connect internally with the various ports of the NUC board. Its body doubles up as a chunky, ridged aluminium heatsink, to cool the "Kaby Lake" SoC. The case measures 234.6 mm x 238 mm x 76.3 mm (WxDxH), and comes with 2 m long modular cables with connectors for power, USB 3.0, network, and HDMI. The case is recommended for outdoor builds such as digital signage, automobile, marine vessels (navigation computers), etc.

Intel Core i7-8709G with Vega M Graphics Parsed by Futuremark SystemInfo

Ahead of its Q1-2018 launch after a CES reveal, Intel's Core i7-8709G multi-chip module (MCM) was picked up by Thai PC enthusiast and tech vlogger "TUM APISAK," revealing some of its first specifications as read by Futuremark SystemInfo, a hardware-detection component common to various Futuremark benchmark suites. The "Kaby Lake-G" MCM combines a quad-core "Kaby Lake" CPU die with an AMD Radeon "Vega M" graphics die that has a dedicated HBM2 memory stack on-package.

Futuremark SystemInfo puts out quite a few specs of the i7-8709G, beginning with its 4-core/8-thread CPU based on the "Kaby Lake" micro-architecture, which is clocked at 3.10 GHz with 3.90 GHz Turbo Boost; Radeon RX Vega M (694C:C0) graphics core with 4 GB of HBM2 memory across a 1024-bit memory bus; with its GPU engine running at 1.19 GHz, and memory at 800 MHz (204.8 GB/s memory bandwidth); although the core-config of the iGPU remains a mystery. We recommend you maximize the video below for legible details.

Shuttle's SZ270R9 Gaming and VR Cube Comes with Overclocking on Demand Function

Shuttle Computer Group, Inc., one of the world's leading designers of small form computers, announces a new and powerful cube-sized computer, its SZ270R9, designed for advanced home and portable gaming, along with virtual reality applications. Unlike other PCs, once set, users can overclock with the Turbo button for the quickest, most realistic action. In spite of its small size, it has an impressive expansion capability and storage capacity. With lots of interior space, the SZ270R9 supports large-format dual-slot graphics cards; users can install up to four 2.5" or 3.5" hard drives and two m.2 bays. It also supports Intel's new Optane Memory to improve data processing and system speed.

"This is the ultimate gaming PC, power packed with an external design that looks like you're ready for battle," said Robert Garcia, channel manager, Shuttle Computer Group. "And when you press the overclock button, watch out! You'll be the winner for sure."

Latest Intel Roadmap Slide Leaked, Next Core X is "Cascade Lake-X"

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

8th and 9th Gen Intel Core Processor Model Names Revealed

Intel 9th generation Core processors could hit the shelves some time in 2018, after Intel has ironed out supply issues of its current 8th generation Core "Coffee Lake" lineup, and figured out what to do with the unsold 7th generation Core "Kaby Lake" inventory. It has been rumored that the company could increase core-counts across the board again, with the introduction of an eight-core part in the mainstream-desktop lineup, probably to better segment the Core i7 series from the Core i5 series. It's not implausible to expect the next-generation Core i7 MSDT parts to be 8-core/16-thread, and Core i5 MSDT 6-core/12-thread, with 4-core/4-thread or 8-thread Core i3 parts making up the entry-level, which would bring Intel's MSDT lineup on core/thread-count parity with AMD.

The change-log of the latest FinalWire AIDA64 version spells out several 9th generation Core processor model numbers, at least the Core i5 and Core i3 SKUs. The Core i5 lineup includes the i5-9600K, followed by the i5-9600, i5-9500, i5-9400, i5-9400T, i3-9300, i3-9300T, i3-9100, i3-9100T, i3-9000, and i3-9000T, with the "T" extension denoting lower TDP, probably at 35W, while the rest of the lineup has its TDP rated at 65W. The change-log also speaks about Intel's second-wave of Core "Coffee Lake" parts, which launch early-2018, alongside its other 300-series chipset for the platform, such as the H370, B360, and H310.

