Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it started producing embedded multi-chip package (eMCP) memory for use in the rapidly expanding market segment for entry- to mid-level smartphones. Samsung's new eMCP solutions come in a wide range of densities, utilizing LPDDR2 (low power double-data-rate 2) DRAM made with 30 nanometer (nm) class process technology and NAND flash memory using 20 nm-class technology.

Punctuating 30 years of nanotechnology research, scientists from IBM Research (NYSE: IBM) have successfully demonstrated the ability to store information in as few as 12 magnetic atoms. This is significantly less than today's disk drives, which use about one million atoms to store a single bit of information. The ability to manipulate matter by its most basic components - atom by atom - could lead to the vital understanding necessary to build smaller, faster and more energy-efficient devices.

While silicon transistor technology has become cheaper, denser and more efficient, fundamental physical limitations suggest this path of conventional scaling is unsustainable. Alternative approaches are needed to continue the rapid pace of computing innovation.

Following the success of their v175w ice cream flash drives PNY Technologies, Inc. ("PNY") is considered a leading designer, manufacturer and a worldwide leader in DRAM Memory and Flash Memory products, introduced a new USB flash drive, the v270w. The innovative flash drive comes in an egg shaped design that gives a light-hearted and fun vibe whilst offering fast and convenient transfer of files on the go.

The HP v270w is covered in a distinctive multicolored rubber material offering water and shock resistance that protects and prevents any data loss from accidental drops or external collisions. The egg shaped cover is embossed in wavy design which provides better grip and easy disconnection. The bright use of white and sunshine yellow exudes a playful and radiant appearance.

Kingston showed off its wares to the media, which included one product in particular that garnered some interest, the new HyperX T1 modules. Designed keeping in mind today's congested high-end motherboards, the HyperX T1 modules feature compound aluminum heatsinks that are designed in away that doesn't make the modules thicker, but taller. These modules are twice as tall as usual kits such as the HyperX Genesis. Their PCBs, too, are taller, and probably have an exposed copper layer for heat-transfer, à la Corsair Dominator. The heatsink branches out into fins at the top, for passive heat transfer to surrounding air. These modules will probably comply with new XMP 1.3 specifications, and offer out-of-the-box DRAM speeds in the range of DDR3-2133 to DDR3-2600, with quite some OC headroom to spare.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX Red Limited Edition Memory and a new look for HyperX LoVo low-voltage modules. These memory modules have a new look and are designed for PC modders, system builders and entry-level gamers looking to push the performance envelope.

HyperX Red Limited Edition has a sleek and aggressive look that provides a stylish accent to any motherboard or desktop computer in which it is installed. HyperX Red is Intel XMP ready and is available in 8 GB kits and 4 GB single modules at 1600 MHz and 1333 MHz, in both 1.65v and 1.5v. With the ease of installation and HyperX reliability, these new modules meet the needs of consumers and gamers alike who seek higher performance via faster speeds and larger capacities.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced that the iNAND Ultra line of products will be the first of its embedded flash memory products to move to 19 nanometer (nm) manufacturing technology, the industry's most advanced chip making process.

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of 8 GB DDR3 memory modules across the Crucial Ballistix Sport, Tactical, and Elite series. By taking advantage of Micron's 4 Gb DRAM technology, the new 8 GB modules provide users with the maximum capacity, performance, and density needed to run data-and graphic-intensive applications smoothly and efficiently.

Available in low-latency DDR3-1600 MHz and DDR3-1866 MHz modules, Crucial 8 GB Ballistix modules can be installed in configurations up to 64 GB in some systems, including the new Intel X79 platforms. Additionally, the complete line of Ballistix memory features a new logo treatment and updated heat spreader designs.

Toshiba Corporation today announced the development of BENAND, a versatile, multi-application single level cell (SLC) NAND flash memory with an embedded error correction code (ECC). BENAND's diverse applications include LCD TVs and digital cameras along with robots and other industrial applications. Samples of eight BENAND products in two capacities, 4 Gigabit and 8 Gigabit, will be available from today and mass production will follow from March 2012.

The simple interface and high reliability of small capacity SLC NAND has won it wide use in consumer applications and industrial programming. Until now, the ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today announced the launch of its new Copy Protection SD/microSD Memory Cards. By recording data in a CDROM style partition, Copy Protection SD/microSD cards ensure the safety of valuable intellectual property against unauthorized copy, modification, and deletion.

Elpida Memory, Inc., the world's third largest Dynamic Random Access Memory manufacturer, today announced that it has begun sample shipments of 4-gigabit Wide IO Mobile RAM and 4-gigabit DDR3 Mobile RAM (LPDDR3).

Wide IO Mobile RAM is a next-generation mobile memory chip that provides solutions to opposing needs for faster speed and lower power consumption. The rising performance of smartphones and tablet devices in recent years has led to demand for faster DRAMs (DRAMs with greater data transfer rates), but in turn this has generated concerns about increases in system power consumption.

