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Intel "Elkhart Lake" Processor Put Through 3DMark

One of the first performance benchmarks of Intel's upcoming low-power processor codenamed "Elkhart Lake," surfaced on the Futuremark database, courtesy of TUM_APISAK. The chip scores 571 points, with a graphics score of 590 and physics score of 3801. The graphics score of the Gen11-based iGPU is behind the Intel UHD 630 gen 9.5 iGPU found in heavier desktop processors since "Kaby Lake," but we predict it's being dragged behind by the CPU (3801 points physics vs. roughly 17000 points of a 6-core "Coffee Lake" processor. The chip goes on to score 170 points in Time Spy, with 148 points graphics- and 1131 points physics-scores. Perhaps Cloud Gate would've been a more apt test.

The "Elkhart Lake" silicon is built on Intel's 10 nm silicon fabrication process, and will power the next generation of Pentium Silver and Celeron processors. The chip features up to 4 CPU cores based on the "Tremont" low-power architecture, and an iGPU based on the newer Gen11 architecture. It features a single-channel memory controller that supports DDR4 and LPDDR4/x memory types. The chip in these 3DMark tests is a 4-core variant, likely a Pentium Silver engineering sample, with its CPU clocked at 1.90 GHz, and is paired with LPDDR4x memory. The chip comes in 5 W, 9 W, and 12 W TDP variants.

Raspberry Pi 4 Gets Upgraded to 8 GB, Priced at $75

Raspberry Pi 4 is almost a year old, and it's been a busy year. We've sold nearly 3 million units, shipped a couple of minor board revisions, and reduced the price of the 2 GB variant from $45 to $35. On the software side, we've done enormous amounts of work to reduce the idle and loaded power consumption of the device, passed OpenGL ES 3.1 conformance, started work on a Vulkan driver, and shipped PXE network boot mode and a prototype of USB mass storage boot mode - all this alongside the usual round of bug fixes, feature additions, and kernel version bumps.

While we launched with 1 GB, 2 GB and 4 GB variants, even at that point we had our eye on the possibility of an 8 GB Raspberry Pi 4. We were so enthusiastic about the idea that the non-existent product made its way into both the Beginner's Guide and the compliance leaflet. The BCM2711 chip that we use on Raspberry Pi 4 can address up to 16 GB of LPDDR4 SDRAM, so the real barrier to our offering a larger-memory variant was the lack of an 8 GB LPDDR4 package. These didn't exist (at least in a form that we could address) in 2019, but happily our partners at Micron stepped up earlier this year with a suitable part. And so, today, we're delighted to announce the immediate availability of the 8 GB Raspberry Pi 4, priced at just $75.

Intel "Elkhart Lake" Atom Processor Surfaces on Chinese Components Marketplace, "Tremont" Meets Gen11

Intel's next-generation Atom processor is codenamed "Elkhart Lake." Built on the 10 nm silicon fabrication process, the chip combines up to four CPU cores based on the "Tremont" microarchitecture, with an iGPU based on the Gen11 architecture, and a single-channel memory interface that supports DDR4 and LPDDR4. Differentiation of the processor include 2-core and 4-core CPU variants, and TDP variants spanning 6 W, 9 W, and 12 W. "Tremont" is a lightweight CPU core by Intel that lacks AVX capabilities. Besides "Elkhart Lake," the core is featured in the "Lakefield" Core heterogenous processors as the their low-power cores.

Chinese electronics B2B marketplace CogoBuy.com has the processor listed, although without listing out any processor model numbers. The marketplace is accepting RFQs (requests for quotations) for bulk purchase of these BGA chips on trays, without listing prices. Also listed is an "industrial variant" of the chip, which has an increased TJmax of 110 °C (compared to 105 °C of the standard variant). The Gen11 iGPU wasn't detailed, but it's likely to have a lower execution unit count than the variant found on "Ice Lake" processors, while retaining its display- and media-engines (ability to pull 8K60 displays).

