Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage, and enthusiast computer products, today announces their new Mac Series XT SSDs and SODIMM lines. Optimized for the latest and popular Mac products, these premium offerings are geared for power users demanding the latest storage and memory technology to increase productivity and performance.

"Patriot Memory's Mac Series XT SSDs will provide users with a great alternative to traditional mechanical hard drives", says William Lai, Patriot Memory's Product Manager. "Offering an easy solid state and memory upgrade, Mac users will be able to maximize their computing experience almost instantly."

Micron Technology, Inc., today announced a new portfolio of load reduced dual-inline memory modules (LRDIMMs) featuring a 64GB offering. In addition to the standard densities of 8GB, 16GB and 32GB, which are sampling in high volume to several customers, Micron is introducing a 64GB LRDIMM to meet the ever-growing density requirements of servers.

Micron continues its memory market leadership with modules that provide 50 percent higher memory capacity and a performance increase of 33 percent for server applications. Resulting improvements to system scalability can significantly enhance cloud computing, high-performance computing, Web servers, transactional databases, and data analytics while reducing power needs by nearly 10 percent per DIMM slot compared to standard modules.

EVGA has just announced a new dual GPU card based on the GF114 GPU - check out the product launch page here and the product page here. If their performance graph on that launch page is accurate, then the card is around 30% faster than a GTX 580 when running the Unigene Heaven benchmark. The output panel contains three DVI connectors for NVIDIA 3D Surround, along with a mini HDMI port. The cooler has three fans, which should make for a well-cooled and reasonably quiet card. The marketing blurb says:

Introducing the EVGA GeForce GTX 560 Ti 2Win
It may not be called a GTX 585, but it's the next best thing. This card harnesses the power of two EVGA GeForce GTX 560 Ti GPU's for blistering fast DirectX 11 performance, including tessellation performance that destroys the competition. Experience a whole new level of interactive gaming and combine up to three displays off a single card for the ultimate in 3D entertainment, or disable Surround and combine up to four displays for maximum productivity. With these features and more, the EVGA GeForce GTX 560 Ti 2Win gives you double the GPU's and double the win!

Translated, this means that your life isn't worth living without one of these babies in your rig. Apparently.

Memristors are a fourth class of electric circuit, first hypothesized way back in the 1970's, which are a new addition to the transistors, capacitors, resistors etc that go into making a silicon chip. HP has put a great deal of resources into developing this technology and is expected to release memory-like memristor products in 2013, so it's not far off from commercial deployment. Now however, the Korean Advanced Institute of Science and Technology (KAIST) have found a way to use memristors to make what they describe as a "fully functional" flexible resistive random access memory (RRAM). This memory is built on a plastic substrate and can be randomly accessed, written to and erased. However, as this substrate is flexible, it can be bent and rolled up easily, opening up possibilities for use that haven't even been thought of yet.

Motherboard vendors aren't the only ones getting ready for the big launch of Intel's new high-end desktop (HEDT) platform - Sandy Bridge-E, the ecosystem also consists of memory and cooling products vendors - more importantly, memory. Intel Sandy Bridge-E processors pack an integrated memory controller with a massive 256-bit bus width. To put it into perspective, if a motherboard is populated with four DDR3-1333 MHz modules, the system memory bandwidth would be a staggering 42,600 MB/s. Like everyone, G.Skill is expected to have memory kits with four DDR3 memory modules. It is likely that these kits consisting of four matched modules will be referred to as "quad-channel". Around this time, the company will have a new lineup, RipjawsZ.

RipjawsZ will make use of a new, slightly taller than standard heatspreader design, and will be available in at least two color options - black and red. Some of the kits will consist of just modules, while some will also pack Turbulence II air-coolers that use two fans. In all there are two basic types of modules: ZL, ZH; among these ZH provides the best timings for the frequencies it offers. These modules will be available in a variety of speeds: DDR3-1333, DDR3-1600, DDR3-1866, DDR3-2133, and DDR3-2400. Modules with speeds of up to DDR3-1866 make do with 1.5V DRAM voltage, DDR3-2133 needs 1.60V, while some higher speed modules need up to 1.65V. These kits are available in a variety of capacities - 8 GB (4 x 2 GB), 16 GB (4 x 4 GB), 32 GB (4 x 8 GB), and 64 GB (probably 8 x 8 GB). These modules will be Intel eXtreme Memory Profile (XMP) revision 1.3 compliant.