The solution is that Wide IO Mobile RAM expands the I/O width by using x512-bit, a data width that is more than 10 times larger than the width for existing DRAMs, which enables a data transfer rate of 12.8 gigabytes per second (GB/s) per chip while operating at a low speed of 200MHz. The reduced DRAM speed results in approximately 50% less power consumption compared with DDR2 Mobile RAM (LPDDR2), currently the leading DRAM choice for mobile devices, configured at the same transfer rate.

Buffalo Japan unveiled new 8 GB memory modules in the 204-pin SO-DIMM and standard 240-pin DIMM form-factors. These modules pack 8 GB capacity, and stick to JEDEC DDR3-1333 MHz standards. Featured in the D3N1333 series, these modules 1024M x 64bit DIMM configuration. They achieve 1333 MHz speeds with CAS latency of 9T and DRAM voltage of 1.5V. The Buffalo Tools software comes bundled with these modules. The two are priced at 26,670 JPY, around US $341.6.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced of 8GB and 16GB DDR3 memory upgrade kits for Apple Mac desktop and laptop systems.

Mac systems with two memory slots have traditionally been limited to only 8GB of memory. By increasing the individual module capacity to 8GB, Corsair's latest memory upgrade kits allow Mac owners to upgrade to 10GB, 12GB, or even 16GB of memory.

A Beyond3D forum member posted a mysterious picture of two graphics cards that could very well be engineering samples of AMD's true next-generation Radeon HD 7900 "Tahiti" graphics cards. The final products most probably won't look like these, with a bare red PCB, but it does look like the reference cooler design is ready. A more important feature in that picture is the spotting of traces for at least 11 memory chips, the 12th one (not highlighted) is apparently near the PCIe slot interface. The presence of 12 memory chips gives rumors of Tahiti featuring a 384-bit wide memory interface a shot in the arm. This will be the first AMD GPU in over 5 years to feature a memory bus wider than 256-bit. The R600 Radeon HD 2900 GPU featured a 512-bit GDDR4-capable memory interface.

Ready or not, here it comes, a brand new memory card format courtesy of the CompactFlash Association (CFA). Named XQD, the new card makes use of a PCI-Express interface (2.5 Gbps for starters, 5 Gbps in the future), features a durable casing that measures 38.5 x 29.8 x 3.8 mm (for comparison, a CompactFlash card is 43 × 36 × 5 mm while an SD card is 32 × 24 × 2.1 mm), and aims to deliver write speeds of 125 MB/s (and higher in future iterations).

"The XQD format will enable further evolution of hardware and imaging applications, and widen the memory card options available to CompactFlash users such as professional photographers," said Mr. Shigeto Kanda of Canon, chairman of the board, CFA. XQD memory cards are set to be showcased at CP+ 2012 (February 9-12) in Yokohama, Japan but it's still uncertain when we'll see them in stores. Licensing of this new format will begin in early 2012 so products supporting it should come later in the year.

Racetrack memory, is a new type of magnetic memory that has magnetic domains "racing" along tiny nanometer sized wires, giving performance similar to conventional DRAM. Invented by IBM Fellow, Stuart Parkin, it has been in development since about 2004, with a working prototype having now been unveiled containing 256 "racetrack" cells, each containing a single wire. The technology works by sending very fast electric pulses down these wires, measured in nanoseconds, which transmit very fast moving magnetic domains which are then read by a magnetic head either as a one or a zero, depending on their direction. IBM said in a statement: "This breakthrough could lead to a new type of data-centric computing that allows massive amounts of stored information to be accessed in less than a billionth of a second."

IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.

Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or "vias," shown above. IBM's new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.

IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC.

Team Group Inc. gives enthusiasts the best present of the year that is Releasing 4 masterpieces of OC memory all in one, including Quad-Channel memory which is compatible with the latest Intel X79 platform, and the highest-level Dual-Channel memory on the market.

Team Group releasing 2 masterpieces of Quad-Channel OC memory at the same time, among OC memory, Team Xtreem LV DDR3 2400 CL9 uses selected chips and passes stringent testing, its low latency of 9-11-11-28 and 1T's Command Rate brings you greatest fun at high speed performance. It is the limited edition and it also the highest specification in Quad-Channel Memory module in the market which is surely the dream product for all the OC gamers.

In August, we got a first glimpse of AMD Radeon-branded DDR3 memory modules sold at select stores in Japan. At the time, AMD denied plans of directly selling AMD-branded memory to customers, and that it was determining if the sale of AMD Radeon-branded memory through channel partners is a viable opportunity. Today there is concrete evidence that AMD wants to go directly to customers with their DDR3 memory products, and has partnered with two well known companies in its effort.

