EVGA released a new non-reference design graphics card based on the NVIDIA GeForce GTX 570 (part: 025-P3-1579-AR), boasting of twice the memory amount, at 2560 MB (2.5 GB). The 2.5 GB of GDDR5 memory is installed over a 320-bit wide memory interface, with a memory clock speed of 950 MHz (3.80 GHz effective), providing a memory bandwidth of 152 GB/s. The added memory could improve performance on HD gaming with 120 Hz refresh-rates (for flicker-free stereo 3D). The core is clocked at 732 MHz, with the 480 CUDA cores running at 1464 MHz. The card uses EVGA's in-house design GF110 PCB, that is shorter than NVIDIA's reference design. Its cooler resembles that of the GTX 560 Ti, and is designed to be quieter. Display outputs include two DVI, and one each of HDMI 1.4a and DisplayPort. EVGA's GTX 570 HD 2.5 GB is priced at US $399.99 at EVGA's online store.

SanDisk Corporation, a global leader in flash memory storage solutions, today expanded its Lightning(R) Enterprise Flash Drive (EFD) family with six new 2.5-inch 6Gb SAS (6 gigabits per second Serial Attached SCSI) models. The Lightning products are part of the new Enterprise Storage Solutions (ESS) division that SanDisk created following its recent acquisition of Pliant Technology.

The new drives include three SLC (single-level cell) flash drives with capacities of 100 gigabytes (GB), 200GB and 400GB; and three MLC (multi-level cell) flash drives with capacities of 200GB, 400GB and 800GB. The new drives extend SanDisk's position as the industry leader in EFD performance, performance predictability and reliability. SanDisk also confirmed today that HP has qualified and integrated the new Lightning 6Gb SAS drives into its HP Qualified storage drive offerings.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the DRAM industry's first-ever use of high-k metal gate (HKMG) technology to develop a 2-gigabit DDR2 Mobile RAM (LPDDR2) at the 40nm-class DRAM node.

HKMG is technology that uses insulator film with a high dielectric constant (abbreviated to "high-k," a semiconductor industry measure of how much charge a material can hold) in the transistor gate to reduce current leakage and improve transistor performance. Metal gate electrodes that are required for the high-k dielectrics process are also used. Some makers of logic semiconductors have started to use HKMG, but higher heat treatment temperatures after HKMG formation and complicated DRAM structural characteristics have prevented consistent application in the DRAM fabrication process. Elpida, however, has managed to lower the heat treatment load and overcome certain memory device structural complications.

TEAM Group, of the TEAM Xtreem fame, showed us its latest generation of ultra-high end DDR3 memory modules for overclocking. The theme for this year is LV (low-voltage) modules, which can do their rated DRAM speeds at 1.35V voltage. We begin with TEAM Xtreem DDR3-2400 MHz and TEAM Xtreem DDR3-2000 MHz, which come in 2 GB and 4 GB module capacities, and in triple-channel and dual-channel kits. These kits are the top of the line that TEAM has, to offer.

Moving on, there's a second line of memory kits for the performance segment, also LV (low-voltage, 1.35V), called TEAM Xtreem Dark series, which offer speeds of DDR3-1600 MHz, and use slightly smaller heatsinks. These modules come in 2, 4 GB capacities, and in dual and triple channel kits. Next up is the TEAM Green series, that are bare modules without heatsinks, that do JEDEC standard DDR3-1333 MHz and DDR3-1600 MHz at 1.35V, with loose timings. Lastly, there's a performance line of SODIMM modules for Apple Macs, the TEAM Mac SODIMM, which runs at DDR3-1333 and DDR3-1066 MHz speeds, offering 2 GB and 4 GB module capacities.

After Aexea, it's time to move onto another boutique memory module vendor, WinChip. This Taiwan-based PC memory vendor seems to focus on the form and design of the memory module (particularly the heatspreaders or heatsinks), so much so, that some of its modules even bear artistic true-color paintings. The first set of modules we came across used a unique kind of heatsinks. Among these, the first one reminded us of some of Mushkin's early heatspreader designs. The second one looks more unique, with a central portion of the heatsink protruding out. A heat pipe is running along the length of the module, evenly distributing heat. In another part of the exhibit, there's a module with a strange heatspreader design. The heatspreader increases module height by almost double, and has a few horizontal grooves to dissipate heat.