Memoright, a leading provider of solid state drive (SSD) products, unveils its latest SSD solutions HTM series which delivers constant sequential performance and constant random access performance and allows MLC- based SSDs to deliver longer life span for enterprise storage.

As Memoright's Chairman and CEO Eric Kao stated in the keynote speech of Flash Memory Summit, "one size does not fit all in SSD world." SSDs are not simply as a faster version of HDDs. If SSD's performance characteristic does not match data access patterns, SSDs will not perform as expected and sometimes can be slower than HDDs.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage, and enthusiast computer products, today expanded their Pyro brand of SATA III solid-state drives with the launch of its new Pyro SE. Powered by SandForce's SF-2281 SSD processor, the Patriot Memory Pyro SE brings the added performance of synchronous NAND to the brand while offering a very aggressive price per performance ratio.

To ensure rock-solid performance, the Patriot Memory Pyro SE utilizes TRIM, DuraClass, and DuraWrite technologies. Offering read/write speeds of 500+ MB/s, the Pyro SE will chew through large file transfers and make even the most demanding applications a smooth experience. The Pyro SE series will feature a standard 2.5-inch form factor for flexible compatibility with both notebooks and desktops.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the addition of 8GB DDR3 memory modules to its Vengeance and Value Select product lines.

The new 8GB Vengeance DDR3 memory operates at 1.5V for compatibility with the new 2nd generation Intel Core processor family and is guaranteed to operate at 1600MHz. Providing 8GB of rigorously-screened DRAM on a single module allows gamers and performance enthusiasts to build systems with 32GB of high-performance memory.

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has started volume production of its SATA interface NANDrive solid state drives (SSDs). The GLS85LS product family has the same pin-out across all capacities-2 GB, 4 GB, 8 GB, 16 GB, 32 GB and higher in the future-which simplifies system-level board design.

Measuring 14mm x 24mm x 1.95mm, in a 145 ball grid array (BGA), 1 mm ball pitch package, SATA NANDrive devices are one of the smallest SSDs, giving OEMs (original equipment manufacturers) flexibility when designing data storage into their embedded products. The BGA package can be soldered directly onto the motherboard-no extra connectors are needed-providing added stability to the SSD.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the availability of JESD216: Serial Flash Discoverable Parameters (SFDP) for Serial NOR Flash. Widely anticipated by software engineers, the SFDP will allow Serial Flash manufacturers to embed a standard description of important device characteristics inside the Flash chip.

Users can read the description and obtain critical information about the functional characteristics and capabilities of SFDP compliant Flash memory devices, which will enable user applications such as mobile phones, set-top boxes, HDTVs, PC/NB motherboards, or any system that needs to support multiple Serial NOR Flash device types, to configure themselves to handle various Serial Flash implementations.

Elpida Memory, Inc., the Japan-based third largest Dynamic Random Access Memory (DRAM) maker in the world, today announced it had completed development of the industry's first 25-nanometer (nm) process 4-gigabit DDR3 SDRAM. The new chip is also the smallest 4-gigabit DRAM. The new cutting-edge smallest available 4-gigabit chip uses ultra fine-width 25nm process migration technology. Back in May, Elpida finished development of a 2-gigabit DDR3 SDRAM using the advanced 25nm process and began sample shipments in July.

By using ultra-fine process technology the 4-gigabit DDR3 SDRAM becomes a more energy efficient chip and achieves higher productivity. As a 4-gigabit product, its density is double that of Elpida's 2-gigabit DDR3 SDRAM based on the same process node. The newly developed 4-gigabit DRAM enhances productivity by about 45% compared with Elpida's 30nm 4-gigabit DDR3 SDRAM. Compared with this same 30nm DDR3, it reduces operating current by about 25-30% and standby current by about 30-50%. It has also realized the industry's highest speed data transfer rate.

Intel Corporation announced today its latest solid-state drive (SSD), the Intel Solid-State Drive 710 Series, a purpose-built Multi-Level Cell (MLC) data center SSD and replacement for the Intel X25-E Extreme SSD. While the Intel X25-E was based on more expensive but highly reliable Single-Level Cell (SLC) NAND flash memory, the Intel SSD 710 uses compute-quality Intel 25-nanomenter (nm) MLC NAND flash memory with Intel High Endurance Technology (HET) to deliver the endurance and performance necessary for data center, financial services, embedded, Internet portal, search engine and other demanding storage and server applications, but at a greater value.