ASUS Announces Tinker Edge R with AI Machine-Learning Capabilities

ASUS today announced Tinker Edge R, a single-board computer (SBC) specially designed for AI applications. It uses a Rockchip RK3399Pro NPU, a machine-learning (ML) accelerator that speeds up processing efficiency, lowers power demands and makes it easier to build connected devices and intelligent applications.

With this integrated ML accelerator, Tinker Edge R can perform three tera-operations per second (3 TOPS), using low power consumption. It also features an optimized neural-network (NN) architecture, which means Tinker Edge R can support multiple ML frameworks and allow lots of common ML models to be compiled and run easily.
ASUS Tinker Edge R

GDP Win Max is an 8-inch Gaming Laptop with Intel's Ice Lake CPU

GDP, a company specializing in the creation of tiny laptops designed for gaming, has just announced the latest addition to its family of tiny notebooks - the GDP Win Max gaming laptop. This model is an 8-inch gaming laptop packing a lot for its size. On the outside, this laptop is equipped with joysticks on both sides, so there is even an option to directly play games using these joysticks instead of the built-in keyboard. The display of the device is an IPS screen that features a 1280×800 resolution, resulting in a 16:10 aspect ratio of the display. What's more important, however, is what is under the hood of the small body.

It is powered by Intel's latest Ice Lake CPU - the Intel Core i5-1035G7. Being a 4 core/ 8 threaded CPU with Gen11 Iris Plus 940 graphics it is accompanied by 16 GB of LPDDR4X RAM and 512 GB SSD. GDP has provided some of the benchmark results of this configuration which you can check out below, however, please take these with a grain of salt. As far as I/O goes, this small laptop is rather well equipped with plenty of ports. There is one Thunderbolt 3 port to connect to external GPU is it is needed. There is one USB Type-C 3.1 Gen2 port and two USB Type-A 3.1 Gen1 ports for the connection of external peripherals. If you wish to connect the laptop to the outside screen, there are options of HDMI, USB Type-C or Thunderbolt 3 ports for connection. A welcome addition to I/O is the inclusion of the RJ45 connector, meaning that if you have access to ethernet you can easily plug it into this laptop.
GDP Win Max GDP Win Max GDP Win Max Benchmarks GDP Win Max Benchmarks

Chuwi Launches the Tiny LarkBox PC

Chuwi has recently announced the LarkBox a Mini-PC which can fit in the palm of your hand. The Chuwi LarkBox claims to be the smallest 4K PC at just 61*61*43 mm (0.16L). The LarkBox features an 8th generation Intel Celeron quad-core N4100 paired with 6 GB of LPDDR4 RAM and a 128 GB SSD. The Celeron N4100's UHD Graphics 600 iGPU allows 4K video output via the HDMI port.

The Mini-PC could be a great low power home office machine for basic web browsing and word processing. The Chuwi LarkBox is cooled by a single ultra-silence cooling fan which should keep the PC stable under all workloads. The Larkbox features two USB-A ports, a single USB-C port, HDMI connector and a 3.5 mm headphone jack along with Bluetooth 5.0 support.

Apple's A12Z SoC Features the Same A12X Silicon

With an introduction of new iPad Pro tablets, Apple has brought another new silicon to its offerings in the form of A12Z SoC. Following the previous king in tablet space, the A12X SoC, Apple has decided to update its silicon and now there is another, more advanced stepping in form of an A12Z SoC. Thanks to the report from TechInsights, their analysis has shown that the new SoC used in Apple's devices is pretty much the same compared to the A12X SoC of last year, except the GPU used. Namely, the configuration of A12X is translated into the A12Z - there are four Apple Vortex and four Apple Tempest cores for the CPU. There is a 128-bit memory bus designed for LPDDR4X memory, the same as the A12X.