Moving on, there are a couple of normally-sized DDR2-800 and DDR3-1333 modules that bears branding of Avatar: The Game. Next up, are the modules attracting a lot of attention. These ones have heatspreaders with fancy true-color graphics, some are photographs, while the others are 3D art, mostly wild-animal themed, including the African Savannah, a gliding eagle, dolphins, toco toucans in a tropical jungle with banana trees, etc.,etc. The last set has heatspreaders with abstract writings in Asian scripts. Like Aexea, WinChip's modules are sold more on their product design. The modules themselves are mostly JEDEC-specced, with the exception of some heavier ones that run at PC3-12800 speeds.

Lesser-known PC memory, flash memory, and phone accessories manufacturer Aexea showed off its goods for the season, including some never before seen memory module heatsink designs. Aexea comes across as a boutique memory module designer, since it displayed many identically/similarly-specced 4 GB and 2 GB DDR3-1333 and DDR3-1600 memory modules with a variety of heatspreader and heatsink designs, in a number of colors, as well. Most of these are sold in single-piece packages, and not so much dual/triple-channel kits. Among these, a certain module called "Vampire" caught our eye, which uses a blood-red colored heatsink, a bat-shadow graphic, and jagged protrusions that put it into the category of semi-heatsink modules, of which G.Skill RipJaws and Corsair Vengeance are popular examples. And oh, they do seem to speak of US market presence.

The RamSan-70 "Gorilla" is a high-performance, half-length PCIe card with 900 GB of usable SLC Flash capacity. Delivering 330K IOPS and 2 GB/s of bandwidth, it offers higher performance and greater capacity than any other half-length SLC Flash PCIe card.

Texas Memory Systems, Inc. (TMS), maker of The World's Fastest Storage, introduces the new high-performance RamSan-70, a 900-GB half-length PCIe card featuring Toshiba's newest 32nm SLC Flash. The RamSan-70 carries on Texas Memory Systems' tradition of delivering a complete integrated RamSan storage solution on a single board.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the shipment of the Flash Voyager USB 3.0 family of USB flash drives.

The new Flash Voyager USB 3.0 models deliver SuperSpeed USB 3.0 performance, with read speeds up to four times faster than typical USB 2.0 drives. The Flash Voyager USB 3.0 product family shares the same rugged rubber housing and finger-friendly ergonomics that have made the Flash Voyager family a favorite of consumers looking for durable portable data storage. All Flash Voyager USB 3.0 models are shockproof, water-resistant, backward compatible with USB 2.0/USB 1.1 standards, and provide easy plug-and-play compatibility with most operating systems.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.

The newly developed 25nm DRAM process technology requires 30% less cell area per bit compared with Elpida's 30nm process. The chip output for a 2-gigabit DDR3 SDRAM wafer using the new process is about 30% higher versus 30nm.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the new HyperX Plug and Play (PnP) series of high-performance enthusiast memory. HyperX PnP are the first modules to scale the higher memory heights that are a part of the second generation Intel Core i5 and i7 CPUs. The memory is programmed with faster frequencies and when 'plugged' into a system using the Sandy Bridge chipset, will automatically 'play' at either 1600MHz or 1866MHz in both desktop and notebook PCs.

The modules are programmed using JEDEC-compliant settings, allowing 1600MHz and 1866MHz frequency support. It is as simple as plugging in the memory and turning on the machine, as the system automatically recognizes faster memory speed with no further BIOS settings required. Users will notice performance gains as overclocking is automatic with the HyperX Plug and Play modules. In addition, the modules are backwards compatible with previously released DDR3 systems on the market.

Toshiba Corporation, reinforcing its leadership in the development and fabrication of cutting-edge, high density NAND flash memories, today announced that it has fabricated NAND flash memories with 19 nm process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)). Toshiba will also add 3-bit-per-cell products fabricated with the 19nm process technology to its product line-up.

Samples of 2-bit-per-cell 64-gigabit will be available from the end of this month with mass production scheduled for the third quarter of the year (July to September 2011). Toshiba leads the industry in fabricating high density, small die size NAND flash memory chips. Application of the 19nm generation process technology will further shrink chip size, allowing Toshiba to assemble sixteen 64Gbit NAND flash memory chips in one package and to deliver 128GB devices for application in smartphones and tablet PCs. The 19nm process products are also equipped with Toggle DDR2.0, which enhances data transfer speed.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and solid-state storage with solid quality, today announces the world's fastest 8GB (4GBx2) DDR3 memory, rated at 2300MHz CL9 with only 1.65V voltage. This ultimate memory kit will join G.Skill award winning Ripjaws-X family and will be available soon via G.Skill global authorized distribution partners.