"The Intel SSD 710 Series gives enterprise data center and embedded users extreme endurance and performance, enabled by Intel's High Endurance Technology based on Intel 25nm MLC NAND technology," said Rob Crooke, Intel vice president and general manager of the Intel Non-Volatile Memory Solutions Group. "Intel SSDs are widely deployed in the data center due to their performance, reliability and value. Our latest SSD product family offers more than 30 times the write endurance of our current MLC SSDs, plus improved performance and new features, such as power-loss data protection and surplus arrays of NAND for enhanced reliability."

SanDisk Corporation, a global leader in flash memory storage solutions, today introduced the SanDisk Memory Vault, the first product in a new category of devices that are designed for long-term data preservation. SanDisk announced the device today as part of a comprehensive new suite of retail products.

The SanDisk Memory Vault is a photo album for the digital age that allows consumers to preserve images in one reliable location. The device connects to a computer's USB port for easy drag-and-drop functionality and features a sleek, ruggedized, metallic design that looks great on any desktop and fits into any drawer.

Micron Technology, Inc., today introduced the highest-density Serial Peripheral Interface (SPI) NOR memory available, launching 1 gigabit (Gb), 512 megabit (Mb) and 256Mb products in both 1.8V and 3V power supply voltages. Employing state-of-the-art 65nm process technology, the N25Q product family offers the highest-speed quad I/O in the industry and a full set of advanced features and small packages that improve overall system performance and time-to-market in networking, set-top boxes, automotive and a wide range of industrial, computing and consumer applications.

Extending the company's legacy of memory leadership, Micron's new SPI NOR product line balances customers' needs for cost-effective solutions at higher densities while ensuring compatibility among future chipsets. Micron's long-term commitment to customers in the embedded markets is reinforced by Micron's Product Longevity Program (PLP) - a 10-year commitment to provide stable memory architectures for customer designs. The new N25Q products will be offered as part of this program to provide design assurance for its PLP customers.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung's advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

SMART Modular Technologies (WWH), Inc., a leading independent manufacturer of solid-state storage products and memory modules, today announced the Optimus solid-state drive (SSD) for enterprise storage applications. Featuring a native Serial Attached SCSI (SAS) 6Gb/s interface and up to 1.6 TB usable capacity, Optimus is the industry's highest capacity and fastest SAS multi-level cell (MLC) SSD. Delivering high performance, endurance, and reliability, the costeffective Optimus SSD satisfies the demands of I/O intensive, web-facing, and cloud-based applications in today's IT infrastructure.

Optimus was developed using SMART's extensive experience in flash technology, SAS firmware, and enterprise storage. SMART's world-class manufacturing and accomplished enterprise organization ensures that the Optimus SSD, as well as SMART's business and support processes, will meet the needs of the most demanding enterprise storage customers.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced worldwide retail availability of the Special Edition Arctic White Vengeance Low Profile memory.

The Special Edition Arctic White Vengeance LP memory operates at a 1.35V and is ideal for ultra-quiet systems and other low-voltage applications. It consists of two rigorously-screened 4GB DDR3 DRAM modules, guaranteed to operate at 1600MHz with a tested latency of 9-9-9-24. The Vengeance low-profile heat spreader has a reduced height of 1.03" (26.25mm) and is designed for high-performance systems with extra-large CPU coolers, small form factor system builds, or any other space-constrained application where standard Vengeance memory may not fit.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced availability in limited quantities of a new 1.5V 8GB Dominator GT DDR3 memory kit with an aggressive timing specification.

The new 8GB dual-channel DDR3 kit is guaranteed to operate at 2133MHz at a memory voltage of 1.5V, and with a groundbreaking timing specification of CL9-11-9. With latency settings this low, the Dominator GT modules have the most aggressive timing specification of any 2x4GB 2133MHz 1.5V memory kit available today.