What is different, however, is the GPU cluster configuration. In A12X there was a cluster filled with 7 working and one disabled A12-gen GPU core. In A12Z SoC all of the 8 GPUs present are enabled and working, and they are also of the same A12 generation. The new SoC is even built using the same N7 7 nm manufacturing process from TSMC. While we don't know the silicon stepping revision of the A12Z, there aren't any new features besides the additional GPU core.
Apple A12Z Bionic

Trio of Intel 10th Gen "Ice Lake" NG Processors Show Up on Intel Website

Three new 10th generation Core "Ice Lake-U" notebook processors surfaced on Intel website with a curious new nomenclature, possibly ahead of their "Q2-2020" launch. The three follow the processor model numbering convention of 10x0NGy, where x denotes the key model differentiator, and y the iGPU tier differentiator. Among the three parts are the Core i7-1060NG7, the Core i5-1030NG7, and the Core i3-1000NG4. The i5-1060NG7 and i5-1030NG7 are 10-Watt parts and feature 4-core/8-thread "Sunny Cove" CPUs, while the i3-1000NG4 packs a 2-core/4-thread "Sunny Cove" CPU, and is rated at 9 W TDP.

What sets the Core i5 apart from the Core i7, besides CPU clock speeds, are L3 cache sizes: 8 MB for the Core i7, and 6 MB for the i5. The Core i3 packs 4 MB. With an eye clearly on ultra-portable notebooks, these chips only feature dual-channel LPDDR4 memory interfaces, with memory clock speeds of up to 3733 MT/s. The i7-1060NG7 CPU ticks at 1.20 GHz and up to 3.80 GHz Turbo Boost; while the i5-1030NG7 runs between 1.10 GHz to 3.50 GHz. The i3-1000NG4 is clocked 1.10 GHz with 3.20 GHz Turbo Boost. The Core i7 and Core i5 parts pack an identical Gen11 iGPU: Iris Plus clocked between 300 MHz to 1.10 GHz for the i7 and up to 1.05 GHz for the i5. The Core i3 features 300-900 MHz iGPU clock speeds and fewer execution units.

A Walk Through SK Hynix at CES 2020: 4D NAND SSDs and DDR5 RDIMMs

Korean DRAM and NAND flash giant SK Hynix brought its latest memory innovations to the 2020 International CES. The star attraction at their booth was the "4D NAND" technology, and some of the first client-segment SSDs based on it. As a concept, 4D NAND surfaced way back in August 2018, and no, it doesn't involve the 4th dimension. Traditional 3D NAND chips use charge-trap flash (CTF) stacks spatially located next to a peripheral block that's responsible for wiring out all of those CTF stacks. In 4D NAND, the peripheral block is stacked along with the CTF stack itself, conserving real-estate on the 2-D plane (which can then be spent on increasing density). We caught two 128-layer 4D NAND-based client-segment drives inbound for 2020, the Platinum P31 M.2 NVMe, and Gold P31 M.2 NVMe. The already launched Gold S31 SATA drive was also there.

Samsung Begins Mass-production of 12GB LPDDR4X uMCP Memory Chips

Samsung Electronics, a world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company's annual Samsung Tech Day at its Device Solutions' America headquarters in San Jose, California.

"Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12 GB not only for high-end smartphones but also for mid-range devices," said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. "Samsung will continue to support our smartphone-manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe."

Razer unveils the World's First Gaming Ultrabook - Razer Blade Stealth 13

Razer, the leading global lifestyle brand for gamers, today announced their new Razer Blade Stealth 13 with NVIDIA GeForce GTX 1650 graphics - the World's First Gaming Ultrabook. Powered by Intel's new 10th generation processor, the new Razer Blade Stealth 13 delivers true gaming performance packed into an amazingly thin 15 mm chassis weighing only 1.3 kg.

"Razer is constantly pushing the boundaries of what's possible, by designing laptops that utilize the most powerful components in the smallest chassis" says Brad Wildes, Senior Vice President of Razer's Systems Division. "We did it with our original Razer Blade, which led the trend of slim gaming systems, and now we're doing it again with our Blade Stealth, pioneering a new market for powerful, small-footprint laptops."