Since the demand of big capacity memory has grown dramatically, G.Skill R&D team has been dedicated to develop the fastest and best performing products based on 4GB memory sticks continuously. Following the marvelous achievement of DDR3 1900MHz 48GB and DDR3 2200MHz 16GB kits, G.Skill once again pushed the memory speed further and developed the industry leading memory kit. The DDR3 2300MHz CL9 kit has passed a series of rigorous tests and guarantees the best stability and performance.

PNY Technologies, Inc. ("PNY") today announced the NVIDIA Verto GeForce GT 520 1024MB graphics card. The new PNY GT 520 graphics card is the perfect mainstream upgrade to bring the latest technology to computers at a reasonable cost. Whether you're watching or editing HD video, enhancing photos, or gaming with support for DirectX 11, this latest PNY graphics card provides a solution for every graphics need. The on-board HDMI port allows for easy connectivity to any HDMI enabled computer monitor or television.

"This mainstream graphics card caters to a wide variety of consumers looking to upgrade their PCs to handle the now everyday tasks of living in a digital world," said Nicholas Mauro, senior marketing manager, PC components for PNY. "It's an ideal solution to enhance your overall computer visualization experience at an affordable cost."

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has developed a 4-gigabit DDR2 Mobile RAMTM that employs state-of-the-art 30nm process. This new Mobile RAM features a low operating voltage of 1.2V, achieves a 1066Mbps high-speed data transfer rate, and uses roughly 30% less operating current compared with stacking two of Elpida's 40nm 2-gigabit products. Through sophisticated circuit design and advanced process technology, this product achieves the world's smallest class in chip size for a 4-gigabit LPDDR2. In addition, it is an eco-friendly DRAM equipped with a low power feature that targets mobile devices such as smart phones and tablet PCs by contributing to extended operating times of battery-powered devices.

Currently, the rapidly expanding market for smart phones and tablet PCs is striving to expand the features of its operating systems. As a result, the ideal density of DRAMs is also rapidly on the rise, and there is an increasing need for high density DRAMs - 8-gigabit for high-end smart phones and 16-gigabit for high-end tablet PCs. At the same time, there is a strong demand for smaller, thinner, and lighter DRAM packages, and attention is being focused on advanced package technologies such as Package on Package (PoP) and Multi Chip Package (MCP).

Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND, its next-generation 24-nanometer (nm) NAND flash product family. The SmartNAND series integrates leading-edge 24nm process NAND flash technology with a control chip that supports error correction code (ECC) and is available in densities ranging from 4 to 64 gigabyte (GB).

The new series is expressly designed to remove the burden of ECC from the host processor, while minimizing protocol changes. SmartNAND simplifies the host-side design and application of advanced NAND technology in a range of applications including portable media players, tablet PCs, digital TVs, set-top-boxes, and other devices that require high-density, non-volatile memory.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the availability of 2000MHz versions of the award-winning Vengeance family of DDR3 memory.

The new 2000MHz kits are equipped with aluminum heat spreaders anodized in Jet Black. They join the 1600MHz Vengeance DDR3 memory kits, which are available in either Jet Black or Cerulean Blue, and the 1866MHz Vengeance DDR3 kit, available in Jet Black.

Exceleram, the Highend Memory maker based in Landau / Germany announces the availability of the new Blue Rippler Kits. The new Blue Rippler series starts with 8 different memory kits. They will be available in capacities from 8GB to 24GB - the focus is here for all memory demanding applications.

"Something special for the new Blue Rippler series is the high compatibility, you can use them for LGA1155, LGA1156, LGA 1366 and AM3. Thus the endcustomer don't need much time to find the right memory for his system." said Martim Reis Silva, Salesdirector Exceleram.

Samsung Electronics America Inc., a subsidiary of Samsung Electronics Corporation, today announced three new mobile PC lines for the workplace. The Series 2, Series 4 and Series 6 laptops combine first-rate reliability and enhanced security with features like anti-shock hard drives and pressure-resistant casings to meet the needs of a fast-paced enterprise or educational environment.

"Samsung's new mobile PCs deliver an unrivaled experience for the workplace, with features specifically designed to meet the needs of IT managers and end users," said Scott Ledterman, director of mobile PC marketing at Samsung Enterprise Business Division. "The new Series 2, 4 and 6 laptops present a unique opportunity for Samsung to specifically focus on the enterprise and educational channels and underscores Samsung as a global leader in the enterprise PC market."