Researchers Find Glaring Intel ME Security Flaws, Company Outs Detection Tool

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

ECS Intros LIVA Z Plus ZE Mini-PC with Legacy Connectivity

ECS today rolled out the LIVA Z Plus ZE mini-PC featuring legacy connectivity, combined with otherwise modern hardware, which puts its applications halfway between retail/POS (point of sale) and educational/robotics. The mini-PC features four RS232 serial COM ports, so you can directly plug in POS peripherals such as barcode/RFID scanners, receipt printers, credit card POS machines, electronic weighing scales, etc. It comes with rather powerful 7th generation "Kaby Lake" SoC options, including Celeron 3965U, Core i3-7100U, Core i5-7200U, and i5-7500U, bolstered by Intel vPro.

Besides factory-fitted SoCs, the LIVA Z Plus ZE comes with two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel memory, and one M.2-2242 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring. Besides the four RS232 ports, it features four USB 3.0 ports (three type-A, one type-C), two 1 GbE wired network interfaces, 802.11ac + Bluetooth 4.0 WLAN, stereo HD audio, and display outputs that include one each of HDMI 1.4 and miniDisplayPort. Measuring 117 mm x 128 mm x 51 mm (WxDxH), it supports VESA mounting, which lets you tuck it away behind your monitor. It draws power from an external 65W power brick.

Intel NUC Based on Intel+Vega MCM Leaked

The first product based on Intel's ambitious "Kaby Lake-G" multi-chip module, which combines a quad-core "Kaby Lake-H" die with a graphics die based on AMD "Vega" architecture, will be a NUC (next unit of computing), and likely the spiritual successor to Intel's "Skull Canyon" NUC. The first picture of the motherboard of this NUC was leaked to the web, revealing a board that's only slightly smaller than the mini-ITX form-factor.

The board draws power from an external power brick, and appears to feature two distinct VRM areas for the CPU and GPU components of the "Kaby Lake-G" MCM SoC. The board feature two DDR4 SO-DIMM slots which are populated with dual-channel memory, and an M.2 NVMe slot, holding an SSD. There are two additional SATA 6 Gb/s ports, besides a plethora of other connectivity options.

Intel Hires Raja Koduri, to Develop Discrete GPUs, This Time for Real

Intel hired Raja Koduri, who resigned as head of AMD's Radeon Technologies Group (RTG), earlier this week. Koduri has been made Senior Vice President and Chief Architect of Intel's future discrete GPUs. That's right, Intel has renewed its dreams to power high-end graphics cards that compete with AMD and NVIDIA. Intel's last attempt at a discrete GPU was "Larrabee," which evolved into a super-scalar multi-core processor for HPC applications under the Xeon Phi line.

This development heralds two major theories. One, that Intel's collaboration with AMD RTG on graphics IP could only go further from here, and what is a multi-chip module of Intel and AMD IP now, could in the future become a true heterogeneous die of Intel's and AMD's IP. Two, that the consolidation of AMD's graphics assets and IP into a monolithic entity as RTG, could make it easier to sell it lock, stock, and barrel, possibly to Intel.

Intel to Rebrand Pentium "Kaby Lake" Processors as Pentium Gold

Intel this Tuesday, issued a curious-looking product-change notification (PCN) directed at retail-channel distributors, which points to the re-branding of 7th generation Pentium "Kaby Lake" desktop processors under the new Pentium Gold brand (PCN #115827-00). The re-brand affects retail SKUs of the Pentium G4560, G4620, and G4600. Intel is borrowing the precious-metal nomenclature from its Xeon product-line over to the Pentium brand, which will help consumers tell the MSDT (mainstream-desktop) Pentium processors from the ULP (ultra low-power) chips branded Pentium.

When this product-change comes into effect from the 2nd of November, 2017, MSDT Pentium dual-core chips will be branded Pentium Gold, while low-power "Gemini Lake" SoCs will bear the Pentium Silver brand, besides Celeron. Re-branded names apart, the Pentium Gold SKUs will be identical to the parts they are replacing. The Pentium G4560, for example, will be re-branded Pentium Gold G4560 (or simply "4560") and will carry an identical feature-set. You probably won't even need to update your motherboard BIOS (of your 100-series and 200-series chipset motherboards) to use these chips. It's not likely that these chips will work on 300-series chipset motherboards since they feature a different pin-map, and the retail box design will reflect that with clear markings. The name change also comes with a refreshed case-badge and a slightly modified box design.
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