Intel Expands 10th Gen Intel Core Mobile Processor Family

Today, Intel introduced eight additional 10th Gen Intel Core processors for modern laptop computing. The new mobile PC processors (formerly code-named "Comet Lake") are tailor-made to deliver increased productivity and performance scaling for demanding, multi-threaded workloads while still enabling thin-and-light laptop and 2 in 1 designs with uncompromising battery life. These processors are performance powerhouses that bring double digit performance gains compared with the previous generation. The lineup also includes Intel's first 6-core processor in the U-series, faster CPU frequencies, faster memory interfaces and the industry redefining connectivity with Intel Wi-Fi 6 (Gig+) and broader scaling of Thunderbolt 3. More than 90 additional designs based on the 10th Gen Intel Core processor family will hit the shelves for the holiday season.

"Our 10th Gen Intel Core mobile processors provide customers with the industry-leading range of products that deliver the best balance of performance, features, power and design for their specific needs. From multitasking to everyday content creation, the newest additions to the family scale performance for even higher levels of productivity -- in addition to offering best-in-class platform connectivity via Wi-Fi 6 (Gig+) and Thunderbolt 3 that people expect with 10th Gen," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group.

Micron Commences Volume Production of 1z Nanometer DRAM Process Node

Micron Technology, Inc. (Nasdaq: MU), today announced advancements in DRAM scaling, making Micron the first memory company to begin mass production of 16 Gb DDR4 products using 1z nm process technology

"Development and mass production of the industry's smallest feature size DRAM node are a testament to Micron's world-class engineering and manufacturing capabilities, especially at a time when DRAM scaling is becoming extremely complex," said Scott DeBoer, executive vice president of Technology Development for Micron Technology. "Being first to market strongly positions us to continue offering high-value solutions across a wide portfolio of end customer applications."

GALAX HOF E16 is a Monstrous M.2 PCIe Gen 4 SSD Dressed in White

With AMD "Valhalla" desktop platform mainstreaming PCI-Express gen 4.0, several SSD manufacturers put out their first products that can take advantage of it, this Computex. The drive with the highest on-paper transfer rates has to be the HOF E16 from GALAX, which will also be sold under the Galaxy and KFA2 brands in various markets. Built in the M.2-2280 form-factor, the drive features an M.2 PCI-Express 4.0 x4 host interface (backwards-compatible with older PCIe generations), with 64 Gbps of interface bandwidth on tap. The drive comes in capacities of 1 TB, 2 TB, and segment-first 4 TB.

The HOF E16 uses the same heatsink GALAX deployed on the older generation of HOF M.2. A block of aluminium pulls heat from the drive's controller, while a flattened copper heat-pipe spreads heat across. The drive is based on the new Phison E16 controller that's cushioned by an LPDDR4 DRAM chip, and wired to 96-layer 3D TLC NAND flash memory. The drive offers sequential read speeds of up to 4,800 MB/s, and sequential writes of up to 4,000 MB/s. 4K random reads are rated at up to 750,000 IOPS, and 4K random writes up to 700,000 IOPS.

Intel 10nm Ice Lake to Quantitatively Debut Within 2019

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.

Logic Supply Unveils Karbon 300 Compact Rugged PC, Built For IoT

Global industrial and IoT hardware manufacturer Logic Supply has combined the latest vision processing, security protocols, wireless communication technologies, and proven cloud architectures to create the Karbon 300 rugged fanless computer. The system has been engineered to help innovators overcome the limitations of deploying reliable computer hardware in challenging environments.

"Computing at the edge is increasingly at the core of today's Industry 4.0 and Industrial IoT solutions," says Logic Supply VP of Products Murat Erdogan. "These devices are being deployed in environments that would quickly destroy traditional computer hardware. The builders and creators we work with require a careful combination of connectivity, processing and environmental protections. With Karbon 300, we're providing the ideal mix of capabilities to help make the next generation of industry-shaping innovation a reality, and enable innovators to truly challenge what's possible."