GeIL (Golden Emperor Industries Ltd.) rolled out two new lines of DDR3 desktop memory targering the gamer-enthusiast segment, the Enhance Corsa and Evo Corsa. Interestingly, these lines don't include triple-channel kits, but quad-channel ones consisting of four modules, aside from the usual dual-channel kits. Gearing up for the Sandy Bridge-E market early, I see. Among the two lines, the Enhance Corsa consists of bang-for-buck kits with DDR3-1333 MHz and DDR3-1600 MHz.

The USP here is that the 1333 MHz kits will pack an Intel XMP profile that runs the modules at 1500 MHz with CL9 timings, and DRAM voltage of 1.5V; while the DDR3-1600 MHz ones will pack a XMP profile that runs them at 1700 MHz with CL9 timings and 1.5V. Evo Corsa comes in dual and quad-channel kits, consisting of 2 GB or 4 GB modules, making up 4 GB or 8 GB dual-channel; and 8 GB or 16 GB quad-channel kits on offer.

Toshiba Corporation and SanDisk Corporation today celebrated the opening of Fab 5, the third 300mm wafer NAND fabrication facility at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.

Consumer demand for smartphones, tablets and other electronic devices continues to fuel strong global demand for NAND flash memory. Toshiba began the construction of Fab 5 in July 2010, and the new facility, equipped with manufacturing equipment funded by Toshiba and SanDisk, started volume production in July 2011. Fab 5 currently uses 24 nanometer (nm) process technology and its first wafer outs will be in August. In time, the fab will transition to more advanced process generations, starting with recently announced 19nm technology, the world's smallest, most advanced process node.

Japanese cooling expert Scythe is expanding the product portfolio by new Kama Rack Series. Kama Rack Multi-Functional Panel allows the useful utilization of available 5,25 and 3,5 inch bays of the PC Chassis by adding many helpful new features to the front panel.

The idea behind the product is the hassle of frequent data-transfers as well as backups in the digital life. Saving, securing and moving of corporate and private data usually requiring several different devices to move or secure data from source A to media drive B. These media could be flash drives, memory cards, USB Drives as well as Hard Drives and Solid State Disks.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, "With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers' minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series". He further stated: "This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs". The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

German boutique memory maker Exceleram announced the new Black&White series of DDR3 memory. The name originates from the modules having black PCBs and white heatspreaders. The first of its kind is a dual-channel DDR3-1600 MHz 8 GB (2x 4 GB) kit. With a module voltage of 1.5V, the modules can run at DDR3-1600 MHz speeds with timings of 9-9-9-24T. Backed by a 10-year warranty, the new kit is said to be available next week.

For the first time, scientists at IBM Research have demonstrated that a relatively new memory technology, known as phase-change memory (PCM), can reliably store multiple data bits per cell over extended periods of time. This significant improvement advances the development of low-cost, faster and more durable memory applications for consumer devices, including mobile phones and cloud storage, as well as high-performance applications, such as enterprise data storage.

With a combination of speed, endurance, non-volatility and density, PCM can enable a paradigm shift for enterprise IT and storage systems within the next five years. Scientists have long been searching for a universal, non-volatile memory technology with far superior performance than flash - today's most ubiquitous non-volatile memory technology. The benefits of such a memory technology would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. A promising contender is PCM that can write and retrieve data 100 times faster than flash, enable high storage capacities and not lose data when the power is turned off. Unlike flash, PCM is also very durable and can endure at least 10 million write cycles, compared to current enterprise-class flash at 30,000 cycles or consumer-class flash at 3,000 cycles. While 3,000 cycles will out live many consumer devices, 30,000 cycles are orders of magnitude too low to be suitable for enterprise applications (see chart for comparisons).

Crucial, a leading global brand of memory and storage upgrades, today announced two product line additions to its highly successful Ballistix high-performance memory: Crucial Ballistix Tactical and Crucial Ballistix Elite lines. Building on the recent successful launch of the Crucial Ballistix Sport memory, these new product lines create a comprehensive high-performance memory portfolio addressing the needs of a broad range of users across performance memory segments.

Whether casual enthusiast or hardcore gamer, the expanded Ballistix portfolio now provides a distinct choice of performance memory solutions and is available in a variety of speeds and densities, along with differentiated product features. The complete line of Ballistix memory features a new logo treatment and updated heat spreader designs, as well as a full range of products from low latency DDR2-800MHz up to high-speed DDR3-2133MHz. Additionally, 4GB densities will be available in DDR3-1600MHz, -1866MHz, and -2000MHz modules.