Presenting a more polished AMD memory module lineup. The first ones (pictured in the link above) looked not much more than bare, generic-looking DDR3 modules with Radeon logo stickers. The new ones look better designed for customers, since good product design pays heavily in the retail channel. The new modules use black colored PCBs, metal heatspreaders, and red colored full-length stickers. A confirmation that these products are headed to the retail channel is the box. OEMs don't buy memory modules in boxes, they buy them in trays. AMD has a nice-looking product box design with a carbon-fiber pattern and appropriate branding.

Exceleram announced a new value-segment 8 GB DDR3 memory module, the E30200A. This no-frills module lacks any heatspreader, because it probably doesn't need it. It can operate at DDR3-1333 MHz (PC3-10700) speed with CAS latency of 9T, and DRAM voltage of 1.5V. More importantly, it is priced at US $49.99 a piece, making 16 GB (2x 8 GB) dual-channel possible at just $99.98. Compare that to the prices of 2x 8 GB kits available on Newegg.

"[The] target for us was to find a solution for our customers to obtain a new 8GB 1333MHz CL9 Memory Module with the price at only US$ 49.99. This price combined with the strong quality level as well as Exceleram always does, it's a really tough target for us to reach. But now we have got the solution, the E30200A Memory Module," said by Steffen Eisenstein, the Product Manager of Exceleram.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced a range of HyperX Genesis memory in 8GB, 16GB and 32GB kits to support the new Intel Sandy Bridge-E X79 quad-channel processors and X79 Express-based motherboards. Kingston HyperX Genesis is the perfect solution for enthusiasts who require 4x raw performance increases afforded by quad channel over single channel solutions.

For extreme users who require both the fastest memory and largest capacity, Kingston's 2400MHz and 2133MHz will soon be available in both 8 GB and 16 GB kits of four modules. Other HyperX Genesis memory for X79 systems include 1866 MHz and 1600 MHz frequencies in kits of four and eight, with capacities ranging from 8GB to 32GB. All of Kingston's HyperX kits have achieved Intel XMP certification and are compatible with the latest X79 motherboards from vendors such as ASUS, GIGABYTE, MSI and ASRock.

Mach Xtreme Technology Inc., a worldwide leader in top performance, high reliability and user-friendly designed PC components, today unveiled Urban Series Quad-Channel DDR3 memory kits giving demanding enthusiasts exactly what they need. The kits are optimized for Intel X79 express chipset based motherboards.

Urban quad-channel DDR3 modules offer desktop users groundbreaking computing experience at an attractive price point. Featuring enhanced capacity of 4GB per module, these new high-density 16GB kits provide customers with cutting-edge memory solution that significantly increases memory space driving breakthrough gaming and digital media content creation performance of X79 based systems. Each kit is designed to work as a kit and users working with the latest operating system can keep multiple applications open or run smoothly memory intensive graphic programs. The uniquely designed lightweight heatsink is made of specially imported top grade Japanese aluminum.

Razer, maker of high performance gaming gear, has reported that two of their prototype gaming laptops were stolen on the weekend of 4th November from their Bay Area R&D lab. Looking at the basic specs of the laptop, one can see why they were so attractive to thieves: Intel Core i7 2640M Processor (2.80 GHz), 8GB 1333MHz DDR3 Memory, 17.3" LED Backlit Display (1920 x 1080 pixels) & NVIDIA GeForce GT 555M with NVIDIA Optimus Technology and 2 GB Dedicated GDDR5 Video Memory and of course the styling. The outfit is understandably miffed about this and have announced the theft on their Facebook page:

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today introduces their new lineup of Quad-Channel Division 4 DDR3 memory solutions specifically engineered for future quad-channel memory based platforms.

For hardware enthusiasts, content developers, and high-end gamers looking for ultimate performance, the Patriot Memory Viper Xtreme Division 4 kits are designed for extreme overclocking and feature a custom copper and all aluminum heat shield to provide the best thermal protection available.

Memory is one of the necessary components with the PC. To enhance the look of these, most high performance modules are covered by fancy heatspreaders. Avexir takes things a step further by adding blue, pulsating LEDs to the mix on their Core Series memory.

As a customer-oriented brand, Avexir Technologies Corporation always tries to listen to the wishes of the growing fan base, taking their suggestions seriously. From the affordable Budget to the Standard Series, along to the high-end offerings like the Blitz family for the enthusiast gamer, Avexir aims to deliver a diverse line-up for ever customer.

German memory maker Exceleram is among the first to release quad-channel DDR3 memory kits, in time for Intel's Core i7 "Sandy Bridge-E" processor platform. Sandy Bridge-E processors pack a massive four-channel DDR3 integrated memory controller, and require at least four DDR3 modules to perform optimally. The kit released by Exceleram features in its "Grand" series, and totals 32 GB in size, spread across four 8 GB modules. These modules run at DDR3-1333 MHz speed, with timings of 9-9-9-24, and DRAM voltage of 1.5V. Exceleram did not give out pricing details, but you should be able to buy one of these in time for your big fat Sandy Bridge-E build.