Intel "Ice Lake" GPU Docs Reveal Unganged Memory Mode

When reading through the Gen11 GT2 whitepaper by Intel, which describes their upcoming integrated graphics architecture, we may have found a groundbreaking piece of information that concerns the memory architecture of computers running 10 nm "Ice Lake" processors. The whitepaper mentions the chip to feature a 4x32-bit LPDDR4/DDR4 interface as opposed to the 2x64-bit LPDDR4/DDR4 interface of current-generation chips such as "Coffee Lake." This is strong evidence that Intel's new architecture will have unganged dual-channel memory controllers (2x 64-bit), as opposed to the monolithic 128-bit IMC found on current-generation chips.

An unganged dual-channel memory interface consists of two independent memory controllers, each handling a 64-bit wide memory channel. This approach lets the processor execute two operations in tandem, given the accesses go to distinct memory banks. On top of that it's now possible to read and write at the same time, something that's can't be done in 128-bit memory mode. From a processor's perspective DRAM is very slow, and what takes up most of the time (= latency), is opening the memory and preparing the read/write operation - the actual data transfer is fairly quick.

Micron Unveils 2200 Client-segment SSD, Ditches SMI for In-house Controller

Micron has curiously been releasing client-segment SSDs these recent weeks. The company's main brand was focused on enterprise products, while subsidiary brands Crucial and Ballistix catered to the client-segment. Following up on its late-February launch of the 1300-series client-segment SSDs, Micron unveiled the even faster 2200-series. These drives ditch Silicon Motion-sourced controllers in favor of a new controller Micron designed in-house. Built in the M.2-2280 form-factor with PCI-Express 3.0 x4 interface, taking advantage of the NVMe protocol. This in-house controller is mated with Micron's 64-layer 3D TLC NAND flash, cushioned by its own LPDDR4 DRAM cache.

Available in capacities of 256 GB, 512 GB, and 1 TB, the Micron 2200 is rated to offer sequential transfer rates of up to 3000 MB/s reads, with up to 1600 MB/s writes, up to 240,000 IOPS 4K random reads, and up to 210,000 IOPS 4K random writes, with an endurance rating of 75 TB, 150 TB, and 300 TB, for the 256 GB, 512 GB, and 1 TB variants, respectively. Micron-exclusive features also make their way, such as native power-loss data-protection, and TCG Opal SED. The company hasn't revealed pricing or availability for these drives.

Intel Readies Crimson Canyon NUC with 10nm Core i3 and AMD Radeon

Intel is giving final touches to a "Crimson Canyon" fully-assembled NUC desktop model which combines the company's first 10 nm Core processor, and AMD Radeon discrete graphics. The NUC8i3CYSM desktop from Intel packs a Core i3-8121U "Cannon Lake" SoC, 8 GB of dual-channel LPDDR4 memory, and discrete AMD Radeon RX 540 mobile GPU with 2 GB of dedicated GDDR5 memory. A 1 TB 2.5-inch hard drive comes included, although you also get an M.2-2280 slot with both PCIe 3.0 x4 (NVMe) and SATA 6 Gbps wiring. The i3-8121U packs a 2-core/4-thread CPU clocked up to 3.20 GHz and 4 MB of L3 cache; while the RX 540 packs 512 stream processors based on the "Polaris" architecture.

The NUC8i3CYSM offers plenty of modern connectivity, including 802.11ac + Bluetooth 5.0 powered by an Intel Wireless-AC 9560 WLAN card, wired 1 GbE from an Intel i219-V controller, consumer IR receiver, an included beam-forming microphone, an SDXC card reader, and stereo HD audio. USB connectivity includes four USB 3.1 type-A ports including a high-current port. Display outputs are care of two HDMI 2.0b, each with 7.1-channel digital audio passthrough. The company didn't reveal pricing, although you can already read a performance review of this NUC from the source link below.