G.Skill, the worldwide leading memory designer and manufacturer, has announced the newest concept and development of new Sniper series designed specifically for PC gamers and modding enthusiasts. Extensive compatibility tests are conducted on a wide range of Intel and AMD platforms, which guarantee the best performance, quality and reliability for user's gaming needs.

The New Sniper series is designed in ultra low voltage, especially 1.25V. This kit can save up to 10% electric power which will simultaneously allow gamers to enjoy smooth gaming without any overheat problems and meet energy efficiency requirements.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the availability of a new blue version of their award-winning Vengeance family of DDR3 memory modules. Vengeance DDR3 memory is optimized for overclocking and compatibility, at an attractive price point. The original Vengeance modules, released to critical acclaim in November 2010, are equipped with aluminum heat spreaders anodized in Jet Black.

The new modules offer performance identical to the original, with Cerulean Blue anodized heat spreaders that provide a great match with the latest 2nd generation Intel Core processor family motherboards from ASUS, MSI, and Gigabyte. The striking blue color is shared with Corsair Gaming Series power supplies, allowing users to maintain a consistent color scheme throughout their system. Style-conscious system builders can also mix original Jet Black and new Cerulean Blue Vengeance modules for an even more dramatic look that matches their motherboard.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.

The UFS standard represents an evolutionary progression of JEDEC standards in this field, and has been specifically tailored for mobile applications and computing systems requiring high performance and low power consumption. The initial data throughput for UFS will be 300 megabytes per second (MB/s), and the standard also supports command queuing features to raise random read/write speeds. JESD220 Universal Flash Storage may be downloaded free of charge from the JEDEC website here.

Microsoft today released Service Pack 1 for Windows 7 and Windows 2008 R2, to all users. A Service Pack is a periodical cumulative of updates released between a period of time, that also introduces new features to the OS. For both operating systems based on the Windows 6.1 kernel, Service Pack 1 will provide all product and security updates released to date. A couple of new features that will benefit Windows 2008 R2 are also bundled. These include Dynamic Memory and RemoteFX.

Dynamic Memory lets Hyper-V administrators pool available memory on a physical host and dynamically distribute it to any virtual machine(s) running on that host, while RemoteFX lets Windows Server 2008 R2 administrators provide a rich end user desktop virtualization experience by delivering vivid content, independent of any graphics stack, to server-hosted virtual and session-based desktops. We put Windows 7 Service Pack 1 to test, to see how the updated OS benefits gamers, or if it does in the first place. Our performance analysis can be read here. A list of notable changes with SP1 can be read here.

Exceleram - the Highend MemoryBlacksmith in Landau / Germany announces the availability of 3 new parts of the EP-Series, and expanded its product range. "The EP series includes memory(kits) based on timing latencies of (currently) 1333mhz, but with "air" up to the top, so that overclockers have their fun." says Steffen Eisenstein, Product Manager at Exceleram.

We start with 3 models: the EP3001A, a 2GB 1333MHz CL9 single module. Followed by a 4GB (2x 2GB) 1333MHz CL9 Memorykit and a 6GB (3x 2GB) 1333MHz CL9 kit, both with the known "Rippler" heatsink. The voltage is 1.5 volts and all are exclusively equipped with the famous Power Chip Rev. D 128 x 8 chips.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardisation of hybrid memory modules. To be chaired by PNY Technologies, Inc. and Cypress Semiconductor, the JC-45.6 Hybrid Modules Subcommittee will hold its first meeting in Munich, Germany on February 28, 2011.

Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components. "I am optimistic about the potential benefits of hybrid modules," said Chris Socci, Chairman of the new JC-45.6 Subcommittee. "For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market 'go green' by reducing the need for batteries, and may one day extend to all applications that demand memory."

Eurocom announces an addition to its already extensive line of fully configurable, performance based Mobile Notebooks with the EUROCOM Racer. This new model will feature next generation technology from ATI, Intel and NVIDIA and will support Intel's new seventh generation chipset platform, the Huron River HM 65. The EUROCOM Racer is expected to ship February 1, 2011.

The EUROCOM Racer will support up to a 100W GPU which will allow it to run up to an NVIDIA Geforce GTX 485M, AMD Radeon Mobility HD6970M or NVIDIA Quadro FX 3800M graphics solution. A major innovation in the EUROCOM Racer model is support for four memory modules which can be configured with up to 32GB of RAM. The EUROCOM Racer supports both DDR3-1333 and DDR3-1600 memory.