ECS LIVA Z2L is a Palm-sized Compact Desktop with GPIO

ECS today rolled out the LIVA Z2L, a palm-size compact desktop with something in it for electronics hobbyists - a GPIO header. Driven by Intel Pentium/Celeron "Gemini Lake" SoCs, these desktops measure 132 mm x 118 mm x 56.4 mm (WxDxH), and feature VESA mounts, so you could tuck them away behind your display. The unit is completely fanless, and draws power from an external power adapter. Connectivity includes four USB 3.0 ports, including a type-C, two USB 2.0 ports, D-Sub and HDMI display outputs, gigabit Ethernet, and 802.11ac WLAN. Under the hood, the "Gemini Lake" SoC is wired to 4 GB of LPDDR4 memory over two SODIMM slots (single channel), and storage is care of a 64 GB eMMC device that can juggle hot data from a 2.5-inch HDD. The company didn't reveal pricing.

Micron Announces Mass Production of Industry's Highest-Capacity Monolithic Memory

Micron Technology, Inc., today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications. This latest generation of Micron's LPDDR4 memory brings key improvements in power consumption while maintaining the industry's fastest LPDDR4 clock speeds, thereby delivering advanced performance for next-generation mobile handsets and tablets. In addition, Micron's 12Gb LPDDR4x doubles memory capacity to offer the industry's highest-capacity monolithic LPDDR4 without increasing the footprint compared to the previous generation product.

The exponential increase in usage of compute and data-intensive mobile applications such as artificial intelligence (AI), augmented reality (AR) and 4K video has been accompanied with demands by mobile users to maximize battery life and performance and increase capacity. Next-generation mobile devices that integrate multiple high-resolution cameras and increasingly use AI for image optimization also require higher DRAM capacities to support these features.

As the industry transitions towards deployment of 5G mobile technology, the memory subsystem in mobile handsets will have to support these dramatically higher data rates and the associated processing of data in real-time. New applications built upon 5G technology will also be able to leverage the increased capabilities of the memory subsystem to enable new and immersive user experiences.

Samsung Announces First 8Gb LPDDR5 DRAM using 10 nm Technology

Samsung Electronics, the world leader in advanced memory technology, today announced that it has successfully developed the industry's first 10-nanometer (nm) class* 8-gigabit (Gb) LPDDR5 DRAM. Since bringing the first 8Gb LPDDR4 to mass production in 2014, Samsung has been setting the stage to transition to the LPDDR5 standard for use in upcoming 5G and Artificial Intelligence (AI)-powered mobile applications.

The newly-developed 8Gb LPDDR5 is the latest addition to Samsung's premium DRAM lineup, which includes 10nm-class 16Gb GDDR6 DRAM (in volume production since December 2017) and 16Gb DDR5 DRAM (developed in February).

Samsung Announces 10 nm-Class DDR4 SO-DIMMs for Gaming Notebooks

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass producing the industry's first 32-gigabyte (GB) double data rate 4 (DDR4) memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10-nanometer (nm)-class process technology that will allow users to enjoy enriched PC-grade computer games on the go, with significantly more capacity, higher speeds and lower energy consumption.

Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations. "Samsung's 32GB DDR4 DRAM modules will deliver gaming experiences on laptops more powerful and immersive than ever before," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "We will continue to provide the most advanced DRAM portfolios with enhanced speed and capacity for all key market segments including premium laptops and desktops."

Samsung Begins Mass Production of 10 nm-class 16 Gb LPDDR4X DRAM for Automobiles

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 10-nanometer (nm)-class 16-gigabit (Gb) LPDDR4X DRAM for automobiles. The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments. The 10nm-class DRAM will also enable the industry's fastest automotive DRAM-based LPDDR4X interface with the highest density.

"The 16Gb LPDDR4X DRAM is our most advanced automotive solution yet, offering global automakers outstanding reliability, endurance, speed, capacity and energy efficiency, ," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "Samsung will continue to closely collaborate with manufacturers developing diverse automotive systems, in delivering premium memory solutions anywhere."

Samsung Launches 800GB Z-SSD for HPC and AI Systems

Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive-the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800 GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.

"With our leading-edge 800 GB Z-SSD, we expect to contribute significantly to market introductions of next-generation supercomputing systems in the near future, enabling improved IT investment efficiency and exceptional performance," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "We will continue to develop next-generation Z-SSDs with higher density and greater product competitiveness, in order to lead the industry in accelerating growth of the premium SSD market."
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